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Yongshun Cui

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2023
[c1]
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Ming Yan, Junjie Chen, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui:
Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. ICSE-SEIP 2023: 343-354

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