Packaging Directory

This directory contains files related to chiplet packaging and multi-die integration.

Purpose

The packaging directory is used for IP blocks that are designed for chiplet integration, containing:

• Interposer constraints - Design rules and routing constraints for interposer-based integration
• Bump maps - Physical bump assignments for die-to-die connections
• Thermal analysis - Thermal constraints and analysis for multi-die systems
• Power domain configuration - Power management and domain isolation requirements
• Signal conformance validation - Protocol compliance and verification results
• Lifecycle metadata - Supply chain tracking and certification information
• Multi-die testing - Test access methods and coverage requirements
• Packaging requirements - Documentation of packaging considerations

When to Use

This directory is created when:

• IP is designed for chiplet integration (chiplet_ready: true in metadata)
• Multi-die system design is required
• Die-to-die interface protocols are used (UCIe, BoW, AIB, EMIB)
• Advanced packaging technologies are employed (2.5D interposer, 3D stacking)
• Supply chain tracking and certification are required

Files

Core Packaging Files

• interposer_constraints.json - Interposer design constraints (technology, routing layers, pitch, spacing)
• bump_map.csv - Bump assignments for die-to-die connections
• thermal_constraints.json - Thermal analysis constraints (power limits, temperature, cooling)
• packaging_requirements.md - Documentation of packaging considerations

Advanced Integration Files

• power_domains.json - Power domain configuration (voltage, isolation, retention, current limits)
• signal_conformance.json - Protocol compliance validation and verification results
• lifecycle_metadata.json - Supply chain tracking, trusted fabricator status, certifications
• multi_die_testing.json - Test access methods, coverage requirements, test vectors

Documentation Files

• thermal_analysis.md - Detailed thermal analysis and cooling requirements
• power_management.md - Power domain design and management guidelines
• chiplet_integration.md - Comprehensive chiplet integration guide

Integration with Vyges CLI

Use the vyges chiplet commands to manage packaging files:

Basic Commands

vyges chiplet validate --ip my-ip
vyges chiplet generate-interface --protocol ucie --ip my-ip
vyges chiplet generate-docs --packaging --ip my-ip

Advanced Commands

# Constraint generation and validation
vyges chiplet generate-constraints --interposer --ip my-ip
vyges chiplet generate-constraints --bump-map --ip my-ip
vyges chiplet validate --constraints interposer --ip my-ip
vyges chiplet validate --constraints thermal --ip my-ip

# Analysis and configuration
vyges chiplet analyze-thermal --ip my-ip
vyges chiplet configure-power-domains --ip my-ip
vyges chiplet validate-conformance --protocol ucie --ip my-ip

# Lifecycle and supply chain
vyges chiplet track-lifecycle --origin vyges/partner-x --ip my-ip

# Multi-die testing
vyges chiplet create-testbench --multi-die --ip1 cpu --ip2 my-ip

AI-Assisted Development

The packaging directory supports AI-assisted development through the .vyges-ai-context.json file:

• Generate interposer constraints using generate_interposer_constraints prompt
• Create bump constraints using create_bump_constraints prompt
• Analyze thermal constraints using analyze_thermal_constraints prompt
• Configure power domains using configure_power_domains prompt
• Validate signal conformance using validate_signal_conformance prompt
• Track lifecycle metadata using track_lifecycle_metadata prompt

Metadata Integration

All packaging files are automatically integrated with the vyges-metadata.json schema:

• Chiplet metadata section includes all packaging constraints
• Interface definitions support chiplet protocol types
• Power domain configuration is tracked in metadata
• Lifecycle and supply chain information is maintained
• Test coverage and validation results are documented