933774680026
更新时间：2025-05-02 18:42:32
品牌：NXP
描述：IC LIQUID CRYSTAL DISPLAY DRIVER, U, DIE, Display Driver
概述
规格参数
数据手册933774680026 概述
IC LIQUID CRYSTAL DISPLAY DRIVER, U, DIE, Display Driver 显示驱动器
933774680026 规格参数
| 生命周期： | Obsolete | 零件包装代码： | DIE |
| 包装说明： | DIE, | Reach Compliance Code： | unknown |
| ECCN代码： | EAR99 | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.57 | 数据输入模式： | SERIAL |
| 显示模式： | SEGMENT | 接口集成电路类型： | LIQUID CRYSTAL DISPLAY DRIVER |
| JESD-30 代码： | R-XUUC-N56 | 复用显示功能： | YES |
| 位数/字符： | 4-DIGIT | 功能数量： | 1 |
| 区段数： | 40 | 端子数量： | 56 |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 封装主体材料： | UNSPECIFIED | 封装代码： | DIE |
| 封装形状： | RECTANGULAR | 封装形式： | UNCASED CHIP |
| 认证状态： | Not Qualified | 最大供电电压： | 9 V |
| 最小供电电压： | 2 V | 标称供电电压： | 5 V |
| 表面贴装： | YES | 技术： | CMOS |
| 温度等级： | INDUSTRIAL | 端子形式： | NO LEAD |
| 端子位置： | UPPER | 最小 fmax： | 0.288 MHz |
| Base Number Matches： | 1 |
933774680026 数据手册
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DATA SHEET
PCF8576
Universal LCD driver for low
multiplex rates
Product specification
2001 Oct 02
Supersedes data of 1998 Feb 06
File under Integrated Circuits, IC12
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
CONTENTS
8
LIMITING VALUES
HANDLING
9
1
2
3
4
5
6
FEATURES
10
11
DC CHARACTERISTICS
AC CHARACTERISTICS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
11.1
11.2
Typical supply current characteristics
Typical characteristics of LCD outputs
PINNING
12
APPLICATION INFORMATION
Chip-on-glass cascadability in single plane
BONDING PAD INFORMATION
TRAY INFORMATION: PCF8576U
TRAY INFORMATION: PCF8576U/2
PACKAGE OUTLINES
FUNCTIONAL DESCRIPTION
12.1
13
6.1
6.2
6.3
6.4
Power-on reset
LCD bias generator
LCD voltage selector
LCD drive mode waveforms
Oscillator
14
15
6.5
16
6.5.1
6.5.2
6.6
Internal clock
External clock
Timing
17
SOLDERING
17.1
Introduction to soldering surface mount
packages
6.7
Display latch
6.8
6.9
Shift register
17.2
17.3
17.4
17.5
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
Segment outputs
Backplane outputs
Display RAM
6.10
6.11
6.12
6.13
6.14
6.15
6.16
Data pointer
Subaddress counter
Output bank selector
Input bank selector
Blinker
18
19
20
21
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I2C COMPONENTS
7
CHARACTERISTICS OF THE I2C-BUS
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Bit transfer (see Fig.12)
START and STOP conditions (see Fig.13)
System configuration (see Fig.14)
Acknowledge (see Fig.15)
PCF8576 I2C-bus controller
Input filters
I2C-bus protocol
Command decoder
Display controller
Cascaded operation
2001 Oct 02
2
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
1
FEATURES
• Single-chip LCD controller/driver
• Selectable backplane drive configuration: static or 2/3/4
backplane multiplexing
• Selectable display bias configuration: static, 1⁄2 or 1⁄3
• Internal LCD bias generation with voltage-follower
buffers
• May be cascaded for large LCD applications (up to
2560 segments possible)
• 40 segment drives: up to twenty 8-segment numeric
characters; up to ten 15-segment alphanumeric
characters; or any graphics of up to 160 elements
• Cascadable with 24-segment LCD driver PCF8566
• Optimized pinning for plane wiring in both single and
multiple PCF8576 applications
• 40 × 4-bit RAM for display data storage
• Space-saving 56-lead plastic very small outline package
(VSO56)
• Auto-incremented display data loading across device
subaddress boundaries
• Very low external component count (at most one
resistor, even in multiple device applications)
• Display memory bank switching in static and duplex
drive modes
• Compatible with chip-on-glass technology
• Manufactured in silicon gate CMOS process.
• Versatile blinking modes
• LCD and logic supplies may be separated
• Wide power supply range: from 2 V for low-threshold
LCDs and up to 9 V for guest-host LCDs and
2
GENERAL DESCRIPTION
The PCF8576 is a peripheral device which interfaces to
almost any Liquid Crystal Display (LCD) with low multiplex
rates. It generates the drive signals for any static or
multiplexed LCD containing up to four backplanes and up
to 40 segments and can easily be cascaded for larger LCD
applications. The PCF8576 is compatible with most
microprocessors/microcontrollers and communicates via a
two-line bidirectional I2C-bus. Communication overheads
are minimized by a display RAM with auto-incremented
addressing, by hardware subaddressing and by display
memory switching (static and duplex drive modes).
high-threshold (automobile) twisted nematic LCDs
• Low power consumption
• Power-saving mode for extremely low power
consumption in battery-operated and telephone
applications
• I2C-bus interface
• TTL/CMOS compatible
• Compatible with any 4-bit, 8-bit or 16-bit
microprocessors/microcontrollers
3
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF8576T
VSO56
plastic very small outline package; 56 leads
chip in tray
SOT190-1
PCF8576U
−
−
−
−
−
−
−
PCF8576U/2
PCF8576U/5
PCF8576U/10
PCF8576U/12
chip with bumps in tray
−
unsawn wafer
FFC
FFC
chip on film frame carrier (FFC)
chip with bumps on film frame carrier (FFC)
2001 Oct 02
3
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BP0 BP2 BP1 BP3
13 14 15 16
S0 to S39
40
17 to 56
5
V
BACKPLANE
OUTPUTS
DD
DISPLAY SEGMENT OUTPUTS
DISPLAY LATCH
R
R
R
LCD
VOLTAGE
SELECTOR
LCD BIAS
GENERATOR
SHIFT REGISTER
12
V
LCD
PCF8576
4
3
CLK
INPUT
BANK
SELECTOR
DISPLAY
RAM
40 x 4 BITS
OUTPUT
BANK
SELECTOR
TIMING
BLINKER
SYNC
DISPLAY
CONTROLLER
6
OSC
OSCILLATOR
POWER-
ON
DATA
POINTER
RESET
COMMAND
DECODER
11
V
SS
2
1
SUB-
ADDRESS
COUNTER
SCL
SDA
2
INPUT
FILTERS
I C - BUS
CONTROLLER
10
7
8
9
SA0
A0 A1 A2
MBK276
Fig.1 Block diagram (for VSO56 package; SOT190-1).
ahdnbok,uflapegwidt
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
5
PINNING
SYMBOL
PIN
DESCRIPTION
I2C-bus serial data input/output
SDA
1
SCL
SYNC
CLK
VDD
2
I2C-bus serial clock input
cascade synchronization input/output
external clock input/output
supply voltage
3
4
5
OSC
6
oscillator input
A0 to A2
7 to 9
10
I2C-bus subaddress inputs
I2C-bus slave address input; bit 0
logic ground
SA0
VSS
11
VLCD
12
LCD supply voltage
BP0, BP2, BP1 and BP3
S0 to S39
13 to 16
17 to 56
LCD backplane outputs
LCD segment outputs
2001 Oct 02
5
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
handbook, halfpage
SDA
SCL
1
2
3
4
5
6
7
8
9
56 S39
55 S38
54 S37
53 S36
52 S35
51 S34
50 S33
49 S32
48 S31
47 S30
46 S29
45 S28
44 S27
43 S26
42 S25
41 S24
40 S23
39 S22
38 S21
37 S20
36 S19
35 S18
34 S17
33 S16
32 S15
31 S14
30 S13
29 S12
SYNC
CLK
V
DD
OSC
A0
A1
A2
SA0 10
V
11
12
SS
V
LCD
BP0 13
BP2 14
BP1 15
BP3 16
S0 17
S1 18
S2 19
S3 20
S4 21
S5 22
S6 23
S7 24
S8 25
S9 26
S10 27
S11 28
PCF8576T
MBK278
Fig.2 Pin configuration; SOT190-1.
6
2001 Oct 02
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6
FUNCTIONAL DESCRIPTION
The host microprocessor/microcontroller maintains the
2-line I2C-bus communication channel with the PCF8576.
The internal oscillator is selected by connecting pin OSC
to pin VSS. The appropriate biasing voltages for the
multiplexed LCD waveforms are generated internally. The
only other connections required to complete the system
are to the power supplies (VDD, VSS and VLCD) and the
LCD panel chosen for the application.
The PCF8576 is a versatile peripheral device designed to
interface to any microprocessor/microcontroller to a wide
variety of LCDs. It can directly drive any static or
multiplexed LCD containing up to four backplanes and up
to 40 segments. The display configurations possible with
the PCF8576 depend on the number of active backplane
outputs required; a selection of display configurations is
given in Table .
All of the display configurations given in Table can be
implemented in the typical system shown in Fig.3.
Selection of display configurations
14-SEGMENTS
ALPHANUMERIC
NUMBER OF
7-SEGMENTS NUMERIC
DOT MATRIX
INDICATOR
SYMBOLS
INDICATOR
SYMBOLS
BACKPLANES SEGMENTS
DIGITS
CHARACTERS
4
160
120
80
20
15
10
5
20
15
10
5
10
8
20
8
160 dots (4 × 40)
120 dots (3 × 40)
80 dots (2 × 40)
40 dots (1 × 40)
3
2
1
5
10
12
40
2
V
DD
t
r
R
2C
B
V
V
DD
LCD
5
12
SDA
SCL
OSC
HOST
1
2
6
17 to 56 40 segment drives
LCD PANEL
MICRO-
PROCESSOR/
MICRO-
PCF8576
(up to 160
elements)
4 backplanes
CONTROLLER
13 to 16
10 11
A0 A1 A2 SA0 V
7
8
9
R
MBK277
OSC
SS
V
SS
Fig.3 Typical system configuration.
2001 Oct 02
7
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.1
Power-on reset
6.3
LCD voltage selector
At power-on the PCF8576 resets to a starting condition as
follows:
The LCD voltage selector co-ordinates the multiplexing of
the LCD in accordance with the selected LCD drive
configuration. The operation of the voltage selector is
controlled by MODE SET commands from the command
decoder. The biasing configurations that apply to the
preferred modes of operation, together with the biasing
characteristics as functions of Vop = VDD − VLCD and the
resulting discrimination ratios (D), are given in Table 1.
1. All backplane outputs are set to VDD
2. All segment outputs are set to VDD
.
.
3. The drive mode ‘1 : 4 multiplex with 1⁄3bias’ is selected.
4. Blinking is switched off.
5. Input and output bank selectors are reset (as defined
in Table 4).
6. The I2C-bus interface is initialized.
A practical value for Vop is determined by equating Voff(rms)
with a defined LCD threshold voltage (Vth), typically when
the LCD exhibits approximately 10% contrast. In the static
drive mode a suitable choice is Vop > 3Vth approximately.
7. The data pointer and the subaddress counter are
cleared.
Multiplex drive ratios of 1 : 3 and 1 : 4 with 1⁄2bias are
possible but the discrimination and hence the contrast
Data transfers on the I2C-bus should be avoided for 1 ms
following power-on to allow completion of the reset action.
ratios are smaller ( 3 = 1.732 for 1 : 3 multiplex or
21
6.2
The full-scale LCD voltage (Vop) is obtained from
DD − VLCD. The LCD voltage may be temperature
compensated externally through the VLCD supply to pin 12.
Fractional LCD biasing voltages are obtained from an
internal voltage divider of the three series resistors
connected between VDD and VLCD. The centre resistor can
be switched out of the circuit to provide a 1⁄2bias voltage
level for the 1 : 2 multiplex configuration.
LCD bias generator
= 1.528 for 1 : 4 multiplex).
----------
3
V
The advantage of these modes is a reduction of the LCD
full-scale voltage Vop as follows:
• 1 : 3 multiplex (1⁄2bias):
Vop
=
6 × Voff rms = 2.449 Voff(rms)
• 1 : 4 multiplex (1⁄2bias):
(4 × 3)
---------------------
3
Vop
=
= 2.309 Voff(rms)
These compare with Vop = 3 Voff(rms) when 1⁄3bias is used.
Table 1 Preferred LCD drive modes: summary of characteristics
NUMBER OF
Voff(rms) V on(rms)
-------------------- --------------------
Vop Vop
V on(rms)
LCD BIAS
CONFIGURATION
D =
--------------------
Voff(rms)
LCD DRIVE MODE
BACKPLANES
LEVELS
static
1 : 2
1 : 2
1 : 3
1 : 4
1
2
2
3
4
2
3
4
4
4
static
0
1
∞
1
⁄
2
0.354
0.333
0.333
0.333
0.791
0.745
0.638
0.577
2.236
2.236
1.915
1.732
1
⁄
3
1
⁄
3
1
⁄
3
2001 Oct 02
8
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.4
LCD drive mode waveforms
When three backplanes are provided in the LCD, the 1 : 3
multiplex drive mode applies, as shown in Fig.7.
The static LCD drive mode is used when a single
backplane is provided in the LCD. Backplane and segment
drive waveforms for this mode are shown in Fig.4.
When four backplanes are provided in the LCD, the 1 : 4
multiplex drive mode applies, as shown in Fig.8.
When two backplanes are provided in the LCD, the 1 : 2
multiplex mode applies. The PCF8576 allows use of
1⁄2bias or 1⁄3bias in this mode as shown in Figs 5 and 6.
T
frame
LCD segments
V
DD
BP0
V
LCD
state 1
(on)
state 2
(off)
V
DD
S
n
V
LCD
V
DD
S
n
1
V
LCD
(a) waveforms at driver
V
op
0
state 1
V
op
V
op
state 2
0
V
op
(b) resultant waveforms
at LCD segment
MBE539
Vstate1(t) = VS (t) – VBP0(t)
n
Von(rms) = Vop
Vstate2(t) = VS (t) – VBP0(t)
n + 1
Voff(rms) = 0 V
Fig.4 Static drive mode waveforms (Vop = VDD − VLCD).
2001 Oct 02
9
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
T
frame
V
DD
LCD segments
(V
DD
V
V
)/2
)/2
BP0
LCD
LCD
V
LCD
DD
state 1
V
state 2
BP1 (V
V
DD
LCD
DD
V
S
n
V
V
LCD
DD
S
n
1
V
V
LCD
(a) waveforms at driver
op
V
/2
/2
op
0
state 1
V
V
op
op
V
op
V
/2
/2
op
0
state 2
V
V
op
op
(b) resultant waveforms
at LCD segment
MBE540
Vstate1(t) = VS (t) – VBP0(t)
n
Von(rms) = 0.791Vop
Vstate2(t) = VS (t) – VBP1(t)
n
Voff(rms) = 0.354Vop
Fig.5 Waveforms for the 1 : 2 multiplex drive mode with 1⁄2bias (Vop = VDD − VLCD).
2001 Oct 02
10
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
T
frame
V
DD
LCD segments
V
V
/3
op
2V /3
DD
BP0
BP1
V
V
op
DD
LCD
state 1
V
V
DD
state 2
V
/3
op
2V /3
DD
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
1
V
V
op
DD
LCD
(a) waveforms at driver
V
op
2V /3
op
V
/3
0
op
state 1
V
/3
op
2V /3
op
V
op
V
op
2V /3
op
V
V
/3
0
/3
op
state 2
op
2V /3
op
V
op
(b) resultant waveforms
at LCD segment
MBE541
Vstate1(t) = VS (t) – VBP0(t)
n
Von(rms) = 0.745Vop
Vstate2(t) = VS (t) – VBP1(t)
n
Voff(rms) = 0.333Vop
Fig.6 Waveforms for the 1 : 2 multiplex drive mode with 1⁄3bias (Vop = VDD − VLCD).
2001 Oct 02
11
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
T
frame
V
DD
LCD segments
V
V
/3
op
2V /3
DD
BP0
BP1
V
V
op
DD
LCD
state 1
state 2
V
V
DD
V
/3
op
2V /3
DD
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
BP2/S23
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
n
1
2
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
V
V
op
DD
LCD
(a) waveforms at driver
V
op
2V /3
op
V
/3
0
op
state 1
V
/3
op
2V /3
op
V
op
V
op
2V /3
op
V
V
/3
0
/3
op
state 2
op
2V /3
op
V
op
(b) resultant waveforms
at LCD segment
MBE542
Vstate1(t) = VS (t) – VBP0(t)
n
Von(rms) = 0.638Vop
Vstate2(t) = VS (t) – VBP1(t)
n
Voff(rms) = 0.333Vop
Fig.7 Waveforms for the 1 : 3 multiplex drive mode (Vop = VDD − VLCD).
2001 Oct 02
12
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
T
frame
V
LCD segments
DD
V
V
/3
op
2V /3
DD
BP0
BP1
BP2
BP3
V
V
op
DD
LCD
state 1
state 2
V
V
DD
V
/3
op
2V /3
DD
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
n
n
n
1
2
3
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
S
S
V
V
op
DD
LCD
V
V
DD
V
/3
op
2V /3
DD
V
V
op
DD
LCD
(a) waveforms at driver
V
op
2V /3
op
V
/3
0
op
state 1
V
/3
op
2V /3
op
V
op
V
op
2V /3
op
V
V
/3
0
/3
op
op
state 2
Vstate1(t) = VS (t) – VBP0(t)
n
Von(rms) = 0.577Vop
2V /3
op
V
op
Vstate2(t) = VS (t) – VBP1(t)
(b) resultant waveforms
at LCD segment
n
MBE543
Voff(rms) = 0.333Vop
Fig.8 Waveforms for the 1 : 4 multiplex drive mode (Vop = VDD − VLCD).
2001 Oct 02
13
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.5
Oscillator
6.6
Timing
6.5.1
INTERNAL CLOCK
The timing of the PCF8576 organizes the internal data flow
of the device. This includes the transfer of display data
from the display RAM to the display segment outputs. In
cascaded applications, the synchronization signal SYNC
maintains the correct timing relationship between the
PCF8576s in the system. The timing also generates the
LCD frame frequency which it derives as an integer
multiple of the clock frequency (see Table 2). The frame
frequency is set by the MODE SET commands when
internal clock is used, or by the frequency applied to
pin CLK when external clock is used.
The internal logic and the LCD drive signals of the
PCF8576 are timed either by the internal oscillator or from
an external clock. When the internal oscillator is used,
pin OSC should be connected to pin VSS. In this event, the
output from pin CLK provides the clock signal for
cascaded PCF8566s in the system.
Where resistor Rosc to VSS is present, the internal oscillator
is selected. The relationship between the oscillator
frequency on pin CLK (fclk) and Rosc is shown in Fig.9.
The ratio between the clock frequency and the LCD frame
frequency depends on the mode in which the device is
operating. In the power-saving mode the reduction ratio is
six times smaller; this allows the clock frequency to be
reduced by a factor of six. The reduced clock frequency
results in a significant reduction in power dissipation. The
lower clock frequency has the disadvantage of increasing
the response time when large amounts of display data are
transmitted on the I2C-bus.
MBE531
3
10
f
clk
(kHz)
max
When a device is unable to digest a display data byte
before the next one arrives, it holds the SCL line LOW until
the first display data byte is stored. This slows down the
transmission rate of the I2C-bus but no data loss occurs.
2
10
min
Table 2 LCD frame frequencies
NOMINAL
10
10
FRAME
FREQUENCY
FRAME
FREQUENCY
(Hz)
2
3
4
10
R
(kΩ)
10
PCF8576 MODE
osc
3.4 × 107
-----------------------
Rosc
fclk
fclk
≈
(kHz)
Normal mode
64
64
------------
2880
f clk
Fig.9 Oscillator frequency as a function of Rosc
.
Power-saving mode
---------
480
6.5.2
EXTERNAL CLOCK
6.7
Display latch
The condition for external clock is made by connecting
pin OSC to pin VDD; pin CLK then becomes the external
clock input.
The display latch holds the display data while the
corresponding multiplex signals are generated. There is a
one-to-one relationship between the data in the display
latch, the LCD segment outputs and one column of the
display RAM.
The clock frequency (fclk) determines the LCD frame
frequency and the maximum rate for data reception from
the I2C-bus. To allow I2C-bus transmissions at their
maximum data rate of 100 kHz, fclk should be chosen to be
above 125 kHz.
6.8
Shift register
The shift register serves to transfer display information
from the display RAM to the display latch while previous
data is displayed.
A clock signal must always be supplied to the device;
removing the clock may freeze the LCD in a DC state.
2001 Oct 02
14
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.9
Segment outputs
correspondence between the RAM addresses and the
segment outputs, and between the individual bits of a RAM
word and the backplane outputs. The first RAM column
corresponds to the 40 segments operated with respect to
backplane BP0 (see Fig.10). In multiplexed LCD
applications the segment data of the second, third and
fourth column of the display RAM are time-multiplexed
with BP1, BP2 and BP3 respectively.
The LCD drive section includes 40 segment outputs
pins S0 to S39 which should be connected directly to the
LCD. The segment output signals are generated in
accordance with the multiplexed backplane signals and
with data resident in the display latch. When less than
40 segment outputs are required the unused segment
outputs should be left open-circuit.
When display data is transmitted to the PCF8576 the
display bytes received are stored in the display RAM in
accordance with the selected LCD drive mode. To
illustrate the filling order, an example of a 7-segment
numeric display showing all drive modes is given in Fig.11;
the RAM filling organization depicted applies equally to
other LCD types.
6.10 Backplane outputs
The LCD drive section includes four backplane outputs
BP0 to BP3 which should be connected directly to the
LCD. The backplane output signals are generated in
accordance with the selected LCD drive mode. If less than
four backplane outputs are required the unused outputs
can be left open-circuit. In the 1 : 3 multiplex drive mode
BP3 carries the same signal as BP1, therefore these two
adjacent outputs can be connected together to give
enhanced drive capabilities. In the 1 : 2 multiplex drive
mode BP0 and BP2, BP1 and BP3 respectively carry the
same signals and may also be paired to increase the drive
capabilities. In the static drive mode the same signal is
carried by all four backplane outputs and they can be
connected in parallel for very high drive requirements.
With reference to Fig.11, in the static drive mode the eight
transmitted data bits are placed in bit 0 of eight successive
display RAM addresses. In the 1 : 2 multiplex drive mode
the eight transmitted data bits are placed in bits 0 and 1 of
four successive display RAM addresses. In the 1 : 3
multiplex drive mode these bits are placed in
bits 0, 1 and 2 of three successive addresses, with bit 2 of
the third address left unchanged. This last bit may, if
necessary, be controlled by an additional transfer to this
address but care should be taken to avoid overriding
adjacent data because full bytes are always transmitted. In
the 1 : 4 multiplex drive mode the eight transmitted data
bits are placed in bits 0, 1, 2 and 3 of two successive
display RAM addresses.
6.11 Display RAM
The display RAM is a static 40 × 4-bit RAM which stores
LCD data. A logic 1 in the RAM bit-map indicates the on
state of the corresponding LCD segment; similarly, a
logic 0 indicates the off state. There is a one-to-one
display RAM addresses (rows) / segment outputs (S)
0
1
2
3
4
35 36 37 38 39
0
1
2
3
display RAM bits
(columns) /
backplane outputs
(BP)
MBE525
Fig.10 Display RAM bit-map showing direct relationship between display RAM addresses and segment outputs,
and between bits in a RAM word and backplane outputs.
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.12 Data pointer
6.14 Output bank selector
The addressing mechanism for the display RAM is
realized using the data pointer. This allows the loading of
an individual display data byte, or a series of display data
bytes, into any location of the display RAM. The sequence
commences with the initialization of the data pointer by the
LOAD DATA POINTER command. Following this, an
arriving data byte is stored starting at the display RAM
address indicated by the data pointer thereby observing
the filling order shown in Fig.11. The data pointer is
automatically incremented in accordance with the chosen
LCD configuration. That is, after each byte is stored, the
contents of the data pointer are incremented by eight
(static drive mode), by four (1 : 2 multiplex drive mode) or
by two (1 : 4 multiplex drive mode).
This selects one of the four bits per display RAM address
for transfer to the display latch. The actual bit chosen
depends on the particular LCD drive mode in operation
and on the instant in the multiplex sequence. In 1 : 4
multiplex, all RAM addresses of bit 0 are the first to be
selected, these are followed by the contents of bit 1, bit 2
and then bit 3. Similarly in 1 : 3 multiplex, bits 0, 1 and 2
are selected sequentially. In 1 : 2 multiplex, bits 0 and 1
are selected and, in the static mode, bit 0 is selected.
The PCF8576 includes a RAM bank switching feature in
the static and 1 : 2 multiplex drive modes. In the static
drive mode, the BANK SELECT command may request
the contents of bit 2 to be selected for display instead of
bit 0 contents. In the 1 : 2 drive mode, the contents of
bits 2 and 3 may be selected instead of bits 0 and 1. This
gives the provision for preparing display information in an
alternative bank and to be able to switch to it once it is
assembled.
6.13 Subaddress counter
The storage of display data is conditioned by the contents
of the subaddress counter. Storage is allowed to take
place only when the contents of the subaddress counter
agree with the hardware subaddress applied to A0, A1
and A2. The subaddress counter value is defined by the
DEVICE SELECT command. If the contents of the
subaddress counter and the hardware subaddress do not
agree then data storage is inhibited but the data pointer is
incremented as if data storage had taken place. The
subaddress counter is also incremented when the data
pointer overflows.
6.15 Input bank selector
The input bank selector loads display data into the display
RAM in accordance with the selected LCD drive
configuration. Display data can be loaded in bit 2 in static
drive mode or in bits 2 and 3 in 1 : 2 drive mode by using
the BANK SELECT command. The input bank selector
functions independent of the output bank selector.
The storage arrangements described lead to extremely
efficient data loading in cascaded applications. When a
series of display bytes are sent to the display RAM,
automatic wrap-over to the next PCF8576 occurs when
the last RAM address is exceeded. Subaddressing across
device boundaries is successful even if the change to the
next device in the cascade occurs within a transmitted
character (such as during the 14th display data byte
transmitted in 1 : 3 multiplex mode).
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
6.16 Blinker
bank selector, the displayed RAM banks are exchanged
with alternate RAM banks at the blinking frequency. This
mode can also be specified by the BLINK command.
The display blinking capabilities of the PCF8576 are very
versatile. The whole display can be blinked at frequencies
selected by the BLINK command. The blinking frequencies
are integer multiples of the clock frequency; the ratios
between the clock and blinking frequencies depend on the
mode in which the device is operating, as shown in
Table 3.
In the 1 : 3 and 1 : 4 multiplex modes, where no alternate
RAM bank is available, groups of LCD segments can be
blinked by selectively changing the display RAM data at
fixed time intervals.
If the entire display is to be blinked at a frequency other
than the nominal blinking frequency, this can be effectively
performed by resetting and setting the display enable bit E
at the required rate using the MODE SET command.
An additional feature is for an arbitrary selection of LCD
segments to be blinked. This applies to the static and
1 : 2 LCD drive modes and can be implemented without
any communication overheads. By means of the output
Table 3 Blinking frequencies
NORMAL OPERATING
BLINKING MODE
POWER-SAVING MODE
RATIO
NOMINAL BLINKING
FREQUENCY
MODE RATIO
Off
−
−
blinking off
fclk
f clk
2 Hz
2 Hz
----------------
92160
----------------
15360
f clk
f clk
1 Hz
1 Hz
-------------------
184320
----------------
30720
f clk
f clk
0.5 Hz
0.5 Hz
-------------------
368640
----------------
61440
2001 Oct 02
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drive mode
LCD segments
LCD backplanes
display RAM filling order
transmitted display byte
a
S
2
n
n
1
n
2
n
3
n
4
n
5
n
6
n 7
n
n
b
BP0
f
S
1
7
S
3
MSB
LSB
DP
n
n
0
1
2
3
c
x
x
x
b
x
x
x
a
x
x
x
f
g
x
x
x
e
x
x
x
d
x
x
x
DP
bit/
BP
g
4
S
S
S
n
n
x
x
x
x
x
x
c
b
a
f
g e d
static
e
S
5
6
c
n
d
DP
S
n
BP0
S
n
a
n
n
n
n
1
1
1
n
2
n 3
b
b
b
1 : 2
f
S
1
n
MSB
LSB
DP
0
1
2
3
a
b
x
x
f
e
c
x
x
d
bit/
BP
g
g
x
x
DP
x
x
a
b
f
g
e c d
BP1
S
S
e
2
3
multiplex
n
n
c
c
c
d
d
d
DP
BP0
BP1
S
1
a
n
n
n 2
S
S
2
f
1 : 3
n
n
MSB
LSB
e
0
1
2
3
b
DP
c
a
d
g
x
f
bit/
BP
g
e
x
x
BP2
b DP
c
a
d
g
f
e
multiplex
x
DP
S
n
a
n
BP2
BP3
BP0
BP1
f
1 : 4
0
1
2
3
a
c
f
bit/
BP
MSB
LSB
d
g
e
g
d
b
DP
e
multiplex
a
c
b
DP f
e
g
S
1
DP
n
MBK389
x = data bit unchanged.
Fig.11 Relationships between LCD layout, drive mode, display RAM filling order and display data transmitted over the I2C-bus.
ahdnbok,uflapegwidt
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
7
CHARACTERISTICS OF THE I2C-BUS
7.5
PCF8576 I2C-bus controller
The I2C-bus is for bidirectional, two-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.
The PCF8576 acts as an I2C-bus slave receiver. It does
not initiate I2C-bus transfers or transmit data to an I2C-bus
master receiver. The only data output from the PCF8576
are the acknowledge signals of the selected devices.
Device selection depends on the I2C-bus slave address,
on the transferred command data and on the hardware
subaddress.
In single device application, the hardware subaddress
inputs A0, A1 and A2 are normally connected to VSS which
defines the hardware subaddress 0. In multiple device
applications A0, A1 and A2 are connected to VSS or VDD in
accordance with a binary coding scheme such that no two
devices with a common I2C-bus slave address have the
same hardware subaddress.
7.1
Bit transfer (see Fig.12)
One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the HIGH
period of the clock pulse as changes in the data line at this
time will be interpreted as a control signal.
7.2
START and STOP conditions (see Fig.13)
In the power-saving mode it is possible that the PCF8576
is not able to keep up with the highest transmission rates
when large amounts of display data are transmitted. If this
situation occurs, the PCF8576 forces the SCL line to LOW
until its internal operations are completed. This is known
as the ‘clock synchronization feature’ of the I2C-bus and
serves to slow down fast transmitters. Data loss does not
occur.
Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is
HIGH is defined as the STOP condition (P).
7.3
System configuration (see Fig.14)
A device generating a message is a ‘transmitter’, a device
receiving a message is the ‘receiver’. The device that
controls the message is the ‘master’ and the devices which
are controlled by the master are the ‘slaves’.
7.6
Input filters
To enhance noise immunity in electrically adverse
environments, RC low-pass filters are provided on the
SDA and SCL lines.
7.4
Acknowledge (see Fig.15)
7.7
I2C-bus protocol
The number of data bytes transferred between the START
and STOP conditions from transmitter to receiver is
unlimited. Each byte of eight bits is followed by an
acknowledge bit. The acknowledge bit is a HIGH level
signal put on the bus by the transmitter during which time
the master generates an extra acknowledge related clock
pulse. A slave receiver which is addressed must generate
an acknowledge after the reception of each byte. Also a
master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the
slave transmitter. The device that acknowledges must
pull-down the SDA line during the acknowledge clock
pulse, so that the SDA line is stable LOW during the HIGH
period of the acknowledge related clock pulse (set-up and
hold times must be taken into consideration). A master
receiver must signal an end of data to the transmitter by
not generating an acknowledge on the last byte that has
been clocked out of the slave. In this event the transmitter
must leave the data line HIGH to enable the master to
generate a STOP condition.
Two I2C-bus slave addresses (0111000 and 0111001) are
reserved for the PCF8576. The least significant bit of the
slave address that a PCF8576 will respond to is defined by
the level connected at its input pin SA0. Therefore, two
types of PCF8576 can be distinguished on the same
I2C-bus which allows:
• Up to 16 PCF8576s on the same I2C-bus for very large
LCD applications
• The use of two types of LCD multiplex on the same
I2C-bus.
The I2C-bus protocol is shown in Fig.16. The sequence is
initiated with a START condition (S) from the I2C-bus
master which is followed by one of the two PCF8576 slave
addresses available. All PCF8576s with the corresponding
SA0 level acknowledge in parallel with the slave address
but all PCF8576s with the alternative SA0 level ignore the
whole I2C-bus transfer.
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
After acknowledgement, one or more command bytes (m)
follow which define the status of the addressed PCF8576s.
7.8
Command decoder
The command decoder identifies command bytes that
arrive on the I2C-bus. All available commands carry a
continuation bit C in their most significant bit position
(Fig.17). When this bit is set, it indicates that the next byte
of the transfer to arrive will also represent a command. If
this bit is reset, it indicates the last command byte of the
transfer. Further bytes will be regarded as display data.
The last command byte is tagged with a cleared most
significant bit, the continuation bit C. The command bytes
are also acknowledged by all addressed PCF8576s on the
bus.
After the last command byte, a series of display data bytes
(n) may follow. These display bytes are stored in the
display RAM at the address specified by the data pointer
and the subaddress counter. Both data pointer and
subaddress counter are automatically updated and the
data is directed to the intended PCF8576 device. The
acknowledgement after each byte is made only by the (A0,
A1 and A2) addressed PCF8576. After the last display
byte, the I2C-bus master issues a STOP condition (P).
The five commands available to the PCF8576 are defined
in Table 4.
SDA
SCL
data line
stable;
data valid
change
of data
allowed
MBA607
Fig.12 Bit transfer.
SDA
SCL
SDA
SCL
S
P
STOP condition
START condition
MBC622
Fig.13 Definition of START and STOP conditions.
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
MASTER
TRANSMITTER/
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER
SDA
SCL
MGA807
Fig.14 System configuration.
DATA OUTPUT
BY TRANSMITTER
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
8
SCL FROM
MASTER
1
2
9
S
clock pulse for
acknowledgement
START
condition
MBC602
Fig.15 Acknowledgement on the I2C-bus.
21
2001 Oct 02
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
acknowledge
by A0, A1 and A2
selected
acknowledge by
all addressed
PCF8576s
R / W
PCF8576 only
slave address
S
A
0
0
1
1
1
0
0
0
A C
A
DISPLAY DATA
A
P
COMMAND
S
1 byte
n
1 byte(s)
n
0 byte(s)
update data pointers
and if necessary,
subaddress counter
MBK279
Fig.16 I2C-bus protocol.
MSB
LSB
C
REST OF OPCODE
MSA833
C = 0; last command.
C = 1; commands continue.
Fig.17 General format of command byte.
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
Table 4 Definition of PCF8576 commands
COMMAND
OPCODE
LP
OPTIONS
DESCRIPTION
MODE SET C 1
0
E
B
M1 M0
Table 5 Defines LCD drive mode.
Table 6 Defines LCD bias configuration.
Table 7 Defines display status. The possibility to disable the
display allows implementation of blinking under
external control.
Table 8 Defines power dissipation mode.
LOAD DATA C 0 P5 P4 P3 P2 P1 P0
POINTER
Table 9 Six bits of immediate data, bits P5 to P0, are
transferred to the data pointer to define one of forty
display RAM addresses.
DEVICE
SELECT
C 1
C 1
1
1
0
1
0
1
A2 A1 A0
Table 10 Three bits of immediate data, bits A2 to A0, are
transferred to the subaddress counter to define one of
eight hardware subaddresses.
BANK
SELECT
0
I
O
Table 11 Defines input bank selection (storage of arriving
display data).
Table 12 Defines output bank selection (retrieval of LCD display
data). The BANK SELECT command has no effect in
1 : 3 and 1 : 4 multiplex drive modes.
BLINK
C 1
1
1
0
A
BF1 BF0 Table 13 Defines the blinking frequency.
Table 14 Selects the blinking mode; normal operation with
frequency set by BF1, BF0 or blinking by alternation of
display RAM banks. Alternation blinking does not
apply in 1 : 3 and 1 : 4 multiplex drive modes.
Table 5 MODE SET option 1
Table 8 MODE SET option 4
LCD DRIVE MODE
BITS
MODE
Normal mode
Power-saving mode
BIT LP
0
1
DRIVE MODE
BACKPLANE
1 BP
M1
M0
Static
1 : 2
1 : 3
1 : 4
0
1
1
0
1
0
1
0
MUX (2 BP)
MUX (3 BP)
MUX (4 BP)
Table 9 LOAD DATA POINTER option 1
DESCRIPTION
BITS
6-bit binary value of 0 to 39 P5 P4 P3 P2 P1 P0
Table 6 MODE SET option 2
Table 10 DEVICE SELECT option 1
LCD BIAS
1⁄3bias
1⁄2bias
BIT B
DESCRIPTION
BITS
0
1
3-bit binary value of 0 to 7
A2
A1
A0
Table 11 BANK SELECT option 1
Table 7 MODE SET option 3
STATIC
RAM bit 0
RAM bit 2
1 : 2 MUX
BIT I
DISPLAY STATUS
BIT E
RAM bits 0 and 1
RAM bits 2 and 3
0
1
Disabled (blank)
Enabled
0
1
2001 Oct 02
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Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
Table 12 BANK SELECT option 2
7.10 Cascaded operation
In large display configurations, up to 16 PCF8576s can be
distinguished on the same I2C-bus by using the 3-bit
hardware subaddress (A0, A1 and A2) and the
STATIC
RAM bit 0
RAM bit 2
1 : 2 MUX
BIT O
RAM bits 0 and 1
RAM bits 2 and 3
0
1
programmable I2C-bus slave address (SA0). When
cascaded PCF8576s are synchronized so that they can
share the backplane signals from one of the devices in the
cascade. Such an arrangement is cost-effective in large
LCD applications since the backplane outputs of only one
device need to be through-plated to the backplane
electrodes of the display. The other PCF8576s of the
cascade contribute additional segment outputs but their
backplane outputs are left open-circuit (see Fig.18).
Table 13 BLINK option 1
BITS
BLINK FREQUENCY
BF1
BF0
Off
0
0
1
1
0
1
0
1
2 Hz
1 Hz
0.5 Hz
The SYNC line is provided to maintain the correct
synchronization between all cascaded PCF8576s. This
synchronization is guaranteed after the Power-on reset.
The only time that SYNC is likely to be needed is if
synchronization is accidentally lost (e.g. by noise in
adverse electrical environments; or by the definition of a
multiplex mode when PCF8576s with differing SA0 levels
are cascaded). SYNC is organized as an input/output pin;
the output selection being realized as an open-drain driver
with an internal pull-up resistor. A PCF8576 asserts the
SYNC line at the onset of its last active backplane signal
and monitors the SYNC line at all other times. Should
synchronization in the cascade be lost, it will be restored
by the first PCF8576 to assert SYNC. The timing
relationship between the backplane waveforms and the
SYNC signal for the various drive modes of the PCF8576
are shown in Fig.19.
Table 14 BLINK option 2
BLINK MODE
Normal blinking
BIT A
0
1
Alternation blinking
7.9
Display controller
The display controller executes the commands identified
by the command decoder. It contains the status registers
of the PCF8576 and co-ordinates their effects. The
controller is also responsible for loading display data into
the display RAM as required by the filling order.
For single plane wiring of packaged PCF8576s and
chip-on-glass cascading, see Chapter 12.
2001 Oct 02
24
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
V
V
LCD
DD
SDA
SCL
5
12
1
2
40 segment drives
17 to 56
LCD PANEL
SYNC
CLK
3
4
6
PCF8576
(up to 2560
elements)
13, 15
14, 16
OSC
BP0 to BP3
(open-circuit)
7
8
9
10 11
A0 A1 A2 SA0 V
SS
V
V
LCD
t
DD
r
R
V
V
2C
DD
LCD
B
5
12
SDA
1
HOST
MICRO-
PROCESSOR/
MICRO-
40 segment drives
17 to 56
SCL
2
PCF8576
SYNC
3
4
6
13, 15
14, 16
4 backplanes
BP0 to BP3
CONTROLLER
CLK
OSC
MBK280
7
8
9
10 11
A0 A1 A2 SA0 V
V
SS
SS
Fig.18 Cascaded PCF8576 configuration.
2001 Oct 02
25
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
1
T
= f
frame
frame
BP0
SYNC
(a) static drive mode.
BP1
(1/2 bias)
BP1
(1/3 bias)
SYNC
(b) 1 : 2 multiplex drive mode.
BP2
SYNC
(c) 1 : 3 multiplex drive mode.
BP3
SYNC
MBE535
(d) 1 : 4 multiplex drive mode.
Excessive capacitive coupling between SCL or CLK and SYNC may cause erroneous synchronization. If this proves to be a problem, the capacitance
of the SYNC line should be increased (e.g. by an external capacitor between SYNC and VDD). Degradation of the positive edge of the SYNC pulse may
be countered by an external pull-up resistor.
Fig.19 Synchronization of the cascade for the various PCF8576 drive modes.
2001 Oct 02
26
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
8
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER
VDD
MIN.
MAX.
+11.0
DD − 11.0 VDD
UNIT
supply voltage
−0.5
V
V
V
V
VLCD
VI
LCD supply voltage
V
V
V
−
−
−
−
−
input voltage SDA, SCL, CLK, SYNC, SA0, OSC, A0 to A2
output voltage S0 to S39, BP0 to BP3
DC input current
SS − 0.5
VDD + 0.5
VO
II
LCD − 0.5 VDD + 0.5
20
mA
mA
mA
mW
mW
°C
IO
DC output current
25
IDD, ISS, ILCD VDD, VSS or VLCD current
50
Ptot
PO
Tstg
total power dissipation
power dissipation per output
storage temperature
400
100
−65
+150
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
2001 Oct 02
27
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
10 DC CHARACTERISTICS
VDD = 2 to 9 V; VSS = 0 V; VLCD = VDD − 2 V to VDD − 9 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
Supplies
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
VLCD
IDD
supply voltage
2
−
9
V
LCD supply voltage
supply current
note 1
note 2
V
DD − 9
−
V
DD − 2
V
normal mode
f
clk = 200 kHz
clk = 35 kHz; VDD = 3.5 V;
−
−
−
−
180
60
µA
µA
power-saving mode
f
VLCD = 0 V; A0, A1 and A2
connected to VSS
Logic
VIL
LOW-level input voltage
HIGH-level input voltage
LOW-level output voltage
HIGH-level output voltage
VSS
0.7VDD
−
−
−
−
0.3VDD
VDD
0.05
−
V
VIH
V
VOL
VOH
IOL1
IOL = 0 mA
V
IOH = 0 mA
VDD − 0.05 −
V
LOW-level output current
CLK, SYNC
VOL = 1 V; VDD = 5 V
1
−
−
mA
IOH1
IOL2
HIGH-level output current CLK
VOH = 4 V; VDD = 5 V
VOL = 0.4 V; VDD = 5 V
1
3
−
−
−
−
mA
mA
LOW-level output current
SDA and SCL
IL1
leakage current SA0, A0 to A2,
CLK, SDA and SCL
VI = VDD or VSS
−
−
−
1
µA
IL2
Ipd
leakage current OSC
VI = VDD
−
1
µA
µA
A0, A1, A2 and OSC pull-down
current
VI = 1 V; VDD = 5 V
20
50
150
RSYNC
VPOR
CI
pull-up resistor (SYNC)
Power-on reset voltage level
input capacitance
20
−
50
1.0
−
150
1.6
7
kΩ
V
note 3
note 4
−
pF
LCD outputs
VBP
VS
DC voltage component BP0 to BP3 CBP = 35 nF
−
−
−
−
20
20
−
−
mV
mV
kΩ
kΩ
DC voltage component S0 to S39
output resistance BP0 to BP3
output resistance S0 to S39
CS = 5 nF
−
RBP
RS
note 5; VLCD = VDD − 5 V
note 5; VLCD = VDD − 5 V
5
−
7.5
Notes
1. VLCD ≤ VDD − 3 V for 1⁄3bias.
2. LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50% duty factor; I2C-bus inactive.
3. Resets all logic when VDD < VPOR
.
4. Periodically sampled, not 100% tested.
5. Outputs measured one at a time.
2001 Oct 02
28
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
11 AC CHARACTERISTICS
VDD = 2 to 9 V; VSS = 0 V; VLCD = VDD − 2 V to VDD − 9 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
fclk
oscillator frequency on pin CLK
normal mode
V
DD = 5 V; note 1
DD = 3.5 V
125
21
1
200
31
−
288
48
−
kHz
kHz
µs
power-saving mode
CLK HIGH time
V
tclkH
see Fig.21
tclkL
CLK LOW time
1
−
−
µs
tPSYNC
tSYNCL
tPLCD
SYNC propagation delay time
SYNC LOW time
−
−
400
−
ns
1
−
µs
driver delays with test loads
VLCD = VDD − 5 V; see Fig.20
−
−
30
µs
Timing characteristics: I2C-bus; note 2; see Fig.22
tSW
tolerable spike width on bus
bus free time
−
−
−
−
−
−
−
−
−
−
−
−
−
100
−
ns
µs
µs
µs
µs
µs
µs
µs
pF
ns
ns
µs
tBUF
4.7
4.0
4.7
4.7
4.0
−
tHD;STA
tSU;STA
tLOW
tHIGH
tr
START condition hold time
set-up time for a repeated START condition
SCL LOW time
−
−
−
SCL HIGH time
−
SCL and SDA rise time
SCL and SDA fall time
capacitive bus line load
data set-up time
1
tf
−
0.3
400
−
CB
−
tSU;DAT
tHD;DAT
tSU;STO
250
0
data hold time
−
set-up time for STOP condition
4.0
−
Notes
1. At fclk < 125 kHz, I2C-bus maximum transmission speed is derated.
2. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to
VIL and VIH with an input voltage swing of VSS to VDD
.
6.8 Ω
SYNC
CLK
V
DD
(2%)
3.3 kΩ
1.5 kΩ
SDA,
SCL
V
0.5V
DD
DD
(2%)
(2%)
1 nF
BP0 to BP3, and
S0 to S39
V
DD
MBE544
Fig.20 Test loads.
29
2001 Oct 02
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
1/ f
clk
t
t
clkL
clkH
0.7V
0.3V
DD
CLK
DD
0.7V
0.3V
DD
SYNC
DD
t
t
PSYNC
PSYNC
SYNCL
t
0.5 V
BP0 to BP3,
and S0 to S39
(V
= 5 V)
DD
0.5 V
t
PLCD
MBE545
Fig.21 Driver timing waveforms.
SDA
SCL
SDA
t
t
t
f
BUF
LOW
t
t
t
SU;DAT
t
HD;STA
r
t
HIGH
HD;DAT
t
SU;STA
MGA728
t
SU;STO
Fig.22 I2C-bus timing waveforms.
30
2001 Oct 02
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
11.1 Typical supply current characteristics
MBE529
MBE530
50
50
40
I
I
SS
(µA)
LCD
(µA)
normal
mode
40
30
20
30
20
power-saving
mode
10
0
10
0
0
100
200
f
(Hz)
0
100
200
f
(Hz)
frame
frame
VDD = 5 V; VLCD = 0 V; Tamb = 25 °C.
VDD = 5 V; VLCD = 0 V; Tamb = 25 °C.
Fig.23 −ISS as a function of fframe
.
Fig.24 −ILCD as a function of fframe.
MBE528 - 1
MBE527 - 1
50
50
handbook, halfpage
handbook, halfpage
I
I
LCD
(µA)
SS
(µA)
normal mode
= 200 kHz
40
40
85oC
f
clk
30
20
30
20
25oC
40oC
power-saving mode
10
f
= 35 kHz
10
clk
0
0
0
0
5
10
5
10
V
(V)
V
(V)
DD
DD
VLCD = 0 V; external clock; Tamb = 25 °C.
VLCD = 0 V; external clock; fclk = nominal frequency.
Fig.25 ISS as a function of VDD
.
Fig.26 ILCD as a function of VDD.
2001 Oct 02
31
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
11.2 Typical characteristics of LCD outputs
MBE532 - 1
MBE526
2.5
2.0
10
handbook, halfpage
R
R
S
O(max)
(kΩ)
R
O(max)
(kΩ)
R
S
1.5
1.0
1
R
R
BP
BP
0.5
0
-1
10
40
0
40
80
120
( C)
amb
0
3
6
o
V
(V)
DD
T
VLCD = 0 V; Tamb = 25 °C.
VDD = 5 V; VLCD = 0 V.
Fig.27 RO(max) as a function of VDD
.
Fig.28 RO(max) as a function of Tamb
.
2001 Oct 02
32
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g
SDA
SCL
SYNC
CLK
V
DD
V
SS
V
LCD
SDA
SCL
1
2
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
S39
S38
S37
S36
S35
S34
S33
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
1
2
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
S79
S78
S77
S76
S75
S74
S73
S72
S71
S70
S69
S68
S67
S66
S65
S64
S63
S62
S61
SYNC
CLK
3
3
4
4
V
5
5
DD
OSC
A0
6
6
7
7
A1
8
8
A2
9
9
SA0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
V
SS
V
LCD
BP0
BP2
BP1
BP3
S0
BP0
BP2
BP1
BP3
S40
S41
S42
S43
open
PCF8576T
PCF8576T
S1
S2
S3
34
33
32
31
30
29
S17
S16
S15
34
33
32
31
30
29
S57
S56
S55
S7
S8
24
25
26
27
28
S47
S48
S49
S50
S51
24
25
26
27
28
S9
S14
S13
S12
S54
S53
S52
S10
S11
S0
S10
S11
S12
S13
S39
S40
S50
S51
S52
S53
S79
MBK281
backplanes
segments
Fig.29 Single plane wiring of packaged PCF8576Ts.
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
12.1 Chip-on-glass cascadability in single plane
and the backplane output pads. The only bus line that does
not require a second opening to lead through to the next
PCF8576 is VLCD, being the cascade centre. The placing
of VLCD adjacent to VSS allows the two supplies to be
connected together.
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576 bonding pad layout (see Fig.30). Pads needing
bus interconnection between all PCF8576s of the cascade
are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These
lines may be led to the corresponding pads of the next
PCF8576 through the wide opening between VLCD pad
When an external clocking source is to be used, OSC of all
devices should be connected to VDD. The pads OSC,
A0, A1, A2 and SA0 have been placed between
VSS and VDD to facilitate wiring of oscillator, hardware
subaddress and slave address.
13 BONDING PAD INFORMATION
34
35
36
33 32 31 30 29 28 27 26 25 24
23
22
21
20
19
18
17
16
15
14
13
S3
S18
S19
S2
S1
37
38
39
40
41
42
S20
S21
S22
S23
S24
S25
S0
BP3
BP1
BP2
BP0
x
4.12
mm
0
0
y
43
44
45
46
47
48
S26
S27
S28
S29
S30
S31
PCF8576
cascade
centre
V
12
11
10
9
LCD
V
SS
49
50
51
S32
S33
SA0
A2
52 53 54 55 56
1
2
3
4
5
6
7
8
3.07 mm
MBK282
Bonding pad dimensions: 120 × 120 µm.
Gold bump dimensions: 94 × 94 × 25 µm.
Fig.30 Bonding pad locations.
34
2001 Oct 02
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
Table 15 Bonding pad locations (dimensions in µm)
COORDINATES
All x and y coordinates are referenced to centre of chip
(see Fig.30).
SYMBOL
S13
PAD
x
y
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
−555
−755
1900
1900
1900
1900
1900
1660
1420
1200
1000
800
COORDINATES
SYMBOL
SDA
PAD
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
x
y
−955
1
−155
45
−1900
−1900
−1900
−1900
−1900
−1900
−1900
−1900
−1700
−1500
−1300
−1100
300
−1155
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1375
−1155
−955
SCL
SYNC
CLK
VDD
OSC
A0
2
3
245
4
445
5
645
6
865
7
1105
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1105
865
A1
8
600
A2
9
400
SA0
VSS
VLCD
BP0
BP2
BP1
BP3
S0
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
200
−200
−400
−600
−800
−1000
−1200
−1420
−1660
−1900
−1900
−1900
−1900
−1900
−900
500
700
900
1100
1300
1500
1700
1900
1900
1900
1900
1900
1900
1900
1900
1900
S1
S2
S3
S4
S5
−755
S6
−555
S7
645
−355
S8
445
S9
245
Table 16 Bonding pad dimensions
S10
S11
S12
45
Pad pitch
200 µm
−155
−355
Pad size, aluminium
Gold bump dimensions
120 × 120 µm
94 × 94 × 25 µm
2001 Oct 02
35
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
14 TRAY INFORMATION: PCF8576U
x
G
A
C
H
y
1,1
1,2
2,1
x,1
D
B
F
x,y
1,y
A
A
E
M
J
MGU431
SECTION A-A
For dimensions see Table 18.
Fig.31 Tray details.
Table 17 Tray dimensions (see Fig.33)
SYMBOL
DESCRIPTION
VALUE
handbook, halfpage
A
B
C
D
E
F
G
H
J
pocket pitch; x direction
pocket pitch; y direction
pocket width; x direction
pocket width; y direction
tray width; x direction
6.32 mm
6.32 mm
4.55 mm
4.55 mm
50.67 mm
50.67 mm
6.32 mm
6.32 mm
3.94 mm
0.61 mm
7
tray width; y direction
cut corner to pocket 1,1 centre
cut corner to pocket 1,1 centre
tray thickness
PC8576U
M
x
pocket depth
number of pockets; x direction
number of pockets; y direction
MGU432
y
7
The orientation of the IC in a pocket is indicated by the
position of the IC type name on the die surface with respect to
the chamfer on the upper left corner of the tray.
Fig.32 Tray alignment.
2001 Oct 02
36
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
15 TRAY INFORMATION: PCF8576U/2
x
G
A
C
y
H
1,1
1,2
2,1
x,1
D
B
F
x,y
1,y
A
K
A
E
M
L
J
MGW014
SECTION A-A
For dimensions see Table 17.
Fig.33 Tray details.
Table 18 Tray dimensions (see Fig.31)
SYMBOL
DESCRIPTION
VALUE
handbook, halfpage
A
B
C
D
E
F
G
H
J
pocket pitch; x direction
pocket pitch; y direction
pocket width; x direction
pocket width; y direction
tray width; x direction
tray width; y direction
cut corner to pocket 1,1 centre
cut corner to pocket 1,1 centre
tray thickness
5.33 mm
7.11 mm
3.43 mm
4.67 mm
50.67 mm
50.67 mm
6.67 mm
7.56 mm
3.94 mm
1.76 mm
2.46 mm
0.89 mm
8
PCF8576U/2
K
L
tray cross section
tray cross section
MGW015
M
x
pocket depth
number of pockets; x direction
number of pockets; y direction
The orientation of the IC in a pocket is indicated by the
position of the IC type name on the die surface with respect to
the chamfer on the upper left corner of the tray.
y
6
Fig.34 Tray alignment.
2001 Oct 02
37
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
16 PACKAGE OUTLINES
VSO56: plastic very small outline package; 56 leads
SOT190-1
D
E
A
X
c
y
H
v
M
A
E
Z
56
29
Q
p
A
2
A
(A )
3
A
1
pin 1 index
θ
L
L
detail X
1
28
w
M
b
p
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(2)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
0.3
0.1
3.0
2.8
0.42
0.30
0.22 21.65 11.1
0.14 21.35 11.0
15.8
15.2
1.6
1.4
1.45
1.30
0.90
0.55
3.3
0.25
0.01
0.75
2.25
0.2
0.1
0.1
7o
0o
0.012 0.12
0.004 0.11
0.017 0.0087 0.85
0.012 0.0055 0.84
0.44
0.43
0.62
0.60
0.063 0.057
0.055 0.051
0.035
0.022
inches
0.008 0.004 0.004
0.0295
0.089
0.13
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
96-04-02
97-08-11
SOT190-1
2001 Oct 02
38
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
17 SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
17.1 Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
17.2 Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
17.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
17.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Oct 02
39
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
17.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
not suitable
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC(3), SO, SOJ
suitable
not suitable(2)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Oct 02
40
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
18 DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
STATUS(2)
DEFINITIONS
Objective specification
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary specification Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product specification
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
19 DEFINITIONS
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Bare die
All die are tested and are guaranteed to
Application information
Applications that are
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
20 DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
2001 Oct 02
41
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
21 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2001 Oct 02
42
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex rates
PCF8576
NOTES
2001 Oct 02
43
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403512/04/pp44
Date of release: 2001 Oct 02
Document order number: 9397 750 08044
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