2013.05.01.
Electronics assembly
http://www.amcham.hu/download/001/670/El_gyartas_20100825.pdf
Surface mount technology SMT:
THT Through Hole Technology; Technology; 3 5 % only SMT Surface Mount Technology 95 98% 98% enefits: enefits :
Smaller devices, smaller footprints Economic High yield, automatic assembly lines
SM LEDs
2013.05.01.
!isa"#antages$ !isa"#antages $ "ifficulties: "ifficulties: Higher "ensity "ensity$ $ higher number of %arts %arts$ $ smaller si&e more com%licate" "esign "e#ice %ositioning re'uire a #ery %recise assembly machine High number of sol"er (oints "ifficult test !ifficult to
use in SM! form:
Bigger coils, Electro-mechnical parts
History of SMT
5)*s: 5)*s: %rinte" +ireing ,)*s: ,)*s: hybri" circuits 8)*s: 8)*s: surface mount technologies
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Ty%ical si&e of %assi#e %arts
-. caracter co"e /st t+o: t+o: length 0n" t+o: t+o: +i"th 1nit:
)$)/2 3 3 /) mil 305- m
4ecent smallest smallest: : )/))5 3 )$05 mm 5 )$/0 mm
Mi5e" assembly solutions
Different sequence of manufacturing
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roduction line in case of reflo! soldering
6aste %rinting
Stencil, fine pitch "#,
$perture formation methodes% #hemical etching &aser 'resolution (,) mm * +, mil-, .alvanoplastic 'electroforming'resolution% (,/ mm * +0 mil-, 1equirements% 2ery precise positioning $ccurate amount of paste arameters% Stencil !idth '3( -0((m- 'Step stencil ressure and angle of the squeegee rinting speed Sin4ing speed of the panel
Dispenser
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6rinting
6rintig %rocess 6rinte" %aste
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Sol"er %aste
"ngredients% "ngredients %
Solder alloy , 0(0(-3( m balls
'*5(6 7lu8 7lu8, , solvent, solvent, activator, activator, 9elly
6in. 6in .in. in.%aste %aste: :
reflo+ %ossibility for Through Hole !e#ices
7 %as&t
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7"hesi#es
8n case of +a#e sol"ering Ty%es e%o5i, urethan, silicone, ciano-a4ril :sually t!o components resins, hardened by heat 4e'uirements: .ood electrical resistance Heat resistance '0;(-0<(=# 7i8 the parts before the hardening> &ong shelf-life and 'pot-life-
!is%enser re'uirements re'uirements: :
6recise %osition 6recise "ot si&e 6recise sha%e of the "ot
2013.05.01.
!e#ice shooting
Bne and multi noCCle ?pic4 and place@ shooter
1evolver head% ?collect-and-place@
$ccuracy% /( -)( Am
$ccuracy % +( -0( Am
#hip dispensing% dispensing% roll tray unor"ere" osition controll 0D, /D
http%DD!!!>youtube>comD!atchEvFcGH/)$IlvG)JfeatureFrelated http%DD!!!>youtube>comD!atchEK1F+JfeatureFendscreenJvFnah)BL5y<"M
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tray
Quad IC
9r"ere" %ac:aging of SM 8;s
1ibbon tray
Tube tray
lastic cover film
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<ee"er
S8EME=S
Sol"ering
1eflo! mainly for SND, recently for IHD too Oave soldering% booth SN and IH parts
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asics of sol"ering
>oin bet+een t+o metals metals$ $ use" a thir" ?sol"er sol"er@ @ metal +ith a lo+er melting %oint %ointA A The molten metal "issol#e a thin layer on the surface of soli" metals metals$ $ form an alloy This alloy is the intermetallic layer layer$ $ %recon"ition of a goo" (oin
The formation of the intermetallic layer
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2013.05.01.
The intermetallic layer
6ro%erties: Brass structure Hard, good !earibility Ihin layer is elastic Ihic4er layer is brittle and fragile Sufficient electrical conductivity Ihe quality of solder 9oin depends on the thic4ness of the intermetallic layer layer> > Ihe thic4ness depends on% on% Time: as short$ as
%ossible in the hot &one
Tem%erature: as lo+ as
%ossibile
Betting
6ure$ o5i"e.free an" sol"erable metals are +etteable ;ontact angle sho+s the +etteability
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2013.05.01.
Cuality of +etting
a" +etting +etting: :
High contact angle The surface is contaminate" an" o5i"i&e" The molten sol"er staye" s%here form cause" by the high surface tension tensionA A
Doo" +etting
Small contact angle The surface is clear The li'i" sol"er e5%an" on the surface
Ihe hole filled, !hen the !etting is good
<lu5es lu5es
!issol#e o5i"es 6re#ent surface from reo5i"ation 6romote +etting ;hemically inert$ there there*s *s no reactions +ith metals Do" electrical insulator There There*s *s no health an" en#ironmental %roblems +ith it 8t has resi"ues after sol"ering
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2013.05.01.
"ngredients 4osin ?%ine@
Ty%es =o ;lean % the residue is colorless, good insultor> Kot need cleaning after soldering> ;lean the cleaning agent usually !ater, sometimes other solvents>
4esin
solvent alcohol
?iso%ro%anol@
activator
4eflo+ sol"ering
4eflo+ o+en 8nfrare" ra"iation ra"iation$ $ #entillation Sometimes nitrogen atmos%here atmos%here$ $ a#oi" o5i"ation su%%ort +etting
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2013.05.01.
Thermal %rofil
, /3 &ones &ones$ $ <i5e" te%erature in each &ones 6anels moo#e in a con#eyor
Neasured I 7i8ed I
Ba#e sol"ering
;lassical: ;lassical: the +hole surface contacts +ith the molte" sol"er sol"erA A Bhen the sol"er meet the lea"s lea"s$ $ %a"s$ %a"s$ the bon"ing reali&e"A reali&e" A
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2013.05.01.
Selecti#e +a#e sol"ering
7 small area of the %anel sol"ere" There are "ifferent sha%es of sol"er source
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Eea" free electronics
E1 "irecti#es
BEEE: ?HEE @ Baste Electrical an" Electronic E'ui%ment
E#ery use" E %ro"ucts 4ecycling an" reco#ery rates /A "ea"line: "ea"line: 0))5A aug /3A
4oHS: 4oHS: 4estriction of certain Ha&ar"ous Substances
8nhibite" substances substances: : b, Hg Hg, , #d, #r'2"-, #r'2"-, brominate" flame retar"ers "e"line "e"line: : 0))FA (uli /A E5clusions E5clusionsGA GA
Solder materials
;lassical: ;lassical: SnF36b3, =e+s: Sn7g?3 Sn7g ?3. .-@;u -@;u?)$5 ?)$5 )$,@ Sn9Hn Sn)$,;u stbA Higher melting %oint %oint$ $ more e5%ensi#$ e5%ensi# $ "ifferent +etting beha#ior beha#ior$ $ higher surface tension Higher sol"ering tem%erature !ifferent settings Eaminates an" enca%sulation can "amage" =ee" more %recise tem%erature setting setting$ $ shorter sol"ering %erio" %erio"$ $
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Electrilit capacitors
!amage" "e#ices at higher sul"ering tem%erature
Encapsulatting by thermoplasts
lastic film capacitors
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2013.05.01.
Surface finishing
Nethodes% Nethodes %
H7SE ?Hot 7ir Sol"er Ee#el@ E=8D ?Electroless nic:elIimmersion gol"@ Dal#anic =i I7u 8mm 7g ?8mmersion sil#er@ 8mm Sn ?8mmersion tin@ Electroless =ic:elI6alla"ium.8mmersion Dol" 9rganic coatings 9S6 ?9rganic Sol"erability 6reser#ati#e@ ;arbon 8n:
SURFACE FINISH COSTS
$10.00 $9.00 $8.00 $7.00 $6.00 $5.00 $4.00 $3.00 $2.00 $1.00 $0.00
Cost per Sq Ft
OSP (-C) I-Tin (-C) HASL (-NC) OSP (-NC) I- Silver (-C) ENIG (-NC)
*Cost per Panel
I-Tin (-NC) HASL (-C) Ni-Pd-Au (-NC)
.;: ;on#eyori&e" 6rocess .=;: =on.;on#eyori&e" 6rocess
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2013.05.01.
;hanges in the lea" free sol"ering: sol"ering : Hand soldering soldering% %
Ke! tools, solder tips, Luic4er !earing of tips, Oor4ers need learn the ne! methods
1eflo! 1eflo!% %
#hange o!en, "1 plus intensive convection Ke! flu8es
Oave soldering% soldering%
Ihe pure Sn is more agressive, corrosive, Keed a protective coating Nore sludge, quic4er dissolving of #u, Keed change the bath more frequettly
Tin +his:ers
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2013.05.01.
!ifferencies in the lea" free sol"ering
Higher melting point Slo!er !etting Higher surface tension Higher viscosity higher soldering temperature longer process time !orse covering the surface voids
Natt surface after soldering ne! !ays need for optical inspection 'visual and instrumentalHigher price Environmental impact is controversial 'reduced to8icity vs> higher energy consumption-
Cuality control
2isual "nstrumental% $B", P-ray
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2013.05.01.
798
Defect databases
http://www.smtonline.com/pages/zone.cgi?a=60049 http://defectsdatabase.npl.co.uk/defectsdb/defects_query. php
Testing Tes ting
$utomatic test machines Testing "e#ices <unctional test
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2013.05.01.
4e+or:
Debugging, trouble shooting 1e!or4 stations% Nanual !or4 !ith special tools B.$% desoldering, reballing, soldering
ES! control
Electro. Electro.Static !ischarge 8 the 8S. 8S.s the insulating thic:ness are: are: m - /) nm Electro Electro. .static "ischarge may ha%%en o#er /)) J The "ischarge har"ly a%%reciable$ a%%reciable $ the cause" error come u% laterA later A
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2013.05.01.
Bhat cause the electro. electro .static chargeingK chargeing K
<loor$ <loor$ furnitures$ furnitures$ "resses$ "resses $ %a%ers$ %a%ers$ %lastics$ %lastics$ %ac:aging materials$ materials$ air con#ection$ con#ection $ con#eyors$ con#eyors$ ;4T monitors 8n"ucate" #oltage #oltage: : /)) 3) ))) J "e%en"s on the materials an" humi"ity
Drou%ing materials accor"ing to their electro. electro .static %ro%erties: %ro%erties :
Shiel"ing: L M /)3 N Shiel"ing: ;on"usting: ;on"usting : L M /)- N 7bsorbing: 7bsorbing : /)- NMLM/)// N 8nsulating: 8nsulating : L O /)// N 7ntistatic: 7ntistatic : /)F NMLM/)/) N
'Ihe surface resistivity is higher about ten times then bul4 ones ones-
ES! control system
<loor: <loor: metal screen ?co%%er co%%er@ @ an" an antistatic%olymer co#er on itA itA The rsistance is bet+een MN DN 6ersonal %rotecti# tools tools: : Shoes Shoes$ $ shoe an" +rist belt belt$ $ o#erall
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