Welcome to CST !
CST STUDIO SUITE
Training Class
Core Module
About CST
Founded in 1992
170 employees
World-wide distribution network
Focus on 3D EM simulation
CST Worldwide
CST West Coast
CST of America
CST Europe
CST China
CST of Korea
AET Japan
CST Products
CST MICROWAVE
Common Easy-To-Use Preand Post-processing Engine
STUDIO
CST CABLE STUDIO
CST PCB STUDIO
Our Flagship Product
for RF Simulations
CST MICROSTRIPES
RF Simulations
for Special
Applications
CST STUDIO SUITE
CST DESIGN STUDIO
Circuit Simulator
Allows Coupling of 3D Models
CST PARTICLE STUDIO
Interaction of EM Fields with
Free Moving Charges
5
CST MPHYSICS STUDIO
Thermal and Mechanical
Effects of EM Fields
CST EM STUDIO
Simulations of Static or
Low-Frequency Fields
Built-In Help
Mechanisms
Documentation
<CST_INSTALLATION_DIR>\Documentation\
The introductory books are a good starting
point to learn the workflow of the CST
STUDIO SUITE products.
All books are available as pdf documents
in the "Documentation" subfolder of your
CST installation.
Tutorials
Step-by-Step tutorials are available for CST MICROWAVE STUDIO
and CST EM STUDIO.
Examples Overview
Many pre-calculated examples are available.
Antenna Calculation Examples
9
Online Help (I)
10
Online Help (II)
- Links to Online Help -
In almost all dialogs there is a link to the online help documents
which provides you with extensive help for all settings.
Linked page of the online help
Transient solver main dialog
11
CST Webpage
www.cst.com
12
CST Support Site
Tutorial Videos
FAQ Section
13
CST User Forum
Ask your questions. Answers are provided by other users or CST engineers.
14
CST Customer Support
CST Malaysia
Phone: +60 (3) 7731 5595
Fax:
+60 (3) 7722 5595
Email: [email protected]
Support available from
9am 5pm
15
CST Training Courses
The training courses for CST STUDIO SUITE provide you with the
knowledge needed for an efficient start with the software.
Currently the following trainings are offered on a regular basis. All
upcoming courses are announced on the CST webpage.
CST STUDIO SUITE
MW & Antenna Training
2 full days
CST PARTICLE STUDIO
Charged Particle
Dynamics Training
1 full day
EMC / SI / PI Training
2 full days
Performance Training
1 full day
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CST EM STUDIO
LF Applications Training
1 full day
CST MICROSTRIPES
CST MICROSTRIPES
Training
1-2 full day(s)
CST CABLE STUDIO
CST PCB STUDIO
Training on Demand
Basic and Advanced
Modeling
19
Common User Interface
Menu Bar
Tool Bars
Primary
Window
Navigation
Tree
Message
Parameter List
20
Window
Customize Your Environment
E.g., define a shortcut key
to call your favorite macro.
21
View Options
Rectangle zoom
allows to zoom in a rectangular domain.
Change the view by dragging the mouse while pressing the left
button and a key.
ctrl - rotation
shift - in-plane rotation
ctrl+shift - panning
Some other useful options are:
spacebar - reset view to structure,
ctrl+f - reset view,
shift+spacebar - zoom into selected shape,
mouse wheel - dynamic zoom to mouse pointer.
22
Primitives
Cylinder
Torus
Cone
Sphere
Rotation
Brick
Elliptical
Hints:
Cylinder
Press the tab-key to enter
a point numerically.
Press backspace to delete
a previously picked point.
Extrusion
23
Picks
Pick a point, an edge, or a face in the structure.
Hints:
Picked Edge
Picked Point
Pick circle
center (c)
Pick corner
Press "s" to activate all pick tools.
Picked Face
To pick a point by given coordinates, press p and the tab-key.
2nd time picking an element
unselects it.
Pick face
Pick face (f)
center (a)
Clear picked elements (d)
point (p)
Pick edge
center (m)
Pick point
24
on circle (r)
Edge from
coordinates
Pick edge (e)
Working Coordinate System
The working coordinate system (WCS) allows the use of context
dependent coordinates.
Use
to switch on/off the WCS.
Use
to rotate the WCS.
Use
to move the WCS.
25
Working Coordinate System
The WCS can be aligned, e.g., with a point, an edge, or a face.
Align the WCS
with a point
Align the WCS
with an edge
Align the WCS
with a face
Press w to align the WCS with the currently selected object.
26
Working Coordinate System
The position of a WCS can be stored for later use.
27
Boolean Operations
Boolean operations can be applied to two or more shapes to
create more complex structures.
Sphere
Brick
Intersect
Brick * Sphere
28
Add
Subtract
Brick + Sphere
Brick - Sphere
Boolean insert
Sphere / Brick
Brick / Sphere
Curve Modeling Tools Overview (I)
Curves can be used for
structure generation,
thin wire generation,
integration path in post-processing,
healing CAD data.
Basic Curves
Generation
Create new curve
29
Curve Modeling Tools Overview (II)
Solids can be created from curves.
Creation of a
Sheet from a
Planar Curve
Extrusion of a
Planar Curve
Sweep Curve
30
Curve Modeling Tools Overview (III)
Solids can be created from curves.
Creation of a
Trace
Creation of
Loft from two
Curves
31
Rotation of Profile
Rotation Axis
Draw the profile.
Press backspace to delete
the last selected point.
32
Specify rotation angle,
material properties, etc.
Double click on any corner
point to change its position.
Analytical Modeling (I)
3D curves and faces can be created using analytical expressions.
Enter parameterization
33
Analytical Modeling (II)
3D curves and faces can be created using analytical expressions.
34
Loft Operation
Two picked faces can be used to create a new shape by a loft
operation.
Pick two faces.
Choose the properties
of the loft operation.
Preview
35
Bending
It is possible to bend a sheet on a solid object.
Example:
Creation of a Helix
Sheet
Solid
The solid and the sheet must touch each other.
36
Blend and Chamfer Edges
Specify angle and width.
Select edges.
Specify radius.
37
Shell Operation
A solid object can be shelled.
Example:
A waveguide bend consisting of three shapes is shelled.
solid2
solid3
solid1
Create a single shape
by a Boolean add.
Picked faces will be open
after the operation.
38
Transform Operation
Existing objects can be translated, rotated, mirrored, and scaled.
Translate
Scale
Rotate
Use the mouse to translate, rotate, or scale objects interactively.
Perform several transformations to the same shape using the Apply
button.
Selecting more than one solid will turn the shape center into the
common center.
39
Local Modifications Face Modifications
Offset Face: Interactively
move the face of a solid in
its normal direction.
Move Face: Interactively
move the face of a solid in
a coordinate direction.
Local Modifications are especially helpful
when you are working with an imported
CAD model for which the model history is
not available. The "Local Modification"
tools help you to modify such geometries.
40
Local Modifications Remove Feature
Feature to be removed
Remove the feature
41
Pick the feature
View Options
Several options are available to gain better insight into the structure.
Cutting Plane
Wireframe Mode
42
View Options
Several options are available to gain better insight into the structure.
Working Plane
Coordinate Axes
43
Copy / Paste Structure Parts
Ctrl+C stores the selected solids on the active working coordinate
system (WCS) to the clipboard. Ctrl+V pastes the clipboard into the
active working coordinate system.
Copy and paste of structure parts works even between different CST
projects.
Paste the objects in
the new WCS.
Press ctrl+c to copy
objects to clipboard.
Move the WCS.
44
Align Objects
Copied or imported objects can be aligned with the current model.
Select shape and
choose Align
Select faces to
align with.
Choose angle.
Final Result
For copied and imported objects, the alignment is started
automatically.
For shapes selected in the Navigation Tree start by choosing Align
from the Objects menu.
45
Interactive CAD Modeling Using the Mouse
1. Adjust the Snap width according to the raster of your structure.
2. Use the pick tools, whenever geometrical information is already available.
Pick points to define new shapes / height of extrusion / transform.
Pick edges for rotation axis / to adjust WCS.
Pick face for extrude / rotate / transform / to adjust WCS.
3. Use the local working coordinate system (WCS).
4. Use the keyboard only for new (independent) geometric information
(e.g. points which cannot be picked and do not fit into the snapping raster).
Relative construction via picks and WCS avoids redundant information.
Parameters/Values are entered once and are later referenced via picks.
46
Solver Overview
Which solver is best suited to my application?
49
Which Solver is the Best?
Unique answer to this question is not easily possible as the
performance and accuracy depend on many parameters:
Electrical size and geometry of the problem,
Material models and material parameters used,
Resonant behavior of the model,
Type of the mesh and the boundary conditions,
Architecture of the workstation used for the simulation,
etc.
BUT: Some helpful rules of thumb are available.
The application engineers of CST are available to
discuss the solver choice and the model setup.
50
Transient Simulation - Behind the Scenes
Output Time Signal
Excitation Time Signal
Numerical time integration
of 3D Maxwell equations
Port 1
Port 2
The simulation duration depends on:
1. Duration of input signal (determined by frequency range selected)
2. Duration of output signal (determined mainly by the size and the
resonances of the model under study)
3. Time step width for numerical time integration (determined by the
mesh used to discretize your model)
51
Frequency Domain Simulation
Behind the Scenes
The steady state behavior of a model is calculated at different
frequency points.
For each frequency
point a linear
equation system
has to be solved.
The intermediate points in broadband results are calculated by an
interpolation.
52
Time Domain + Frequency Domain
in out
in out
Time Domain
Frequency Domain Calculation
in
in
out
out
TDR
53
Frequency Domain
S-parameter
S-parameter
Solver Choice (I) - Overview
General Purpose Solver (3D-Volume)
Solver
Transient
Frequency
Domain
Area of Application (Rule of Thumb)
Electrically medium and large sized problems
Broadband
Arbitrary time signals
Narrow band / Single frequency
Electrically small to medium sized problems
Periodic structures with Floquet port modes
Special Solver (3D-Volume): Closed Resonant Structures
Eigenmode
FD Resonant
Strongly resonant structures, narrow band (e.g. cavities)
Strongly resonant, non radiating structures (e.g. filters)
Special Solver (3D-Surface): Large Open Metallic Structures
54
Integral Equation
(based on MLFMM)
Electrically large structures
Dominated by metal
Asymptotic Solver
RCS calculations for electrically very large objects
Solver Choice (II) - Resonances
The following rules of thumb apply:
Weak Resonances
Strong Resonances
General Purpose
+AR-Filter
for S-parameter
calculation only
Resonant Fast
F-solver is better suited to strongly resonant applications than T-solver.
55
Solver Choice (III) - Electrical Size
The following rules of thumb apply:
Structure under study
Electrically Small
Electrically Large
With MPI also very large
problems can be solved.
RCS calculations for electrically
very large structures
For electrically very small structures the quasistatic solvers provided in
CST EM STUDIO might be a good choice.
56
Solver Choice (IV) - Bandwidth
The following rules of thumb apply:
Narrowband
Broadband
F-solver and I-solver are better suited to narrowband applications,
while the T-solver is better suited to broadband applications.
57
Specialized Products
In addition to the general purpose solvers of CST MICROWAVE STUDIO
CST offers solvers specialized to certain classes of applications.
CST PCB STUDIO
Specialized solvers for the
simulation of PCB boards.
CST CABLE STUDIO
CST MICROSTRIPES
Efficient solvers based on the
Transmission Line Matrix (TLM)
method. Contains special
algorithms for EMC analysis.
58
Specialized solvers for the
simulation of complete cable
harnesses for all kind of EMC
investigations.
Optional Workflow Example
Patch Antenna Array
Purpose 1: Design a single patch using
a parameter sweep & optimization.
Purpose 2: Create a dual patch array
using
a farfield array combination
3D array creation
a beam-forming feeding network
60
Single Patch
61
Single Patch Design
Frequency range: 3 8 GHz
Port size:
2*width in y-direction
Copper
Substrate (Rogers RT 5880)
5*height in z-direction
40mm
20mm
0.5mm
0.035mm
h = 0.787mm
7.5mm
20mm
w = 2.38mm
40mm
Copper groundplane,
thickness = 0.035 mm
62
Construction (i)
Choose template:
63
Load materials:
Construction (ii)
Construct the substrate:
Load substrate material
64
Construction (iii)
Construct the patch:
65
Construction (iv)
Align WCS with picked
point
Select edge centre
66
Construction (v)
Construct the feed line
Press Shift-Tab
67
Select edge centre
Construction (vi)
Pick point
Align WCS with picked point
68
Construction (vii)
Construct the feed
gaps
69
Construction (viii)
Pick two points to form a
translation vector
Select solid1 by doubleclicking it
70
Construction (ix)
Transform solid1 to make a copy
71
Construction (x)
Select component patch
Select component solid1
Hit ENTER to substract
solid1 from patch
72
Construction (xi)
Pick bottom face of
substrate
Extrude face to make
ground plane
73
Construct Port
Pick face of feed line
74
Construct Port
Construct waveguide port
75
Simulation Settings
Set freq. range
76
Exploit symmetry plane
Simulation
Define monitors (E-, H-, Farfield @ 5.25 GHz)
Start transient solver
77
Visualize Results
Farfield result
E-field result
78
Parameter Sweep
79
Parameter Sweep Results: S11
80
Optimization of Single Patch
Optimizer Parameters
Optimizer Goal
81
Optimizer Results (iii)
83
Farfield Efficiency
Before optimization:
84
Patch Array
85
Combine Farfields (1)
86
Phaseshift = -45 (1R)
87
Phaseshift = 135 (2L)
88
Combine Farfields (2)
Transform component1 to make
a copy
Combine ground and
substrate components
89
Combine Farfields (2)
Construct second port and run transient simulation
without symmetry.
90
Combine Farfields (2)
91
Farfield Results (L)
92
Farfield Results (R)
93
Feeding Network Design (DS)
lg/4
lg/4
Z0
Z0/sqrt(2)
94
DS MWS co-simulation
3D MWS model fed with
DS circuit network
95
Definition of Ports
98
Available Port Types
Ports for S-Parameter Computation
Discrete Ports
Waveguide Ports
(Lumped Element)
(2D Eigenmode Solver)
Input: Knowledge of TEM Mode and
line impedance is required.
Output: Voltage and current
Input: Area for eigenmode solution
Output: Pattern of E- and H-field,
line impedance,
Propagation constant
Discrete ports can be used for TEM-like modes, not for higher order
modes (cutoff frequency > 0).
99
Waveguide ports provide a better match to the mode pattern as well
as higher accuracy for the S-parameters.
Discrete Ports
S-Parameter Port
Current Port
Voltage Port
Voltage or current source with
internal resistance
Coaxial
100
Microstrip
Stripline
Coplanar waveguide
Discrete Edge Port Definition
Pick two points,
or
pick one point and a face,
or enter coordinates directly (not recommended).
Select port type
and impedance.
101
Discrete Face Port Definition
Pick two edges
Select port type
and impedance.
102
or
one edge and a face.
Available Port Types
Ports for S-Parameter Computation
Discrete Ports
Waveguide Ports
(Lumped Element)
(2D Eigenmode Solver)
Input: Knowledge of TEM Mode and
line impedance is required.
Output: Voltage and current
Input: Area for eigenmode solution
Output: Pattern of E- and H-field,
line impedance,
propagation constant
Discrete ports can be used for TEM-like modes, not for higher order
modes (cutoff frequency > 0).
103
Waveguide ports provide a better match to the mode pattern as well
as higher accuracy for the S-parameters.
Port Definition (I) Closed Structures
Typically, waveguide ports are defined based on a geometric object. Use the
pick tools to select a unique port plane.
The port size is equal to the smallest rectangular area which includes all picked objects.
104
Port Definition (II) Open Structures
1. Pick three points.
2. Enter port menu
3. Adjust additional
port space.
105
Port Definition (III) - Backing
For the I-solver and the F-solver waveguide ports must be backed with
a PEC solid (or by electric boundaries).
Pick port using
the pick tools.
Port backed with PEC solid.
106
Extrude the port plane.
Materials
&
Boundary Conditions
108
Basic Materials
Define a new material or load materials from the large material database.
Material Types
PEC = Perfect Electrical Conductor (
Normal: General material model. This is
typically used for dielectric materials.
Anisotropic: Permittivity and permeability
depend upon the spatial direction.
Lossy Metal: Model for conductors with
Corrugated Wall: Surface impedance model.
Ohmic Sheet: Surface impedance model.
109
Material Database
Loaded materials are available
for the creation of new shapes.
110
Lossy Metal
Why is it required?
Sampling of skin depth would require very fine mesh steps at
the metal surface when defining conductor as a normal material
(skin depth for copper at 1 GHz approx. 2 m).
This results in a very small time step, which leads to a very long
simulation time.
Solution:
1D model which takes skin depth into account without spatial
sampling.
111
Boundaries
CST MWS uses a rectangular grid system, therefore, also the complete calculation
domain is of rectangular shape 6 boundary surfaces have to be defined at the
minimum and maximum position in each coordinate direction (xmin, xmax, ymin,
ymax, zmin, zmax).
Example: T-Splitter
ymax
xmin
zmin
zmax
ymin
xmax
112
Boundary Settings (I)
Seven different settings are available.
113
Boundary Settings (II)
Electric Boundaries (default setting): No tangential electric field at surface.
Magnetic Boundaries: No tangential magnetic field at surface. Default
setting for waveguide port boundaries.
Open Boundaries: Operates like free space Waves can pass this boundary
with minimal reflections. Perfectly matched layer (PML) condition.
Open (add space) Boundaries: Same as open, but adds some extra space for
far field calculation (automatically adapted to center frequency of desired
bandwidth). This option is recommended for antenna problems.
Conducting Wall: Electric conducting wall with finite conductivity (defined
in Siemens/meter).
114
Boundary Settings (III)
Periodic Boundaries: Connects two opposite boundaries where the calculation
domain is simulated to be periodically expanded in the corresponding direction.
Thus, it is necessary that facing boundaries are defined as periodic.
The resulting structure represents an infinitely expanded antenna pattern,
phased array antennas. F! (hexahedral mesh), T! + 0 phase shift
Unit Cell: Used with F! solver, tetrahedral mesh, similar to F! periodic
boundary with hexahedral mesh. A two dimensional periodicity other than
in direction of the coordinate axes can be defined. If there are open
boundaries perpendicular to the unit cell boundaries, they are realized by
Floquet modes, similar to modes of a waveguide port .
115
Boundaries: Symmetry Planes
Three different settings are available.
Three possible symmetry planes.
116
Meshing Basics
119
How to Get a Proper Mesh?
Question: How does a proper mesh look like and what are the
best settings to get it?
Answer: This depends on your problem under study as well as
the type of result you are interested in.
However, there are some rules of thumb:
For several classes of application (e.g. antennas, PCB boards
etc.) there are some common properties a "good" mesh
possesses (project templates make use of this fact).
It is known that the results become more accurate when the
mesh is refined (automatic mesh refinement is based on this
knowledge).
Geometry and material of the model influences the behavior of
the EM fields (fixpoints, material based meshing, and other
special techniques are based on this knowledge).
120
Hierarchy of Mesh Settings
Global Mesh Properties
General settings usually done by project
template. Global settings for mesh controls of
automatic meshing algorithms.
Local Mesh Properties
Special settings (fine-tuning) to adjust the
global mesh better to the model under study.
Defined per shape or per material.
Local mesh properties have precedence over global mesh properties.
121
Mesh Generation - A Typical Workflow
Select Project Template
Global Mesh Settings
122
This adjusts the global mesh properties to
values which we found to be a good starting
point for a certain area of application.
Optimize the global mesh settings for the
geometry of your model.
Local Mesh Settings
Fine tune the mesh (if necessary) to meet the
really specific requirements of your model.
Perform Simulation
Start the solver and perform a convergence
study (e.g. using adaptive mesh refinement).
Results
Simulations and mesh studies provide insight
about the dependency of the results on the
mesh settings.
Project Templates
A project template makes some basic settings for a new project. A
project template can be applied to an already existing project.
Information about the
settings the template
will apply.
Template Title
(Area of Application)
123
Initial Mesh Settings
Automatic Mesh Refinement (I)
It is known that the numerical solution calculated by the solvers converges to
the analytical solution if the grid is sufficiently refined.
The automatic mesh refinement in CST tries to refine the initial mesh in a
clever way such that the results are accurate.
124
Automatic Mesh Refinement (II)
The results for different meshes during an adaptive mesh
refinement are shown in the "Navigation Tree".
125
Hexahedral Meshing for
Transient Simulations
126
Hexahedral Meshing - Overview
1. Hexahedral Mesh Configuration Options
2. Some Meshing Guidelines
2.1 Some Representative Meshes for Common Structures
2.2 Meshing Pitfalls
3. Influence of the Mesh on Simulation Performance
127
Hexahedral Mesh (I) - Mesh View
Mesh lines in one
mesh plane are shown
in the 3D view.
View mesh.
Mesh controls are
displayed in the mesh
view.
Information about mesh plane.
The total number of mesh
cells is displayed in status bar.
128
Corner
Correction
Fixpoints
Hexahedral Mesh (II) - Global Settings
Absolute and frequency
dependent setting to
determine the largest
mesh step.
Settings to limit the
size of the smallest
mesh step.
129
Automatically create
and use mesh controls.
Strongly recommended!
Hexahedral Mesh (III) - Global Settings
Largest Mesh Step - "Lines per Wavelength"
"Lines per wavelength" is based on the
upper limit of the frequency range.
130
Thus, increasing the upper frequency limit
usually leads to a finer mesh.
Hexahedral Mesh (IV) - Global Settings
Largest Mesh Step - "Lower Mesh Limit"
"Lower Mesh Limit" is based on the
dimensions of the computational domain.
131
The diagonal of the smallest boundary
face of the comp. domain is divided by
this number. Result is used as the max.
mesh step width allowed in the model
Hexahedral Mesh (V) - Global Settings
Smallest Mesh Step - "Mesh Line Ratio Limit"
The time needed to complete a time domain simulation heavily depends on the size
of the smallest mesh step (see later in section "Performance Aspects of Meshing").
The size of the minimum mesh step can be
limited using the "Mesh Line Ratio Limit" or the
"Smallest Mesh Step" setting.
Mesh lines are
inserted at
fixpoints.
Mesh Line Ratio Limit
The "Mesh Line Ratio Limit" specifies the
maximum value allowed for the ratio of the
maximum mesh step width to the minimum
mesh step width.
132
Hexahedral Mesh (V) - Global Settings
Smallest Mesh Step - "Smallest Mesh Step"
The time needed to complete a time domain simulation heavily depends on the size
of the smallest mesh step (see later in section "Performance Aspects of Meshing").
Smallest Mesh Step
The "Smallest Mesh Step" specifies the minimum
value allowed for the minimum mesh step
width in terms of the units defined in your
project.
Note: If the settings for "Steps per Wavelength"
or "Lower Mesh Limit" lead to a smaller
then the "Smallest Mesh Step" setting is
ignored.
133
Hexahedral Meshing - Overview
1. Hexahedral Mesh Configuration Options
2. Some Meshing Guidelines
2.1 Some Representative Meshes for Common Structures
2.2 Meshing Pitfalls
3. Influence of the Mesh on Simulation Performance
134
Representative Meshes (I) - Minimal Requirements
The gap between inner and outer conductor
should be resolved by at least one mesh cell.
Partially filled cells are handled with PBA/FPBA
technique.
Coaxial Line
1-2 mesh lines
2-3 mesh lines
(depends on thickness)
Microstrip Line
135
Depending on the thickness and the
permittivity of the substrate the number
of mesh lines should be at least as shown
in the picture.
It is NOT necessary to resolve the
thickness of the microstrip line by the
mesh.
Representative Meshes (II) - Minimal Requirements
The gap between multiple strip lines should be
resolved by at least one or two mesh cells.
Parallel Microstrip Lines
A discrete port must be discretized by at least
one mesh cell.
Discrete Ports
136
Meshing Pitfalls - Staircase Cells (I)
Cells which contain more than two metallic
material boundaries are completely filled
with PEC (staircase cells).
A warning is shown by the
solver to inform you of this
modification.
Staircase cells are shown in the
mesh view.
137
Meshing Pitfalls - Staircase Cells (II)
Staircase cells must be avoided if
they influence the electrical
behavior of the model, i.e. if they
introduce shortcuts.
Example: Shortcut between two
microstrip lines is introduced by a
staircase cell.
Staircase cells which do not change
the electrical behavior of a model
are usually OK.
138
Example: Staircase cell at
a wire in free space.
Online Help - PBA and TST
PBA
139
TST
Whenever a mesh cell cuts more than two metallic material
boundaries the cell is filled with PEC material (staircase cell).
Quite often such cells do not influence the simulation result
much, but if they introduce shortcuts (as shown on the previous
slide) this might be critical.
Hexahedral Meshing - Overview
1. Hexahedral Mesh Configuration Options
2. Some Meshing Guidelines
2.1 Some Representative Meshes for Common Structures
2.1 Meshing Pitfalls
3. Influence of the Mesh on Simulation Performance
140
Hexahedral Meshing Performance (I)
For stability, the time step of the numerical quadrature is determined by the
smallest mesh step. Increasing the smallest mesh step will increase the
time step.
Smallest Mesh Step
tiny t: slow
big t: fast
The smaller the smallest mesh step width, the smaller the time
step for the numerical time integration.
141
Hexahedral Meshing Performance (II)
The smallest mesh step in a model can be visualized in the mesh
view.
142
Hexahedral Meshing Guidelines - Summary
Select a proper project template for your application to get good
initial mesh settings.
Perform an adaptive mesh refinement to find a good mesh.
Fine tune the mesh if necessary using the local mesh settings.
Try to avoid critical cells. Quite often they are an indicator that the
mesh is too coarse at least in some regions.
Try to avoid to use a mesh with a very high mesh line ratio limit.
Consider using subgrids for models which require a very fine mesh at
localized positions.
143
Transient Simulation - Memory Consumption
- Memory-Consumption versus Mesh Size -
Some rules of thumb are:
A structure with open boundaries and material losses requires
about 1 GB RAM to handle 3-4 million mesh cells.
A structure with closed boundaries and without material losses
requires about 1 GB RAM to handle 5 million mesh cells.
Subgridding:
The subgridding feature starts to be efficient when the mesh
cell reduction factor is larger than 3.
(Macros Calculate Subgridding Meshcell Factor)
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Tetrahedral and Surface Meshing
for Frequency Domain Simulations
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Global Mesh Properties
Steps per wavelength: This value refers to the
highest frequency of the simulation. It defines the
minimum number of mesh cells that are used for a
distance equal to this wavelength.
Minimum number of steps: This value controls the
global relative mesh size and defines a lower bound
for the number of mesh cells independently of the
wavelength. It specifies the minimum number of
mesh edges to be used for the diagonal of the model
bounding box.
Note: A tetrahedral mesh requires a valid ACIS model.
(HEX mesh even works with INVALID ACIS model...)
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Tetrahedral / Surface Mesh (I)
-Global Mesh Settings -
"Steps per wavelength" is based on the
upper limit of the frequency range.
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Thus, increasing the upper frequency limit
usually leads to a finer mesh.
Tetrahedral / Surface Mesh (II)
-Global Mesh Settings -
"Min. number of steps" allows to refine
the mesh globally independently of the
frequency range settings.
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It specifies the minimum number of
mesh edges to be used for the diagonal
of the model bounding box.
Mesh Generation Method
The method for surface and volume meshing can be chosen.
General purpose: A simple surface mesh
generation which is adequate in most cases.
Fast (for complex structures): Especially suited
to meshing large or complex structures. If used
together with (tetrahedral) volume mesh
generation, this method can be combined only
with Delaunay volume mesh generation.
Delaunay: Fast tetrahedral volume meshing
method (recommended).
Geometry accuracy: If the defined
or imported geometry is less
accurate than the default tolerance
1e-6, it is recommended to select a
larger tolerance. Otherwise artificial
shapes might arise or the model
preparation might fail.
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Advancing Front: An alternative method to
generate a volume mesh. Advantageous in some
cases (like thin layers), because the surface
mesh can be generated more flexible than with
Delaunay, that is, it can be altered during the
mesh generation if necessary. This method is
available only in combination with the general
purpose surface mesh generation.
Curvature Refinement (I)
30
100
default = 100
If cylinders are
still not well
discretized,
increase it
to, e.g., 200-300.
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Curvature Refinement (II)
The Curvature refinement ratio specifies the ratio of
the maximum deviation (d) of the surface mesh from the
actual shape of the structure divided by the edge length
(h) of the surface triangle (as shown in the picture above).
Smaller values lead to better approximation of curved
objects.
Volume optimization: If this field is checked
(recommended), the mesh connectivity of the
preliminary volume mesh is changed to improve the
mesh quality.
Volume smoothing: If this field is checked
(recommended), the position of mesh vertices will
be changed in order to enhance the mesh quality.
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Adaptive Mesh Refinement
Multi-frequency adaptive mesh refinement
The adaptation frequency samples are sequentially processed before
the broadband sweep.
Example: Diplexer
Mesh adaptation at 75.1 GHz and 77 GHz.
Initial mesh
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Optimized mesh
Open Discussion
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