MC74VHC1GT14

SchmittTrigger Inverter /
CMOS Logic Level Shifter
LSTTLCompatible Inputs
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MARKING
DIAGRAMS

5
SC88A/SC705/SOT353
DF SUFFIX
CASE 419A

High Speed: tPD = 4.5 ns (Typ) at VCC = 5 V

Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C

VC M G
G

5
1
TSOP5/SOT235/SC595
DT SUFFIX
CASE 483
VC
M
G

Features

The MC74VHC1GT14 is a single gate CMOS Schmitttrigger

inverter fabricated with silicon gate CMOS technology. It achieves
high speed operation similar to equivalent Bipolar Schottky TTL
while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The device input is compatible with TTLtype input thresholds and
the output has a full 5 V CMOS level output swing. The input protection
circuitry on this device allows overvoltage tolerance on the input,
allowing the device to be used as a logiclevel translator from 3 V
CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to 3 V
CMOS Logic while operating at the highvoltage power supply.
The MC74VHC1GT14 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GT14 to be used to interface 5 V circuits to 3 V
circuits. The output structures also provide protection when VCC = 0 V.
These input and output structures help prevent device destruction
caused by supply voltage input/output voltage mismatch, battery
backup, hot insertion, etc. The MC74VHC1GT14 can be used to
enhance noise immunity or to square up slowly changing waveforms.

VC M G
G
1

= Device Code
= Date Code*
= PbFree Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may vary
depending upon manufacturing location.

TTLCompatible Inputs: VIL = 0.8 V; VIH = 2 V

CMOSCompatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @Load
Power Down Protection Provided on Inputs and Outputs

PIN ASSIGNMENT

Balanced Propagation Delays

Pin and Function Compatible with Other Standard Logic Families

IN A

GND

OUT Y

VCC

Chip Complexity: FETs = 100; Equivalent Gates = 25

PbFree Packages are Available

NC

IN A

GND

NC

VCC

FUNCTION TABLE
4

OUT Y

A Input

Y Output

L
H

H
L

Figure 1. Pinout (Top View)

ORDERING INFORMATION
1

IN A

OUT Y

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

Figure 2. Logic Symbol

Semiconductor Components Industries, LLC, 2007

February, 2007 Rev. 12

Publication Order Number:

MC74VHC1GT14/D

MC74VHC1GT14
MAXIMUM RATINGS
Symbol

Characteristics

Value

Unit

VCC

DC Supply Voltage

0.5 to +7.0

VIN

DC Input Voltage

0.5 to +7.0

0.5 to 7.0
0.5 to VCC + 0.5

20

mA

+20

mA

+25

mA

VOUT

DC Output Voltage

IIK

Input Diode Current

IOK

Output Diode Current

IOUT

DC Output Current, per Pin

ICC

DC Supply Current, VCC and GND

PD

Power Dissipation in Still Air

qJA

Thermal Resistance

TL

VCC = 0
High or Low State

VOUT < GND; VOUT > VCC

+50

mA

SC88A, TSOP5

200

mW

SC88A, TSOP5

333

C/W

Lead Temperature, 1 mm from Case for 10 secs

260

TJ

Junction Temperature Under Bias

+150

Tstg

Storage Temperature

65 to +150

> 2000
> 200
N/A

500

mA

VESD

ESD Withstand Voltage

ILatchup

Latchup Performance

Human Body Model (Note 1)

Machine Model (Note 2)
Charged Device Model (Note 3)
Above VCC and Below GND at 125C (Note 4)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22A114A
2. Tested to EIA/JESD22A115A
3. Tested to JESD22C101A
4. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

VCC

DC Supply Voltage

3.0

5.5

VIN

DC Input Voltage

0.0

5.5

0.0
0.0

5.5
VCC

55

+125

No Limit
No Limit

ns/V

VOUT

DC Output Voltage

TA

VCC = 0
High or Low State

Operating Temperature Range

tr , tf

VCC = 3.3 V 0.3 V

VCC = 5.0 V 0.5 V

Input Rise and Fall Time

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

TJ = 80 C

117.8

TJ = 90 C

1,032,200

TJ = 100 C

80

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR
TJ = 110 C

Time, Years

TJ = 120 C

Time, Hours

TJ = 130 C

Junction
Temperature C

NORMALIZED FAILURE RATE

Device Junction Temperature versus

Time to 0.1% Bond Failures

1
1

10

100

1000

TIME, YEARS

Figure 3. Failure Rate vs. Time Junction Temperature

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2

MC74VHC1GT14
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol

Parameter

Test Conditions

TA 85C

TA = 25C

(V)

Min

Typ

Max

Min

VT+

Positive Threshold
Voltage

3.0
4.5
5.5

1.20
1.58
1.79

1.40
1.74
1.94

1.60
2.00
2.10

VT

Negative Threshold
Voltage

3.0
4.5
5.5

0.35
0.5
0.6

0.76
1.01
1.13

0.93
1.18
1.29

0.35
0.5
0.6

VH

Hysteresis Voltage

3.0
4.5
5.5

0.30
0.40
0.50

0.64
0.73
0.81

1.20
1.40
1.60

0.30
0.40
0.50

VIN VT Min
IOH = 50 mA

2.0
3.0
4.5

1.9
2.9
4.4

2.0
3.0
4.5

IOH = 4 mA
IOH = 8 mA

3.0
4.5

2.58
3.94

VIN VT + Max
IOL = 50 mA

2.0
3.0
4.5

IOL = 4 mA
IOL = 8 mA

VOH

Minimum HighLevel
Output Voltage

Max

55 TA 125C
Min

1.6
2.0
2.0

Max

Unit

1.6
2.0
2.0

0.35
0.5
0.6
1.20
1.40
1.60

0.30
0.40
0.50

1.9
2.9
4.4

1.9
2.9
4.4

2.48
3.80

2.34
3.66

1.20
1.40
1.60

VOL

Maximum LowLevel
Output Voltage

0.0
0.0
0.0

0.1
0.1
0.1

0.1
0.1
0.1

0.1
0.1
0.1

3.0
4.5

0.36
0.36

0.44
0.44

0.52
0.52

IIN

Maximum Input
Leakage Current

VIN = 5.5 V or GND

0 to
5.5

0.1

1.0

1.0

mA

ICC

Maximum Quiescent
Supply Current

VIN = VCC or GND

5.5

1.0

20

40

mA

ICCT

Quiescent Supply
Current

Input: VIN = 3.4 V

5.5

1.35

1.50

1.65

mA

IOPD

Output Leakage
Current

VOUT = 5.5 V

0.0

0.5

5.0

10

mA

AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns

TA 85C

TA = 25C

Symbol
tPLH,
tPHL

CIN

Parameter

Maximum Propagation
Delay, A to Y

Min

Test Conditions

55 TA 125C

Typ

Max

Min

Max

Min

Max

Unit
ns

VCC = 3.3 0.3 V

CL = 15 pF
CL = 50 pF

7.0
8.4

12.8
16.3

1.0
1.0

15.0
18.5

1.0
1.0

17.0
20.5

VCC = 5.0 0.5 V

CL = 15 pF
CL = 50 pF

4.5
5.8

8.6
10.6

1.0
1.0

10.0
12.0

1.0
1.0

11.5
13.5

10

Maximum Input
Capacitance

10

10

pF

Typical @ 25C, VCC = 5.0 V

CPD

10

Power Dissipation Capacitance (Note 5)

pF

5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the noload dynamic
power consumption; PD = CPD  VCC2  fin + ICC  VCC.

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3

MC74VHC1GT14

3.0 V

A
50%

GND
tPLH

tPHL
VOH

50% VCC
VOL

Figure 4. Switching Waveforms

TEST POINT
OUTPUT
DEVICE
UNDER
TEST

CL *

*Includes all probe and jig capacitance

Figure 5. Test Circuit

ORDERING INFORMATION
Device

Package

MC74VHC1GT14DFT1

SC705/SC88A/SOT353

M74VHC1GT14DFT1G

SC705/SC88A/SOT353
(PbFree)

MC74VHC1GT14DFT2

SC705/SC88A/SOT353

M74VHC1GT14DFT2G

SC705/SC88A/SOT353
(PbFree)

MC74VHC1GT14DTT1

SOT235/TSOP5/SC595

M74VHC1GT14DTT1G

SOT235/TSOP5/SC595
(PbFree)

Shipping

3000/Tape & Reel

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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4

MC74VHC1GT14
PACKAGE DIMENSIONS

SC88A, SOT353, SC70

CASE 419A02
ISSUE J

NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A01 OBSOLETE. NEW STANDARD
419A02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.

S
1

DIM
A
B
C
D
G
H
J
K
N
S

D 5 PL

0.2 (0.008)

INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC

0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087

J
C

SOLDERING FOOTPRINT*
0.50
0.0197

0.65
0.025
0.65
0.025
0.40
0.0157

1.9
0.0748

SCALE 20:1

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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5

mm
inches

MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC

0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20

MC74VHC1GT14
PACKAGE DIMENSIONS

TSOP5
CASE 48302
ISSUE G

NOTE 5
2X

0.10 T

2X

0.20 T

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.

D 5X
0.20 C A B
5
1

4
2

M
B

S
K

DETAIL Z

G
A

DIM
A
B
C
D
G
H
J
K
L
M
S

DETAIL Z

J
C
0.05

SEATING
PLANE

H
T

MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00

SOLDERING FOOTPRINT*

0.95
0.037

1.9
0.074

2.4
0.094
1.0
0.039
0.7
0.028

SCALE 10:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MC74VHC1GT14/D