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Hardware Interview

This document lists over 200 VLSI companies and provides a one stop site for all VLSI interview questions. It introduces the blog which focuses on VLSI interview questions and lists categories of questions including ASIC, digital design, physical design, basic digital, Verilog, VHDL, FPGA, CMOS, and more. The blog aims to help with VLSI interview preparation.

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SaurabhSharma
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© © All Rights Reserved
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0% found this document useful (0 votes)
330 views50 pages

Hardware Interview

This document lists over 200 VLSI companies and provides a one stop site for all VLSI interview questions. It introduces the blog which focuses on VLSI interview questions and lists categories of questions including ASIC, digital design, physical design, basic digital, Verilog, VHDL, FPGA, CMOS, and more. The blog aims to help with VLSI interview preparation.

Uploaded by

SaurabhSharma
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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28/03/2017 VLSIInterviewQuestions

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VLSIInterviewQuestions
OneStopsiteforalltheVLSIInterviewQuestions.

Wednesday,November19,2008 Followers
ListofVLSICompanies Followers(80)Next
AlienTechnology
AltaSens,Inc.
AlteraCorporation
AmalfiSemiconductor
Ambric,Inc.
AmimonLtd.
AmkorTechnology,Inc.*
AnalogDevices,Inc.(ADI)
AnalogixSemiconductor
ApexoneMicroelectronicsInc.
AppliedMicroCircuitsCorporation(AMCC)
AppoTechLimited
Follow
ARM*
AspexSemiconductorLtd
AtherosCommunications,Inc. BlogArchive
Audience,Inc. 2008(9)
austriamicrosystemsAG November(9)
AuthenTec,Inc.
AvagoTechnologies ASICInterviewQuestions
AzulSystems DigitalDesignInterview
BayMicrosystems,Inc. Questions
BeSangInc.
PhysicalDesignInterview
BournsInc.
Questions
BrightScaleInc.
BroadcomCorporation BasicDigitalInterview
BroadLogicNetworkTechnologies Questions
CadenceDesignSystems,Inc.* VerilogInterviewQuestions
CaliforniaMicroDevicesCorp.(CMD)
VHDLInterviewQuestions
CambridgeSemiconductor,Ltd.(CamSemiLtd.)
Canesta,Inc. FPGAInterviewQuestions
CanovaTechSrl CMOSInterviewQuestions
CavendishKinetics*
ListofVLSICompanies
CaviumNetworks
CECHuaDaElectronicDesignCo.,Ltd(HED) AboutMe
CentilliumCommunications,Inc.
VLSI_Rules
CharteredSemiconductorManufacturingInc.*
CHiLSemiconductor,Inc. Viewmycompleteprofile
ChingisTechnologyCorporation
ChipX,Inc.
CISSOIDS.A.
ComtechAdvancedHardwareArchitectures(AHA)Corporation
ConexantSystems,Inc.
CoreLogicInc.
CortinaSystems
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28/03/2017 VLSIInterviewQuestions

CpacketNetworks
CrocusTechnologySA
CSR,Plc.
Cswitch
CyanHoldingsPlc(CyanTechnologyLtd.)
CypressSemiconductorCorporation
DatangMicroelectronicsTechnologyCo.,Ltd(DMT)
DesignofSystemsOnSilicon(DS2)
DialogSemiconductor
DiBcom(DigitalBroadbandCommunications)
Discera,Inc.
DisplayLink
DSPGroup,Inc.
DuneNetworks
EastmanKodakImageSensorSolutions
ElonicsLtd
EmberCorporation
EMemoryTechnologyInc.(EMTC)*
Enpirion
EnSYNCCorporation*
EntropicCommunicationsInc.
eSiliconCorporation
Essensium
EtronTechnology,Inc.
ExarCorporation
FrescoMicrochip
FujitsuMicroelectronicsAmerica,Inc.
FulcrumMicrosystems
GardereWynneSewellLlp
GCTSemiconductor
GennumCorporation
GigOptixHelixAG
GlobalUnichipCorporation(GUC)
GTronix,Inc.
Hifn
HimaxTechnologies,Inc.
HiSiliconTechnologiesCo.,Ltd.
HoltekSemiconductorInc.
IBM
IceraInc.
IkanosCommunications,Inc.
Impinj,Inc.
InapacTechnology,Inc.
INCIDE,S.A.
InfineonTechnologiesAG
InnofideiInc.
InnovasicSemiconductor
InnovisionResearch&TechnologyPlc
InphiCorporation
IntegratedDeviceTechnology(IDT)
IntegratedSiliconSolution,Inc.(ISSI)
IntelCorporation
IntellaSysCorp.
Intellon
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28/03/2017 VLSIInterviewQuestions

InternationalRectifier
IntersilCorporation
IPextreme*
JacketMicroDevices(JMD)
JazzSemiconductor,Inc.,aTowerGroupCompany*
Jennic,Ltd.
JSCMikron
KeyASIC,Inc.
L3Communications,InfraredProducts
LegendSiliconCorporation
LogicVision,Inc.*
LSICorporation
LuminaryMicroInc.
LVSensors,Inc.
M2000InternationalInc.
MacronixInternationalCo.,Ltd.(MXIC)
MagICTechnologies
MagnaChipSemiconductor,Inc.
MagnoliaBroadband,Inc.
MagnumSemiconductor
MarvellSemiconductor,Inc.
MediaTekInc.
MedtronicMicroelectronicsCenter
MellanoxTechnologies,Inc.
MentorGraphicsCorporation*
MetaRAM
MicroAnalogSystemsOy
MicrobridgeTechnologies
MicronasSemiconductorHoldingAG(MicronasGroup)
MicrosemiCorporation
MindspeedTechnologies,Inc.
MiradiaInc.
MobilygenCorporation
MobiusMicrosystems,Inc.
MosChipSemiconductorTechnology
MSilicaIncorporated
Multigig,Inc.
NTrigLtd.
NanoradioAB
NECElectronicsCorporation
NethraImaging
NetLogicMicrosystems,Inc.
NewportMedia,Inc.
NextIO,Inc.
NextWaveWirelessInc.
NordicSemiconductorASA
NovatekMicroelectronicsCorporation
NVIDIACorporation
NXPSemiconductors
Octasic,Inc.
OpenSilicon,Inc.
OptichronInc.
OxfordSemiconductor,Inc.
ParkerVision,Inc.
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28/03/2017 VLSIInterviewQuestions

PhyworksLtd.
PicoChipDesignsLimited
Pixelworks,Inc.
Pixim,Inc.
PLXTechnology,Inc.
PMCSierra,Inc.
PowerchipSemiconductorCorporation(PSC)
PowervationLtd.
Primarion,AnInfineonTechnologiesCompany
PulseLinkInc.
PulseCoreSemiconductor
QPSemiconductor,Inc.
QUALCOMM
QuickLogicCorporation
QuinticCorporation
RapidBridgeLLC*
Rapport,Inc.
RedpineSignalsInc.
RFMicroDevices(RFMD)
RichWaveTechnologyCorp.
RMICorporation
SamsungElectronicsCo.,Ltd.
SanDiskCorporation
ScinteraNetworks,Inc.
SemtechCorporation
SequoiaCommunications
ShanghaiHuahongIntegratedCircuitCo.,Ltd.
SiBEAM,Inc.
SiconSemiconductorAB
SiGeSemiconductor,Inc.
SiliconLaboratories
SiliconMotion
SiliconStorageTechnology,Inc.(SST)
SilterraMalaysiaSdn.Bhd.*
SimtekCorporation
SiPort
SiRFTechnology,Inc.
SiTelSemiconductorB.V.
SkyworksSolutions,Inc.
SolidStateDevicesInc.
SpreadtrumCommunicationsInc.
StaccatoCommunications
StandardMicrosystemsCorporation(SMSC)
STATSChipPACLtd.*
STMicroelectronics
SummitMicroelectronics,Inc.
SunplusTechnologyCompany
Symwave
Synopsys,Inc.*
Tabula,Inc.
TaiwanSemiconductorManufacturingCorporation(TSMC)*
Tekmos
Teknovus,Inc.
TelegentSystems
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28/03/2017 VLSIInterviewQuestions

TeradiciCorporation
Teranetics
TheWesternDesignCenter,Inc.(WDC)
Thomson
TileraCorporation
TMTechnologyInc.(TMTECH)
ToshibaAmericaElectronicComponents,Inc.
TransmetaCorporation*
TranSwitchCorporation
TriadSemiconductor,Inc.
TundraSemiconductorCorporation
TZeroTechnologies,Inc.
uNavMicroelectronicsCorporation
Ubicom,Inc.
Ubidyne
UnionSemiconductorInc.
UnitedMicroelectronicsCorporation(UMC)*
UnitySemiconductor
VerigyLtd.*
VeriSilicon,Inc.*
VIATechnologies,Inc.
VimicroInternationalCorporation
VitesseSemiconductorCorporation
VivaceSemiconductorInc.
ViXSSystems,Inc.
VolterraSemiconductorCorporation
VTSilicon
Wintegra,Inc.
WiQuestCommunications,Inc.
WiSpry,Inc.
WolfsonMicroelectronics
XceiveInc.
XeleratedAB
Xilinx,Inc.
XMOSSemiconductorLtd.
ZilkerLabs,Inc.
ZiLOG,Inc.
Ziptronix,Inc.*
ZMOSTechnology,Inc.
ZoranCorporation

PostedbyVLSI_Rulesat6:05PM4comments:
Labels:backend,chip,cmos,Companies,design,fabless,
frontend,hyderabad,india,List,logic,of,physical,
semiconductor,verilog,vhdl,vlsi,world
Monday,November17,2008
CMOSInterviewQuestions
1.Explainwhy&howaMOSFETworks
2.DrawVdsIdscurveforaMOSFET.Now,showhowthiscurve
changes(a)withincreasingVgs(b)withincreasingtransistorwidth
(c)consideringChannelLengthModulation
3.ExplainthevariousMOSFETCapacitances&theirsignificance
4.DrawaCMOSInverter.Explainitstransfercharacteristics
5.Explainsizingoftheinverter
http://vlsichip.blogspot.in/ 5/50
28/03/2017 VLSIInterviewQuestions

6.HowdoyousizeNMOSandPMOStransistorstoincreasethe
thresholdvoltage?
7.WhatisNoiseMargin?ExplaintheproceduretodetermineNoise
Margin
8.GivetheexpressionforCMOSswitchingpowerdissipation
9.WhatisBodyEffect?
10.Describethevariouseffectsofscaling
11.GivetheexpressionforcalculatingDelayinCMOScircuit
12.Whathappenstodelayifyouincreaseloadcapacitance?
13.Whathappenstodelayifweincludearesistanceattheoutputof
aCMOScircuit?
14.Whatarethelimitationsinincreasingthepowersupplytoreduce
delay?
15.HowdoesResistanceofthemetallinesvarywithincreasing
thicknessandincreasinglength?
16.Youhavethreeadjacentparallelmetallines.Twooutofphase
signalspassthroughtheoutertwometallines.Drawthewaveforms
inthecentermetallineduetointerference.Now,drawthesignalsif
thesignalsinoutermetallinesareinphasewitheachother
17.Whathappensifweincreasethenumberofcontactsorviafrom
onemetallayertothenext?
18.DrawatransistorleveltwoinputNANDgate.Explainitssizing(a)
consideringVth(b)forequalriseandfalltimes
19.LetA&BbetwoinputsoftheNANDgate.SaysignalAarrivesat
theNANDgatelaterthansignalB.Tooptimizedelay,ofthetwo
seriesNMOSinputsA&B,whichonewouldyouplacenearthe
output?
20.DrawthestickdiagramofaNORgate.Optimizeit
21.ForCMOSlogic,givethevarioustechniquesyouknowtominimize
powerconsumption
22.WhatisChargeSharing?ExplaintheChargeSharingproblem
whilesamplingdatafromaBus
23.Whydowegraduallyincreasethesizeofinvertersinbuffer
design?Whynotgivetheoutputofacircuittoonelargeinverter?
24.Inthedesignofalargeinverter,whydoweprefertoconnect
smalltransistorsinparallel(thusincreasingeffectivewidth)rather
thanlayoutonetransistorwithlargewidth?
25.Givenalayout,drawitstransistorlevelcircuit.(Iwasgivena3
inputANDgateanda2inputMultiplexer.Youcanexpectanysimple
2or3inputgates)
26.GivethelogicexpressionforanAOIgate.Drawitstransistor
levelequivalent.Drawitsstickdiagram
27.WhydontweusejustoneNMOSorPMOStransistorasa
transmissiongate?
28.ForaNMOStransistoractingasapasstransistor,saythegateis
connectedtoVDD,givetheoutputforasquarepulseinputgoing
from0toVDD
29.Drawa6TSRAMCellandexplaintheReadandWriteoperations
30.DrawtheDifferentialSenseAmplifierandexplainitsworking.Any
ideahowtosizethiscircuit?(ConsiderChannelLengthModulation)
31.WhathappensifweuseanInverterinsteadoftheDifferential
SenseAmplifier?
32.DrawtheSRAMWriteCircuitry
33.Approximately,whatwerethesizesofyourtransistorsinthe
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28/03/2017 VLSIInterviewQuestions

SRAMcell?Howdidyouarriveatthosesizes?
34.HowdoesthesizeofPMOSPullUptransistors(forbit&bit
lines)affectSRAMsperformance?
35.WhatsthecriticalpathinaSRAM?
36.DrawthetimingdiagramforaSRAMRead.Whathappensifwe
delaytheenablingofClocksignal?
37.GiveabigpictureoftheentireSRAMLayoutshowingyour
placementsofSRAMCells,RowDecoders,ColumnDecoders,Read
Circuit,WriteCircuitandBuffers
38.InaSRAMlayout,whichmetallayerswouldyoupreferforWord
LinesandBitLines?Why?
39.HowcanyoumodelaSRAMatRTLLevel?
40.WhatsthedifferencebetweenTesting&Verification?
41.ForanANDORimplementationofatwoinputMux,howdoyou
testforStuckAt0andStuckAt1faultsattheinternalnodes?(You
canexpectacircuitwithsomeredundantlogic)
42.WhatisLatchUp?ExplainLatchUpwithcrosssectionofaCMOS
Inverter.HowdoyouavoidLatchUp?
============================================
===================
1.GivetwowaysofconvertingatwoinputNANDgatetoaninverter
2.Givenacircuit,drawitsexacttimingresponse.(Iwasgivena
PseudoRandomSignalGeneratoryoucanexpectanysequentialckt)
3.Whataresetuptime&holdtimeconstraints?Whatdothey
signify?Whichoneiscriticalforestimatingmaximumclockfrequency
ofacircuit?
4.Giveacircuittodividefrequencyofclockcyclebytwo
5.Designadivideby3sequentialcircuitwith50%dutycircle.(Hint:
DoubletheClock)
6.Supposeyouhaveacombinationalcircuitbetweentworegisters
drivenbyaclock.Whatwillyoudoifthedelayofthecombinational
circuitisgreaterthanyourclocksignal?(Youcantresizethe
combinationalcircuittransistors)
7.Theanswertotheabovequestionisbreakingthecombinational
circuitandpipeliningit.Whatwillbeaffectedifyoudothis?
8.WhatarethedifferentAddercircuitsyoustudied?
9.GivethetruthtableforaHalfAdder.Giveagatelevel
implementationofthesame.
10.DrawaTransmissionGatebasedDLatch.
11.DesignaTransmissionGatebasedXOR.Now,howdoyou
convertittoXNOR?(Withoutinvertingtheoutput)
12.Howdoyoudetectiftwo8bitsignalsaresame?
13.Howdoyoudetectasequenceof"1101"arrivingseriallyfroma
signalline?
14.DesignanyFSMinVHDLorVerilog.
15.ExplainRCcircuitscharginganddischarging.
16.Explaintheworkingofabinarycounter.
17.Describehowyouwouldreverseasinglylinkedlist.

PostedbyVLSI_Rulesat10:43AMNocomments:
Labels:analysis,asic,backend,buffer,chip,clock,cmos,
delay,design,layout,physical,routing,sta,synthesis,timing,
vlsi
FPGAInterviewQuestions

http://vlsichip.blogspot.in/ 7/50
28/03/2017 VLSIInterviewQuestions

1)Whatisminimumandmaximumfrequencyofdcminspartan3
seriesfpga?

Spartanseriesdcmshaveaminimumfrequencyof24MHZanda
maximumof248

2)Tellmesomeofconstraintsyouusedandtheirpurposeduringyour
design?

Therearelotofconstraintsandwillvaryfortooltotool,Iamlisting
someofXilinxconstraints
a)TranslateonandTranslateoff:theVerilogcodebetween
TranslateonandTranslateoffisignoredforsynthesis.
b)CLOCK_SIGNAL:isasynthesisconstraint.Inthecasewherea
clocksignalgoesthroughcombinatoriallogicbeforebeingconnected
totheclockinputofaflipflop,XSTcannotidentifywhatinputpinor
internalnetistherealclocksignal.Thisconstraintallowsyouto
definetheclocknet.
c)XOR_COLLAPSE:issynthesisconstraint.Itcontrolswhether
cascadedXORsshouldbecollapsedintoasingleXOR.
Formoreconstraintsdetaileddescriptionrefertoconstraintguide.

3)Supposeforapieceofcodeequivalentgatecountis600andfor
anothercodeequivalentgatecountis50,000willthesizeofbitmap
change?inotherwordswillsizeofbitmapchangeitgatecount
change?

Thesizeofbitmapisirrespectiveofresourceutilization,itisalways
thesame,forSpartanxc3s5000itis1.56MBandwillneverchange.

4)WhataredifferenttypesofFPGAprogrammingmodes?whatare
youcurrentlyusing?howtochangefromonetoanother?

BeforepoweringontheFPGA,configurationdataisstoredexternally
inaPROMorsomeothernonvolatilemediumeitheronoroffthe
board.Afterapplyingpower,theconfigurationdataiswrittentothe
FPGAusinganyoffivedifferentmodes:MasterParallel,Slave
Parallel,MasterSerial,SlaveSerial,andBoundaryScan(JTAG).The
MasterandSlaveParallelmodes
Modeselectingpinscanbesettoselectthemode,referdatasheet
forfurtherdetails.

5)TellmesomeoffeaturesofFPGAyouarecurrentlyusing?

Iamtakingexampleofxc3s5000toansweringthequestion.

Verylowcost,highperformancelogicsolutionfor
highvolume,consumerorientedapplications
Densitiesashighas74,880logiccells
Upto784I/Opins
622Mb/sdatatransferrateperI/O
18singleendedsignalstandards
6differentialI/OstandardsincludingLVDS,RSDS
TerminationbyDigitallyControlledImpedance
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28/03/2017 VLSIInterviewQuestions

Signalswingrangingfrom1.14Vto3.45V
DoubleDataRate(DDR)support
Logicresources
Abundantlogiccellswithshiftregistercapability
Widemultiplexers
Fastlookaheadcarrylogic
Dedicated18x18multipliers
Upto1,872KbitsoftotalblockRAM
Upto520KbitsoftotaldistributedRAM
DigitalClockManager(uptofourDCMs)
Clockskewelimination
Eightglobalclocklinesandabundantrouting

6)Whatisgatecountofyourproject?

Wellminewas3.2million,Idontknowyours.!

7)Canyoulistoutsomeofsynthesizableandnonsynthesizable
constructs?

notsynthesizable>>>>
initial
ignoredforsynthesis.
delays
ignoredforsynthesis.
events
notsupported.
real
Realdatatypenotsupported.
time
Timedatatypenotsupported.
forceandrelease
Forceandreleaseofdatatypesnotsupported.
forkjoin
Usenonblockingassignmentstogetsameeffect.
userdefinedprimitives
Onlygatelevelprimitivesaresupported.

synthesizableconstructs>>
assign,forloop,GateLevelPrimitives,repeatwithconstantvalue...

8)Canyouexplainwhatstruckatzeromeans?

ThesestuckatproblemswillappearinASIC.Sometimes,thenodes
willpermanentlytieto1or0becauseofsomefault.Toavoidthat,
weneedtoprovidetestabilityinRTL.Ifitispermanently1itiscalled
stuckat1Ifitispermanently0itiscalledstuckat0.

9)Canyoudrawgeneralstructureoffpga?

10)DifferencebetweenFPGAandCPLD?

FPGA:
a)SRAMbasedtechnology.
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28/03/2017 VLSIInterviewQuestions

b)Segmentedconnectionbetweenelements.
c)Usuallyusedforcomplexlogiccircuits.
d)Mustbereprogrammedoncethepowerisoff.
e)Costly

CPLD:
a)FlashorEPROMbasedtechnology.
b)Continuousconnectionbetweenelements.
c)Usuallyusedforsimplerormoderatelycomplexlogiccircuits.
d)Neednotbereprogrammedoncethepowerisoff.
e)Cheaper

11)Whataredcm's?whytheyareused?

Digitalclockmanager(DCM)isafullydigitalcontrolsystemthat
usesfeedbacktomaintainclocksignalcharacteristicswitha
highdegreeofprecisiondespitenormalvariationsinoperating
temperatureandvoltage.
ThatisclockoutputofDCMisstableoverwiderangeoftemperature
andvoltage,andalsoskewassociatedwithDCMisminimalandall
phasesofinputclockcanbeobtained.TheoutputofDCMcoming
formglobalbuffercanhandlemoreload.


12)FPGAdesignflow?

13)whatisslice,clb,lut?

Iamtakingexampleofxc3s500toanswerthisquestion

TheConfigurableLogicBlocks(CLBs)constitutethemainlogic
resourceforimplementingsynchronousaswellascombinatorial
circuits.
CLBareconfigurablelogicblocksandcanbeconfiguredto
combo,ramorromdependingoncodingstyle
CLBconsistof4slicesandeachsliceconsistoftwo4inputLUT(look
uptable)FLUTandGLUT.

14)Canaclbconfiguredasram?

YES.

Thememoryassignmentisaclockedbehavioralassignment,Reads
fromthememoryareasynchronous,Andalltheaddresslinesare
sharedbythereadandwritestatements.

15)Whatispurposeofaconstraintfilewhatisitsextension?

TheUCFfileisanASCIIfilespecifyingconstraintsonthelogical
design.Youcreatethisfileandenteryourconstraintsinthefilewith
atexteditor.YoucanalsousetheXilinxConstraintsEditortocreate
constraintswithinaUCF(extention)file.Theseconstraintsaffecthow
thelogicaldesignisimplementedinthetargetdevice.Youcanuse
thefiletooverrideconstraintsspecifiedduringdesignentry.
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28/03/2017 VLSIInterviewQuestions


16)WhatisFPGAyouarecurrentlyusingandsomeofmainreasons
forchoosingit?

17)DrawaroughdiagramofhowclockisroutedthroughoutFPGA?



18)Howmanyglobalbuffersarethereinyourcurrentfpga,whatis
theirsignificance?

Thereare8oftheminxc3s5000
AnexternalclocksourceenterstheFPGAusingaGlobalClockInput
Buffer(IBUFG),whichdirectlyaccessestheglobalclocknetworkor
anInputBuffer(IBUF).ClocksignalswithintheFPGAdriveaglobal
clocknetusingaGlobalClockMultiplexerBuffer(BUFGMUX).The
globalclocknetconnectsdirectlytotheCLKINinput.

19)Whatisfrequencyofoperationandequivalentgatecountofur
project?

20)Tellmesomeoftimingconstraintsyouhaveused?

21)Whyismaptimingoptionused?

Timingdrivenpackingandplacementisrecommendedtoimprove
designperformance,timing,andpackingforhighlyutilizeddesigns.

22)Whataredifferenttypesoftimingverifications?

Dynamictiming:
a.Thedesignissimulatedinfulltimingmode.
b.Notallpossibilitiestestedasitisdependentontheinputtest
vectors.
c.Simulationsinfulltimingmodeareslowandrequirealotof
memory.
d.Bestmethodtocheckasynchronousinterfacesorinterfaces
betweendifferenttimingdomains.
Statictiming:
a.Thedelaysoverallpathsareaddedup.
b.Allpossibilities,includingfalsepaths,verifiedwithouttheneedfor
testvectors.
c.Muchfasterthansimulations,hoursasopposedtodays.
d.Notgoodwithasynchronousinterfacesorinterfacesbetween
differenttimingdomains.

23)ComparePLL&DLL?

PLL:
PLLshavedisadvantagesthatmaketheiruseinhighspeeddesigns
problematic,particularlywhenbothhighperformanceandhigh
reliabilityarerequired.
ThePLLvoltagecontrolledoscillator(VCO)isthegreatestsourceof
problems.Variationsintemperature,supplyvoltage,and
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28/03/2017 VLSIInterviewQuestions

manufacturingprocessaffectthestabilityandoperatingperformance
ofPLLs.

DLLs,however,areimmunetotheseproblems.ADLLinitssimplest
forminsertsavariabledelaylinebetweentheexternalclockandthe
internalclock.Theclocktreedistributestheclocktoallregistersand
thenbacktothefeedbackpinoftheDLL.
ThecontrolcircuitoftheDLLadjuststhedelayssothattherising
edgesofthefeedbackclockalignwiththeinputclock.Oncetheedges
oftheclocksarealigned,theDLLislocked,andboththeinputbuffer
delayandtheclockskewarereducedtozero.
Advantages:
precision
stability
powermanagement
noisesensitivity
jitterperformance.


24)GiventwoASICs.onehassetupviolationandtheotherhashold
violation.howcantheybemadetoworktogetherwithoutmodifying
thedesign?

Slowtheclockdownontheonewithsetupviolations..
Andaddredundantlogicinthepathwhereyouhaveholdviolations.

25)Suggestsomewaystoincreaseclockfrequency?

Checkcriticalpathandoptimizeit.
Addmoretimingconstraints(overconstrain).
pipelinethearchitecturetothemaxpossibleextentkeepinginmind
latencyreq's.

26)WhatisthepurposeofDRC?

DRCisusedtocheckwhethertheparticularschematicand
correspondinglayout(especiallythemasksetsinvolved)catertoa
predefinedrulesetdependingonthetechnologyusedtodesign.
Theyareparameterssetasidebytheconcernedsemiconductor
manufacturerwithrespecttohowthemasksshouldbeplaced,
connected,routedkeepinginmindthatvariationsinthefabprocess
doesnoteffectnormalfunctionality.Itusuallydenotestheminimum
allowableconfiguration.

27)WhatisLVsandwhydowedothat.Whatisthedifference
betweenLVSandDRC?

Thelayoutmustbedrawnaccordingtocertainstrictdesignrules.
DRChelpsinlayoutofthedesignsbycheckingifthelayoutisabide
bythoserules.
Afterthelayoutiscompleteweextractthenetlist.LVScomparesthe
netlistextractedfromthelayoutwiththeschematictoensurethatthe
layoutisanidenticalmatchtothecellschematic.

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28/03/2017 VLSIInterviewQuestions

28)WhatisDFT?

DFTmeansdesignfortestability.'DesignforTestorTestability'a
methodologythatensuresadesignworksproperlyafter
manufacturing,whichlaterfacilitatesthefailureanalysisandfalse
product/piecedetection
Otherthanthefunctionallogic,youneedtoaddsomeDFTlogicin
yourdesign.Thiswillhelpyouintestingthechipformanufacturing
defectsafteritcomefromfab.Scan,MBIST,LBIST,IDDQtestingetc
areallpartofthis.(thisisahotfieldandwithlotsofopportunities)

29)TherearetwomajorFPGAcompanies:XilinxandAltera.Xilinx
tendstopromoteitshardprocessorcoresandAlteratendsto
promoteitssoftprocessorcores.Whatisthedifferencebetweena
hardprocessorcoreandasoftprocessorcore?

Ahardprocessorcoreisapredesignedblockthatisembeddedonto
thedevice.IntheXilinxVirtexIIPro,someofthelogicblockshave
beenremoved,andthespacethatwasusedfortheselogicblocksis
usedtoimplementaprocessor.TheAlteraNios,ontheotherhand,
isadesignthatcanbecompiledtothenormalFPGAlogic.

30)Whatisthesignificanceofcontaminationdelayinsequential
circuittiming?


31)WhenareDFTandFormalverificationused?

DFT:
manufacturingdefectslikestuckat"0"or"1".
testforsetofrulesfollowedduringtheinitialdesignstage.

Formalverification:
Verificationoftheoperationofthedesign,i.e,toseeifthedesign
followsspec.
gatenetlist==RTL?
usingmathematicsandstatisticalanalysistocheckforequivalence.

32)WhatisSynthesis?

Synthesisisthestageinthedesignflowwhichisconcernedwith
translatingyourVerilogcodeintogatesandthat'sputtingitvery
simply!Firstofall,theVerilogmustbewritteninaparticularwayfor
thesynthesistoolthatyouareusing.Ofcourse,asynthesistool
doesn'tactuallyproducegatesitwilloutputanetlistofthedesign
thatyouhavesynthesisedthatrepresentsthechipwhichcanbe
fabricatedthroughanASICorFPGAvendor.

33)Weneedtosampleaninputoroutputsomethingatdifferent
rates,butIneedtovarytherate?What'sacleanwaytodothis?

Many,manyproblemshavethissortofvariableraterequirement,yet
weareusuallyconstrainedwithaconstantclockfrequency.Onetrick
istoimplementadigitalNCO(NumericallyControlledOscillator).An
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28/03/2017 VLSIInterviewQuestions

NCOisactuallyverysimpleand,whileitismostnaturallyunderstood
ashardware,italsocanbeconstructedinsoftware.TheNCO,quite
simply,isanaccumulatorwhereyoukeepaddingafixedvalueon
everyclock(e.g.ataconstantclockfrequency).WhentheNCO
"wraps",yousampleyourinputordoyouraction.Byadjustingthe
valueaddedtotheaccumulatoreachclock,youfinelytunethe
AVERAGEfrequencyofthatwrapevent.Nowyoumayhaverealized
thatthewrappingeventmayhavelotsofjitteronit.True,butyou
mayusethewraptoincrementyetanothercounterwhereeach
additionalDivideby2bitreducesthisjitter.TheDDSisarelated
technique.IhavetwoexamplesshowingbothanNCOsandaDDSin
myFileArchive.Thisistrickytograspatfirst,buttremendously
powerfulonceyouhaveitinyourbagoftricks.NCOsalsorelateto
digitalPLLs,TimingRecovery,TDMAandother"variablerate"
phenomena.

PostedbyVLSI_Rulesat10:42AM2comments:
Labels:asic,chip,cmos,combinational,design,digital,fifo,
flip,flop,fpga,fsm,interview,latch,questions,RTL,
sequential,synchronous,verilog,vhdl,vlsi
VHDLInterviewQuestions
Whatisthedifferencebetweenusingdirectinstntiationsand
componentonesexceptthatyouneedtodeclarethecomponent?

WhatistheuseofBLOCKS?

WhatistheuseofPROCEDURES?

Whatistheusageofusingmorethenonearchitectureinanentity?

WhatisaDlatch?WritetheVHDLCodeforit?

ImplementDflipflopwithacoupleoflatches?WriteaVHDLCode
foraDflipflop?

DifferencesbetweenSignalsandVariablesinVHDL?Ifthesame
codeiswrittenusingSignalsandVariableswhatdoesitsynthesize
to?

DifferencesbetweenfunctionsandProceduresinVHDL?

ExplaintheconceptofaClockDividerCircuit?WriteaVHDLcodefor
thesame?

WhatyouwoulduseinRTLa'boolean'typeora'std_logic'typeand
why.

Whatare/maybetheimplicationsofusingan'integer'typeinRTL.

Atimingpathfails:whatareyouroptions?

WhatareVHDLstructures,giveanexampletoexploitthem

Whatisgreycoding,anyexamplewheretheyareused

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28/03/2017 VLSIInterviewQuestions


DiscussAsyncinterfaces

Metastability

Synopsysunwantedlatch

Verilogblockingvsnonblocking

VHDLvariables:examplewhereyouhavetousethem

Whatispipeliningandhowitmayimprovetheperformance

Whataremulticyclepaths.

Whatarefalsepaths

WhatareAsynccounters,whatareadvantagesofusingtheseover
synccounters.andwhatarethedisadvantages

SensitivityList:
Howdoesitmatter.Whatwillhappen
ifyoudontincludeasignalinthesensitivitylist
anduse/readitinsidetheprocess

HowyouwillimplementaClanguagepointerinVHDL

WhatisDesignForTestandwhyitisdone.

Whatisclockgating?Howandwhyitisdone.
LowPower:discusshowitmaybedone

Discussdisadvantages/challengesofshrinkingtechnology

Whatispipelining,howmayitaffecttheperformanceofadesign
Whatisthedifferencebetweentransportdelaysandinertialdelaysin
VHDL
Whatdeterminesthemaxfrequencyadigitaldesignmayworkon
Whythold(holdtime)isnotincludedinthecalculationfortheabove.
Whatwillhappenifoutputofaninverterisshortedtoitsinput
Whatisnoisemargin.
WhyarepmoslargerthannmosinCMOSdesign.
DrawDCcurveofinverterandReDrawitifpmosandnmosare
equal.
WhatisLatchup
HowcananInverterworkasanamplifier
Designastatemachinewhichdividestheinputfrequencyofaclock
by3.

Whydoesapassgaterequirestwotransistors(1Nand1Ptype)Can
weusea
singletransistorNorPtypeinapassgate?Ifnotwhy?andifyes
theninwhatconditions?

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28/03/2017 VLSIInterviewQuestions

WhyCMOSwhynotNMOSorPMOSlogic,whenweknowthatthe
number
ofgatesrequiredinCMOSaregraterthaninnmosorpmoslogic.

HowmuchisthemaxfanoutofatypicalCMOSgate.Oralternatively,

discussthelimitingfactors.

Whataredynamiclogicgates?Whataretheiradvantagesover
conventionallogicgates

Designadigitalcircuittodelaythenegativeedgeoftheinputsignal
by2clockcycles

Whatistherelationbetweenbinaryencodingandgrey(orgray)
encoding.

Writeavhdlfunctiontoimplementalengthindependentgreycode
counter.
alternatively,discussthelogictodothat.

Howyouwillconstraintacombinationallogicpaththroughyour
design
indc_shell.

MakeaTFlipFlopusingaDFlipFlop

HowyouwillmakeaNandGatefunctionlikeaninverter.

Designastatemachinetodetecta'1101'patterninastream.
Detectboth,overlappingandnonoverlappingpatterns.

WhatareMISRs,exampleusage?

PostedbyVLSI_Rulesat10:41AMNocomments:
Labels:asic,chip,cmos,combinational,design,digital,fifo,
flip,flop,fsm,interview,latch,questions,RTL,sequential,
skew,synchronous,verilog,vhdl,vlsi
VerilogInterviewQuestions
1.WhatisthedifferencebetweenBehaviormodelingandRTL
modeling?
2.WhatisthebenefitofusingBehaviormodelingstyleoverRTL
modeling?
3.Whatisthedifferencebetweenblockingassignmentsandnon
blockingassignments?
4.HowdoyouimplementthebidirectionalportsinVerilogHDL
5.HowtomodelinertialandtransportdelayusingVerilog?
6.Howtosynchronizecontrolsignalsanddatabetweentwodifferent
clockdomains?
7.Create4bitmultiplierusingaROMandwhatwillbethesizeofthe
ROM.Howcanyourealizeitwhentheoutputsarespecified.
8.Howcanyouswap2integersaandb,withoutusinga3rdvariable
9.Whichoneispreferred?1'scomplementor2'scomplementand
why?

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28/03/2017 VLSIInterviewQuestions

10.WhichoneispreferredinFSMdesign?MealyorMoore?Why?
11.Whichoneispreferredindesignentry?RTLcodingorSchematic?
Why?
12.Designa2inputORgateusinga2:1mux.
13.Designa2inputANDgateusinga2inputXORgate.
14.Designahardwaretoimplementfollowingequationswithout
usingmultipliersordividers.
a.out=7x+8y
b.out=.78x+.17y
15.DesignGraycountertocount6.
16.DesignXORgateusingjustNANDgates.
17.Create"AND"gateusinga2:1multiplexer.(Createallother
gatestoo.)
18.Howareblockingandnonblockingstatementsexecuted?
19.Howdoyoumodelasynchronousandasynchronousresetin
Verilog?
20.Whathappensifthereisconnectingwireswidthmismatch?
21.Whataredifferentoptionsthatcanbeusedwith$display
statementinVerilog?
22.GivetheprecedenceorderoftheoperatorsinVerilog.
23.Shouldweincludealltheinputsofacombinationalcircuitinthe
sensitivitylist?Givereason.
24.Give10commonlyusedVerilogkeywords.
25.IsitpossibletooptimizeaVerilogcodesuchthatwecanachieve
lowpowerdesign?
26.Whichisupdatedfirst:signalorvariable?

PostedbyVLSI_Rulesat10:40AMNocomments:
Labels:asic,chip,cmos,combinational,design,digital,fifo,
flip,flop,fsm,interview,latch,questions,RTL,sequential,
skew,synchronous,verilog,vhdl,vlsi
BasicDigitalInterviewQuestions
WhatisthefunctionofaDflipflop,whoseinvertedoutputis
connectedtoitsinput?


Designacircuittodivideinputfrequencyby2.


Designadivideby3sequentialcircuitwith50%dutycycle.


Designadivideby5sequentialcircuitwith50%dutycycle.


Whatarethedifferenttypesofadderimplementations?


DrawaTransmissionGatebasedDLatch.


GivethetruthtableforaHalfAdder.Giveagatelevel
implementationofit.

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28/03/2017 VLSIInterviewQuestions

DesignanXORgatefrom2:1MUXandaNOTgate


WhatisthedifferencebetweenaLATCHandaFLIPFLOP?


*Latchisalevelsensitivedevicewhileflipflopisanedgesensitive
device.
*Latchissensitivetoglitchesonenablepin,whereasflipflopis
immunetoglitches.
*Latchestakelessgates(alsolesspower)toimplementthanflip
flops.
*Latchesarefasterthanflipflops.

DesignaDFlipFlopfromtwolatches.

Designa2bitcounterusingDFlipFlop.

Whatarethetwotypesofdelaysinanydigitalsystem?

DesignaTransparentLatchusinga2:1Mux.

Designa4:1Muxusing2:1Muxesandsomecombologic.

Whatismetastablestate?Howdoesitoccur?


Whatismetastability?


Designa3:8decoder


DesignaFSMtodetectsequence"101"ininputsequence.


ConvertNANDgateintoInverter,intwodifferentways.


DesignaDandTflipflopusing2:1muxuseofothercomponents
notallowed,justthemux.


DesignadividebytwocounterusingDLatch.


DesignDLatchfromSRflipflop.


DefineClockSkew,NegativeClockSkew,PositiveClockSkew.


WhatisRaceCondition?

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28/03/2017 VLSIInterviewQuestions


Designa4bitGrayCounter.


Design4bitSynchronouscounter,Asynchronouscounter.


Designa16byteAsynchronousFIFO.


WhatisthedifferencebetweenanEEPROMandaFLASH?


WhatisthedifferencebetweenaNANDbasedFlashandaNOR
basedFlash?


Youaregivena100MHzclock.Designa33.3MHzclockwithand
without50&37dutycycle.


DesignaReadonResetSystem?


Whichoneissuperior:AsynchronousResetorSynchronousReset?
Explain.


DesignaStatemachineforTrafficControlataFourpointJunction.


WhatareFIFO's?CanyoudrawtheblockdiagramofFIFO?Could
youmodifyittomakeitasynchronousFIFO?


Howcanyougeneraterandomsequencesindigitalcircuits?

PostedbyVLSI_Rulesat10:39AM1comment:
Labels:asic,chip,cmos,combinational,design,digital,fifo,
flip,flop,fsm,interview,latch,questions,RTL,sequential,
skew,synchronous,verilog,vhdl,vlsi
PhysicalDesignInterviewQuestions
CompanywiseASIC/VLSIInterviewQuestions

BelowquestionsareaskedforseniorpositioninPhysicalDesign
domain.ThequestionsarealsorelatedtoStaticTimingAnalysisand
Synthesis.Answerstosomequestionsaregivenaslink.Remaining
questionswillbeansweredincomingblogs.


Commonintroductoryquestionseveryinterviewerasksare:


*Discussabouttheprojectsworkedinthepreviouscompany.

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28/03/2017 VLSIInterviewQuestions

*Whatarephysicaldesignflows,variousactivitiesyouareinvolved?
*Designcomplexity,capacity,frequency,processtechnologies,block
sizeyouhandled.


Intel

*Whypowerstripesroutedinthetopmetallayers?

TheresistivityoftopmetallayersarelessandhencelessIRdropis
seeninpowerdistributionnetwork.Ifpowerstripesareroutedin
lowermetallayersthiswillusegoodamountoflowerrouting
resourcesandthereforeitcancreateroutingcongestion.

*WhydoyouusealternateroutingapproachHVH/VHV(Horizontal
VerticalHorizontal/VerticalHorizontalVertical)?

Answer:

Thisapproachallowsroutabilityofthedesignandbetterusageof
routingresources.


*Whatareseveralfactorstoimprovepropagationdelayofstandard
cell?

Answer:

Improvetheinputtransitiontothecellunderconsiderationbyup
sizingthedriver.
Reducetheloadseenbythecellunderconsideration,eitherby
placementrefinementorbuffering.
IfallowedincreasethedrivestrengthorreplacewithLVT(low
thresholdvoltage)cell.

*Howdoyoucomputenetdelay(interconnectdelay)/decodeRC
valuespresentintechfile?
*Whatarevariouswaysoftimingoptimizationinsynthesistools?

Answer:

Logicoptimization:buffersizing,cellsizing,leveladjustment,dummy
bufferingetc.

LessnumberoflogicsbetweenFlipFlopsspeedupthedesign.

Optimizedrivestrengthofthecell,soitiscapableofdrivingmore
loadandhencereducingthecelldelay.

Betterselectionofdesignwarecomponent(selecttimingoptimized
designwarecomponents).

UseLVT(Lowthresholdvoltage)andSVT(standardthreshold
voltage)cellsifallowed.
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28/03/2017 VLSIInterviewQuestions



*Whatwouldyoudoinordertonotusecertaincellsfromthe
library?

Answer:

Setdontuseattributeonthoselibrarycells.

*HowdelaysarecharacterizedusingWLM(WireLoadModel)?

Answer:

Foragivenwireloadmodelthedelayareestimatedbasedonthe
numberoffanoutofthecelldrivingthenet.

FanoutvsnetlengthistabulatedinWLMs.

ValuesofunitresistanceRandunitcapacitanceCaregivenin
technologyfile.

Netlengthvariesbasedonthefanoutnumber.

OncethenetlengthisknowndelaycanbecalculatedSometimesitis
againtabulated.

*Whatarevarioustechniquestoresolvecongestion/noise?

Answer:

Routingandplacementcongestionalldependupontheconnectivityin
thenetlist,abetterfloorplancanreducethecongestion.

Noisecanbereducedbyoptimizingtheoverlapofnetsinthedesign.

*Letssaythereenoughroutingresourcesavailable,timingisfine,
canyouincreaseclockbuffersinclocknetwork?Ifsowilltherebe
anyimpactonotherparameters?

Answer:

No.Youshouldnotincreaseclockbuffersintheclocknetwork.
Increaseinclockbufferscausemorearea,morepower.When
everythingisfinewhyyouwanttotouchclocktree??

*Howdoyouoptimizeskew/insertiondelaysinCTS(ClockTree
Synthesis)?

Answer:

Betterskewtargetsandinsertiondelayvaluesprovidedwhilebuilding
theclocks.

Chooseappropriatetreestructureeitherbasedonclockbuffersor
http://vlsichip.blogspot.in/ 21/50
28/03/2017 VLSIInterviewQuestions

clockinvertersormixofclockbuffersorclockinverters.

Formulticlockdomain,grouptheclockswhilebuildingtheclocktree
sothatskewisbalancedacrosstheclocks.(Interclockskew
analysis).

*Whatarepros/consoflatch/FF(FlipFlop)?


*Howyougoaboutfixingtimingviolationsforlatchlatchpaths?
*Asanengineer,letssayyourmanagercomestoyouandasksfor
nextprojectdiesizeestimation/projection,givingdataonRTLsize,
performancerequirements.Howdoyougoaboutthefiguringoutand
comeupwithdiesizeconsideringphysicalaspects?
*Howwillyoudesigninsertingvoltageislandschemebetween
macropinscrossingcoreandareatdifferentpowerwells?Whatis
theoptimalresourcesolution?
*Whatarevariousformalverificationissuesyoufacedandhowdid
youresolve?
*Howdoyoucalculatemaximumfrequencygivensetup,hold,clock
andclockskew?
*Whatareeffectsofmetastability?


*Consideratimingpathcrossingfromfastclockdomaintoslow
clockdomain.Howdoyoudesignsynchronizercircuitwithout
knowingthesourceclockfrequency?
*Howtosolvecrossclocktimingpath?
*HowtodeterminethedepthofFIFO/sizeoftheFIFO?



STmicroelectronics

*Whatarethechallengesyoufacedinplaceandroute,FV(Formal
Verification),ECO(EngineeringChangeOrder)areas?
*Howlongthedesigncycleforyourdesigns?
*Whatpartareyourareasofinterestinphysicaldesign?
*ExplainECO(EngineeringChangeOrder)methodology.
*ExplainCTS(ClockTreeSynthesis)flow.


*Whatkindofroutingissuesyoufaced?
*HowdoesSTA(StaticTimingAnalysis)inOCV(OnChipVariation)
conditionsdone?HowdoyousetOCV(OnChipVariation)inIC
compiler?Howistimingcorrelationdonebeforeandafterplaceand
route?


*Iftherearetoomanypinsofthelogiccellsinoneplacewithin
core,whatkindofissueswouldyoufaceandhowwillyouresolve?
*Definehash/@arrayinperl.
*UsingTCL(ToolCommandLanguage,Tickle)howdoyouset
variables?
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28/03/2017 VLSIInterviewQuestions

*WhatisICC(ICCompiler)commandforsettingderatefactor/
commandtoperformphysicalsynthesis?
*Whatarenanorouteoptionsforsearchandrepair?
*Whatwereyourdesignskew/insertiondelaytargets?
*HowisIRdropanalysisdone?Whatarevariousstatisticsavailable
inreports?
*Explainpindensity/celldensityissues,hotspots?
*Howwillyourelateroutinggridwithmanufacturinggridandjudge
iftheroutinggridissetcorrectly?
*Whatisthecommandforsettingmulticyclepath?
*Ifholdviolationexistsindesign,isitOKtosignoffdesign?Ifnot,
why?


TexasInstruments(TI)

*Howaretimingconstraintsdeveloped?
*Explaintimingclosureflow/methodology/issues/fixes.
*ExplainSDF(StandardDelayFormat)backannotation/SPEF
(StandardParasiticExchangeFormat)timingcorrelationflow.
*Givenatimingpathinmultimodemulticorner,howisSTA(Static
TimingAnalysis)performedinordertomeettiminginbothmodes
andcorners,howarePVT(ProcessVoltageTemperature)/derate
factorsdecidedandsetinthePrimetimeflow?
*Withrespecttoclockgate,whatarevariousissuesyoufacedat
variousstagesinthephysicaldesignflow?
*Whataresynthesisstrategiestooptimizetiming?
*ExplainECO(EngineeringChangeOrder)implementationflow.
Givenpostrouteddatabaseandfunctionalfixes,howwillyoutakeit
toimplementECO(EngineeringChangeOrder)andwhatphysicaland
functionalchecksyouneedtoperform?


Qualcomm

*Inbuildingthetimingconstraints,doyouneedtoconstrainallIO
(InputOutput)ports?
*Canasingleporthavemulticlocked?Howdoyousetdelaysfor
suchports?
*HowisscanDEF(DesignExchangeFormat)generated?
*Whatispurposeoflockuplatchinscanchain?
*Explainshortcircuitcurrent.

*Whatarepros/consofusinglowVt,highVtcells?

*Howdoyousetinterclockuncertainty?

Answer:

set_clock_uncertaintyfromclock1toclock2

*InDC(DesignCompiler),howdoyouconstrainclocks,IO(Input
Output)ports,maxcap,maxtran?
*WhataredifferencesinclockconstraintsfrompreCTS(ClockTree
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28/03/2017 VLSIInterviewQuestions

Synthesis)topostCTS(ClockTreeSynthesis)?

Answer:

DifferenceinclockuncertaintyvaluesClocksarepropagatedinpost
CTS.

InpostCTSclocklatencyconstraintismodifiedtomodelclockjitter.

*Howisclockgatingdone?

*WhatconstraintsyouaddinCTS(ClockTreeSynthesis)forclock
gates?

Answer:

Maketheclockgatingcellsasthroughpins.

*Whatistradeoffbetweendynamicpower(current)andleakage
power(current)?

Answer:

*Howdoyoureducestandby(leakage)power?

*Explaintoplevelpinplacementflow?Whatareparametersto
decide?
*Givenblocklevelnetlists,timingconstraints,libraries,macroLEFs
(LayoutExchangeFormat/LibraryExchangeFormat),howwillyou
startfloorplanning?
*Withnetlengthof1000umhowwillyoucomputeRCvalues,using
equations/techfileinfo?
*Whatdonoisereportsrepresent?
*Whatdoesglitchreportscontain?
*WhatareCTS(ClockTreeSynthesis)stepsinICcompiler?
*Whatdoclockconstraintsfilecontain?
*Howtoanalyzeclocktreereports?
*WhatdoIRdropVoltagestormreportsrepresent?
*Where/whendoyouuseDCAP(DecouplingCapacitor)cells?
*Whatarevariouspowerreductiontechniques?


HughesNetworks

*Whatissetup/hold?Whataresetupandholdtimeimpactson
timing?Howwillyoufixsetupandholdviolations?
*ExplainfunctionofMuxedFF(MultiplexedFlipFlop)/scanFF(Scal
FlipFlop).
*WhataretestedinDFT(DesignforTestability)?
*Inequivalencechecking,howdoyouhandlescanensignal?
*IntermsofCMOS(ComplimentaryMetalOxideSemiconductor),
explainphysicalparametersthataffectthepropagationdelay?
*Whatarepowerdissipationcomponents?Howdoyoureduce
them?
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28/03/2017 VLSIInterviewQuestions


*HowdelayaffectedbyPVT(ProcessVoltageTemperature)?

*Whyispowersignalroutedintopmetallayers?


AvagoTechnologies(formerHPgroup)

*Howdoyouminimizeclockskew/balanceclocktree?
*Given11mintermsandaskedtoderivethelogicfunction.
*GivenC1=10pf,C2=1pfconnectedinserieswithaswitchin
between,att=0switchisopenandoneendhaving5vandotherend
zerovoltagecomputethevoltageacrossC2whentheswitchis
closed?
*ExplainthemodesofoperationofCMOS(ComplimentaryMetal
OxideSemiconductor)inverter?ShowIO(InputOutput)
characteristicscurve.
*Implementaringoscillator.
*Howtoslowdownringoscillator?


HynixSemiconductor

*Howdoyouoptimizepoweratvariousstagesinthephysicaldesign
flow?
*Whattimingoptimizationstrategiesyouemployinprelayout/post
layoutstages?
*Whatareprocesstechnologychallengesinphysicaldesign?
*Designdivideby2,divideby3,anddivideby1.5counters.Draw
timingdiagrams.
*Whataremulticyclepaths,falsepaths?Howtoresolvemulticycle
andfalsepaths?
*Givenafloptofloppathwithcombodelayinbetweenandoutputof
thesecondflopfedbacktocombologic.Whichpathisfastestpathto
haveholdviolationandhowwillyouresolve?
*WhatareRTL(RegisterTransferLevel)codingstylestoadaptto
yieldoptimalbackenddesign?
*Drawtimingdiagramstorepresentthepropagationdelay,setup,
hold,recovery,removal,minimumpulsewidth.


AboutContributor

ASIC_diehardhasmorethan5yearsofexperienceinphysicaldesign,
timing,netlisttoGDSflowsofIntegratedCircuitdevelopment.
ASIC_diehard'sfieldsofinterestarebackenddesign,placeandroute,
timingclosure,processtechnologies.


Readersareencouragedtodiscussanswerstothesequestions.Just
clickonthe'postacomment'optionbelowandputyourcomments
there.Alternativelyyoucansendyouranswers/discussionstomy
mailid:[email protected]
PhysicalDesignObjectiveTypeofQuestionsandAnswers
http://vlsichip.blogspot.in/ 25/50
28/03/2017 VLSIInterviewQuestions


*1)Chiputilizationdependson___.

a.Onlyonstandardcells
b.Standardcellsandmacros
c.Onlyonmacros
d.StandardcellsmacrosandIOpads

*2)InSoftblockages____cellsareplaced.

a.Onlysequentialcells
b.Nocells
c.OnlyBuffersandInverters
d.Anycells

*3)Whywehavetoremovescanchainsbeforeplacement?

a.Becausescanchainsaregroupofflipflop
b.Itdoesnothavetimingcriticalpath
c.ItisseriesofflipflopconnectedinFIFO
d.None

*4)Delaybetweenshortestpathandlongestpathintheclockis
called____.

a.Usefulskew
b.Localskew
c.Globalskew
d.Slack

*5)Crosstalkcanbeavoidedby___.

a.Decreasingthespacingbetweenthemetallayers
b.Shieldingthenets
c.Usinglowermetallayers
d.Usinglongnets

*6)Preroutingmeansroutingof_____.

a.Clocknets
b.Signalnets
c.IOnets
d.PGnets

*7)WhichofthefollowingmetallayerhasMaximumresistance?

a.Metal1
b.Metal2
c.Metal3
d.Metal4

*8)WhatisthegoalofCTS?

a.MinimumIRDrop
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28/03/2017 VLSIInterviewQuestions

b.MinimumEM
c.MinimumSkew
d.MinimumSlack

*9)UsuallyHoldisfixed___.

a.BeforePlacement
b.AfterPlacement
c.BeforeCTS
d.AfterCTS

*10)Toachievebettertiming____cellsareplacedinthecritical
path.

a.HVT
b.LVT
c.RVT
d.SVT

*11)Leakagepowerisinverselyproportionalto___.

a.Frequency
b.LoadCapacitance
c.Supplyvoltage
d.ThresholdVoltage

*12)Fillercellsareadded___.

a.BeforePlacementofstdcells
b.AfterPlacementofStdCells
c.BeforeFloorplanning
d.BeforeDetailRouting

*13)SearchandRepairisusedfor___.

a.ReducingIRDrop
b.ReducingDRC
c.ReducingEMviolations
d.None

*14)Maximumcurrentdensityofametalisavailablein___.

a..lib
b..v
c..tf
d..sdc

*15)MoreIRdropisdueto___.

a.Increaseinmetalwidth
b.Increaseinmetallength
c.Decreaseinmetallength
d.Lotofmetallayers

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28/03/2017 VLSIInterviewQuestions

*16)Theminimumheightandwidthacellcanoccupyinthedesign
iscalledas___.

a.UnitTilecell
b.Multiheightencell
c.LVTcell
d.HVTcell

*17)CRPRstandsfor___.

a.CellConvergencePessimismRemoval
b.CellConvergencePresetRemoval
c.ClockConvergencePessimismRemoval
d.ClockConvergencePresetRemoval

*18)InOCVtimingcheck,forsetuptime,___.

a.MaxdelayisusedforlaunchpathandMindelayforcapturepath
b.MindelayisusedforlaunchpathandMaxdelayforcapturepath
c.BothMaxdelayisusedforlaunchandCapturepath
d.BothMindelayisusedforbothCaptureandLaunchpaths

*19)"Totalmetalareaand(or)perimeterofconductinglayer/gate
togatearea"iscalled___.

a.Utilization
b.AspectRatio
c.OCV
d.AntennaRatio

*20)TheSolutionforAntennaeffectis___.

a.Diodeinsertion
b.Shielding
c.Bufferinsertion
d.Doublespacing

*21)Toavoidcrosstalk,theshieldednetisusuallyconnectedto
___.

a.VDD
b.VSS
c.BothVDDandVSS
d.Clock

*22)IfthedataisfasterthantheclockinRegtoRegpath___
violationmaycome.

a.Setup
b.Hold
c.Both
d.None

*23)Holdviolationsarepreferredtofix___.
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28/03/2017 VLSIInterviewQuestions


a.Beforeplacement
b.Afterplacement
c.BeforeCTS
d.AfterCTS


*24)WhichofthefollowingisnotpresentinSDC___?

a.Maxtran
b.Maxcap
c.Maxfanout
d.Maxcurrentdensity

*25)Timingsanitycheckmeans(withrespecttoPD)___.

a.Checkingtimingofrouteddesignwithoutnetdelays
b.CheckingTimingofplaceddesignwithnetdelays
c.CheckingTimingofunplaceddesignwithoutnetdelays
d.CheckingTimingofrouteddesignwithnetdelays

*26)Whichofthefollowingishavinghighestpriorityatfinalstage
(postrouted)ofthedesign___?

a.Setupviolation
b.Holdviolation
c.Skew
d.None

*27)WhichofthefollowingisbestsuitedforCTS?

a.CLKBUF
b.BUF
c.INV
d.CLKINV

*28)Maxvoltagedropwillbethereat(withoutmacros)___.

a.LeftandRightsides
b.BottomandTopsides
c.Middle
d.None

*29)Whichofthefollowingispreferredwhileplacingmacros___?

a.Macrosplacedcenterofthedie
b.Macrosplacedleftandrightsideofdie
c.Macrosplacedbottomandtopsidesofdie
d.MacrosplacedbasedonconnectivityoftheI/O

*30)Routingcongestioncanbeavoidedby___.

a.placingcellscloser
b.Placingcellsatcorners
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c.Distributingcells
d.None

*31)Pitchofthewireis___.

a.Minwidth
b.Minspacing
c.Minwidthminspacing
d.Minwidth+minspacing

*32)InPhysicalDesignfollowingstepisnotthere___.

a.Floorplaning
b.Placement
c.DesignSynthesis
d.CTS

*33)Intechnologyfileif7metalsaretherethenwhichmetalsyou
willuseforpower?

a.Metal1andmetal2
b.Metal3andmetal4
c.Metal5andmetal6
d.Metal6andmetal7

*34)Ifmetal6andmetal7areusedforthepowerin7metallayer
processdesignthenwhichmetalsyouwilluseforclock?

a.Metal1andmetal2
b.Metal3andmetal4
c.Metal4andmetal5
d.Metal6andmetal7

*35)InaregtoregtimingpathTclocktoqdelayis0.5nsand
TCombodelayis5nsandTsetupis0.5nsthentheclockperiodshould
be___.

a.1ns
b.3ns
c.5ns
d.6ns

*36)DifferencebetweenClockbuff/invertersandnormal
buff/invertersis__.

a.Clockbuff/invertersarefasterthannormalbuff/inverters
b.Clockbuff/invertersareslowerthannormalbuff/inverters
c.Clockbuff/invertersarehavingequalriseandfalltimeswithhigh
drivestrengthscomparetonormalbuff/inverters
d.Normalbuff/invertersarehavingequalriseandfalltimeswithhigh
drivestrengthscomparetoClockbuff/inverters.

*37)Whichconfigurationismorepreferredduringfloorplaning?

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a.Doublebackwithflippedrows
b.Doublebackwithnonflippedrows
c.Withchannelspacingbetweenrowsandnodoubleback
d.Withchannelspacingbetweenrowsanddoubleback

*38)Whatistheeffectofhighdrivestrengthbufferwhenaddedin
longnet?

a.Delayonthenetincreases
b.Capacitanceonthenetincreases
c.Delayonthenetdecreases
d.Resistanceonthenetincreases.

*39)Delayofacelldependsonwhichfactors?

a.Outputtransitionandinputload
b.InputtransitionandOutputload
c.InputtransitionandOutputtransition
d.InputloadandOutputLoad.

*40)Afterthefinalroutingtheviolationsinthedesign___.

a.Therecanbenosetup,noholdviolations
b.Therecanbeonlysetupviolationbutnohold
c.TherecanbeonlyholdviolationnotSetupviolation
d.Therecanbebothviolations.

*41)Utilisationofthechipafterplacementoptimisationwillbe___.

a.Constant
b.Decrease
c.Increase
d.Noneoftheabove

*42)Whatisroutingcongestioninthedesign?

a.Ratioofrequiredroutingtrackstoavailableroutingtracks
b.Ratioofavailableroutingtrackstorequiredroutingtracks
c.Dependsontheroutinglayersavailable
d.Noneoftheabove

*43)Whatarepreroutesinyourdesign?

a.Powerrouting
b.Signalrouting
c.PowerandSignalrouting
d.Noneoftheabove.

*44)Clocktreedoesn'tcontainfollowingcell___.

a.Clockbuffer
b.ClockInverter
c.AOIcell
d.Noneoftheabove
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*Answers:

1)b
2)c
3)b
4)c
5)b
6)d
7)a
8)c
9)d
10)b
11)d
12)d
13)b
14)c
15)b
16)a
17)c
18)a
19)d
20)a
21)b
22)b
23)d
24)d
25)c
26)b
27)a
28)c
29)d
30)c
31)d
32)c
33)d
34)c
35)d
36)c
37)a
38)c
39)b
40)d
41)c
42)a
43)a
44)c
Backend(PhysicalDesign)InterviewQuestionsandAnswers

*Belowarethesequenceofquestionsaskedforaphysicaldesign
engineer.



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Inwhichfieldareyouinterested?

*Answertothisquestiondependsonyourinterest,expertiseandto
therequirementforwhichyouhavebeeninterviewed.

*Well..thecandidategaveanswer:Lowpowerdesign


Canyoutalkaboutlowpowertechniques?
Howlowpowerandlatest90nm/65nmtechnologiesarerelated?

Doyouknowaboutinputvectorcontrolledmethodofleakage
reduction?

*Leakagecurrentofagateisdependantonitsinputsalso.Hence
findthesetofinputswhichgivesleastleakage.Byapplyigthis
minimumleakagevectortoacircuititispossibletodecreasethe
leakagecurrentofthecircuitwhenitisinthestandbymode.This
methodisknownasinputvectorcontrolledmethodofleakage
reduction.


Howcanyoureducedynamicpower?

*ReduceswitchingactivitybydesigninggoodRTL
*Clockgating
*Architecturalimprovements
*Reducesupplyvoltage
*UsemultiplevoltagedomainsMultivdd

Whatarethevectorsofdynamicpower?

*VoltageandCurrent


Howwillyoudopowerplanning?

IfyouhavebothIRdropandcongestionhowwillyoufixit?

*Spreadmacros
*Spreadstandardcells
*Increasestrapwidth
*Increasenumberofstraps
*Useproperblockage


Isincreasingpowerlinewidthandprovidingmorenumberofstraps
aretheonlysolutiontoIRdrop?

*Spreadmacros
*Spreadstandardcells
*Useproperblockage


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Inaregtoregpathifyouhavesetupproblemwherewillyouinsert
bufferneartolaunchingfloporcaptureflop?Why?

*(buffersareinsertedforfixingfanoutvoilationsandhencethey
reducesetupvoilationotherwisewetrytofixsetupvoilationwiththe
sizingofcellsnowjustassumethatyoumustinsertbuffer!)

*Neartocapturepath.

*Becausetheremaybeotherpathspassingthroughororiginating
fromtheflopnearertolauchflop.Hencebufferinsertionmayaffect
otherpathsalso.Itmayimproveallthosepathsordegarde.Ifall
thosepathshavevoilationthenyoumayinsertbuffernearerto
launchflopprovideditimprovesslack.


Howwillyoudecidebestfloorplan?

Whatisthemostchallengingtaskyouhandled?
WhatisthemostchallengingjobinP&Rflow?

*ItmaybepowerplanningbecauseyoufoundmoreIRdrop
*Itmaybelowpowertargetbecauseyouhadmoredynamicand
leakagepower
*Itmaybemacroplacementbecauseithadmoreconnectionwith
standardcellsormacros
*ItmaybeCTSbecauseyouneededtohandlemultipleclocksand
clockdomaincrossings
*ItmaybetimingbecausesizingcellsinECOflowisnotmeeting
timing
*Itmaybelibrarypreparationbecauseyoufoundsome
inconsistancyinlibraries.
*ItmaybeDRCbecauseyoufacedthousandsofvoilations


Howwillyousynthesizeclocktree?

*Singleclocknormalsynthesisandoptimization
*MultipleclocksSynthesiseachclockseperately
*MultipleclockswithdomaincrossingSynthesiseachclock
seperatelyandbalancetheskew


Howmanyclockswerethereinthisproject?

*Itisspecifictoyourproject
*Moretheclocksmorechallenging!


Howdidyouhandleallthoseclocks?

*Multipleclocks>synthesizeseperately>balancetheskew
>optimizetheclocktree

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AretheycomefromseperateexternalresourcesorPLL?

*Ifitisfromseperateclocksources(i.e.asynchronousfrom
differentpadsorpins)thenbalancingskewbetweentheseclock
sourcesbecomeschallenging.

*IfitisfromPLL(i.e.synchronous)thenskewbalancingis
comparativelyeasy.


Whybuffersareusedinclocktree?

*Tobalanceskew(i.e.floptoflopdelay)


Whatiscrosstalk?

*Switchingofthesignalinonenetcaninterfereneigbouringnetdue
tocrosscouplingcapacitance.Thisaffectisknownascrostalk.Cross
talkmayleadsetuporholdvoilation.


Howcanyouavoidcrosstalk?

*Doublespacing=>morespacing=>lesscapacitance=>lesscross
talk
*Multiplevias=>lessresistance=>lessRCdelay
*Shielding=>constantcrosscouplingcapacitance=>knownvalue
ofcrosstalk
*Bufferinsertion=>boostthevictimstrength


Howshieldingavoidscrosstalkproblem?Whatexactlyhappensthere?

*Highfrequencynoise(orglitch)iscoupledtoVSS(orVDD)since
shildedlayersareconnectedtoeitherVDDorVSS.

*CouplingcapacitanceremainsconstantwithVDDorVSS.


Howspacinghelpsinreducingcrosstalknoise?

*widthismore=>morespacingbetweentwoconductors=>cross
couplingcapacitanceisless=>lesscrosstalk


Whydoublespacingandmultipleviasareusedrelatedtoclock?

*Whyclock?becauseitistheonesignalwhichchagesitstate
regularlyandmorecomparedtoanyothersignal.Ifanyothersignal
switchesfastthenalsowecanusedoublespace.

*Doublespacing=>widthismore=>capacitanceisless=>lesscross
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talk

*Multiplevias=>resistanceinparellel=>lessresistance=>lessRC
delay



Howbuffercanbeusedinvictimtoavoidcrosstalk?

*Bufferincreasevictimssignalstrengthbuffersbreakthenet
length=>victimsaremoretoleranttocoupledsignalfromaggressor.

PhysicalDesignQuestionsandAnswers

*Iamgettingseveralemailsrequestinganswerstothequestions
postedinthisblog.Butitisverydifficulttoprovidedetailedanswerto
allquestionsinmyavailablesparetime.Henceidecidedtogive
"shortandsweet"onelineanswerstothequestionssothatreaders
canimmediatelybenefited.Detailedanswerswillbepostedinlater
stage.Ihavegivenanswerstosomeofthephysicaldesignquestions
here.Enjoy!



Whatparameters(oraspects)differentiateChipDesignandBlock
leveldesign?

*ChipdesignhasI/Opadsblockdesignhaspins.

*Chipdesignusesallmetallayesavailableblockdesignmaynotuse
allmetallayers.

*Chipisgenerallyrectangularinshapeblockscanberectangular,
rectilinear.

*Chipdesignrequiresseveralpackagingblockdesignendsina
macro.


Howdoyouplacemacrosinafullchipdesign?

*Firstcheckflylinesi.e.checknetconnectionsfrommacrotomacro
andmacrotostandardcells.

*Ifthereismoreconnectionfrommacrotomacroplacethose
macrosnearertoeachotherpreferablynearertocoreboundaries.

*Ifinputpinisconnectedtomacrobettertoplacenearertothatpin
orpad.

*Ifmacrohasmoreconnectiontostandardcellsspreadthemacros
insidecore.

*Avoidcriscrossplacementofmacros.
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*Usesoftorhardblockagestoguideplacementengine.


DifferentiatebetweenaHierarchicalDesignandflatdesign?

*Hierarchialdesignhasblocks,subblocksinanhierarchyFlattened
designhasnosubblocksandithasonlyleafcells.

*HierarchicaldesigntakesmoreruntimeFlatteneddesigntakes
lessruntime.


Whichismorecomplicatedwhenuhavea48MHzand500MHzclock
design?

*500MHzbecauseitismoreconstrained(i.e.lesserclockperiod)
than48MHzdesign.


Namefewtoolswhichyouusedforphysicalverification?

*HerculisfromSynopsys,CaliberfromMentorGraphics.


Whataretheinputfileswillyougiveforprimetimecorrelation?

*Netlist,Technologylibrary,Constraints,SPEForSDFfile.



Iftheroutingcongestionexistsbetweentwomacros,thenwhatwill
youdo?

*Providesoftorhardblockage


Howwillyoudecidethediesize?

*Bycheckingthetotalareaofthedesignyoucandecidediesize.


Iflengthymetallayerisconnectedtodiffusionandpoly,thenwhich
onewillaffectbyantennaproblem?

*Poly


Ifthefullchipdesignisroutedby7layermetal,whymacrosare
designedusing5LMinsteadofusing7LM?

*Becausetoptwometallayersarerequiredforglobalroutinginchip
design.Iftopmetallayersarealsousedinblocklevelitwillcreate
routingblockage.
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Inyourprojectwhatisdiesize,numberofmetallayers,technology,
foundry,numberofclocks?

*Diesize:tellinmmeg.1mmx1mmremeber1mm=1000micron
whichisabigsize!!

*Metallayers:Seeyourtechfile.generallyfor90nmitis7to9.

*Technology:Againlookintotechfiles.

*Foundry:Againlookintotechfileseg.TSMC,IBM,ARTISANetc

*Clocks:LookintoyourdesignandSDCfile!


Howmanymacrosinyourdesign?

*Youknowitwellasyouhavedesignedit!ASoC(SystemOnChip)
designmayhave100macrosalso!!!!


Whatiseachmacrosizeandnumberofstandardcellcount?

*Dependsonyourdesign.


Whataretheinputneedsforyourdesign?

*Forsynthesis:RTL,Technologylibrary,Standardcelllibrary,
Constraints

*ForPhysicaldesign:Netlist,Technologylibrary,Constraints,
Standardcelllibrary


WhatisSDCconstraintfilecontains?

*Clockdefinitions

*Timingexceptionmulticyclepath,falsepath

*InputandOutputdelays


Howdidyoudopowerplanning?Howtocalculatecoreringwidth,
macroringwidthandstraportrunkwidth?Howtofindnumberof
powerpadandIOpowerpads?Howthewidthofmetalandnumber
ofstrapscalculatedforpowerandground?

*Getthetotalcorepowerconsumptiongetthemetallayercurrent
densityvaluefromthetechfileDividetotalpowerbynumbersides
ofthechipDividetheobtainedvaluefromthecurrentdensitytoget
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corepowerringwidth.Thencalculatenumberofstrapsusingsome
moreequations.Willbeexplainedindetaillater.

Howtofindtotalchippower?

*Totalchippower=standardcellpowerconsumption,Macropower
consumptionpadpowerconsumption.


Whataretheproblemsfacedrelatedtotiming?

*Prelayout:Setup,Maxtransition,maxcapacitance

*Postlayout:Hold


Howdidyouresolvethesetupandholdproblem?

*Setup:upsizethecells

*Hold:insertbuffers


Inwhichlayerdoyoupreferforclockroutingandwhy?

*Nextlowerlayertothetoptwometallayers(globalroutinglayers).
BecauseithaslessresistancehencelessRCdelay.


Ifinyourdesignhasresetpin,thenitllaffectinputpinoroutputpin
orboth?

*Outputpin.


Duringpoweranalysis,ifyouarefacingIRdropproblem,thenhow
didyouavoid?

*Increasepowermetallayerwidth.

*Goforhighermetallayer.

*Spreadmacrosorstandardcells.

*Providemorestraps.


Defineantennaproblemandhowdidyouresolvetheseproblem?

*Increasednetlengthcanaccumulatemorechargeswhile
manufacturingofthedeviceduetoionisationprocess.Ifthisnetis
connectedtogateoftheMOSFETitcandamagedielectricpropertyof
thegateandgatemayconductcausingdamagetotheMOSFET.This
isantennaproblem.
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*Decreasethelengthofthenetbyprovidingmoreviasandlayer
jumping.

*Insertantennadiode.


HowdelaysvarywithdifferentPVTconditions?Showthegraph.

*Pincrease>dealyincrease

*Pdecrease>delaydecrease


*Vincrease>delaydecrease

*Vdecrease>delayincrease


*Tincrease>delayincrease

*Tdecrease>delaydecrease


Explaintheflowofphysicaldesignandinputsandoutputsforeach
stepinflow.

Whatiscelldelayandnetdelay?

*Gatedelay

*Transistorswithinagatetakeafinitetimetoswitch.Thismeans
thatachangeontheinputofagatetakesafinitetimetocausea
changeontheoutput.[Magma]


*Gatedelay=functionof(i/ptransitiontime,Cnet+Cpin).


*CelldelayisalsosameasGatedelay.


*Celldelay


*Foranygateitismeasuredbetween50%ofinputtransitiontothe
corresponding50%ofoutputtransition.


*Intrinsicdelay


*Intrinsicdelayisthedelayinternaltothegate.Inputpinofthecell
tooutputpinofthecell.
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*Itisdefinedasthedelaybetweenaninputandoutputpairofacell,
whenanearzeroslewisappliedtotheinputpinandtheoutputdoes
notseeanyloadcondition.Itispredominantlycausedbytheinternal
capacitanceassociatedwithitstransistor.


*Thisdelayislargelyindependentofthesizeofthetransistors
formingthegatebecauseincreasingsizeoftransistorsincrease
internalcapacitors.


*NetDelay(orwiredelay)


*Thedifferencebetweenthetimeasignalisfirstappliedtothenet
andthetimeitreachesotherdevicesconnectedtothatnet.


*Itisduetothefiniteresistanceandcapacitanceofthenet.Itisalso
knownaswiredelay.


*Wiredelay=fn(Rnet,Cnet+Cpin)


Whataredelaymodelsandwhatisthedifferencebetweenthem?

*LinearDelayModel(LDM)

*NonLinearDelayModel(NLDM)


Whatiswireloadmodel?

*WireloadmodelisNLDMwhichhasestimatedRandCofthenet.


WhyhighermetallayersarepreferredforVddandVss?

*BecauseithaslessresistanceandhenceleadstolessIRdrop.


Whatislogicoptimizationandgivesomemethodsoflogic
optimization.

*Upsizing

*Downsizing

*Bufferinsertion

*Bufferrelocation
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*Dummybufferplacement


Whatisthesignificanceofnegativeslack?

*negativeslack==>thereissetupvoilation==>deisgncanfail


Whatissignalintegrity?HowitaffectsTiming?

*IRdrop,ElectroMigration(EM),Crosstalk,Groundbounceare
signalintegrityissues.

*IfIdropismore==>delayincreases.

*crosstalk==>therecanbesetupaswellasholdvoilation.


WhatisIRdrop?Howtoavoid?Howitaffectstiming?

*Thereisaresistanceassociatedwitheachmetallayer.This
resistanceconsumespowercausingvoltagedropi.e.IRdrop.

*IfIRdropismore==>delayincreases.


WhatisEManditeffects?

*Duetohighcurrentflowinthemetalatomsofthemetalcan
displacedfromitsorigialplace.Whenithappensinlargeramountthe
metalcanopenorbulgingofmetallayercanhappen.Thiseffectis
knownasElectroMigration.


*Affects:Eithershortoropenofthesignallineorpowerline.


Whataretypesofrouting?

*GlobalRouting

*TrackAssignment

*DetailRouting


Whatislatency?Givethetypes?

*SourceLatency

*Itisknownassourcelatencyalso.Itisdefinedas"thedelayfrom
theclockoriginpointtotheclockdefinitionpointinthedesign".

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*Delayfromclocksourcetobeginningofclocktree(i.e.clock
definitionpoint).


*Thetimeaclocksignaltakestopropagatefromitsidealwaveform
originpointtotheclockdefinitionpointinthedesign.


*Networklatency


*ItisalsoknownasInsertiondelayorNetworklatency.Itisdefined
as"thedelayfromtheclockdefinitionpointtotheclockpinofthe
register".


*Thetimeclocksignal(riseorfall)takestopropagatefromtheclock
definitionpointtoaregisterclockpin.


Whatistrackassignment?

*Secondstageoftheroutingwhereinparticularmetaltracks(or
layers)areassignedtothesignalnets.


Whatiscongestion?

*Ifthenumberofroutingtracksavailableforroutingislessthanthe
requiredtracksthenitisknownascongestion.


Whethercongestionisrelatedtoplacementorrouting?

*Routing


Whatareclocktrees?

*Distributionofclockfromtheclocksourcetothesyncpinofthe
registers.


Whatareclocktreetypes?

*Htree,Balancedtree,Xtree,Clusteringtree,Fishbone


Whatiscloningandbuffering?

*Cloningisamethodofoptimizationthatdecreasestheloadofa
heavilyloadedcellbyreplicatingthecell.

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*Bufferingisamethodofoptimizationthatisusedtoinsertbeffers
inhighfanoutnetstodecreasethedealy.

Whatisthedifferencebetweensoftmacroandhardmacro?

*Whatisthedifferencebetweenhardmacro,firmmacroandsoft
macro?


or

*WhatareIPs?



*Hardmacro,firmmacroandsoftmacroareallknownasIP
(Intellectualproperty).Theyareoptimizedforpower,areaand
performance.TheycanbepurchasedandusedinyourASICorFPGA
designimplementationflow.SoftmacroisflexibleforalltypeofASIC
implementation.HardmacrocanbeusedinpureASICdesignflow,
notinFPGAflow.BeforebyinganyIPitisveryimportanttoevaluate
itsadvantagesanddisadvantagesovereachother,hardware
compatibilitysuchasI/Ostandardswithyourdesignblocks,
reusabilityforotherdesigns.


Softmacros

*SoftmacrosareinsynthesizableRTL.

*Softmacrosaremoreflexiblethanfirmorhardmacros.

*Softmacrosarenotspecifictoanymanufacturingprocess.

*Softmacroshavethedisadvantageofbeingsomewhat
unpredictableintermsofperformance,timing,area,orpower.

*SoftmacroscarrygreaterIPprotectionrisksbecauseRTLsource
codeismoreportableandtherefore,lesseasilyprotectedthaneither
anetlistorphysicallayoutdata.

*Fromthephysicaldesignperspective,softmacroisanycellthat
hasbeenplacedandroutedinaplacementandroutingtoolsuchas
Astro.(ThisisthedefinitiongiveninAstroRailusermanual!)

*Softmacrosareeditableandcancontainstandardcells,hard
macros,orothersoftmacros.



Firmmacros

*Firmmacrosareinnetlistformat.

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*Firmmacrosareoptimizedforperformance/area/powerusinga
specificfabricationtechnology.

*Firmmacrosaremoreflexibleandportablethanhardmacros.

*Firmmacrosarepredictiveofperformanceandareathansoft
macros.



Hardmacro

*HardmacrosaregenerallyintheformofhardwareIPs(orwe
termeditashardwreIPs!).

*HardmacosaretargetedforspecificICmanufacturingtechnology.

*Hardmacrosareblockleveldesignswhicharesilicontestedand
proved.

*Hardmacroshavebeenoptimizedforpowerorareaortiming.

*Inphysicaldesignyoucanonlyaccesspinsofhardmacrosunlike
softmacroswhichallowsustomanipulateindifferentway.

*Youhavefreedomtomove,rotate,flipbutyoucan'ttouchanything
insidehardmacros.

*Verycommonexampleofhardmacroismemory.Itcanbeany
designwhichcarriesdedicatedsinglefunctionality(ingeneral)..for
exampleitcanbeaMP4decoder.

*Beawareoffeaturesandcharacteristicsofhardmacrobeforeyou
useitinyourdesign...otherthanpower,timingandareayoualso
shouldknowpinpropertieslikesyncpin,I/Ostandardsetc

*LEF,GDS2fileformatallowseasyusageofmacrosindifferent
tools.



Fromthephysicaldesign(backend)perspective:

*Hardmacroisablockthatisgeneratedinamethodologyother
thanplaceandroute(i.e.usingfullcustomdesignmethodology)and
isbroughtintothephysicaldesigndatabase(eg.Milkywayin
SynopsysVolcanoinMagma)asaGDS2file.



SynthesisandplacementofmacrosinmodernSoCdesignsare
challenging.EDAtoolsemploydifferentalgorithmsaccomplishthis
taskalongwiththetargetofpowerandarea.Thereareseveral
researchpapersavailableonthesesubjects.Someofthemcanbe
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downloadedfromthegivenlinkbelow.


Whatisdifferencebetweennormalbufferandclockbuffer?

Answer:


ClocknetisoneoftheHighFanoutNet(HFN)s.Theclockbuffersare
designedwithsomespecialpropertylikehighdrivestrengthandless
delay.Clockbuffershaveequalriseandfalltime.Thispreventsduty
cycleofclocksignalfromchangingwhenitpassesthroughachainof
clockbuffers.


NormalbuffersaredesignedwithW/Lratiosuchthatsumofrise
timeandfalltimeisminimum.Theytooaredesignedforhigherdrive
strength.
WhatisdifferencebetweenHFNsynthesisandCTS?

Answer:


HFNsaresynthesizedinfrontendalso....butatthatmomentno
placementinformationofstandardcellsareavailable...hence
backendtoolcollapsessynthesizedHFNs.ItresenthesizesHFNs
basedonplacementinformationandappropriatelyinsertsbuffer.
Targetofthissynthesisistomeetdelayrequirementsi.e.setupand
hold.


Forclocknosynthesisiscarriedoutinfrontend
(why.....????..becausenoplacementinformationofflipflops!So
synthesiswon'tmeettrueskewtargets!!)...inbackendclocktree
synthesistriestomeet"skew"targets...Itinsertsclockbuffers(which
haveequalriseandfalltime,unlikenormalbuffers!)...Thereisno
skewinformationforanyHFNs.
Isitpossibletohaveazeroskewinthedesign?

Answer:

Theoreticallyitispossible....!

Practicallyitisimpossible....!!


Practicallywecantreduceanydelaytozero....delaywillexist...
hencewetrytomakeskew"equal"(orsame)ratherthan
"zero"......nowwiththisoptimizationallflopsgettheclockedgewith
samedelayrelativetoeachother....sovirtuallywecansaytheyare
having"zeroskew"orskewis"balanced".
PhysicalDesignInterviewQuestions

BelowaretheimportantinterviewquestionsforVLSIphysicaldesign
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aspirants.Interviewstartswithflowofphysicaldesignandgoes
on.....on....on.....Iamtryingtomakeyourlifeeasy.....letme
prepareanswerstoalltheseifsoftform....assoonasithappens
thoseanswerswillbepostedincomingblogs.

*
Whatparameters(oraspects)differentiateChipDesign&Blocklevel
design??
*
Howdoyouplacemacrosinafullchipdesign?
*
DifferentiatebetweenaHierarchicalDesignandflatdesign?
*
Whichismorecomplicatedwhenuhavea48MHzand500MHzclock
design?
*
Namefewtoolswhichyouusedforphysicalverification?
*
Whataretheinputfileswillyougiveforprimetimecorrelation?
*
Whatarethealgorithmsusedwhilerouting?Willitoptimizewire
length?
*
HowwillyoudecidethePinlocationinblockleveldesign?
*
Iftheroutingcongestionexistsbetweentwomacros,thenwhatwill
youdo?
*
Howwillyouplacethemacros?
*
Howwillyoudecidethediesize?
*
Iflengthymetallayerisconnectedtodiffusionandpoly,thenwhich
onewillaffectbyantennaproblem?
*
Ifthefullchipdesignisroutedby7layermetal,whymacrosare
designedusing5LMinsteadofusing7LM?
*
Inyourprojectwhatisdiesize,numberofmetallayers,technology,
foundry,numberofclocks?
*
Howmanymacrosinyourdesign?
*
Whatiseachmacrosizeandno.ofstandardcellcount?
*
HowdiduhandletheClockinyourdesign?
*
WhataretheInputneedsforyourdesign?
*
WhatisSDCconstraintfilecontains?
*
Howdidyoudopowerplanning?
*
Howtofindtotalchippower?
http://vlsichip.blogspot.in/ 47/50
28/03/2017 VLSIInterviewQuestions

*
Howtocalculatecoreringwidth,macroringwidthandstraportrunk
width?
*
HowtofindnumberofpowerpadandIOpowerpads?
*
Whataretheproblemsfacedrelatedtotiming?
*
Howdiduresolvethesetupandholdproblem?
*
Ifinyourdesign10000andmorenumbersofproblemscome,then
whatyouwilldo?
*
Inwhichlayerdoyoupreferforclockroutingandwhy?
*
Ifinyourdesignhasresetpin,thenitllaffectinputpinoroutputpin
orboth?
*
Duringpoweranalysis,ifyouarefacingIRdropproblem,thenhow
diduavoid?
*
Defineantennaproblemandhowdiduresolvetheseproblem?
*
HowdelaysvarywithdifferentPVTconditions?Showthegraph.
*
Explaintheflowofphysicaldesignandinputsandoutputsforeach
stepinflow.
*
Whatiscelldelayandnetdelay?
*
Whataredelaymodelsandwhatisthedifferencebetweenthem?
*
Whatiswireloadmodel?
*
WhatdoesSDCconstraintshas?
*
WhyhighermetallayersarepreferredforVddandVss?
*
Whatislogicoptimizationandgivesomemethodsoflogic
optimization.
*
Whatisthesignificanceofnegativeslack?
*
Whatissignalintegrity?HowitaffectsTiming?
*
WhatisIRdrop?Howtoavoid.howitaffectstiming?
*
WhatisEManditeffects?
*
Whatisfloorplanandpowerplan?
*
Whataretypesofrouting?
*
Whatisagrid.whyweneedanddifferenttypesofgrids?
http://vlsichip.blogspot.in/ 48/50
28/03/2017 VLSIInterviewQuestions

*
Whatiscoreandhowuwilldecidew/hratioforcore?
*
Whatiseffectiveutilizationandchiputilization?
*
Whatislatency?Givethetypes?
*
Howthewidthofmetalandnumberofstrapscalculatedforpower
andground?
*
Whatisnegativeslack?Howitaffectstiming?
*
Whatistrackassignment?
*
Whatisgridedandgridlessrouting?
*
Whatisamacroandstandardcell?
*
Whatiscongestion?
*
Whethercongestionisrelatedtoplacementorrouting?
*
Whatareclocktrees?
*
Whatareclocktreetypes?
*
Whichlayerisusedforclockroutingandwhy?
*
Whatiscloningandbuffering?
*
Whatareplacementblockages?
*
Howslowandfasttransitionatinputseffecttimingforgates?
*
Whatisantennaeffect?
*
WhatareDFMissues?
*
Whatis.lib,LEF,DEF,.tf?
*
Whatisthedifferencebetweensynthesisandsimulation?
*
Whatismetaldensity,metalslottingrule?
*
WhatisOPC,PSM?
*
WhyclockisnotsynthesizedinDC?
*
WhatarehighVtandlowVtcells?
*
Whatcornercellscontains?
*
Whatisthedifferencebetweencorefillercellsandmetalfillers?
*
http://vlsichip.blogspot.in/ 49/50
28/03/2017 VLSIInterviewQuestions

Howtodecidenumberofpadsinchipleveldesign?
*
Whatistiehighandtielowcellsandwhereitisused
*
WhatisLEF?
*
WhatisDEF?
*
Whatarethestepsinvolvedindesigninganoptimalpadring?

*Whatarethestepsthatyouhavedoneinthedesignflow?
*Whataretheissuesinfloorplan?
*Howcanyouestimateareaofblock?
*Howmuchaspectratioshouldbekept(orhaveyoukept)andwhat
istheutilization?
*Howtocalculatecoreringandstripewidths?
*Whatifhotspotfoundinsomeareaofblock?Howyoutacklethis?
*Afteraddingstripesalsoifyouhavehotspotwhattodo?
*Whatisthresholdvoltage?Howitaffecttiming?
*Whatiscontentoflib,lef,sdc?
*Whatismeantmy9track,12trackstandardcells?
*Whatisscanchain?Whatifscanchainnotdetachedand
reordered?Isitcompulsory?
*Whatissetupandhold?Whythereare?Whatifsetupandhold
violates?
*Inacircuit,forregtoregpath...Tclktoqis50ps,Tcombo50ps,
Tsetup50ps,tskewis100ps.Thenwhatisthemaximumoperating
frequency?
*HowRandCvaluesareaffectingtime?
*Howohm(R),fared(C)isrelatedtosecond(T)?
*Whatistransition?Whatiftransitiontimeismore?
*Whatisdifferencebetweennormalbufferandclockbuffer?
*Whatisantennaeffect?Howitisavoided?
*WhatisESD?
*Whatiscrosstalk?Howcanyouavoid?
*Howdoublespacingwillavoidcrosstalk?
*WhatisdifferencebetweenHFNsynthesisandCTS?
*Whatisholdproblem?Howcanyouavoidit?
*Foraniterationwehave0.5nsofinsertiondelayand0.1skewand
forotheriteration0.29nsinsertiondelayand0.25skewforthesame
circuitthenwhichoneyouwillselect?Why?
*Whatispartialfloorplan?

PostedbyVLSI_Rulesat10:37AM5comments:
Labels:analysis,asic,backend,buffer,chip,clock,cmos,
delay,design,layout,optimization,physical,routing,sta,
synthesis,timing,tree,vlsi
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