FAKULTI KEJURUTERAAN ELEKTRONIK
DAN KEJURUTERAAN KOMPUTER
BASIC HAND SOLDERING
INTRODUCTION
What students will learn:
Soldering
– What is soldering
– Soldering basic tools/materials: soldering iron, solder
tips, solder sucker, solder wick, solder wire, flux
– Soldering technique/process
– Acceptance/inspection standard for soldering
– Desoldering technique/process
Occupational Safety & Health matters related to the
to soldering process
What is Solder ?
Solder = Alloy;
commonly of Tin (Sn)
and Plumbum (Pb)
Cheapest in market Sn:Pb
= 60:40
Solder melting temperature ~ 180°C to
190°C
Soldering Basic Concept
Copper Lead
(Base Metal)
Solder
Solder react with copper (on Joint
PCB & lead) to form PCB
Intermetallic Bond (a form
of alloy) Solder Connection
Intermetallic bond is
stronger if:
- temperature is not high
- high temperature
- contact is not too long
SOLDERING TOOLS
Soldering Iron
Different wattage specification – the
higher the wattage spec. the more
heat will be stored in the soldering
iron. Common wattage spec e.g.
16w, 25w, 60w & 100w
Electronic component soldering
temperature = 240°C ~ 320°C
Soldering Iron Tip
Different tip design
for different soldering
application
For through-hole
component (e.g.
carbon resistor with
copper leads), a
conical tip is suitable
Flux
Contains activation agent
- corrosive
Typically either water
soluble or resin based
Purpose
- To remove oxide layer from the base of
metal surface Flux core
Solder
alloy
− To shield base metal surface from
oxygen which re-oxidize metal
Solder Wire
− To lower solder’s surface tension to
improve wetting
SOLDERING TECHNIQUE
Prepare component for solder
Clean component lead – from dirt & smear
Insert component. Clinch lead
Apply flux to soldering point & proceed for
soldering work
Cut off excess wire
SOLDERING TECHNIQUE
Prepare soldering iron for soldering work
Wet
sponge
Use only well-heated soldering iron
Clean soldering iron tip- use wet sponge
Apply a bit of solder to iron tip – make sure
solder are attached to tip
SOLDERING TECHNIQUE
Solder the target/ point
Heat the soldering point –soldering iron must
contact both component lead and pcb copper
Apply solder wire –solder wire must contact both
component lead and pcb copper also
SOLDERING TECHNIQUE
Finish off soldering
Pull away soldering iron from solder point when
solder becomes shiny
Timing is important! – Do not apply soldering
iron too long or too short.
Soldering Technique Summary
Clean component’s leads
Insert component. Clinch it
Apply flux to soldering point
Clean soldering iron tip
Apply a bit of solder to iron tip
Heat both soldering point &
component lead
Apply solder wire to soldering point & comp. lead
Pull solder wire away. Then pull soldering iron
away after solder becomes shiny
Cut off excess wire
INTERNATIONAL ACCEPTANCE
STANDARD
IPC-A-610 Class C
– IPC = associations of US electronic
companies and their suppliers
J-Std-001
– Joint standard of IPC and Electronic
Industry Association
ACCEPTANCE CRITERIA
Base on IPC-A-610 and J-STD-
001 (Class 2)
Criteria:
– Circumferential fillet and
wetting = 270°
– Percentage of PCB copper
land area covered with solder
= 75%
– Visible good wetting
ACCEPTANCE CRITERIA
Lead
Fillet Height Height
Criteria:
– Fillet Height = minimum ¼
Lead height or 0.05mm
– Note: Lead height after cut =
maximum 2.5mm
– Solder finish = glossy or shiny θ≤ 90°
– Solder contact angle ≤ 90°
SOLDER JOINT PROBLEM
Cold solder
– Soldering iron heats up PCB and component
lead too short before solder is applied
– After solder is applied, soldering iron is pulled
away too fast from solder point
– Soldering iron touches PCB pattern only
– Solder wire applied at iron tip only
SOLDER JOINT PROBLEM
Fractured solder
– Cold solder joint breaks off
– Solder wire applied at iron tip
only
Excessive solder
– Solder wire applied at
component lead only
– Solder wire applied at iron tip
only
– Too much solder applied to
solder point
SOLDER JOINT PROBLEM
No wetting
– Soldering iron touches component
lead only
– Soldering iron heats up both PCB
and component lead too fast
before solder is applied
– After solder is applied, soldering
iron is pulled away too fast from
solder point
SOLDER JOINT PROBLEM
Solder Bridging
– Short circuit due to solder
Burnt solder
– After solder is applied,
soldering iron is pulled away
too slow from solder point
Touch Screen Resistance PCB
Material: 400 ohm
– Strip Board
– Resistors: 8 PCB
400 ohm 400 ohm
pcs of 200
ohm
– Jumper wire: 2
400 ohm
Specification:
– Corner to corner resistance = 400 Ω
– Use all provided material
– Do not cut any PCB trace
Touch Screen Resistance PCB
Strip Board
PCB
Construction Method with Strip
Board
Understanding the problem
– Specification:
400 ohm resistance on each side on 4 sides
– Limitation:
Given: 8 pcs of 200 ohm resistors, 2 pcs of
jumper wires and a strip board
-Strip board cannot be cut
Construction Method with Strip
Board
Draw schematics / circuit diagram
A 200 200 B
200 200
200 200
D 200 200 C
Construction Method with Strip
Board
Identify each node / net on circuit
diagram 1 9 10
200 200
200 200
Total Node / 2 8
Net = 10 3 7
200 200
4
200 200 6
5
Construction Method with Strip
Board
Assigna copper track or part of a
copper track for each node
6 5 7 8 9 10
4 3 2 1
Construction Method with Strip
Board
Mount component according to node
6 7 8 10
5 9
4 3 2 1
DESOLDER
Removing solder
Common Tools:
– Solder sucker (cheap but not
clean & not safe to PCB)
– Solder wick (more expensive
but clean and safe to PCB)
– Desoldering iron (more
expensive but clean, safe and
easy to use)
DESOLDERING TECHNIQUE
Using Solder Sucker
Heat up solder point with soldering iron
Prepare solder sucker - press suction spring
After solder melts, place solder sucker on top of
solder point
Release suction spring
DESOLDERING TECHNIQUE
Using Solder Wick (solder net)
Place solder wick on top of solder point
Place soldering iron on top of solder wick to heat
it up
When solder melt, capillary action will suck the
solder into the net of solder wick
Use part of solder wick that has not catch solder
HEALTH AND SAFETY DURING
SOLDERING
Lead Absorption into body system:
- By inhalation and ingestion
- Lead fumes generated by heating & melting
lead
- Handling metallic lead & lead compounds can
contaminate hands and lead to ingestion
- Once absorbed into body, lead will circulate in
the blood system and finally deposited in bones
and teeth
HEALTH AND SAFETY DURING
SOLDERING
Health effect:
- Gastro intestinal disturbances including
constipation, discomfort and sometimes severe
pain
- Weakness and lost weight
- Anaemia (lead interfere the red blood cell
production)
- Kidney damage
- Brain nervous system damage to unborn
children
CONTROLS
Hygiene control aims at preventing the inhalation
or ingestion
Other control :
a) medical surveillance
b) biological monitoring
Personal hygiene measures –washing and showers
are necessary to prevent ingestion
Personal protection- use respirators, gloves
Clean Touch Screen Resistance
PCB
Material:
– Touch Screen
Resistance PCB PCB
Method:
– Remove all components from PCB
– Make sure all PCB holes and copper
tracks are clean
Summary
What has been learned
- What is solder and how to solder
- Basic soldering tools
- Acceptance standard
- How to desolder
- Occupational Safety & Health requirement related
to the soldering work and control methods
