MBR0540T1G,

NRVB0540T1G,
MBR0540T3G,
NRVB0540T3G

Surface Mount
Schottky Power Rectifier http://onsemi.com

SOD−123 Power Surface Mount Package SCHOTTKY BARRIER

RECTIFIER
The Schottky Power Rectifier employs the Schottky Barrier 0.5 AMPERES, 40 VOLTS
principle with a barrier metal that produces optimal forward voltage
drop−reverse current tradeoff. Ideally suited for low voltage, high
frequency rectification, or as a free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package provides an alternative to the
leadless 34 MELF style package.
SOD−123
Features CASE 425
STYLE 1
 Guardring for Stress Protection
 Very Low Forward Voltage
MARKING DIAGRAM
 Epoxy Meets UL 94 V−0 @ 0.125 in
 Package Designed for Optimal Automated Board Assembly
 AEC−Q101 Qualified and PPAP Capable B4MG
1
 NRVB Prefix for Automotive and Other Applications Requiring G
Unique Site and Control Change Requirements
 All Packages are Pb−Free*
B4 = Device Code
Mechanical Characteristics M = Date Code
G = Pb−Free Package
 Device Marking: B4
(Note: Microdot may be in either location)
 Polarity Designator: Cathode Band
 Weight: 11.7 mg (approximately) ORDERING INFORMATION
 Case: Epoxy Molded
Device Package Shipping†
 Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable MBR0540T1G SOD−123 3,000/Tape & Reel
(Pb−Free) (8 mm Tape, 7” Real)
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C max. for 10 Seconds NRVB0540T1G SOD−123 3,000/Tape & Reel
(Pb−Free) (8 mm Tape, 7” Real)
 ESD Rating:
 Human Body Model = 3B MBR0540T3G SOD−123 10,000/Tape & Reel
(Pb−Free) (8 mm Tape, 13” Real)
 Machine Model = C
NRVB0540T3G SOD−123 10,000/Tape & Reel
(Pb−Free) (8 mm Tape, 13” Real)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:

January, 2012 − Rev. 7 MBR0540T1/D
 MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G

MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 40 V
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IO A
(At Rated VR, TC = 115C) 0.5

Peak Repetitive Forward Current IFRM A

(At Rated VR, Square Wave, 20 kHz, TC = 115C) 1.0

Non−Repetitive Peak Surge Current IFSM A

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 5.5

Storage/Operating Case Temperature Range Tstg, TC −55 to +150 C

Operating Junction Temperature TJ −55 to +150 C
Voltage Rate of Change dv/dt V/ms
(Rated VR, TJ = 25C) 1000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1) Rtjl 118 C/W
Thermal Resistance − Junction−to−Ambient (Note 2) Rtja 206
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board.

ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3) vF TJ = 25C TJ = 100C V
(iF = 0.5 A) 0.51 0.46
(iF = 1 A) 0.62 0.61

Maximum Instantaneous Reverse Current (Note 3) IR TJ = 25C TJ = 100C mA

(VR = 40 V) 20 13,000
(VR = 20 V) 10 5,000
3. Pulse Test: Pulse Width  250 ms, Duty Cycle  2.0%.

100
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

10 10

25C

1.0 1.0

TJ = 125C TJ = -40C
TJ = 125C
TJ = 25C TJ = 100C

TJ = 100C TJ = 25C
0.1 0.1
0.2 0.4 0.6 0.8 1.0 1.2 0.2 0.4 0.6 0.8 1.0 1.2
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

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 MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G

100E-3 100E-3

I R, MAXIMUM REVERSE CURRENT (AMPS)

10E-3 10E-3
I R, REVERSE CURRENT (AMPS)

TJ = 100C
1.0E-3 TJ = 125C 1.0E-3

100E-6 100E-6
TJ = 100C
10E-6 10E-6
TJ = 25C
1.0E-6 TJ = 25C 1.0E-6

100E-9 100E-9
0 10 20 30 40 0 10 20 30 40
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

0.8 0.45

PFO , AVERAGE POWER DISSIPATION (WATTS)

I O , AVERAGE FORWARD CURRENT (AMPS)

dc
0.7 0.40
FREQ = 20 kHz SQUARE WAVE dc
SQUARE WAVE 0.35
0.6 Ipk/Io = p
0.30
0.5
Ipk/Io = p Ipk/Io = 5
0.25
0.4 Ipk/Io = 10
Ipk/Io = 5 0.20
0.3 Ipk/Io = 20
Ipk/Io = 10 0.15
0.2 0.10
Ipk/Io = 20
0.1 0.05
0 0
0 20 40 60 80 100 120 140 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
TL, LEAD TEMPERATURE (C) IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating Figure 6. Forward Power Dissipation

100 126
TJ , DERATED OPERATING TEMPERATURE ( C)

TJ = 25C 124
Rtja = 118C/W
122
C, CAPACITANCE (pF)

120

118
149C/W
116
180C/W
114
206C/W
112
228C/W
10 110
0 5.0 10 15 20 25 30 35 40 0 5.0 10 15 20 25 30 35 40
VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any
reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as
TJ = TJmax − r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed.

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 MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G

R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)

1E+00
50%
20%

10%
1E-01
5.0%
2.0%
1.0%

1E-02

Rtjl(t) = Rtjl*r(t)

1E-03
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000
T, TIME (s)
Figure 9. Thermal Response Junction to Lead
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)

1E+00

50%

20%
1E-01
10%

5.0%
2.0%
1E-02
1.0%
Rtjl(t) = Rtjl*r(t)

1E-03
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000
T, TIME (s)
Figure 10. Thermal Response Junction to Ambient

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 MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G

PACKAGE DIMENSIONS

SOD−123
CASE 425−04
ISSUE G

D
A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
A1 Y14.5M, 1982.

ÂÂÂÂ
2. CONTROLLING DIMENSION: INCH.
1
MILLIMETERS INCHES

ÂÂÂÂ
DIM MIN NOM MAX MIN NOM MAX
A 0.94 1.17 1.35 0.037 0.046 0.053
A1 0.00 0.05 0.10 0.000 0.002 0.004
b 0.51 0.61 0.71 0.020 0.024 0.028
HE E c --- --- 0.15 --- --- 0.006
D 1.40 1.60 1.80 0.055 0.063 0.071
E 2.54 2.69 2.84 0.100 0.106 0.112
HE 3.56 3.68 3.86 0.140 0.145 0.152
L 0.25 --- --- 0.010 --- ---
q 0 --- 10  0 --- 10 
2
q STYLE 1:
PIN 1. CATHODE
b L 2. ANODE
C

SOLDERING FOOTPRINT*

ÉÉ ÉÉ
0.91
0.036

ÉÉ
ÉÉ ÉÉ
ÉÉ
1.22
0.048

ÉÉ 2.36
0.093
ÉÉ
4.19
0.165

SCALE 10:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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