SOT89
9
T8
SO
plastic surface-mounted package; die pad for good heat
transfer; 3 leads
8 February 2016 Package information
1. Package summary
Terminal position code S (single)
Package type descriptive code SOT89
Package type industry code SOT89
Package style descriptive code SOT (small outline transistor)
Package style suffix code NA (not applicable)
Package body material type P (plastic)
JEDEC package outline code TO-243
JEITA package outline code SC-62
Mounting method type S (surface mount)
Issue date 29-8-2006
Table 1. Package summary
Symbol Parameter Min Typ Nom Max Unit
D package length 4.4 - 4.5 4.6 mm
E package width 2.4 - 2.5 2.6 mm
A seated height 1.4 - 1.5 1.6 mm
e nominal pitch - - 1.5 - mm
n2 actual quantity of termination - - 3 -
NXP Semiconductors SOT89
plastic surface-mounted package; die pad for
good heat transfer; 3 leads
2. Package outline
Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89
D B
bp3
E
HE
Lp
1 2 3
bp2 c
w M B bp1
e1
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A bp1 bp2 bp3 c D E e e1 HE Lp w
1.6 0.48 0.53 1.8 0.44 4.6 2.6 4.25 1.2
mm 3.0 1.5 0.13
1.4 0.35 0.40 1.4 0.23 4.4 2.4 3.75 0.8
OUTLINE REFERENCES EUROPEAN
ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
06-03-16
SOT89 TO-243 SC-62
06-08-29
Fig. 1. Package outline SOT89
SOT89 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved
Package information 8 February 2016 2/5
NXP Semiconductors SOT89
plastic surface-mounted package; die pad for
good heat transfer; 3 leads
3. Soldering
4.75
2.25
1.9
1.2
0.2
0.85 solder lands
1.7 solder resist
1.2
4.6 4.85
0.5 solder paste
occupied area
1 1.1
(3×) (2×)
Dimensions in mm
1.5 1.5
0.6
(3×)
0.7
(3×)
3.95 sot089_fr
Fig. 2. Reflow soldering footprint for SOT89
6.6
2.4
3.5
solder lands
7.6
0.5 solder resist
occupied area
1.8
(2×) Dimensions in mm
preferred transport direction during soldering
1.9 1.9
1.5
0.7
(2×)
5.3 sot089_fw
Fig. 3. Wave soldering footprint for SOT89
SOT89 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved
Package information 8 February 2016 3/5
NXP Semiconductors SOT89
plastic surface-mounted package; die pad for
good heat transfer; 3 leads
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT89 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved
Package information 8 February 2016 4/5
NXP Semiconductors SOT89
plastic surface-mounted package; die pad for
good heat transfer; 3 leads
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
© NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to:
[email protected]Date of release: 8 February 2016
SOT89 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved
Package information 8 February 2016 5/5
