TCS3200 Color Sensor
TCS3200 Color Sensor
is now
ams AG
The technical content of this TAOS datasheet is still valid.
Contact information:
Headquarters:
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail: [email protected]
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GND 4 5 VDD
D Stable 200 ppm/°C Temperature Coefficient
D Low-Profile Lead (Pb) Free and RoHS
TCS3200
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Compliant Surface-Mount Package
S0 1 8 S3
Description
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S1 2 7 S2
The TCS3200 and TCS3210 programmable color
OE 3 6 OUT
light-to-frequency converters that combine confi-
gurable silicon photodiodes and a current-to-fre-
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GND 4 5 VDD
quency converter on a single monolithic CMOS
TCS3210
st
te G
integrated circuit. The output is a square wave
(50% duty cycle) with frequency directly propor-
tional to light intensity (irradiance).
on A
The full-scale output frequency can be scaled by one of three preset values via two control input pins. Digital
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inputs and digital output allow direct interface to a microcontroller or other logic circuitry. Output enable (OE)
places the output in the high-impedance state for multiple-unit sharing of a microcontroller input line.
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In the TCS3200, the light-to-frequency converter reads an 8 × 8 array of photodiodes. Sixteen photodiodes have
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blue filters, 16 photodiodes have green filters, 16 photodiodes have red filters, and 16 photodiodes are clear
with no filters.
In the TCS3210, the light-to-frequency converter reads a 4 × 6 array of photodiodes. Six photodiodes have blue
filters, 6 photodiodes have green filters, 6 photodiodes have red filters, and 6 photodiodes are clear with no
filters.
The four types (colors) of photodiodes are interdigitated to minimize the effect of non-uniformity of incident
irradiance. All photodiodes of the same color are connected in parallel. Pins S2 and S3 are used to select which
group of photodiodes (red, green, blue, clear) are active. Photodiodes are 110 μm × 110 μm in size and are on
134-μm centers.
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Output
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Photodiode Current-to-Frequency
Light Converter
Array
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S2 S3 S0 S1 OE
Terminal Functions
TERMINAL
I/O DESCRIPTION
NAME NO.
GND 4 Power supply ground. All voltages are referenced to GND.
OE 3 I Enable for fo (active low).
OUT 6 O Output frequency (fo).
S0, S1 1, 2 I Output frequency scaling selection inputs.
S2, S3 7, 8 I Photodiode type selection inputs.
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VDD 5 Supply voltage
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Table 1. Selectable Options
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S0 S1 OUTPUT FREQUENCY SCALING (fo) S2 S3 PHOTODIODE TYPE
L L Power down L L Red
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L H 2% L H Blue
H L 20% H L Clear (no filter)
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H H 100%
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Available Options nt
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage range, all inputs, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature range (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Solder conditions in accordance with JEDEC J−STD−020A, maximum temperature (see Note 3) . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
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implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. Long-term storage or operation above 70°C could cause package yellowing that will lower the sensitivity to wavelengths < 500nm.
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3. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of
the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
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Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage, VDD 2.7 5 5.5 V
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High-level input voltage, VIH VDD = 2.7 V to 5.5 V 2 VDD V
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Low-level input voltage, VIL
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Operating free-air temperature range, TA
VDD = 2.7 V to 5.5 V
−40
0 0.8
70
V
°C
on A
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Electrical Characteristics at TA = 25°C, VDD = 5 V (unless otherwise noted)
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
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Ee = 40.4 μW/cm2,
fO frequency 8% 28% 57% 80% 9% 27% kHz
λp = 524 nm (4.7) (5.85) (7)
(Note 9)
Ee = 34.6 μW/cm2, 13.1 16.4 19.7
5% 21% 0% 12% 84% 105%
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λp = 640 nm (4.9) (6.15) (7.4)
331
λp = 470 nm 61% 84% 22% 43% 0% 6%
(124)
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Irradiance 386 Hz/
Re responsivity λp = 524 nm 8% 28% 57% 80% 9% 27% (μW/
( W/
(Note 10) (145) cm2)
474
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λp = 640 nm 5% 21% 0% 12% 84% 105%
(178)
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1813
λp = 470 nm −− −− −−
(4839)
Saturation 1554 μW/
on A
irradiance λp = 524 nm −− −− −−
(4138) cm2
(Note 11)
λp = 640 nm nt 1266
(3371)
−− −− −−
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Dark
fD Ee = 0 2 10 2 10 2 10 2 10 Hz
frequency
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(OE)
NOTES: 5. Optical measurements are made using small-angle incident radiation from a light-emitting diode (LED) optical source.
6. The 470 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
peak wavelength λp = 470 nm, spectral halfwidth Δλ½ = 35 nm, and luminous efficacy = 75 lm/W.
7. The 524 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
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peak wavelength λp = 524 nm, spectral halfwidth Δλ½ = 47 nm, and luminous efficacy = 520 lm/W.
8. The 640 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics:
peak wavelength λp = 640 nm, spectral halfwidth Δλ½ = 17 nm, and luminous efficacy = 155 lm/W.
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9. Output frequency Blue, Green, Red percentage represents the ratio of the respective color to the Clear channel absolute value.
10. Irradiance responsivity Re is characterized over the range from zero to 5 kHz.
11. Saturation irradiance = (full-scale frequency)/(irradiance responsivity) for the Clear reference channel.
12. Nonlinearity is defined as the deviation of fO from a straight line between zero and full scale, expressed as a percent of full scale.
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
TYPICAL CHARACTERISTICS
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Clear TA = 25°C
0.7
Relative Responsivity
Optical Axis
Red
Green
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0.6 0.6
Blue
0.5
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0.4 0.4
0.3
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0.2 0.2
st
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Green
Equal for Both Aspects
0 0
300 500 700 900 1100 −90 −60 −30 0 30 60 90
on A
λ − Wavelength − nm − Angular Displacement − °
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Figure 1 Figure 2
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IDD vs.
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NORMALIZED OUTPUT
VDD vs. vs.
TEMPERATURE VDD
1.55 100.6
1.5
1.45 Saturated
100.4
VDD = 5 V
Normalized Output — %
1.4
100.2
1.35
IDD — mA
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1.3 Saturated
VDD = 3 V 100
1.25
1.2
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99.8
1.15
Dark
1.1 99.6
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VDD = 3 V
1.05 Dark
VDD = 5 V
1 99.4
0 25 50 75 100 2.5 3 3.5 4 4.5 5 5.5
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Figure 3 Figure 4
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
TYPICAL CHARACTERISTICS
8k
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Temperature Coefficient — ppm/deg C
7k
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6k
5k
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4k
3k
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2k
st
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0
on A
600 650 700 750 800 850 900 950 1000
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
APPLICATION INFORMATION
Input interface
A low-impedance electrical connection between the device OE pin and the device GND pin is required for
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improved noise immunity. All input pins must be either driven by a logic signal or connected to VDD or GND —
they should not be left unconnected (floating).
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Output interface
The output of the device is designed to drive a standard TTL or CMOS logic input over short distances. If lines
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greater than 12 inches are used on the output, a buffer or line driver is recommended.
A high state on Output Enable (OE) places the output in a high-impedance state for multiple-unit sharing of a
microcontroller input line.
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Power down
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Powering down the sensor using S0/S1 (L/L) will cause the output to be held in a high-impedance state. This
is similar to the behavior of the output enable pin, however powering down the sensor saves significantly more
on A
power than disabling the sensor with the output enable pin.
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Photodiode type (color) selection
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The type of photodiode (blue, green, red, or clear) used by the device is controlled by two logic inputs, S2 and
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The output-scaling counter registers are cleared upon the next pulse of the principal frequency after any
transition of the S0, S1, S2, S3, and OE lines. The output goes high upon the next subsequent pulse of the
principal frequency, beginning a new valid period. This minimizes the time delay between a change on the input
lines and the resulting new output period. The response time to an input programming change or to an irradiance
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step change is one period of new frequency plus 1 μs. The scaled output changes both the full-scale frequency
and the dark frequency by the selected scale factor.
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The frequency-scaling function allows the output range to be optimized for a variety of measurement
techniques. The scaled-down outputs may be used where only a slower frequency counter is available, such
as low-cost microcontroller, or where period measurement techniques are used.
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
APPLICATION INFORMATION
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to maximize resolution as the light input changes. Period measurement is used to measure rapidly varying light
levels or to make a very fast measurement of a constant light source.
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Maximum resolution and accuracy may be obtained using frequency-measurement, pulse-accumulation, or
integration techniques. Frequency measurements provide the added benefit of averaging out random- or
high-frequency variations (jitter) resulting from noise in the light signal. Resolution is limited mainly by available
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counter registers and allowable measurement time. Frequency measurement is well suited for slowly varying
or constant light levels and for reading average light levels over short periods of time. Integration (the
accumulation of pulses over a very long period of time) can be used to measure exposure, the amount of light
present in an area over a given time period.
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PCB Pad Layout
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Suggested PCB pad layout guidelines for the D package are shown in Figure 6.
on A
nt
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4.65 6.90
1.27 2.25
0.50
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3200 has an 8 × 8 array of photodiodes with a total size of 1 mm
by 1 mm. The photodiodes are 110 μm × 110 μm in size and are positioned on 134 μm centers.
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2.12 3.00 0.250
0.250
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PIN 1
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PIN 1
il
st
6 1.27
te G 8 0.510
0.330
SIDE VIEW
on A
nt 2.8 TYP
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CLEAR WINDOW
am
5.00
END VIEW 4.80
5.3
MAX
0.50 0.88 TYP TOP OF
0.25 45 SENSOR DIE
1.75
1.35
DETAIL A
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4.00
3.80
6.20
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5.80 0.25
0.19
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Pb 1.27
0.41
0.25
0.10
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3210 has a 4 × 6 array of photodiodes with a total size of 0.54 mm
by 0.8 mm. The photodiodes are 110 μm × 110 μm in size and are positioned on 134 μm centers.
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2.12 3.00 0.250
0.250
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PIN 1
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PIN 1
il
st
6 1.27
te G 8 0.510
0.330
SIDE VIEW
on A
nt 2.8 TYP
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CLEAR WINDOW
am
5.00
END VIEW 4.80
5.3
MAX
0.50 0.88 TYP TOP OF
0.25 45 SENSOR DIE
1.75
1.35
DETAIL A
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4.00
3.80
6.20
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5.80 0.25
0.19
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Pb 1.27
0.41
0.25
0.10
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
MECHANICAL INFORMATION
SIDE VIEW
Ko 2.11 0.10 [0.083 0.004]
0.292 0.013
[0.0115 0.0005]
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TOP VIEW END VIEW
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8 0.1 4 0.1 2 0.05
1.50 1.75 0.10
[0.315 [0.157 [0.079
[0.069 0.004]
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0.004] 0.004] 0.002]
il
B
5.50 0.05
[0.217 0.002]
st
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on A
[0.472 + 0.12 − 0.004]
A
nt A
B
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DETAIL A DETAIL B
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. This drawing is subject to change without notice.
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
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Table 2. TCS3200, TCS3210 Solder Reflow Profile
PARAMETER REFERENCE TCS32x0
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Average temperature gradient in preheating 2.5°C/sec
Soak time tsoak 2 to 3 minutes
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Time above 217°C t1 Max 60 sec
Time above 230°C t2 Max 50 sec
Time above Tpeak −10°C t3 Max 10 sec
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Peak temperature in reflow Tpeak 260° C (−0°C/+5°C)
Temperature gradient in cooling Max −5°C/sec
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on A
Tpeak
T3 nt Not to scale — for reference only
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T2
T1
Temperature (C)
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Time (sec) t3
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t2
tsoak t1
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
STORAGE INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect
them from ambient moisture during shipping, handling, and storage before use.
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Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on
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the bag when stored under the following conditions:
Shelf Life: 12 months
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Ambient Temperature: < 40°C
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator
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Card shows that the devices were exposed to conditions beyond the allowable moisture region.
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Floor Life
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The D package has been assigned a moisture sensitivity level of MSL 5a. As a result, the floor life of devices
on A
removed from the moisture barrier bag is 24 hours from the time the bag was opened, provided that the devices
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are stored under the following conditions:
Floor Life: 24 hours
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If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior
to solder reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 60°C for 24 hours.
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TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
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lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
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Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
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belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
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chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
st
te G NOTICE
on A
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
nt
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
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TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
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design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
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LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
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