RAYMING PCB & ASSEMBLY
PCBA Quality Control
PCB Assembly Quality
Control System
X-Ray Inspection for BGA
Assembly
Our automated X-ray inspection systems are able to monitor a variety
of aspects of a printed circuit board in assembly production. The
inspection is done after the soldering process to monitor defects in
soldering quality. Our equipment is able to”see” solder joints that are
under packages such as BGAs, CSPs and FLIP chips WHERE the solder
joints are hidden.
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This allows us to verify that the assembly is done right. The defects and
other information detected by the inspection system can be quickly
analyzed and the process altered to reduce the defects and improve
the quality of the final products. In this way not only are actual faults
detected, but the process can be altered to reduce the fault levels on
the boards coming through. Use of this equipment allows us to ensure
that the highest standards are maintained in our assembly.
Components Quality control
To make sure the components to be used are good quality, there are
several processes that we follow:
1. An overview of the visual electronic components inspection process
includes:
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* Packaging examined:
-Weighed and checked for damage
-Taping condition inspected-dented package etc.
-Original factory sealed vs. non-factory sealed
* Shipping documents verified
-Country of origin
-Purchase order and sales order numbers match
* Manufacturer P/N, quantity, date code verification, RoHS
* Moisture barrier protection verified (MSL)-vacuum sealed
and humidity indicator with specification (HIC)
* Products and packaging (photographed and cataloged)
* Body marking inspection (faded markings, broken text, double
print, ink stamps, etc.)
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* Physical conditions inspection (lead bands, scratches, chipped
edges, etc.)
* Any other visual irregularities found
Once our visual distribution inspection is completed, products are
escalated to the next level-electronic components engineering
distribution inspection for review.
2. Engineering Components Inspection
Our highly skilled and trained engineers receive the components for
evaluation at a microscopic level to ensure consistency and quality. Any
suspect parts or discrepancies that are discovered in the visual
inspection process will either be verified or discounted by taking a
product sampling of the material/parts.
The engineering electronic components distribution inspection
process includes:
* Review visual inspection findings and notes
* Purchase and sales orders numbers verified
* Verification of labels (bar codes)
* Manufacturer’s logo and date log verification
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* Moisture sensitivity level (MSL) and RoHS status
* Extensive marking permanency tests
* Review and comparison to manufacturer datasheet
* Additional photos taken and cataloged
* Solderibility Testing, the samples undergo an accelerated ‘aging
‘ process before being tested for solderibility, to take into
consideration the natural aging effects of storage prior to board-
mounting; In addition to the Engineering Components Inspection
we have a higher level of inspection under the customer request.
3. By customer request, all components can pass a thorough final
inspection in our Assembly facility.
Detectable defects list
Automated
Selected
Defect Defect Detection by
Inspection Defect Class
No. Description final proto
Technology(s)
type
1 Dry joints AOI Soldering No
4 BGA voiding X-ray Soldering Yes
5 BGA bridging X-ray Soldering Yes
6 BGA tilted X-ray Soldering Yes
BGA missing
7 X-ray Soldering Yes
balls
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BGA poor Not reliable
8 X-ray Soldering
wetting detection
9 BGA poor reflow X-ray Soldering Yes
Leaded CC poor
10 X-ray Soldering No
heel joint
Leaded CC
13 AOI Soldering No
lifted leads
SOT SOIC lea Not reliable
14 AOI Soldering
d lift detection
15 Solder balls AOI Soldering Yes
PTH solder
16 AOI Soldering No
poor fill
PTH poor lead
17 AOI Soldering No
wetting
Heat
SAM/Active
18 plane delamin Board Yes
thermography
ation
Plastic
SAM/Active
19 Encapsulated Components Yes
thermography
Delamination
Chip capacito
20 SAM/X-ray Components Yes
r crack
Missing
21 AOI Placement Yes
component
22 Tomb-stoning AOI Soldering Yes
23 Flipped AOI Soldering/Placement Yes
24 Tilted AOI Placement Yes
Passive
25 Solder short Soldering Yes
thermography
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