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How to Design a PCB Layout
Introduction
Printed circuit board (PCB) layout design is a complex engineering art
involving the layout of components and interconnections on a PCB to
realize the circuit schematic functionality. A good PCB layout ensures
proper signal and power integrity, electromagnetic compatibility, thermal
management, manufacturability, and reliability of the product. This article
provides a step-by-step guide on designing effective PCB layouts.
PCB Layout Design Steps
The major steps involved in designing the layout for a PCB are:
1. Planning the layout and creating a stackup
2. Placing components strategically
3. Routing traces taking signal integrity into account
4. Adding power/ground planes and ensuring decoupling
5. Incorporating thermal management features
6. Adding mounting holes, connectors, indicators, etc.
7. Finalizing layer stacks and interfaces
8. Checking design rule and manufacturing compliance
9. Validating with DFx analysis like signal, power, thermal, EMI
10. Iterating to optimize based on analysis feedback
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Proper planning is key before starting the actual layout to avoid
sub-optimal results requiring rework.
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1. Layout Planning and Stackup Design
Hard
ware Layout
The first step is planning the layout architecture and defining the PCB
layer stackup.
Key planning activities:
Understand PCBspecs – board dimensions, layer count, density, etc.
Review schematic for component types and counts
Plan partitioning for analog and digital sections
Define interfaces, high speed routing needs
Plan power architecture and decoupling strategy
Identify high power components needing cooling
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Understand enclosure and assembly constraints
List critical nets needing impedance control
Gather applicable routing guidelines from IPC and OEMs
Defining layer stackup:
Select number of layers suitable for density
Choose dielectric materials based on performance
Determine copper weights for current needs
Add impedance control layers if needed
Assign plane layers (power, ground)
Plan signal routing layers
Consider double-sided component placement
Incorporate internal thermal vias/layers if necessary
Specify thickness, finish and solder mask for outer layers
Careful planning and stackup design ensures effective layout of all
sub-systems.
2. Component Placement
Next step is intelligently placing components on the board.
Placement guidelines:
Group associated circuits together
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Ensure important nets have short paths
High speed ICs close to connectors
Match component footprint to placement side
Distribute heat sources avoiding hotspots
Allow access to testpoints
Ensure components fit within board outline
Maintain clearance between components
Standardize orientation for polarized parts
Consider rework access requirements
Define placement zones for partitioned layout
Good component placement minimizes interconnect lengths, noise
coupling, and thermal issues while taking assembly needs into account.
3. Signal Trace Routing
PCB Ante
nna Layout
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With components placed, signal interconnects between pins are routed:
Signal trace routing tips:
Use appropriate trace widths based on current
Minimize length for critical signals like clocks
Avoid 90° angles. Use 45° bends.
Route noise-sensitive signals away from aggressors
Provide isolation channels between digital and analog
Use impedance matching techniques if needed
Take care of high speed interfaces
Facilitate test probe accessibility
Enable visual inspection where needed
Allow space between traces for manufacturing
Intelligent trace routing controls impedance, EMI and signal quality while
enabling testability.
4. Power Distribution and Decoupling
Proper PCB power distribution is key for stable functioning of circuits.
Power distribution considerations:
Use power/ground planes to distribute current
Decide on split or contiguous planes
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Stack-up should sandwich signal layers between power layers
Use wide traces/polygons for power connections
Add local vias in pads to connect devices to power plane
Include thick interconnects between layers
Decoupling guidelines:
Place bypass caps close to ICs on same layer
Minimize trace length between cap and pin
Select suitable capacitors for HF and LF decoupling
Add sufficient bulk capacitance distributed around the board
Together, a robust power distribution network and decoupling strategy
provide clean stable supply voltages to all devices.
5. Thermal Management
Proper cooling provisions must be incorporated for heat generating
components:
Thermal design techniques:
Identify components needing heatsinks from power dissipation
Position hot parts for maximum heat sink contact
Ensure air flow access over heat sinks and vents
Use thermal vias under hot device pads
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Add internal thermal layers connected by vias
Incorporate thick copper planes for spreading heat
Define thermal pads for device cooling
Check for hot spots and temperature gradients
This removes heat efficiently from critical high power devices.
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6. Mechanical Features
PCB
layout line design
Additional mechanical elements are added:
Mounting holes with correct diameter and annular ring spacing
Edge connectors, testpoints, indicators and switches
Brackets, clamps and strengtheners if needed
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Mark component IDs, polarity, ratings as needed
Add board outline with proper corner chamfers
Include any required assembly instructions
These features facilitate mounting, assembly and usage of the designed
PCB.
7. Finalizing Layer Stack
With routing completed, the individual layers are finalized:
Review all routing on layers, rearrange if needed
Check for manufacturing spacing violations
Verify alignment between layers for vias
Add reference markers for layer alignments
Insert testpoints for probing individual layers
Check plane void areas affecting current flow
Define minimum annular rings for vias
Confirm margins from edge meet requirements
This completes the detailed inner layer builds ready for integration.
8. Design Rule Checks
The PCB layout is then validated against:
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Electrical rules: spacing between traces, pads, and planes based on
voltage levels and insulation needs
Routing rules: trace widths and clearances, via dimensions, acute
angle avoidance
Manufacturing rules: capabilities of PCB fabrication process like
minimum track width, hole size, spacing
Tools like designersRule inside Cadence Allegro can automate checking
against IPC and OEM guidelines. Errors must be fixed to ensure
manufacturability.
9. DFx Analysis
The next step is verifying the design using DFx simulations:
Signal integrity: Check for reflections, crosstalk, timing issues using
IBIS models
Power integrity: Simulate power distribution network stability and
resonance
Thermal: Verify temperature profiles using tools like IcePak
EMI/EMC: Model radiated and conducted emissions
Mechanical: Stress analysis, vibration and shock checks
This validates the design meets all functional requirements before release.
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10. Layout Optimization
Corn
e PCB Layout
Based on the analysis feedback, layout issues are addressed:
Tune trace widths, spacing, layer stackup issues
Adjust placement to minimize coupling
Add shielding, bandgaps, power islands if needed
Improve heat spreading and airflow
Tweak decoupling strategy based on resonance modes
Adjust trace angles, impedance matching
Modify plane shapes to lower resonant peaks
Reroute signals affecting EMC/EMI
With iterations, an optimized layout satisfying electrical, thermal, and
mechanical needs is finalized.
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Conclusion
PCB layout design requires carefully planning the partitioning, layer
stackup, placement strategy and routing architecture.
Components must be intelligently placed to minimize interconnect
lengths and noises.
Signal traces should use controlled impedance routing to ensure
signal integrity.
A robust power distribution network and decoupling strategy
stabilizes power delivery.
Thermal design techniques like thermal vias, pads and internal
layers enable cooling.
Mechanical features are added to facilitate assembly, usage and
testing.
Extensive design validation using DFx analysis uncovers issues
requiring tuning.
Using these best practices helps create a manufacturable layout optimized
for electrical, thermal and mechanical performance. This results in a
reliable PCB with the best signal and power integrity for the desired
application.
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Frequently Asked Questions
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What are some key aspects to check during layout review?
Critical items to check in layout review are: impedance matching on high
speed nets, bypass cap placement, plane void areas, clearance between
traces and pads, trace angles, thermal reliefs on pads, vias aligned with
pads, plane splits, and manufacturability spacing checks.
What is the optimal copper thickness for power traces?
For power traces carrying over 1A current, it is recommended to use
thicker 2oz/3oz copper instead of standard 1oz. This significantly reduces
voltage drop over interconnects due to lower resistive losses.
How can EMI emissions be reduced through PCB layout?
EMI reduction techniques include: enclose board in grounded metal shield,
use multilayer board with uninterrupted ground planes, route high speed
traces over plane, use ground vias for shields, avoid big current loop areas,
avoid slits/voids in planes, filter connectors.
What are some thermal vias best practices?
Use thermal vias under high power component pads. Each via should be
10-20 mils diameter with 1 oz copper plating. Include 4-8 vias in pad with
50% copper fill. Use thermal spokes or patterns connecting to internal
ground layers which act as heat sinks.
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What are some key signal integrity checks during PCB layout?
Critical SI checks include: match net trace impedance, minimize
discontinuities, avoid stubs, route clock nets with daisy chains, use
differential pairs with skew control, provide shielding for noise-prone
signals, avoid 90° angles, use plane cavities below, add
termination resistors.
Related Posts:
1. Antenna Design and RF Layout Guidelines You Must Know
2. What is the Significance of the Hardware Design Layout?
3. Additive Manufacturing Vs. Traditional PCB Design and Layout
4. Aircraft PCB Design, Layout, and Assembly Processes
https://www.raypcb.com/13-basic-rules-of-pcb-layout/
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