Designers Perspective SI PI
Designers Perspective SI PI
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= .
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L = = 7.05cms (Inner)
.
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HCTTL = 850 mV
HCTTL = 500 mV
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Summarizing
► Interconnect behaves as a transmission line.
► Signal topology can have one or multiple paths.
► Signal propagates due to its changing states.
► Signals see instantaneous impedance during propagation.
► Signal has a return path and important as the signal path.
► Signal has a Forward and Return conductive path separated by dielectric.
► Signal path has conductor and dielectric loss.
► Both losses are frequency dependent.
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Conductive
Path
Return
Path
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Reflection Coefficient
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- =
- =
- =
- = +
= = =
Source: Signal Integrity AND Power Integrity Simplified – Dr.Eric Bogatin
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Voltage
Rist Time in nSecs
Signal
Time
Rise Time Tr
90%
Voltage
Propagation delay/2
Signal Transition Time
Voltage
10%
Time in nSecs
Propagation delay/2
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Parallel AC Termination
Termination
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PCB Material
►Resin and Reinforcement make up base material.
►Copper foil bonded to base material is laminate.
►Copper clad laminates thus has three parts:
• Resin - natural or synthetic resinous material
• Reinforcement –provides mechanical stability to the
laminate. This can be paper, matte glass, woven glass.
• Copper foil – The conductive element
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Crosstalk
► Crosstalk is defined as the “noise” introduced in a quiet net by an
active net.
► Crosstalk happens between the signal and return paths of the
“active net” and the signal and return paths of the “quiet net”.
► Normally crosstalk margins acceptable as a rule of thumb is 5%
of the signal voltage swing.
► “Active net” is termed “Aggressor” and the “Quiet net” as
“Victim”.
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Phenomena of Crosstalk
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Coupled Currents
► The near and far end victim line currents sum to produce the near and the
far end crosstalk noise
I near I Cm I Lm I far I Cm I Lm
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► Near-end noise (NEXT) rises up to a constant value and is valid for a time equal to 2.Td of the
coupling length.
► Far-end noise (FEXT) until one time of flight after the signal starts it has a time period equal to
rise time of signal.
► Ratio of coupled noise voltage to signal voltage is called NEXT and FEXT coefficient.
Source: Signal Integrity AND Power Integrity Simplified – Dr.Eric Bogatin
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Controlling Crosstalk
► Near-end
• Increase the spacing between Traces.
• Use strip line construction.
• Use guard traces to reduce cross talk.
► Far-end
• Increase the spacing.
• Use strip line construction.
• Decrease the coupled length.
• Increase dielectric thickness above the trace, this increase near-end
noise and decrease Z0.
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►When Q2 turns “On” and Q1 turns “Off”, then it provides the path for the current
from output to ground. This is when the signal switches from “High” to “Low” .
►A current spike now flows from output through Q2 flows to ground. This current is
dependent on the number of loads connected at the out put.
►This current then flows through the lead inductance resulting in the voltage at “Ref
B” being elevated from the GND level.
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►When Q2 turns “Off” and Q1 turns “On”, then it provides the path for the current from
Vcc to output. This cuts off the current flowing through Q2 to ground.
►The negative current spike generates a voltage at “Ref B”, which propagates to the
output. This will be in addition to the voltage drop due to the lead inductance at “Ref
A”.
►These changes in the voltage level is called “Ground Bounce or SSN or SSO Noise”
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Impedance of plane
Characteristic Impedance of Air
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Minimizing EMI Caused by Radially Propagating Waves inside High Speed Digital Logic PCBs – By Franz Gisin et al - Mikrotalasna revija (2001)
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Minimizing EMI Caused by Radially Propagating Waves inside High Speed Digital Logic PCBs – By Franz Gisin et al - Mikrotalasna revija (2001)
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Minimizing EMI Caused by Radially Propagating Waves inside High Speed Digital Logic PCBs – By Franz Gisin et al - Mikrotalasna revija (2001)
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Differential Signaling
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Differential Signaling
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Differential Signaling
►Key advantages:
• Higher noise margin at receiver. Higher data rate
• Can be operated at lower voltage and less power
• Less SSN noise impact at Transmitter end
• Less sensitivity to return path discontinuities
• Hence more adaptive to Gbps signaling
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S - Parameters
► S-Parameters used as the behavioural model of a network, translated into
terms of reflection and loss.
► For passive interconnect structures, like transmission lines and via's, as
the frequency increases dependency on loss.
► Standard methods of analysing and modelling these types of structures no
longer hold true when considering a wide range of frequency dependent
phenomena.
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S-Parameter - Representation
► Focus here will be on a simple 2-port network:
► Linear equations can be used to describe the network in terms of injected
and transmitted power waves.
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S-Parameter - Representation
S11= S21=
S22= S12=
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I/O I/O
CORE
CORE
CORE
CORE
+ +
tx rx
- -
C1 C2
C1 C2
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Architecture
CORE
CORE
CORE
CORE
+ +
tx rx
- -
C1 C2 C1 C2
U7 in
tint
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deterministic jitter
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► PDN is the path from Power Input Point (Connector or VRM) all the way to the power pins of
Active devices (IC’s)
► PDN Includes PCBs and packages, Planes, Routed traces, and Decoupling capacitors
► PDN shall ensure that the voltage levels at the power points of all active devices is above the
minimum value.
► PDN also provides low-noise reference path for signals
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PDN – DC Failure
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References
1. Signal Integrity & Power Integrity Simplified - 2nd Edition Dr.Eric Bogatin
2. Noise Reduction Techniques in Electronic Systems Dr.Henry Ott
3. High-Speed Digital Design – Advanced Black Magic Dr. Johnson H.W et al.
4. Digital Techniques for High speed design Dr. Tom Granberg
5. Printed Circuit Board Design Techniques for EMC compliance Mark Montrose
6. Signal Integrity & Radiated Emission of High Speed Digital Systems Spartaco Caniggia et al
7. A Handbook of Interconnect Theory & Design Practices Stephen Hall et al
8. Advanced Signal Integrity For High-speed Digital Designs Stephen Hall, et al
9. PCB Design for Real-World EMI Control Bruce R Archambeault
10.Electromagnetic Compatibility Engineering Dr.Henry W Ott
11.Base Materials for High Speed, High Frequency PC Boards Lee Ritchey 2002
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