AT24C01B-08B Automotive EEPROM Datasheet
AT24C01B-08B Automotive EEPROM Datasheet
AT24C04B, AT24C08B
Replaced by DATASHEET
AT24C01C, Features
AT24C02C,
AT24C04C, Medium-voltage and Standard-voltage Operation
or AT24C08C ̶ 2.5V (VCC = 2.5V to 5.5V)
Automotive Temperature Range –40C to 125C
Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), or 1,024 x 8 (8K)
2-Wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400kHz (2.5V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (1K, 2K) or 16-byte Page (4K, 8K) Write Modes
Partial Page Writes are Allowed
Self-timed Write Cycle (5ms max)
High-reliability
̶ Endurance: 1,000,000 Write Cycles
̶ Data Retention: 100 Years
8-lead JEDEC SOIC and 8-lead TSSOP Packages
Description
Atmel-8517D-SEEPROM-AT24C01B-02B-04B-08B-Auto-Datasheet_082014
1. Pin Configurations and Pinouts
Table 1-1. Pin Configurations
Operating Temperature 55C to +125C *Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
Storage Temperature . . . . . . . . . . . . . . . . ..65C to +150C damage to the device. This is a stress rating
only and functional operation of the device at
Voltage on Any Pin these or any other conditions beyond those
with Respect to Ground 1.0V to +7.0V indicated in the operational sections of this
Maximum Operating Voltage . . . . . . . . . . . . . . . . . . . . 6.25V specification is not implied. Exposure to
absolute maximum rating conditions for
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA extended periods may affect device reliability.
3. Block Diagram
Figure 3-1. Block Diagram
VCC
GND
WP
SCL Start
Stop
SDA Logic Serial
EN
Control H.V. Pump/Timing
Logic
LOAD
DIN DOUT/ACK
Logic
DOUT
5. Memory Organization
AT24C01B, 1K Serial EEPROM: Internally organized with 16 pages of 8 bytes each, the 1K requires a 7-bit
data word address for random word addressing.
AT24C02B, 2K Serial EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit
data word address for random word addressing.
AT24C04B, 4K Serial EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit
data word address for random word addressing.
AT24C08B, 8K Serial EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit
data word address for random word addressing.
Applicable over recommended operating range from TA = 25C, f = 400kHz, VCC = +2.5V.
Note: 1. VIL min and VIH max are reference only and are not tested.
5.3 AC Characteristics
Table 5-3. AC Characteristics
Applicable over recommended operating range from TA = 40C to +125C, VCC = +2.5V to +5.5V, CL = 1 TTL Gate and
100pF (unless otherwise noted).
Notes: 1. This parameter is characterized and is not 100% tested (TA = 25C).
2. This parameter is characterized only.
SDA
SCL
Data
Change
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the
Stop command will place the EEPROM in a standby power mode.
SDA
SCL
Start Stop
SCL 1 8 9
DATA IN
DATA OUT
Start Acknowledge
Standby Mode: The AT24C01B/02B/04B/08B Automotive features a low-power standby mode which is
enabled:
Upon power-up.
After the receipt of the Stop condition and the completion of any internal operations.
2-Wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be
protocol reset by following these steps:
1. Create a Start condition.
2. Clock nine cycles.
3. Create another start but followed by Stop condition as shown below.
The device is ready for the next communication after above steps have been completed.
SCL 1 2 3 8 9
SDA
tHIGH
tF tR
tLOW tLOW
SCL
SDA IN
SDA OUT
Figure 6-6. Write Cycle Timing — SCL: Serial Clock, SDA: Serial Data I/O
SCL
WORDn
(1)
twr
Stop Start
Condition Condition
Note: 1. The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
1K/2K 1 0 1 0 A2 A1 A0 R/W
MSB LSB
4K 1 0 1 0 A2 A1 P0 R/W
8K 1 0 1 0 A2 P1 P0 R/W
S W
T R S
A I T
R Device T O
T Address E Word Address Data P
SDA LINE
M L R A M L A A
S S / C S SC C
B BW K B BK K
Page Write: The 1K/2K EEPROM is capable of an 8-byte Page Write. The 4K/8K devices are capable of
16-byte Page Writes.
A Page Write is initiated the same as a Byte Write, but the microcontroller does not send a Stop condition after
the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the
microcontroller can transmit up to seven (1K/2K) or fifteen (4K/ 8K) more data words. The EEPROM will
respond with a zero after each data word received. The microcontroller must terminate the Page Write
sequence with a Stop condition.
The data word address lower three (1K/2K) or four (4K/8K) bits are internally incremented following the receipt
of each data word. The higher data word address bits are not incremented, retaining the memory page row
location. When the word address, internally generated, reaches the page boundary, the following byte is placed
at the beginning of the same page. If more than eight (1K/2K) or sixteen (4K/8K) data words are transmitted to
the EEPROM, the data word address will roll-over and previous data will be overwritten.
S W
T R S
A I T
R Device T O
T Address E Word Address (n) Data (n) Data (n + 1) Data (n + x) P
SDA LINE
M L R A A A A A
S S / C C C C C
B BW K K K K K
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero, allowing the read or write sequence to continue.
S
T R S
A E T
R A O
T Device
Address D P
SDA LINE
M L R A Data N
S S / C O
B BW K
A
C
K
Random Read: A random read requires a “dummy” Byte Write sequence to load in the data word address.
Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start condition. The microcontroller now initiates a Current Address
Read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop condition.
S W S
T R T R S
A I A E T
R Device T Word R Device A O
T Address E Address n T Address D Data n P
SDA Line
M R A A M A N
S / C C S C O
B W K K B K
A
C
K
Dummy Write
R S
E T
Device A O
Address D Data (n) Data (n + 1) Data (n + 2) Data (n + x) P
SDA Line
R A A A A N
/ C C C C O
WK K K K
A
C
K
ATMLPYWW PYWW
### % ###%
AAAAAAAA
6/13/14
AT 2 4 C 0 1 B N - S P 2 5 - B
Device Density
01 = 2 kilobit Package Device Grade
02 = 2 kilobit P = NiPdAu Lead Finish
04 = 4 kilobit Automotive Temperature Range
08 = 8 kilobit (-40°C to +125°C)
Device Revision
Package Option
S = JEDEC SOIC
Package Variation T = TSSOP
(Package Type Dependant)
N = 0.150” width SOIC
AT24C01BN-SP25-B(1)
8S1
AT24C01BN-SP25-T(2) NiPdAu Automotive Temperature
2.5V to 5.5V
AT24C01B-TP25-B (1) (Lead-free/Halogen-free) (40C to 125C)
8X
AT24C01B-TP25-T(2)
AT24C02BN-SP25-B(1)
8S1
AT24C02BN-SP25-T(2) NiPdAu Automotive Temperature
2.5V to 5.5V
AT24C02B-TP25-B (1) (Lead-free/Halogen-free) (40C to 125C)
8X
AT24C02B-TP25-T(2)
AT24C04BN-SP25-B(1)
8S1
AT24C04BN-SP25-T(2) NiPdAu Automotive Temperature
2.5V to 5.5V
AT24C04B-TP25-B (1) (Lead-free/Halogen-free) (40C to 125C)
8X
AT24C04B-TP25-T(2)
AT24C08BN-SP25-B(1)
8S1
AT24C08BN-SP25-T(2) NiPdAu Automotive Temperature
2.5V to 5.5V
AT24C08B-TP25-B (1) (Lead-free/Halogen-free) (40C to 125C)
8X
AT24C08B-TP25-T(2)
Notes: 1. B = Bulk
2. T = Tape and Real
SOIC = 4,000 per reel.
TSSOP = 5,000 per reel.
Package Type
8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
E E1
N L
Ø
TOP VIEW
END VIEW
e b
A COMMON DIMENSIONS
(Unit of Measure = mm)
6/22/11
TITLE GPC DRAWING NO. REV.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Package Drawing Contact: SWB 8S1 G
Small Outline (JEDEC SOIC)
[email protected]
C
1
Pin 1 indicator
this corner
E1 E
L1
N
L
Top View End View
A
b
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
e A2
SYMBOL MIN NOM MAX NOTE
D
A - - 1.20
Side View A1 0.05 - 0.15
Notes: 1. This drawing is for general information only. A2 0.80 1.00 1.05
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc. D 2.90 3.00 3.10 2, 5
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
E 6.40 BSC
0.15mm (0.006in) per side. E1 4.30 4.40 4.50 3, 5
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm b 0.19 0.25 0.30 4
(0.010in) per side. e 0.65 BSC
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess L 0.45 0.60 0.75
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
L1 1.00 REF
space between protrusion and adjacent lead is 0.07mm. C 0.09 - 0.20
5. Dimension D and E1 to be determined at Datum Plane H.
2/27/14
TITLE GPC DRAWING NO. REV.
8X, 8-lead 4.4mm Body, Plastic Thin
Package Drawing Contact: TNR 8X E
Shrink Small Outline Package (TSSOP)
[email protected]
Update template, logos, and disclaimer page. Add part markings section. No changes to
8517D 08/2014
functional specification. Add NRND statement and repalced by devices.
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