FQA24N60

April 2000

QFET TM

FQA24N60
600V N-Channel MOSFET

General Description Features

These N-Channel enhancement mode power field effect • 23.5A, 600V, RDS(on) = 0.24 Ω @ VGS = 10 V
transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 110 nC)
planar stripe, DMOS technology. • Low Crss ( typical 56 pF)
This advanced technology has been especially tailored to • Fast switching
minimize on-state resistance, provide superior switching • 100% avalanche tested
performance, and withstand high energy pulse in the • Improved dv/dt capability
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply.

D
!

"

! "
G! "
"

TO-3P !
G DS S
FQA Series

Absolute Maximum Ratings

TC = 25°C unless otherwise noted

Symbol Parameter FQA24N60 Units

VDSS Drain-Source Voltage 600 V
ID Drain Current - Continuous (TC = 25°C) 23.5 A
- Continuous (TC = 100°C) 14.9 A
IDM Drain Current - Pulsed (Note 1) 94 A
VGSS Gate-Source Voltage ±
30 V
EAS Single Pulsed Avalanche Energy (Note 2) 1300 mJ
IAR Avalanche Current (Note 1) 23.5 A
EAR Repetitive Avalanche Energy (Note 1) 31 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V
ns
PD Power Dissipation (TC = 25°C) 310 W
- Derate above 25°C 2.5 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
TL 300 °C
1/8 from case for 5 seconds

Thermal Characteristics
Symbol Parameter Typ Max Units
RθJC Thermal Resistance, Junction-to-Case -- 0.4 °CW
RθCS Thermal Resistance, Case-to-Sink 0.24 -- °CW
RθJA Thermal Resistance, Junction-to-Ambient -- 40 °CW

©2000 Fairchild Semiconductor International Rev. A, April 2000

 FQA24N60
Electrical Characteristics




T C = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 600 -- -- V
∆BVDSS Breakdown Voltage Temperature
ID = 250 µA, Referenced to 25°C -- 0.6 -- V/°C
/ ∆TJ Coefficient
IDSS VDS = 600 V, VGS = 0 V -- -- 10 µA
Zero Gate Voltage Drain Current
VDS = 480 V, TC = 125°C -- -- 100 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA

On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 3.0 -- 5.0 V
RDS(on) Static Drain-Source
VGS = 10 V, ID = 11.8 A -- 0.18 0.24 Ω
On-Resistance
gFS Forward Transconductance VDS = 50 V, ID = 11.8 A (Note 4) -- 22.5 -- S

Dynamic Characteristics
Ciss Input Capacitance VDS = 25 V, VGS = 0 V, -- 4200 5500 pF
Coss Output Capacitance f = 1.0 MHz -- 550 720 pF
Crss Reverse Transfer Capacitance -- 56 75 pF

Switching Characteristics
td(on) Turn-On Delay Time VDD = 300 V, ID = 23.5 A, -- 90 190 ns
tr Turn-On Rise Time RG = 25 Ω -- 270 550 ns
td(off) Turn-Off Delay Time -- 200 410 ns
(Note 4, 5)
tf Turn-Off Fall Time -- 170 350 ns
Qg Total Gate Charge VDS = 480 V, ID = 23.5 A, -- 110 145 nC
Qgs Gate-Source Charge VGS = 10 V -- 25 -- nC
Qgd Gate-Drain Charge (Note 4, 5) -- 53 -- nC

Drain-Source Diode Characteristics and Maximum Ratings

IS Maximum Continuous Drain-Source Diode Forward Current -- -- 23.5 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 94 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 23.5 A -- -- 1.4 V
trr Reverse Recovery Time VGS = 0 V, IS = 23.5 A, -- 470 -- ns
Qrr Reverse Recovery Charge dIF / dt = 100 A/µs (Note 4)
-- 6.2 -- µC

Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 4.3mH, IAS = 23.5A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD
23.5A, di/dt
200A/µs, VDD
BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width
300µs, Duty cycle
2%
5. Essentially independent of operating temperature

©2000 Fairchild Semiconductor International Rev. A, April 2000

FQA24N60

Typical Characteristics

VGS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V 1
150

10
ID, Drain Current [A]

ID, Drain Current [A]

1
10

25

0
10
-55

0
10
Notes :
Notes :
1. 250s Pulse Test 1. VDS = 50V
2. TC = 25 2. 250s Pulse Test

-1
10
10
-1
10
0
10
1 2 4 6 8 10

VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V]

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics

1.0

0.8
Drain-Source On-Resistance

VGS = 10V
IDR, Reverse Drain Current [A]

1
10
RDS(ON) [
],

0.6
VGS = 20V

0.4
0
10

150
25

0.2

Notes :
1. VGS = 0V

Note : TJ = 25 2. 250s Pulse Test

0.0 -1
0 10 20 30 40 50 60 70 80 90 100 10
0.2 0.4 0.6 0.8 1.0 1.2 1.4
ID, Drain Current [A] VSD, Source-Drain voltage [V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage

Drain Current and Gate Voltage Variation vs. Source Current and
Temperature

12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
8000 Crss = Cgd VDS = 120V
10
VDS = 300V
VGS, Gate-Source Voltage [V]

Ciss VDS = 480V

6000 8
Capacitance [pF]

Coss
6
4000

Notes : 4
1. VGS = 0 V
Crss 2. f = 1 MHz
2000
2

Note : ID = 23.5 A

0 0
-1 0 1 0 20 40 60 80 100 120
10 10 10
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

©2000 Fairchild Semiconductor International Rev. A, April 2000

 FQA24N60
Typical Characteristics (Continued)

1.2 3.0

2.5
Drain-Source Breakdown Voltage

1.1

Drain-Source On-Resistance
BV DSS , (Normalized)

RDS(ON) , (Normalized)
2.0

1.0 1.5

1.0

0.9
Notes :
1. VGS = 0 V

Notes :
2. ID = 250 A 0.5 1. VGS = 10 V
2. ID = 11.8 A

0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]

Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation

vs. Temperature vs. Temperature

24
Operation in This Area
is Limited by R DS(on)
20
2
10
10 µs
100 µs 16
ID, Drain Current [A]

ID, Drain Current [A]

1 ms
1
10 10 ms 12
DC

8
0
10
Notes :
o
1. TC = 25 C 4
o
2. TJ = 150 C
3. Single Pulse
-1
10 0
0 1 2 3
10 10 10 10 25 50 75 100 125 150

VDS, Drain-Source Voltage [V] TC, Case Temperature [
]

Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
( t) , T h e r m a l R e s p o n s e

D = 0 .5

10
-1

N o te s :
0 .2 1 . Z
J C ( t) = 0 .4  /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
0 .1 3 . T J M - T C = P D M * Z
J C ( t)

0 .0 5

0 .0 2 PDM

JC

10
-2 0 .0 1 t1
s i n g l e p u ls e t2
Z

-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10

t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]

Figure 11. Transient Thermal Response Curve

©2000 Fairchild Semiconductor International Rev. A, April 2000

FQA24N60

Gate Charge Test Circuit & Waveform

VGS
Same Type
50K

as DUT Qg
12V 200nF
300nF 10V
VDS
VGS Qgs Qgd

DUT
3mA

Charge

Resistive Switching Test Circuit & Waveforms

RL VDS
VDS 90%

VGS VDD
RG
10%
VGS
10V DUT
td(on) tr td(off)
tf
t on t off

Unclamped Inductive Switching Test Circuit & Waveforms

L 1 BVDSS
VDS EAS = ---- L IAS2 --------------------
2 BVDSS - VDD
BVDSS
ID
IAS
RG
VDD ID (t)

10V DUT VDD VDS (t)

tp
tp Time

©2000 Fairchild Semiconductor International Rev. A, April 2000

 FQA24N60
Peak Diode Recovery dv/dt Test Circuit & Waveforms

DUT +

VDS

I SD
L

Driver
RG
Same Type
as DUT VDD

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

Gate Pulse Width

VGS D = --------------------------
Gate Pulse Period 10V
( Driver )

IFM , Body Diode Forward Current

I SD
( DUT ) di/dt

IRM

Body Diode Reverse Current

VDS
( DUT ) Body Diode Recovery dv/dt

VSD VDD

Body Diode
Forward Voltage Drop

©2000 Fairchild Semiconductor International Rev. A, April 2000

FQA24N60

Package Dimensions

TO-3P
15.60 ±0.20
4.80 ±0.20
13.60 ±0.20

3.80 ±0.20
ø3.20 ±0.10 +0.15
9.60 ±0.20 1.50 –0.05

18.70 ±0.20
12.76 ±0.20

19.90 ±0.20

23.40 ±0.20
13.90 ±0.20

2.00 ±0.20
3.50 ±0.20

3.00 ±0.20
16.50 ±0.30

1.00 ±0.20 1.40 ±0.20

+0.15
0.60 –0.05
5.45TYP 5.45TYP
[5.45 ±0.30] [5.45 ±0.30]

©2000 Fairchild Semiconductor International Rev. A, April 2000

 TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx™ HiSeC™ SuperSOT™-8

Bottomless™ ISOPLANAR™ SyncFET™
CoolFET™ MICROWIRE™ TinyLogic™
CROSSVOLT™ POP™ UHC™
E2CMOS™ PowerTrench® VCX™
FACT™ QFET™
FACT Quiet Series™ QS™
FAST® Quiet Series™
FASTr™ SuperSOT™-3
GTO™ SuperSOT™-6

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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

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when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
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PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or In This datasheet contains the design specifications for
Design product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

©2000 Fairchild Semiconductor International Rev. A, January 2000