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Application Brief
DLA Approved Optimizations for QML Products

Bhavika Kagathi

Introduction
The MIL-PRF-38535 is a military specification standard for hermetic and non-hermetic integrated circuits. This
specification covers manufacturing general, quality, and reliability requirements for aerospace and defense
applications. The goal is to establish a process flow baseline for quality and performance in these high reliability
scenarios. Texas Instruments developed specifications and requirements for QML products to meet a level of
quality that are defined in accordance with MIL-PRF-38535. The TI supplied and DLA agreed on optimizations
for QML are listed in Table 1.

QML Classes
Class N – Items which have been subjected to and passed all applicable requirements of MIL-PRF-38535
including TI defined qualification testing, screening testing, and TCI/QCI inspections, and are encapsulated in
plastic (TI supplied).
Class V – Products which have been subjected to and passed all applicable requirements of MIL-PRF-38535
including qualification testing, screening testing, and Technology Conformance Inspection and Quality
Conformance Inspection (TCI/QCI) and have been subjected to, and passed all applicable requirements of
MIL-PRF-38535 in Table 1 (TI supplied).
Class P – A non-hermetic Plastic Encapsulated Microcircuit (PEM), which meets all applicable requirements of
MIL-PRF-38535 including qualification, screening and TCI/QCI inspections, and all applicable requirements in
the table below (TI supplied).
Class Y – A microcircuit employing a non-hermetic package, which meets all applicable requirements of MIL-
PRF-38535 including qualification, screening and TCI/QCI inspections, and all applicable requirements in Table
1 (TI supplied).

QML Optimizations
Table 1. QML Optimizations
Manufacturer Specification Test Optimized Date
D-8, lid torque eliminated (all cerdip, cerflat glass sealed packages all Oct-93
Texas Instruments MIL-PRF-38535
classes)

100% burn-in eliminated (all TTL, LS, STTL products line. All package Jun-94
Texas Instruments MIL-PRF-38535 configurations.)
Level B/Q only

Constant acceleration eliminated (all products in the 8, 14, 16, 20, pin DIP) Jun-94
Texas Instruments MIL-PRF-38535
Level B/Q only

Texas Instruments MIL-PRF-38535 Temperature cycles eliminated (all products in the 8, 14, 16, 20 pin DIP) Jun-94

100% high magnification inspection eliminated (TTL, LS, STTL, ALS Jun-94
Texas Instruments MIL-PRF-38535 HCMOS, F, AS, and 55 series products lines. All packages configurations)
Level B/Q only

100% burn-in on certain linear product eliminated (contact TI or DLA Land Sep-94
Texas Instruments MIL-PRF-38535 and Maritime for specific linear products)
Level B/Q only

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Table 1. QML Optimizations (continued)

Manufacturer Specification Test Optimized Date
Group A sample testing of alpha V10, alpha I10 and various noise tests on Sep-94
Texas Instruments MIL-PRF-38535 certain linear products eliminated (contact TI or DLA Land and Maritime for
specific linear products)

Final electrical, 25°C (ALS, AS, FAST, 54ABT32316 parent device types Nov-95
Texas Instruments MIL-PRF-38535 eliminated)
Level B/Q only

100% burn-in (HCMOS, all packages) eliminated Feb-95

Texas Instruments MIL-PRF-38535
Level B/Q only

100% burn-in (ALS, AS, FAST) eliminated Aug-95

Texas Instruments MIL-PRF-38535
Level B/Q only

100% temperature cycle (all CPAK) eliminated Aug-95

Texas Instruments MIL-PRF-38535
Level B/Q only

100% constant acceleration (all CPAK) eliminated Aug-95

Texas Instruments MIL-PRF-38535
Level B/Q only

100% -55°C screening and group A (HC and HCT) eliminated Mar-95
Texas Instruments MIL-PRF-38535
Level B/Q only

100% -55°C screening (ABT, AC, ACT, BCT) eliminated Aug-96

Texas Instruments MIL-PRF-38535
Level B/Q only

Burn-in reduction on 4 Meg DRAM Aug-96

Texas Instruments MIL-PRF-38535
Level B/Q only

Physical dimensions (D1), moisture resistance (D3), insulation resistance Oct-96

Texas Instruments MIL-PRF-38535
(D3) (for all ceramic packages in Taiwan and Singapore facilities) eliminated

Class V, P, Y May-00
Texas Instruments MIL-PRF-38535
Eliminated read and record data

Class V May-00
Texas Instruments MIL-PRF-38535
X-ray (monitor only, for glass-frit seal)

Class V May-00
Texas Instruments MIL-PRF-38535
Eliminated Non-Destructive Bond Pull

Class V May-00
Texas Instruments MIL-PRF-38535
Eliminated PIND and Centrifuge on all flip chip mounted die

100% burn-in (selected DSP/MCU) eliminated Jun-96

Texas Instruments MIL-PRF-38535
Level B/Q only

100% -55°C screening (selected DSP/MCU) eliminated Jun-98

Texas Instruments MIL-PRF-38535
Level B/Q only

Texas Instruments MIL-PRF-38535 100% X-ray eliminated on welded lid parts Oct-07

QCI Group B Subgroup 1 Class V Aug-00

Texas Instruments MIL-PRF-38535 Physical Dimensions and Internal Water Vapor Performed as part of Generic
Group D QCI by package family within 36 week window

QCI Group B Subgroup 2 Class V Aug-00

Resistance to Solvents, Bond Strength and Die shear are done as part of
Texas Instruments MIL-PRF-38535 Generic group B QCI by package family by week of seal. Main body 38535
group B.
Internal visual and mechanical is covered by 100% pre-cap inspection.

QCI Group B Subgroup 3 Class V Aug-00

Texas Instruments MIL-PRF-38535 Solder-ability performed as part of Generic Group B QCI by package family
per week of seal.

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Table 1. QML Optimizations (continued)

Manufacturer Specification Test Optimized Date

QCI Group B Subgroup 4 Class V Aug-00

Lead Integrity, Seal are performed as part of generic group D CQI by
Texas Instruments MIL-PRF-38535
package family within 36-week window.
Lid torque testing eliminated for all package families

QCI Group B Subgroup 5 Class V Aug-00

Texas Instruments MIL-PRF-38535 End point electrical, Steady State Life and End point electrical performed as
part of Wafer Lot acceptance by wafer lot

QCI Group B Subgroup 6 Class V Aug-00

End-point electrical, temp cycle, constant acceleration, seal and endpoint
Texas Instruments MIL-PRF-38535
electrical parameters performed as part of generic Group D QCI by package
family within 36 week window

DS16F95 Jun-97
DS26F31 and 32
DS96F172 through 175
Legacy (National
MIL-PRF-38535 Level S/V only
Semiconductor)
Minimum percentage of the metallization cross sectional area required over
the passivation steps in Method 2018, SEM Inspection, reduced from 50%
to 30% for Method 5007, Wafer Lot Acceptance

All part numbers for Level S/V only Oct-99

Legacy (National Method 5007, parts a. and c., Thermal Stability test (C-V plot) reduced from
MIL-PRF-38535
Semiconductor) each wafer lot to pre-designated maintenance events of the sputter metal
deposition system (for example, venting, and so on.)

Metal can packages (TO-3, 5, 39, 46) Jun-96

Legacy (National Level B/Q only

MIL-PRF-38535
Semiconductor)
M2001, Constant Acceleration eliminated for screen

Specific part numbers for Level S/V only Nov-06

Legacy (National
MIL-PRF-38535 Ultrasonic inspection per Method 2030 is being performed instead of
Semiconductor)
Radiography on ceramic package with a coppertungsten heat slug

DS26LS31 for Level B/Q only Jul-00

Legacy (National
MIL-PRF-38535 Burn-in reduced from inspection lot screen to fab lot sample. Life test
Semiconductor)
frequency increased from yearly to quarterly and can use non-burned-in
parts.

LM124 Aug-00
Jan-01
LM139

Legacy (National Level B/Q only

MIL-PRF-38535
Semiconductor)
Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

LM124, LM124A Oct-02

Legacy (National
MIL-PRF-38535
Semiconductor) Level B/Q only
Screen for A-2, A-3 final electricals moved prior to burn-in

JL111, LM111 Jun-02

Level B/Q only

Legacy (National
MIL-PRF-38535
Semiconductor) Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

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Table 1. QML Optimizations (continued)

Manufacturer Specification Test Optimized Date

LM158 Nov-02

Level B/Q only

Legacy (National
MIL-PRF-38535
Semiconductor) Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

DS96F173 and 175 Aug-02

Level B/Q only

Legacy (National
MIL-PRF-38535
Semiconductor) Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

JL148, LM148 Nov-02

Level B/Q only
Legacy (National
MIL-PRF-38535 Burn-in reduced from inspection lot screen to fab lot sample. Life test
Semiconductor)
frequency increased from yearly to quarterly and can use non-burned-in
parts.

LM139, LM139A Jan-03

Legacy (National
MIL-PRF-38535 Level B/Q only
Semiconductor)
Screen for A-2, A-3 final electricals moved prior to burn-in

LM741 Jun-03
Level B/Q only
Legacy (National
MIL-PRF-38535 Burn-in reduced from inspection lot screen to fab lot sample. Life test
Semiconductor)
frequency increased from yearly to quarterly and can use non-burned-in
parts.

LM136A Oct-05
May-06
Level B/Q only
Jun-06
Legacy (National Screen for A-2, A-3 final electricals moved prior to burn-in
MIL-PRF-38535
Semiconductor) LM136 Screen for 25°C, -55°C, +125°C and temperature coefficient testing
can be performed prior to burn-in.
LM148 Screen for -55°C, 125°C moved prior to burn-in

LM723 Nov-03

Level B/Q only

Legacy (National
MIL-PRF-38535
Semiconductor) Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

DS26LS31 Dec-05

Level B/Q only

Legacy (National
MIL-PRF-38535
Semiconductor) Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

LM117, JL117 May-08

LM119

Legacy (National Level B/Q only

MIL-PRF-38535
Semiconductor)
Burn-in reduced from inspection lot screen to fab lot sample. Life test
frequency increased from yearly to quarterly and can use non-burned-in
parts.

TI systems do not support Marking as described in Section 3.1 (p.13-14): Aug-23

Texas Instruments MIL-PRF-38535 Marking for plastic packages. Follow TI Standard Marking/Symbolization.
Actual product symbolization can be documented in the SMD.

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Table 1. QML Optimizations (continued)

Manufacturer Specification Test Optimized Date

MIL-PRF-38535 Allow 1X Reflow in lieu of temp cycle in Table IA.TM1010, Condition B, Aug-23
Texas Instruments Table IA: Screening -55/125C, 15cy – nonstandard flow. When TC is performed, it can be in
procedure (p. 20) accordance with JESD22-A104.

MIL-PRF-38535 Perform TC with accordance to JESD22- A104 to align with Appendix H and Aug-23
Texas Instruments Table V: Group D (p 37-43)
standard factory specifications.
D3 / TM1010

Clarification: Aug-23
Perform UHAST per one of the following conditions:
MIL-PRF-38535
130C, 85%RH – 96 Hours
Texas Instruments Table V: Group D (p 37-43)
110C, 85%RH – 264 Hours.
D3 / Clarification
Allowed per Note 18.

TI can perform UHAST, not BHAST for QCI. Allowed per MIL-PRF-38535.
MIL-PRF-38535 Clarification: TI can use separate units for UHAST and TC. Allowed option Aug-23
Texas Instruments Table V: Group D (p 37-43)
per Note 17.
D3 / Clarification

MIL-PRF-38535 Moisture resistance per JESD22-A118 Unbiased HAST condition A or B. Aug-23

Table V: Group D (p 37-43)
Texas Instruments
D3 / Moisture resistance
condition

MIL-PRF-38535 TI uses internal procedure (QSS 009- 109). Aug-23

Table V: Group D (p 37-43)
Texas Instruments
D7 / Adhesion of lead
finish

Clarified NiPdAu thickness. TI devices meet NiPdAu thickness indicated Aug-23

below.
MIL-PRF-38535
Texas Instruments Table A-III (p 80)
Over plating thickness (microinch/micrometer):
Coating Thickness
Min 20/0.51
Max NS

Flip Chip containing PB free bumps: Aug-23

MIL-PRF-38535
Biased Humidity option to run JESD22- A101 (THB) or A110 (Biased HAST)
Table H-I. Assembly
Conditions:
process technology testing
Texas Instruments • 85C/ 85% relative humidity, 1000 hours or
for flip chip packages
• 130C/85% relative Humidity, 96 hours, or
containing Pb free bump
• 110C/85% relative humidity, 264 hours
[p196]

Thermal Shock is not applicable to organic substrates.

MIL-PRF-38535 Class Q, V, Y (flip chip): Aug-23
Table H-IA. Assembly
process technology testing Final Package testing
Texas Instruments for hermetic (classes High temperature Storage TM 1008 (1,000 hours at +150°C) or JESD 22
Q, V) and non-hermetic A103 (1,000 hours at +150°C or equivalent).
packages (class Y).
[197-198]

Class Q, V, Y (flip chip): Aug-23

MIL-PRF-38535
Table H-IIA. Technology
Group 2:
characterization testing
a. Thermal shocks N/A
Texas Instruments for hermetic (classes
b. Temperature cycles TM 1010, condition C, 100 cycles or JESD22-A104
Q, V) and non-hermetic
c. HAST(Biased) JESD22-A110 or THB JESD22-A101
packages (class Y)
d. Visual inspection TM 1010 and TM 1004 visual criteria
[200-202]
e. Not applicable

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Table 1. QML Optimizations (continued)

Manufacturer Specification Test Optimized Date

Class N, P: Aug-23

MIL-PRF-38535 Group #3 Temperature Cycling per one of the following:

Table H-IB. Assembly
- 55/125C, 700 cycle (product release), 1000 cycle (technology release) or-
Texas Instruments process technology testing 65/150C, 500 cycle (product release), 1000 cycle (technology release).
for plastic packages
(classes N, P) Group #5 High Temp
Storage performed per JESD 22 A103
Bake 150C, 1000 Hours or equivalent.

Class N, P: Aug-23

Group#2 Moisture sensitivity level per manufacturer’s specification or

JEDEC JSTD- 020/ JESD 22-A113

Group #3
MIL-PRF-38535
b. Biased HAST (130C/85%RH/96, 192hr) or (110C/85% RH/264, 528hr) or
Table H-IIB. Technology
(85C/85%RH/1000, 2000hr) per JESD22-A110/JESD22-A101
Texas Instruments characterization testing for
plastic packages (classes Group #6 Lead Integrity - For plastic packages, TI uses internal test method,
N, P) QSS 009-134. TM is not applicable for plastic packages. For trim and form
leaded packages this is N/A per Test Method 2004 section 3.2

Group #7 - Can perform MSL testing per J-STD-020/JESD 22-A113 instead

of this test.

Group #9 - Does not perform Fungus testing.

Group #12 – Thermal characteristics based on Modeling.

MIL-STD-883 Alternate method of inline measurements can be used in lieu of cross Dec 23
Texas Instruments
TM5007 section (applies to planar technologies only).

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