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Introduction to Printed Circuit Board (PCB) Designing

We typically learn about, analyze, and design electrical or electronic circuits using a
diagram, called a schematic, that consists of component symbols connected by lines. The
symbols represent everything from basic passive components such as resistors or capacitors
to sophisticated integrated circuits such as microcontrollers, and the lines represent
conductive pathways that allow electrical current to flow freely from one portion of the
circuit to another.

One thing that all schematics have in common is the utter inability to drive a motor,
or blink an LED, or filter out noise, or do any of the other useful and interesting things that
we expect electrical systems to do. A schematic is, after all, just a drawing. To actually
accomplish something with a circuit, we need to translate its schematic into physical
components and physical interconnections. Simple schematics can often be realized on
a breadboard, but the vast majority of circuit designs enter the physical realm in the form of
a printed circuit board, or PCB for short

A Printed Circuit Board or PCB is essentially a board that connects electronic

components. It is the basic building block of any electronic design and has developed over
the years into a very sophisticated component. In 1925, Charles Dukas of the US, created and
patented a way of electroplating an electrical path onto an insulated surface. The Printed
Circuit Board was born, opening the door to smaller, simpler and less cumbersome designs.

Paul Eisler, an Austrian refugee to Britain in 1936, is considered the real founder of
the PCB. He developed and patented a number of applications that eventually grabbed the
attention of US military. The rest, as they say, is history.

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PCBs have moved from 1 layer boards to the 20 + layer boards found in your smartphone.
They have interconnecting layers that allow the overall size to be reduced – think of mobile
phones in the 80s versus the smart phones of today.

To describe how a PCB is created, we’ve taken a standard 2 Layer or Double Sided
PCB. Using DesignSpark PCB Software to design your PCB, Gerber and NcDrill files are
created. Each Gerber file represents a component necessary for PCB Manufacture including
the copper layers, soldermask and silkscreen data, the PCB outline and the solder paste data
for producing a laser stencil for assembly. The NcDrill file defines the location and size of
each hole on the PCB both PTH (pin through hole) and NPTH (non pin through hole).

The double sided PCB is made of epoxy glass (FR4) with copper foil on both sides of
the epoxy glass. This is generally bought pre-prepared from suppliers. The FR4 material is
fibreglass and gives the board its rigidity. To create multilayered PCBs combinations of the
pre-made material are pressed together with other layers or non-copper clad FR4 (Prepreg)
used to isolate the copper layers from each other.

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In the PCB design stage, using the DesignSpark software, a drill or DRL file is
created. This is the drill file containing the information used to drill the necessary holes.

At this point there is no electrical connection between the layers. The hole walls need
to layered with copper. As the walls are non-conductive, a layer of copper is deposited
chemically over the hole walls. This process, known as electroplating, is repeated until the
copper thickness reached is optimum for connectivity, typically 25um.

The board is covered with photo-resist. This is a soft, photo-sensitive material. The
copper film is placed over the board, aligned with the drills and the board is exposed to UV
light. The unexposed areas of resist are removed by passing the boards through a developer
solution leaving the copper track\pad pattern visible on the board.

The next step is the deposit a coating over the exposed copper, this coating protects
the copper on vias, component holes and traces from being removed during the etching stage.

The photo-resist is stripped (chemically), from the board. It is now time to remove all
the copper chemically. The chemical will only remove the copper and not the copper
protected by the coating. Now the coating is removed, exposing all the traces and component
pads, vias, etc. This is the fundamental PCB circuitry.

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A layer of soldermask is added to both sides. It is generally green, although other

colours are common. Using a similar process to the photo-resist, the areas for soldering are
exposed.

The soldermask insulates the copper and will only create a contact where it is
exposed. It also acts as a protector against oxidation & corrosion of the copper. The
soldermask layers will include clearances around traces, vias, etc.

To identify the PCB, often developers like to add print to the PCB. This silk-screen
will be added at this stage using epoxy ink. Typically, this is white, although many coloured
options are available.

A layer of gold, silver or solder on the copper pads will be applied to all component pads,
vias, etc., giving the expected finish for the customer. This improves the solderability and
protects these surfaces from oxidation. This is the final surface finish.

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History of Printed Circuit Board

The first printed circuit boards (PCBs) can be traced all the back to the early 1900s
and a patent for “printed wire.” It was in 1925 that Charles Ducas first submitted a patent that
involved creating an electrical path directly on an insulated surface. It was a revolutionary
idea because it could eliminate complex wiring and provide consistent results. Still, they
didn’t really catch on until after WWII, when Dr. Paul Eisler in Austria began making the
first real operational printed circuit boards in 1943.

PCB Timeline - Before printed circuits became the common component used in electronics,
point to point construction was used. This meant some extremely bulky and unreliable
designs that required large sockets and regular replacement. Most of these issues were
directly addressed when PCBs went into regular production.

1920s – The early PCB material could be almost anything, from Bakelite and Masonite to
plain old thin pieces of wood. Holes could be drilled into the material and flat brass wires
would be riveted onto it. It may not have been pretty, but the concept was there, and it
worked. It was often used in radios and gramophones at the time.

1947 – First double sided PCB’s with plated through holes produced.

1950s – 60s – The types of materials used for the board was shifting to different resins and
other materials, but they could still only be printed on a single side. The wiring would be
printed on one side and the electrical components would be on the other. Still, it was a much
more efficient option than bulky wiring, so it was starting to see a wider adoption.
One of the biggest steps forward came in 1956 when the U.S. Patent Office granted a patent
to a small group of scientists representing the U.S. Army for the “Process of Assembling
Electrical Circuits.” At the time, the process involved drawing the wiring pattern and then
photographing it onto a zinc plate. This plate could then be used to create a printing plate for
an offset printing press. This is what was used to print the wire in acid resistant ink on the
copper foil, which could then be etched by an acid solution.

1957 – IPC (The Institute of Printed Circuits) formed and hold first meeting in Chicago IL.

1960 – Multilayer (4+ layer count) PCB’s begin production.

1960s -70’s – Boards were designed using 4:1, red-and-blue line vellum method for hand-
taping components and tracks. A precision camera then produced the 1:1 negative
manufacturing film. An experienced designer could layout and tape a board at the rate of
about two hours for each equivalent 14-pin IC on the board.

1970s – The circuitry and overall size of the boards were starting to get a lot smaller by the
70s, and hot air soldering methods began to be used. This is also when the Japanese
developers began to create screen processes that used various aqueous developed LPIs (liquid
photo imageable masks). This became the industry standard over the years.
Gerber Scientific introduces RS-274-D as a machine-based format for vector photoplotters.

1980s – Surface mount parts became the preferred option over through-hole components,
which led to further size reductions while maintaining the same level of functionality.

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1986 – RS-274X released as an enhancement to RS-274-D data format. New version supports
embedded aperture information relieving the need for external aperture definition files.

1992 – Valor Computerized Systems founded introducing Genesis 2000 software for PCB
CAM and DFM.

1990s– While the complexity of modern circuit boards continues to go up, the size of the
boards and costs of materials has generally been able to go down. Once developers were able
to start using multi-layer circuit boards they were able to minimize the size and incorporate
combinations of rigid and flexible PCBs in a range of devices. Going forward, new
developments will continue to produce more efficient circuits that can effectively meet the
needs of rapidly growing technology.

1995 -US PCB production reaches $7.1 billion, topping $7 billion for first time.

1995 – Use of micro-via technology in PCB production starts, ushering in the era of HDI
(High Density Interconnect) PCB’s.

1997 – Valor Computerized Systems releases ODB ++ printed circuit board manufacturing
data format into public domain.

2000- US PCB fabrication market peaks at more than $10 billion.

2000s – PCB Real Estate becomes even tighter with 5-6mil trace & space becoming
commonplace. Hi-tech shops fabricating boards with 3.5 to 4.5mil trace & space in
production quantities. Flex and Rigid –Flex PCBs become an affordable option and widely
used.

2010s – ELIC (Every Layer Interconnect) production begins.

The Future

Miniaturization of electronic products continue to drive printed circuit board

manufacturing technology and design towards smaller and more densely packed boards with
increased electronic capabilities. Future advancements may include three-dimensional
molded plastic boards and the increased use of integrated circuit chips, POP (package on
package) as well as embedded components. These and other advancements will keep the
design and manufacture of printed circuit boards a dynamic and constantly evolving industry
for many years to come.

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The Structure of a PCB

A very basic printed circuit board is a flat, rigid, insulating material that has thin
conductive structures adhering to one side. These conductive structures create geometric
patterns consisting of, for example, rectangles, circles, and squares. Long, thin rectangles
function as interconnections (i.e., the equivalent of wires), and various shapes function as
connection points for components

This is an example of a very basic PCB. This board is actually homemade; see AAC’s guide
to home PCB fabrication for more information

A printed circuit board such as the example in the image has only one conductive
layer. A single-layer PCB is very restrictive; the circuit realization will not make efficient use
of available area, and the designer may have difficulty creating the necessary
interconnections.

Incorporating additional conductive layers makes the PCB more compact and easier
to design. A two-layer board is a major improvement over a single-layer board, and most
applications benefit from having at least four layers. A four-layer board consists of
the top layer, the bottom layer, and two internal layers. (“Top” and “bottom” may not seem
like typical scientific terminology, but they are nonetheless the official designations in the
world of PCB design and fabrication.)

PCB Stackup

The stackup is the arrangement of conductive and insulating layers in a multilayer

PCB. The following side-view diagram shows the stackup of a four-layer board

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The conductive material of choice is copper. Prepreg is an insulating material that is

pre-impregnated (hence the name) with resin, and the core (also insulating) is similar in
composition to the prepreg

I recommend that you use a four-layer structure whenever possible. A four-layer board
allows you to devote one internal layer to the reference potential (i.e., ground) and another
internal layer to power-supply voltages. The top, and if necessary the bottom, will be a
component layer. This arrangement facilitates PCB design and also helps you to achieve
improved circuit performance

Understanding PCB Features and Terminology

There’s quite a bit of specialized vocabulary that arises in discussions of printed

circuit boards. This section describes physical structures found on PCBs and gives you the
words that we use to identify them

 A conductive interconnection is called a trace, and connection points for components

are called pads (for pins that rest on the surface of the board) and through-holes (for
pins that are inserted into holes drilled in the board). Basic PCB design consists of
arranging pads and through-holes so that components can be properly installed, and
then connecting these pads and through-holes using traces
 Not all drilled holes are for through-hole components. We often need to transfer a
signal or supply voltage from one PCB layer to another, and this is accomplished
using small, conductive holes called vias
 Many PCBs also include mounting holes, which have a mechanical rather than an
electrical function and therefore don’t need to be plated. The term “plating” in this
context refers to conductive material that has been deposited onto the interior of a
drilled hole
 A copper pour is a relatively large section of a PCB layer that is filled with
conductive material. Copper pours can be used to provide a very low-resistance or
low-inductance connection between components and to improve thermal performance

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 A PCB layer that consists entirely of one large copper pour is called a plane layer. We
frequently use an internal layer as a ground plane and create ground connections by
placing vias next to component pins
 A through-hole or via begins as a circle of copper and then becomes a hole when a
drill bit passes through the circle (ideally through the center of the circle). The
term annular ring refers to the width of copper that remains after the hole has been
drilled
 Printed circuit boards include a variety of “supplemental” information that have no
role in the electrical functionality of the device. For example, reference
designators uniquely identify components, dots indicate proper component
orientation, and project titles or serial numbers help us to keep track of the many
circuit boards that accumulate in a lab. We refer to this information as the silkscreen.

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Different Parts of PCB:

Pad: Pad is nothing but a piece of copper on which lead of components are mounted and on
which soldering are done. Pad provides the mechanical support to the components.

Trace: In PCB, components are not connected with the help of wires. All components are
connected with a conducting material like copper. This copper part of PCB which is used to
connect all components that is known as trace. Trace is looks like below figure.

Layers: According to application, cost and available space of circuit, user can choose the
layer of PCB. Most simple in construction, easy to design and most useful in routine life is
single layer PCB. But for very large and complex circuit, double layer PCB or Multi-layer
PCB is most preferred compared to single layer PCB. Now a day, in multi-layer PCB, 10-12

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layers can be connected and most critical thing is to communicate between the components in
different layer.

Silk layer: Silk layer is used for printing line, text or any art on the surface of PCB. Usually,
for screen printing epoxy ink is used. Silk layer can be used in top and/or bottom layer of
PCB according to user requirement which is known as silk screen TOP and silk screen
BOTTOM.

Top and bottom layer: In Top layer of PCB, all components are mounted in this layer of
PCB. Generally, this layer is green coloured. In bottom layer of PCB, all components are
soldered through the hole and lead of components is known as bottom layer of PCB.
Sometime, in top and/or bottom layer PCB is coated with green colour layer, which is known
as solder mask.

Solder Mask: There is one additional layer on the top of copper layer called as Solder Mask.
This layer generally has green color but it can be of any color. This insulating layer is used
for to prevent accidental contact of pads with other conductive material on PCB.

What are the Different Types of PCBs?

Types of PCBs According to Mounting System

1. Through-hole PCB
2. Surface mounted PCB

1) Through-hole PCB:

In this type of PCB, we have to make hole using drill on PCB. In these holes, leads of
components are mounted and soldered to pads situated on opposite side of PCB. This
technology is most useful because it gives more mechanical support to electrical components
and very reliable technology for mounting of components but drilling in PCB make it more
expensive. In single layer PCB, this mounting technology is easy to implement, but in case of
double layer and multi-layer PCB making hole is more difficult.

Through-hole PCB
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2) Surface mounted PCB:

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In this type of PCB, components are small in size because these components have
very small lead or no leads are required for mounting on the board. Here, in this technology,
SMD components are directly mounted on the surface of the board and not require to make
hole on board.

Surface mounted PCB

PCB’s are often classified on the basis of frequency, a number of layers and substrate
used. Some popular types are discussed below.
 Single Sided PCBs
Single sided PCBs are the basic type of circuit boards, which contain only one layer of
substrate or base material. The layer is covered with a thin layer of metal, i.e. copper-
which is a good conductor of electricity. These PCBs also contain a protective solder
mask, which is applied on the top of the copper layer along with a silk screen coat. Some
advantages offered by single sided PCB’s are:
o Single sided PCB’s are utilized for volume production and are low in cost.
o These PCBs are utilized for simple circuits such as power sensors, relays, sensors and
electronic toys.
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 Double Sided PCBs
Double sided PCBs have both the sides of the substrate featuring metal conductive layer.
Holes in the circuit board allow the metal parts to be attached from one side to the other.
These PCBs connect the circuits on the either side by either of the two mounting
schemes, namely through-hole technology and surface mount technology. The through-
hole technology involves inserting of lead components through the pre-drilled holes on
the circuit board, which are soldered to the pads on the opposite sides. The surface mount
technology involves electrical components 24 to be directly placed on the surface of the
circuit boards. Advantages offered by double sided PCBs are:
o Surface mounting allows more circuits to be attached to the board in comparison to
the through-hole mounting.
o These PCB’s are utilized in a wide range of applications, including mobile phone
system, power monitoring, test equipment, amplifiers, and many others.

 Multi-layer PCBs
Multi-layer PCBs are printed circuit boards, which comprise more than two copper layers
like 4L, 6L, 8L, etc. These PCBs expand the technology used in double sided PCB’s.
Various layers of a substrate board and insulating materials separate the layers in multi-
layer PCBs. The PCBs are compact sized, and offer benefits of weight and space. Some
advantages offered by multi-layer PCBs are:
o Multi-layer PCBs offer a high level of design flexibility.
o These PCBs play an important role in high speed circuits. They provide more space
for conductor pattern and power.

 Rigid PCBs
Rigid PCBs refer to those types of PCBs whose base material is fabricated from a solid
material and which cannot be bent. Some salient advantage offered by them:
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o These PCBs are compact, which ensures the creation of variety of complex circuitry
around it.
o Rigid PCBs offer easy repair and maintenance, as all the components are clearly
marked. Also, the signal paths are well organized.

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 Flexible PCBs
Flexible PCBs are constructed on a flexible base material. These PCBs come in single
sided, double-sided and multilayer formats. This helps in reducing the complexity within
the device assembly. Some advantages offered by these PCBs are:
o These PCBs help save a lot of space, along with reducing the overall board weight.
o Flexible PCBs helps in decreasing the board size, which makes it ideal for various
applications where high signal trace density is needed.
o These PCBs are designed for working conditions, where temperature and density is a
main concern.

 Rigid-Flex-PCBs
Rigid flex PCBs are the combination of rigid and flexible circuit boards. They comprise
of multiple layers of flexible circuits attached to more than one rigid board.
o These PCBs are precision built. Hence, it is used in various medical and military
applications.
o Being light-weight, these PCB offer 60% of weight and space savings.
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 High-Frequency PCBs
High-frequency PCBs are used in the frequency range of 500MHz – 2GHz. These PCBs
are used in various frequency critical applications like communication systems,
microwave PCBs, microstrip PCBs, etc.

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 Aluminum backed PCBs

These PCBs are used in high power applications, as the aluminum construction helps in
heat dissipation. Aluminum backed PCBs are known to offer high level of rigidity and
low level of thermal expansion, which makes them ideal for applications having high
mechanical tolerance. The PCBs are used for LEDs and power supplies.

The demand for PCBs is catching up in various industrial sectors. Today, you will find
various reputed PCB manufacturers and distributors, who cater the competitive connective
devices market. It is always recommended to buy PCBs for industrial and commercial use
from reputed manufacturers and suppliers. Twisted Traces is one such trusted and
experienced manufacturers of different types of PCBs. The company has consistently
provided their customers with high-quality circuit boards with excellent speed, and
performance.