ESP32-S3-MINI-1

ESP32-S3-MINI-1U
Datasheet

Small-sized module supporting 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 (LE)
Built around ESP32-S3 series of SoCs, Xtensa® dual-core 32-bit LX7 microprocessor
Flash up to 8 MB, optional 2 MB PSRAM in chip package
39 GPIOs, rich set of peripherals
On-board PCB antenna or external antenna connector

ESP32-S3-MINI-1 ESP32-S3-MINI-1U

Version 1.2
Espressif Systems
Copyright © 2023

www.espressif.com
1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf

1.1 Features

CPU and On-Chip Memory Peripherals

• ESP32-S3 embedded, Xtensa® dual-core 32-bit • GPIO, SPI, LCD interface, Camera interface,
LX7 microprocessor (with single precision FPU), UART, I2C, I2S, remote control, pulse counter,
up to 240 MHz LED PWM, full-speed USB 2.0 OTG, USB
Serial/JTAG controller, MCPWM, SDIO host,
• 384 KB ROM GDMA, TWAI® controller (compatible with ISO
11898-1, i.e. CAN Specification 2.0), ADC, touch
• 512 KB SRAM
sensor, temperature sensor, timers and
• 16 KB SRAM in RTC watchdogs

• Up to 8 MB Quad SPI flash Note:

* Please refer to ESP32-S3 Series Datasheet for
• 2 MB PSRAM (ESP32-S3FH4R2 only)
detailed information about the module peripherals.

Wi-Fi Integrated Components on Module

• 802.11 b/g/n • 40 MHz crystal oscillator

• Bit rate: 802.11n up to 150 Mbps

Antenna Options
• A-MPDU and A-MSDU aggregation • On-board PCB antenna
(ESP32-S3-MINI-1)
• 0.4 µs guard interval support
• External antenna via a connector
• Center frequency range of operating channel: (ESP32-S3-MINI-1U)
2412 ~ 2484 MHz
Operating Conditions
Bluetooth
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Bluetooth LE: Bluetooth 5, Bluetooth mesh • Operating ambient temperature: –40 ~ 85 °C

• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

Certification
• Advertising extensions
• RF certification: See certificates
• Multiple advertisement sets
• Green certification: RoHS/REACH
• Channel selection algorithm #2
Test
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna • HTOL/HTSL/uHAST/TCT/ESD

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1 Module Overview

1.2 Description
ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that
feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application
scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics,
etc.

ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with a connector for an external
antenna. They feature an up to 8 MB SPI flash and an optional 2 MB SPI Pseudo static RAM (PSRAM). Both
ESP32-S3-MINI-1 and ESP32-S3-MINI-1U come in two versions, with the ordering code ending with -N8 and
-N4R2 respectively. The two versions only vary in flash and PSRAM size.

The series comparison for the two modules is as follows:

Table 1: ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison

Ambient Temp.3 Size4

Ordering Code Flash1, 2 PSRAM1
(°C) (mm)
ESP32-S3-MINI-1-N8 8 MB (Quad SPI) -
15.4 × 20.5 × 2.4
ESP32-S3-MINI-1-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI)
–40 ∼ 85
ESP32-S3-MINI-1U-N8 8 MB (Quad SPI) -
15.4 × 15.4 × 2.4
ESP32-S3-MINI-1U-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI)
1
The modules use flash and PSRAM integrated in the chip’s package.
2
By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not
support the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz
or if you need the flash auto suspend feature, please contact us.
3
Ambient temperature specifies the recommended temperature range of the environment immediately out-
side the Espressif module.
4
For details, refer to Section 7.1 Physical Dimensions.

At the core of the modules is an ESP32-S3, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You
can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for
changes or crossing of thresholds.

ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote
control, pulse counter, LED PWM, USB Serial/Jtag, MCPWM, SDIO host, GDMA, TWAI® controller (compatible
with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs,
as well as up to 45 GPIOs. It also includes a full-speed USB 2.0 On-The-Go (OTG) interface to enable USB
communication.

Note:
* For more information on ESP32-S3, please refer to ESP32-S3 Series Datasheet.

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1 Module Overview

1.3 Applications
• Generic Low-power IoT Sensor Hub • Smart Building

• Generic Low-power IoT Data Loggers • Industrial Automation

• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• USB Devices
• Health Care Applications
• Speech Recognition
• Wi-Fi-enabled Toys
• Image Recognition

• Mesh Network • Wearable Electronics

• Home Automation • Retail & Catering Applications

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Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 4

2 Block Diagram 9

3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 11
3.3 Strapping Pins 13
3.3.1 Chip Boot Mode Control 14
3.3.2 VDD_SPI Voltage Control 15
3.3.3 ROM Messages Printing Control 15
3.3.4 JTAG Signal Source Control 15

4 Electrical Characteristics 17
4.1 Absolute Maximum Ratings 17
4.2 Recommended Operating Conditions 17
4.3 DC Characteristics (3.3 V, 25 °C) 17
4.4 Current Consumption Characteristics 18
4.4.1 RF Current Consumption in Active Mode 18
4.4.2 Current Consumption in Other Modes 18
4.5 Wi-Fi RF Characteristics 20
4.5.1 Wi-Fi RF Standards 20
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 20
4.5.3 Wi-Fi RF Receiver (RX) Specifications 21
4.6 Bluetooth LE Radio 22
4.6.1 Bluetooth LE RF Transmitter (TX) Characteristics 23
4.6.2 Bluetooth LE RF Receiver (RX) Characteristics 24

5 Module Schematics 27

6 Peripheral Schematics 29

7 Physical Dimensions and PCB Land Pattern 30

7.1 Physical Dimensions 30
7.2 Recommended PCB Land Pattern 31
7.3 Dimensions of External Antenna Connector 33

8 Product Handling 34
8.1 Storage Conditions 34
8.2 Electrostatic Discharge (ESD) 34

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Contents

8.3 Soldering Profile 34

8.3.1 Reflow Profile 34
8.4 Ultrasonic Vibration 35

9 Related Documentation and Resources 36

Revision History 37

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List of Tables

List of Tables
1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison 3
2 Pin Definitions 11
3 Default Configuration of Strapping Pins 13
4 Description of Timing Parameters for the Strapping Pins 14
5 Chip Boot Mode Control 14
6 VDD_SPI Voltage Control 15
7 JTAG Signal Source Control 16
8 Absolute Maximum Ratings 17
9 Recommended Operating Conditions 17
10 DC Characteristics (3.3 V, 25 °C) 17
11 Current Consumption Depending on RF Modes 18
12 Current Consumption in Modem-sleep Mode 19
13 Current Consumption in Low-Power Modes 19
14 Wi-Fi RF Standards 20
15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 20
16 TX EVM Test 21
17 RX Sensitivity 21
18 Maximum RX Level 22
19 RX Adjacent Channel Rejection 22
20 Bluetooth LE Frequency 22
21 Transmitter Characteristics - Bluetooth LE 1 Mbps 23
22 Transmitter Characteristics - Bluetooth LE 2 Mbps 23
23 Transmitter Characteristics - Bluetooth LE 125 Kbps 23
24 Transmitter Characteristics - Bluetooth LE 500 Kbps 24
25 Receiver Characteristics - Bluetooth LE 1 Mbps 24
26 Receiver Characteristics - Bluetooth LE 2 Mbps 25
27 Receiver Characteristics - Bluetooth LE 125 Kbps 25
28 Receiver Characteristics - Bluetooth LE 500 Kbps 26

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List of Figures

List of Figures
1 ESP32-S3-MINI-1 Block Diagram 9
2 ESP32-S3-MINI-1U Block Diagram 9
3 Pin Layout (Top View) 10
4 Visualization of Timing Parameters for the Strapping Pins 14
5 ESP32-S3-MINI-1 Schematics 27
6 ESP32-S3-MINI-1U Schematics 28
7 Peripheral Schematics 29
8 ESP32-S3-MINI-1 Physical Dimensions 30
9 ESP32-S3-MINI-1U Physical Dimensions 30
10 ESP32-S3-MINI-1 Recommended PCB Land Pattern 31
11 ESP32-S3-MINI-1U Recommended PCB Land Pattern 32
12 Dimensions of External Antenna Connector 33
13 Reflow Profile 34

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2 Block Diagram

2 Block Diagram
ESP32-S2-MINI-2
40 MHz
Crystal ESP32-S3-MINI-1
3V3 40 MHz Antenna
Crystal
3V3 Antenna

RF Matching
ESP32-S2FH4 RF Matching
ESP32-S2FN4R2
ESP32-S3FN8
EN GPIOs
ESP32-S3FH4R2
EN FLASH PSRAM(opt.) GPIOs
(QSPI) (QSPI)
FLASH PSRAM(opt.)
(QSPI) (QSPI)

Figure 1: ESP32-S3-MINI-1 Block Diagram

ESP32-S3-MINI-1U
40 MHz
Crystal ESP32-S2-MINI-2U
3V3 40 MHz Antenna
Crystal
3V3 Antenna

RF Matching
ESP32-S3FN8 RF Matching
ESP32-S3FH4R2
ESP32-S2FH4
EN GPIOs
ESP32-S2FN4R2
EN FLASH PSRAM(opt.) GPIOs
(QSPI) (QSPI)
FLASH PSRAM(opt.)
(QSPI) (QSPI)

Figure 2: ESP32-S3-MINI-1U Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.

The pin diagram is applicable for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U, but the latter has no keepout
zone.

Keepout Zone
GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND
Pin 51
Pin 60

Pin 56

Pin 54

Pin 52

Pin 50

Pin 46
Pin 59

Pin 58

Pin 57

Pin 55

Pin 53

Pin 49

Pin 48

Pin 47
Pin 62 Pin 65
GND GND

GND Pin 1 Pin 45 EN

GND Pin 2 Pin 44 IO46

3V3 Pin 3 Pin 43 GND

IO0 Pin 4 Pin 42 GND

IO1 Pin 5 Pin 41 IO45

IO2 Pin 6 GND GND GND Pin 40 RXD0

IO3 Pin 7 Pin 39 TXD0

Pin 61
IO4 Pin 8 GND
GND
GND Pin 38 IO42

IO5 Pin 9 Pin 37 IO41

IO6 Pin 10 GND GND GND Pin 36 IO40

IO7 Pin 11 Pin 35 IO39

IO8 Pin 12 Pin 34 IO38

IO9 Pin 13 Pin 33 IO37

IO10 Pin 14 Pin 32 IO36

IO11 Pin 15 Pin 31 IO35

Pin 21

Pin 22
Pin 16

Pin 17

Pin 18

Pin 19

Pin 20

Pin 23

Pin 24

Pin 26

Pin 27

Pin 28

Pin 29

Pin 30
Pin 25

Pin 63 Pin 64
GND GND
IO21
IO12

IO14

IO20

IO34
IO13

IO16

IO17

IO26

IO47

IO33
IO18

IO19

IO48
IO15

Figure 3: Pin Layout (Top View)

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3 Pin Definitions

3.2 Pin Description

The module has 65 pins. See pin definitions in Table 2 Pin Definitions.

For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to
�ESP32-S3 ����������.

Table 2: Pin Definitions

Name No. Type a Function

GND 1, 2, 42, 43, 46-65 P GND
3V3 3 P Power supply
IO0 4 I/O/T RTC_GPIO0, GPIO0
IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
IO10 14 I/O/T
SUBSPICS0
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
IO11 15 I/O/T
SUBSPID
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
IO12 16 I/O/T
SUBSPICLK
RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,
IO13 17 I/O/T
SUBSPIQ
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
IO14 18 I/O/T
SUBSPIWP
IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 25 I/O/T RTC_GPIO21, GPIO21
b
IO26 26 I/O/T SPICS1, GPIO26
IO47 27 I/O/T SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD, SUBSPIHD
IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0, SUBSPICS0
IO48 30 I/O/T SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
IO35 31 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID
IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK
Cont’d on next page

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3 Pin Definitions

Table 2 – cont’d from previous page

a
Name No. Type Function
IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38 34 I/O/T GPIO38, FSPIWP, SUBSPIWP
IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 38 I/O/T MTMS, GPIO42
TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 41 I/O/T GPIO45
IO46 44 I/O/T GPIO46
High: on, enables the chip.
EN 45 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
a
P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default pin functions.
For pin 28 ∼ 29, 31 ∼ 33, the default function is decided by eFuse bit.
b
For modules with ordering codes ending with -N4R2, IO26 connects to the embedded PSRAM and is not available
for other uses.

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3 Pin Definitions

3.3 Strapping Pins

Note:
The content below is excerpted from ESP32-S3 Series Datasheet > Section Strapping Pins. For the strapping pin mapping
between the chip and modules, please refer to Chapter 5 Module Schematics.

At each startup or reset, a module requires some initial configuration parameters, such as in which boot mode to
load the module, voltage of flash memory, etc. These parameters are passed over via the strapping pins. After
reset, the strapping pins operate as regular IO pins.

The parameters controlled by the given strapping pins at module reset are as follows:

• Chip boot mode – GPIO0 and GPIO46

• VDD_SPI voltage – GPIO45

• ROM messages printing – GPIO46

• JTAG signal source – GPIO3

GPIO0, GPIO45, and GPIO46 are connected to the chip’s internal weak pull-up/pull-down resistors at chip reset.
These resistors determine the default bit values of the strapping pins. Also, these resistors determine the bit
values if the strapping pins are connected to an external high-impedance circuit.

Table 3: Default Configuration of Strapping Pins

Strapping Pin Default Configuration Bit Value

GPIO0 Pull-up 1
GPIO3 Floating –
GPIO45 Pull-down 0
GPIO46 Pull-down 0

To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the
ESP32-S3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host
MCU.

All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed
up to be used as regular IO pins after reset.

Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time.
For more information, see Table 4 and Figure 4.

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3 Pin Definitions

Table 4: Description of Timing Parameters for the Strapping Pins

Parameter Description Min (ms)

Setup time is the time reserved for the power rails to stabilize before
tSU 0
the CHIP_PU pin is pulled high to activate the chip.
Hold time is the time reserved for the chip to read the strapping pin
tH values after CHIP_PU is already high and before these pins start 3
operating as regular IO pins.

tSU tH

VIL_nRST
CHIP_PU

VIH

Strapping pin

Figure 4: Visualization of Timing Parameters for the Strapping Pins

3.3.1 Chip Boot Mode Control

GPIO0 and GPIO46 control the boot mode after the reset is released. See Table 5 Chip Boot Mode
Control.

Table 5: Chip Boot Mode Control

Boot Mode GPIO0 GPIO46

Default Configuration 1 (Pull-up) 0 (Pull-down)
SPI Boot (default) 1 Any value
1
Joint Download Boot 0 0
1
Joint Download Boot mode supports the following
download methods:
• USB Download Boot:
– USB-Serial-JTAG Download Boot
– USB-OTG Download Boot
• UART Download Boot

In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the
system.

In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is also
possible to download binary files into SRAM and execute it from SRAM.

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3 Pin Definitions

In addition to SPI Boot and Joint Download Boot modes, ESP32-S3 also supports SPI Download Boot mode.
For details, please see ESP32-S3 Technical Reference Manual > Chapter Chip Boot Control.

3.3.2 VDD_SPI Voltage Control

Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways.

Table 6: VDD_SPI Voltage Control

EFUSE_VDD_SPI_FORCE GPIO45 eFuse 1 Voltage VDD_SPI power source 2

0 3.3 V VDD3P3_RTC via RSP I
0 Ignored
1 1.8 V Flash Voltage Regulator
0 1.8 V Flash Voltage Regulator
1 Ignored
1 3.3 V VDD3P3_RTC via RSP I
1
eFuse: EFUSE_VDD_SPI_TIEH
2
See ESP32-S3 Series Datasheet > Section Power Scheme

3.3.3 ROM Messages Printing Control

During boot process the messages by the ROM code can be printed to:

• (Default) UART and USB Serial/JTAG controller.

• USB Serial/JTAG controller.

• UART.

The ROM messages printing to UART or USB Serial/JTAG controller can be respectively disabled by configuring
registers and eFuse. For detailed information, please refer to ESP32-S3 Technical Reference Manual > Chapter
Chip Boot Control.

3.3.4 JTAG Signal Source Control

The strapping pin GPIO3 can be used to control the source of JTAG signals during the early boot process. This
pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that
cannot be in a high impedance state.

As Table 7 shows, GPIO3 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and

EFUSE_STRAP_JTAG_SEL.

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3 Pin Definitions

Table 7: JTAG Signal Source Control

eFuse 1a eFuse 2b eFuse 3c GPIO3 JTAG Signal Source

0 Ignored USB Serial/JTAG Controller
0 0 0 JTAG pins MTDI, MTCK, MTMS, and MTDO
1
1 USB Serial/JTAG Controller
0 1 Ignored Ignored JTAG pins MTDI, MTCK, MTMS, and MTDO
1 0 Ignored Ignored USB Serial/JTAG Controller
1 1 Ignored Ignored JTAG is disabled
a
eFuse 1: EFUSE_DIS_PAD_JTAG
b
eFuse 2: EFUSE_DIS_USB_JTAG
c
eFuse 3: EFUSE_STRAP_JTAG_SEL

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4 Electrical Characteristics

4 Electrical Characteristics

4.1 Absolute Maximum Ratings

Stresses above those listed in Table 8 Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under Table 9 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 8: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C

4.2 Recommended Operating Conditions

Table 9: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
TA Operating ambient temperature –40 — 85 °C

4.3 DC Characteristics (3.3 V, 25 °C)

Table 10: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Internal weak pull-up resistor — 45 — kΩ
RP D Internal weak pull-down resistor — 45 — kΩ
Chip reset release voltage (EN voltage is within
VIH_nRST 0.75 × VDD1 — VDD1+ 0.3 V
the specified range)
Cont’d on next page

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4 Electrical Characteristics

Table 10 – cont’d from previous page

Symbol Parameter Min Typ Max Unit
Chip reset voltage (EN voltage is within the
VIL_nRST –0.3 — 0.25 × VDD1 V
specified range)
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.

4.4 Current Consumption Characteristics

4.4.1 RF Current Consumption in Active Mode
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32-S3 Series Datasheet.

Table 11: Current Consumption Depending on RF Modes

Work mode Description Peak (mA)

802.11b, 1 Mbps, @20.5 dBm 355
802.11g, 54 Mbps, @18 dBm 297
TX
802.11n, HT20, MCS 7, @17.5 dBm 286
Active (RF working)
802.11n, HT40, MCS 7, @17 dBm 285
802.11b/g/n, HT20 95
RX
802.11n, HT40 97
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.

Note:
The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S3 Series Datasheet.

4.4.2 Current Consumption in Other Modes

Please note that if the chip embedded has in-package PSRAM, the current consumption of the module might be
higher compared to the measurements below.

Espressif Systems 18 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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4 Electrical Characteristics

Table 12: Current Consumption in Modem-sleep Mode

Frequency Typ1 Typ2

Work mode (MHz) Description (mA) (mA)
WAITI (Dual core in idle state) 13.2 18.8
Single core running 32-bit data access instructions, the
16.2 21.8
other core in idle state
40 Dual core running 32-bit data access instructions 18.7 24.4
Single core running 128-bit data access instructions, the
19.9 25.4
other core in idle state
Dual core running 128-bit data access instructions 23.0 28.8
WAITI 22.0 36.1
Single core running 32-bit data access instructions, the
28.4 42.6
other core in idle state
80 Dual core running 32-bit data access instructions 33.1 47.3
Single core running 128-bit data access instructions, the
35.1 49.6
other core in idle state
Dual core running 128-bit data access instructions 41.8 56.3
Modem-sleep3
WAITI 27.6 42.3
Single core running 32-bit data access instructions, the
39.9 54.6
other core in idle state
160 Dual core running 32-bit data access instructions 49.6 64.1
Single core running 128-bit data access instructions, the
54.4 69.2
other core in idle state
Dual core running 128-bit data access instructions 66.7 81.1
WAITI 32.9 47.6
Single core running 32-bit data access instructions, the
51.2 65.9
other core in idle state
240 Dual core running 32-bit data access instructions 66.2 81.3
Single core running 128-bit data access instructions, the
72.4 87.9
other core in idle state
Dual core running 128-bit data access instructions 91.7 107.9
1
Current consumption when all peripheral clocks are disabled.
2
Current consumption when all peripheral clocks are enabled. In practice, the current consumption might be
different depending on which peripherals are enabled.
3
In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing
flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA.

Table 13: Current Consumption in Low-Power Modes

Work mode Description Typ (µA)

VDD_SPI and Wi-Fi are powered down, and all GPIOs
Light-sleep1 240
are high-impedance.
RTC memory and RTC peripherals are powered up. 8
Deep-sleep
RTC memory is powered up. RTC peripherals are
7
powered down.

Espressif Systems 19 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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4 Electrical Characteristics

Power off CHIP_PU is set to low level. The chip is shut down. 1
1
In Light-sleep mode, all related SPI pins are pulled up. For chips embedded with
PSRAM, please add corresponding PSRAM consumption values, e.g., 140 µA
for 8 MB Octal PSRAM (3.3 V), 200 µA for 8 MB Octal PSRAM (1.8 V) and 40
µA for 2 MB Quad PSRAM (3.3 V).

4.5 Wi-Fi RF Characteristics

4.5.1 Wi-Fi RF Standards

Table 14: Wi-Fi RF Standards

Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna connector 2
1
Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
2
For the modules that use external antenna connectors, the output impedance is 50 Ω. For other modules
without external antenna connectors, the output impedance is irrelevant.

4.5.2 Wi-Fi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards.

Table 15: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS 0 — 19.0 —
802.11n, HT20, MCS 7 — 17.5 —
802.11n, HT40, MCS 0 — 18.5 —
802.11n, HT40, MCS 7 — 17.0 —

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4 Electrical Characteristics

Table 16: TX EVM Test

Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –24.5 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –29.5 –25
802.11n, HT20, MCS 0, @19 dBm — –24.0 –5
802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27
802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5
802.11n, HT40, MCS 7, @17 dBm — –30.0 –27
1
SL stands for standard limit value.

4.5.3 Wi-Fi RF Receiver (RX) Specifications

Table 17: RX Sensitivity

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.2 —
802.11b, 2 Mbps — –95.6 —
802.11b, 5.5 Mbps — –92.8 —
802.11b, 11 Mbps — –88.5 —
802.11g, 6 Mbps — –93.0 —
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.5 —
802.11g, 24 Mbps — –85.5 —
802.11g, 36 Mbps — –82.2 —
802.11g, 48 Mbps — –78.0 —
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS 0 — –93.0 —
802.11n, HT20, MCS 1 — –90.6 —
802.11n, HT20, MCS 2 — –88.4 —
802.11n, HT20, MCS 3 — –84.8 —
802.11n, HT20, MCS 4 — –81.6 —
802.11n, HT20, MCS 5 — –77.4 —
802.11n, HT20, MCS 6 — –75.6 —
802.11n, HT20, MCS 7 — –74.2 —
802.11n, HT40, MCS 0 — –90.0 —
802.11n, HT40, MCS 1 — –87.5 —
802.11n, HT40, MCS 2 — –85.0 —
802.11n, HT40, MCS 3 — –82.0 —
Cont’d on next page

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4 Electrical Characteristics

Table 17 – cont’d from previous page

Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11n, HT40, MCS 4 — –78.5 —
802.11n, HT40, MCS 5 — –74.4 —
802.11n, HT40, MCS 6 — –72.5 —
802.11n, HT40, MCS 7 — –71.2 —

Table 18: Maximum RX Level

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS 0 — 5 —
802.11n, HT20, MCS 7 — 0 —
802.11n, HT40, MCS 0 — 5 —
802.11n, HT40, MCS 7 — 0 —

Table 19: RX Adjacent Channel Rejection

Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS 0 — 31 —
802.11n, HT20, MCS 7 — 13 —
802.11n, HT40, MCS 0 — 19 —
802.11n, HT40, MCS 7 — 8 —

4.6 Bluetooth LE Radio

Table 20: Bluetooth LE Frequency

Min Typ Max

Parameter (MHz) (MHz) (MHz)
Center frequency of operating channel 2402 — 2480

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4 Electrical Characteristics

4.6.1 Bluetooth LE RF Transmitter (TX) Characteristics

Table 21: Transmitter Characteristics - Bluetooth LE 1 Mbps

Parameter Description Min Typ Max Unit

RF power control range –24.00 0 21.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.40 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 249.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 198.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.86 — —
±2 MHz offset — –37.00 — dBm
In-band spurious emissions ±3 MHz offset — –42.00 — dBm
>±3 MHz offset — –44.00 — dBm

Table 22: Transmitter Characteristics - Bluetooth LE 2 Mbps

Parameter Description Min Typ Max Unit

RF power control range –24.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.40 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 499.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 416.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.89 — —
±4 MHz offset — –42.00 — dBm
In-band spurious emissions ±5 MHz offset — –44.00 — dBm
>±5 MHz offset — –47.00 — dBm

Table 23: Transmitter Characteristics - Bluetooth LE 125 Kbps

Parameter Description Min Typ Max Unit

RF power control range –24.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
Carrier frequency offset and drift
|fn − fn−3 | — 0.30 — kHz
Cont’d on next page

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4 Electrical Characteristics

Table 23 – cont’d from previous page

Parameter Description Min Typ Max Unit
|f0 − f3 | — 1.00 — kHz
∆ f 1avg — 248.00 — kHz
Modulation characteristics Min ∆ f 1max (for at least
— 222.00 — kHz
99.9% of all∆ f 1max )
±2 MHz offset — –37.00 — dBm
In-band spurious emissions ±3 MHz offset — –42.00 — dBm
>±3 MHz offset — –44.00 — dBm

Table 24: Transmitter Characteristics - Bluetooth LE 500 Kbps

Parameter Description Min Typ Max Unit

RF power control range –24.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
Carrier frequency offset and drift
|fn − fn−3 | — 0.85 — kHz
|f0 − f3 | — 0.34 — kHz
∆ f 2avg — 213.00 — kHz
Modulation characteristics Min ∆ f 2max (for at least
— 196.00 — kHz
99.9% of all ∆ f 2max )
±2 MHz offset — –37.00 — dBm
In-band spurious emissions ±3 MHz offset — –42.00 — dBm
>±3 MHz offset — –44.00 — dBm

4.6.2 Bluetooth LE RF Receiver (RX) Characteristics

Table 25: Receiver Characteristics - Bluetooth LE 1 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –96.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel C/I F = F0 MHz — 8 — dB
F = F0 + 1 MHz — 4 — dB
F = F0 – 1 MHz — 4 — dB
F = F0 + 2 MHz — –23 — dB
F = F0 – 2 MHz — –23 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –34 — dB
F = F0 – 3 MHz — –34 — dB
F > F0 + 3 MHz — –36 — dB
F > F0 – 3 MHz — –37 — dB
Image frequency — — –36 — dB
Cont’d on next page

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4 Electrical Characteristics

Table 25 – cont’d from previous page

Parameter Description Min Typ Max Unit
F = Fimage + 1 MHz — –39 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –12 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –10 — dBm
Intermodulation — — –29 — dBm

Table 26: Receiver Characteristics - Bluetooth LE 2 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –92 — dBm
Maximum received signal @30.8% PER — — 3 — dBm
Co-channel C/I F = F0 MHz — 8 — dB
F = F0 + 2 MHz — 4 — dB
F = F0 – 2 MHz — 4 — dB
F = F0 + 4 MHz — –27 — dB
F = F0 – 4 MHz — –27 — dB
Adjacent channel selectivity C/I
F = F0 + 6 MHz — –38 — dB
F = F0 – 6 MHz — –38 — dB
F > F0 + 6 MHz — –41 — dB
F > F0 – 6 MHz — –41 — dB
Image frequency — — –27 — dB
F = Fimage + 2 MHz — –38 — dB
Adjacent channel to image frequency
F = Fimage – 2 MHz — 4 — dB
30 MHz ~ 2000 MHz — –15 — dBm
2003 MHz ~ 2399 MHz — –21 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –21 — dBm
3000 MHz ~ 12.75 GHz — –9 — dBm
Intermodulation — — –29 — dBm

Table 27: Receiver Characteristics - Bluetooth LE 125 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –103.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel C/I F = F0 MHz — 4 — dB
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –26 — dB
F = F0 – 2 MHz — –26 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –36 — dB
F = F0 – 3 MHz — –39 — dB
Cont’d on next page

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4 Electrical Characteristics

Table 27 – cont’d from previous page

Parameter Description Min Typ Max Unit
F > F0 + 3 MHz — –42 — dB
F > F0 – 3 MHz — –43 — dB
Image frequency — — –42 — dB
F = Fimage + 1 MHz — –43 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –36 — dB

Table 28: Receiver Characteristics - Bluetooth LE 500 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –100 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel C/I F = F0 MHz — 4 — dB
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 0 — dB
F = F0 + 2 MHz — –24 — dB
F = F0 – 2 MHz — –24 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –37 — dB
F = F0 – 3 MHz — –39 — dB
F > F0 + 3 MHz — –38 — dB
F > F0 – 3 MHz — –42 — dB
Image frequency — — –38 — dB
F = Fimage + 1 MHz — –42 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –37 — dB

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 Espressif Systems

5 Module Schematics
5 Module Schematics
This is the reference design of the module.
5 4 3 2 1

GND

GND GND

3
Y1

GND

GND XOUT
The values of C1 and C4 vary with C1 C4

D
the selection of the crystal. TBD TBD VDD33 D

XIN
The value of R4 varies with the

2
actual PCB board. R4 could be a
resistor or inductor, the initial R1
value is suggested to be 24 nH. GND 10K(NC)
VDD33 40MHz(±10ppm)
GPIO46
GPIO45 GND
U0RXD
C3 C2 R3 499 U0TXD
GPIO42
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1uF 10nF GPIO41

0
GPIO40

61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
VDD33 GPIO39
GND GND GND GPIO38

EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
L1 2.0nH(0.1nH) 62 65

R4
GND GND
C6 C7 C8 C9 C10 VDD33 1 45 CHIP_PU
C VDD33 2 GND EN 44 GPIO46 C

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
10uF 1uF 0.1uF 0.1uF 0.1uF 3 GND IO46 43
GPIO0 4 3V3 GND 42
IO0 GND

VDDA
VDDA
GND

U0RXD
U0TXD
MTMS

MTDO
MTCK
XTAL_P
XTAL_N
GPIO46
GPIO45

MTDI
VDD3P3_CPU

GPIO38
GPIO1 5 41 GPIO45
27

GND GND GND GND GND GPIO2 6 IO1 IO45 40 U0RXD

GPIO3 7 IO2 RXD0 39 U0TXD
ANT1 50 ohm Impedance Control GPIO4 8 IO3 TXD0 38 GPIO42
RF_ANT LNA_IN IO4 ESP32-S3-MINI-1 IO42
1 L2 TBD 1 42 GPIO37 GPIO5 9 37 GPIO41
2 2 LNA_IN GPIO37 41 GPIO36 GPIO6 10 IO5 IO41 36 GPIO40
3 VDD3P3 GPIO36 40 GPIO35 GPIO7 11 IO6 IO40 35 GPIO39
L3 C11 C12 VDD3P3 GPIO35 IO7 IO39
PCB_ANT CHIP_PU 4 39 GPIO34 GPIO8 12 34 GPIO38
TBD TBD TBD GPIO0 5 CHIP_PU GPIO34 38 GPIO33 GPIO9 13 IO8 IO38 33 GPIO37
GPIO1 6 GPIO0 GPIO33 37 GPIO47 GPIO10 14 IO9 IO37 32 GPIO36
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 GPIO11 15 IO10 IO36 31 GPIO35
GND C5 GND GND GPIO3 8 GPIO2 SPICLK_N 35 IO11 IO35
GPIO4 9 GPIO3 SPID 34 VDD33 63 64
GPIO4 SPIQ GND GND

IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
TBD GPIO5 10 33
GPIO6 11 GPIO5 SPICLK 32
GPIO7 12 GPIO6 SPICS0 31 VDD_SPI U2 GND
GPIO7 SPIWP

16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND GPIO8 13 30 D1
GPIO9 14 GPIO8 SPIHD 29
B
GPIO9 VDD_SPI ESD B
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

VDD3P3_RTC

The values of L3, C5, C11, L2 and C12

XTAL_32K_N
XTAL_32K_P

GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
vary with the actual PCB board. C13 C14
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
0.1uF 1uF GND
NC: No component.
ESP32-S3-MINI-1(pin-out)
U1 ESP32-S3FN8 GND GND
VDD33
15
16
17
18
19
20
21
22
23
24
25
26
27
28

C15

0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26

GND

A A

Figure 5: ESP32-S3-MINI-1 Schematics

Title
<ESP32-S3-MINI-1>

Size Page Name Rev

A4 <02_ESP32-S3-MINI-1> 1.1 Confidential and Proprietary
Date: Wednesday, November 22, 2023 Sheet 2 of 2
5 4 3 2 1
 5 4 3 2 1
Espressif Systems

5 Module Schematics
GND

GND GND

3
Y1

GND

GND XOUT
The values of C1 and C4 vary with C1 C4
D D
the selection of the crystal. TBD TBD VDD33

XIN
The value of R4 varies with the

2
actual PCB board. R4 could be a
resistor or inductor, the initial R1
value is suggested to be 24 nH. GND 10K(NC)
VDD33 40MHz(±10ppm)
GPIO46
GPIO45 GND
U0RXD
C3 C2 R3 499 U0TXD
GPIO42
1uF 10nF GPIO41

0
GPIO40

61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
VDD33 GPIO39
GND GND GND GPIO38

EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
L1 2.0nH(0.1nH) 62 65

R4
GND GND
C C6 C7 C8 C9 C10 VDD33 1 45 CHIP_PU C
VDD33 2 GND EN 44 GPIO46

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
10uF 1uF 0.1uF 0.1uF 0.1uF 3 GND IO46 43
GPIO0 4 3V3 GND 42
IO0 GND

VDDA
VDDA
GND

U0RXD
U0TXD
MTMS

MTDO
MTCK
XTAL_P
XTAL_N
GPIO46
GPIO45

MTDI
VDD3P3_CPU

GPIO38
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GPIO1 5 41 GPIO45
GND GND GND GND GND GPIO2 6 IO1 IO45 40 U0RXD
GPIO3 7 IO2 RXD0 39 U0TXD
50 ohm Impedance Control GPIO4 8 IO3 TXD0 38 GPIO42
RF_ANT LNA_IN IO4 ESP32-S3-MINI-1U IO42
1 L2 TBD 1 42 GPIO37 GPIO5 9 37 GPIO41
2 LNA_IN GPIO37 41 GPIO36 GPIO6 10 IO5 IO41 36 GPIO40
3 VDD3P3 GPIO36 40 GPIO35 GPIO7 11 IO6 IO40 35 GPIO39
ANT1 C11 C12 VDD3P3 GPIO35 IO7 IO39
4
3
2

CHIP_PU 4 39 GPIO34 GPIO8 12 34 GPIO38

CONN TBD TBD GPIO0 5 CHIP_PU GPIO34 38 GPIO33 GPIO9 13 IO8 IO38 33 GPIO37
GPIO1 6 GPIO0 GPIO33 37 GPIO47 GPIO10 14 IO9 IO37 32 GPIO36
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 GPIO11 15 IO10 IO36 31 GPIO35
28

GND GND GND GPIO3 8 GPIO2 SPICLK_N 35 IO11 IO35

GPIO4 9 GPIO3 SPID 34 VDD33 63 64
GPIO4 SPIQ GND GND

IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
The values of C11, L2 and C12 GPIO5 10
GPIO5 SPICLK
33
GPIO6 11 32
vary with the actual PCB board. GPIO7 12 GPIO6 SPICS0 31 VDD_SPI U2 GND
GPIO7 SPIWP

16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
B GPIO8 13 30 D1 B
GPIO8 SPIHD
NC: No component. GPIO9 14
GPIO9 VDD_SPI
29 ESD

VDD3P3_RTC

XTAL_32K_N
XTAL_32K_P

GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
C13 C14
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
0.1uF 1uF GND

ESP32-S3-MINI-1U(pin-out)
U1 ESP32-S3FN8 GND GND
VDD33
15
16
17
18
19
20
21
22
23
24
25
26
27
28
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

C15

0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26

GND

A A

Figure 6: ESP32-S3-MINI-1U Schematics Title

<ESP32-S3-MINI-1U>

Size Page Name Rev

A4 <02_ESP32-S3-MINI-1U> 1.1 Confidential and Proprietary
Date: Wednesday, November 22, 2023 Sheet 2 of 2
5 4 3 2 1
6 Peripheral Schematics
4 3 2

6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).

GND

GND

61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
62 65
GND GND
VDD33 1 45 EN C2 TBD
GND EN GND
2 44 IO46
3 GND IO46 43 VDD33
IO0 4 3V3 GND 42 JP1
C1 C3 IO1 5 IO0 GND 41 IO45 R1 TBD 1
IO2 6 IO1 IO45 40 RXD0 2 1
22uF 0.1uF IO3 7 IO2 RXD0 39 TXD0 3 2
IO4 8 IO3 TXD0 38 IO42 4 3
IO5 9 IO4 ESP32-S3-MINI-1/ESP32-S3-MINI-1U IO42 37 IO41 4
GND GND IO6 10 IO5 IO41 36 IO40 UART
JP4 IO7 11 IO6 IO40 35 IO39 GND JP2
1 IO8 12 IO7 IO39 34 IO38 TMS 1
1 2 IO9 13 IO8 IO38 33 IO37 TDI 2 1
2 IO10 14 IO9 IO37 32 IO36 TDO 3 2
Boot Option IO11 15 IO10 IO36 31 IO35 TCK 4 3
IO11 IO35 4
GND 63 64 JTAG
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
GND GND SW1
R7 0 EN
U1
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

C8 0.1uF
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48

GND
C4 12pF(NC)
GND
NC

JP3
1

R3 0(NC) R4 0 USB_D+ 1
X1 USB_D- 1
R5 0(NC) R6 0 2
32.768KHz(NC) 2
2

R2

X1: ESR = Max. 70 KΩ C5 C6 USB OTG

GND TBD TBD
C7 12pF(NC)

NC: No component. GND GND

Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much
soldering paste may increase the gap between the module and the baseboard. As result, the adhesion
between other pins and the baseboard may be poor.

• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
4
timing diagram, please refer to ESP32-S3 Series Datasheet 3> Section Power Supply. 2

Espressif Systems 29 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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7 Physical Dimensions and PCB Land Pattern

7 Physical Dimensions and PCB Land Pattern

7.1 Physical Dimensions

Unit: mm
Unit: mm

15.4±0.2 0.8
15.4±0.2 0.8
5.05
5.05

60 x 0.4 x 0.8 4 x 0.8 x 0.8

60 x 0.4 x 0.8 4 x 0.8 x 0.8
0.6
1.2 0.6
20.5±0.2

14
1.2
20.5±0.2

14

11.9
13.55

1.71.7
1414
11.9
13.55

0.60.6
5
0.
0.50.5

Ø .5 4.5

0.85
0

4.54.5

7.77.7
1.21.2
Ø 4.5

0.85
0.7 2.4±0.15 1.7
0.7 2.4±0.15 1.7
11.9
11.9
14
14
Top view Side view Bottom view
Top view Side view Bottom view

Figure 8: ESP32-S3-MINI-1 Physical Dimensions

ESP32-S3-MINI-1U Dimensions
ESP32-S3-MINI-1U Dimensions
Unit: mm
Unit: mm

15.4±0.2 0.8
15.4±0.2 0.8
0.85 60 x 0.4 x 0.8 4 x 0.8 x 0.8
0.85 60 x 0.4 x 0.8 4 x 0.8 x 0.8
0.6
1.2 0.6
3.2
15.4±0.2

1.2
1.61.6

3.2
15.4±0.2

13.55

11.9
13.55

1.71.7
1414
11.9

0.60.6

14 4.5
0.85
0.50.5

4.54.5

7.77.7
1.21.2

14 4.5
0.85

0.7 2.4±0.15 1.7

0.7 2.4±0.15 1.7
11.9
11.9
14
14
Top view Side view Bottom view
Top view Side view Bottom view

Figure 9: ESP32-S3-MINI-1U Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.

Espressif Systems 30 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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7 Physical Dimensions and PCB Land Pattern

7.2 Recommended PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
10 ESP32-S3-MINI-1 Recommended PCB Land Pattern and Figure 11 ESP32-S3-MINI-1U Recommended
PCB Land Pattern.

• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10 and
Figure 11. You can view the source files for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U with Autodesk
Viewer.

• 3D models of ESP32-S3-MINI-1. Please make sure that you download the 3D model file in .STEP format
(beware that some browsers might add .txt).

Unit: mm
Via for thermal pad
Pad
15.4

Pin 1
Antenna Area
60 x 0.4 x 0.8 5.05 4 x 0.8 x 0.8

1.2
0.6
20.5
11.9
1.7
14

1.2

4.5
0.85
4.5

7.7
0.6

1.7
11.9
14

Figure 10: ESP32-S3-MINI-1 Recommended PCB Land Pattern

ESP32-S3-MINI-1U Land Pattern

Unit: mm
Via for thermal pad
Pad

Pin 1 15.4
60 x 0.4 x 0.8 4 x 0.8 x 0.8

1.2
0.6
11.9

15.4
1.7
14

1.2

Espressif Systems 31 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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4.5 Feedback
0.85
4.5
0.6

7.7
7 Physical Dimensions and PCB Land Pattern
ESP32-S3-MINI-1U Land Pattern
Unit: mm
Via for thermal pad
Pad

Pin 1 15.4
60 x 0.4 x 0.8 4 x 0.8 x 0.8

1.2
0.6
11.9

15.4
1.7
14

1.2
4.5

0.85
4.5
0.6

7.7
1.7
11.9
14

Figure 11: ESP32-S3-MINI-1U Recommended PCB Land Pattern

Espressif Systems 32 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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7 Physical Dimensions and PCB Land Pattern

7.3 Dimensions of External Antenna Connector

ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure 12 Dimensions of
External Antenna Connector. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose

• MHF III connector from I-PEX

• AMMC connector from Amphenol

Unit: mm
Tolerance: +/-0.1 mm

CONTACT
A

2.00±0.10
1.7

A
GROUND CONTACT
2.05±0.10
1.7
0.57

0.85

CONTACT
1.40

0.10

HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL

CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

PERFORMANCE:

CONTACT RESISTANCE: 20mOHM Max.

DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;

INSULATION RESISTANCE: 500MOHM Min.

Figure 12: Dimensions of External Antenna Connector

Espressif Systems 33 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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8 Product Handling

8 Product Handling

8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.

8.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

8.3 Soldering Profile

8.3.1 Reflow Profile
Solder the module in a single reflow.
Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 13: Reflow Profile

Espressif Systems 34 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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8 Product Handling

8.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

Espressif Systems 35 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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9 Related Documentation and Resources

9 Related Documentation and Resources

Related Documentation
• ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware.
• ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals.
• ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product.
• ESP32-S3 Series SoC Errata – Descriptions of known errors in ESP32-S3 series of SoCs.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32-S3 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns?keys=ESP32-S3
• ESP32-S3 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories?keys=ESP32-S3
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos

Products
• ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules.
https://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Espressif Systems 36 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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Revision History

Revision History

Date Version Release notes

• Removed the table note about ESP32-S3FH4R2 sample status from Table
1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison and added
the second table note
• Updated Section 3.3.1 Chip Boot Mode Control
2023-11-24 v1.2 • Updated the module schematics in Section 5 Module Schematics
• Updated the physical dimensions figure in Section 7.1 Physical Dimensions
• Updated the recommended PCB land pattern figure in Section 7.2 Recom-
mended PCB Land Pattern
• Other minor updates

• Remove module variants ESP32-S3-MINI-1-H4R2 and ESP32-S3-MINI-

1U-H4R2
• Update the descriptions and Table 1 ESP32-S3-MINI-1 and ESP32-S3-
MINI-1U Series Comparison in Section 1.2 Description
• Update Section 3.3 Strapping Pins
• Update Section 4.4 Current Consumption Characteristics
2023-03-07 v1.1
• Update the minimum value of RF transmit power in Section 4.6.1 Bluetooth
LE RF Transmitter (TX) Characteristics
• Update descriptions in Section 6 Peripheral Schematics
• Add descriptions in Section 7.2 Recommended PCB Land Pattern
• Update Section 9 Related Documentation and Resources
• Other minor updates

• Update information about flash and PSRAM on the title page and in Section
1.1
• Add certification and test information
• Add information of new module variants and their ambient operating tem-
perature versions in Table 1
2022-05-24 v1.0 • Add the second note in Table 2
• Update Section 3.3
• Add notes in Table 13
• Update Bluetooth LE RF data
• Update module schematics in Section 5
• Other minor updates

2021-11-16 v0.6 Overall update for chip revision 1

2021-03-30 v0.1 Preliminary release, for chip revision 0

Espressif Systems 37 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.2

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 Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
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Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.