Possible Questions:

1. What is a Printed Circuit Board (PCB)?

o A) A device for generating electricity
o B) A mechanical and electronic support system using conductive tracks
o C) A component for wireless communication
o D) A software for designing circuits
(Answer: B)
2. What is the most common material used for PCB substrate?
o A) Aluminum
o B) Fiberglass-reinforced epoxy resin (FR4)
o C) Copper foil
o D) Ceramic
(Answer: B)
3. Which of the following is a key advantage of PCBs?
o A) Reduced signal transmission speed
o B) Larger size and weight
o C) Cost-effective and compact design
o D) Increased complexity
(Answer: C)
4. Who is credited with creating the first operational PCBs?
o A) Charles Ducas
o B) Dr. Paul Eisler
o C) Thomas Edison
o D) Nikola Tesla
(Answer: B)
5. What is the purpose of a solder mask on a PCB?
o A) To insulate the substrate
o B) To provide mechanical support
o C) To prevent oxidation and short circuits
o D) To connect conductive layers
(Answer: C)
6. Which type of PCB is most commonly used in consumer electronics like cameras
and radios?
o A) Single-layer PCB
o B) Double-layer PCB
o C) Multi-layer PCB
o D) Rigid-Flex PCB
(Answer: A)
7. What is the minimum spacing recommended between adjacent traces on a PCB?
o A) 0.001 inches
o B) 0.01 inches
o C) 0.007 inches
o D) 0.1 inches
(Answer: C)
8. What is the main difference between through-hole mounting and surface-mount
technology?
o A) Through-hole mounting uses no soldering.
o B) Surface-mount technology requires components to pass through the board.
o C) Through-hole mounting involves leads inserted through holes.
o D) Surface-mount technology is only used for flexible PCBs.
(Answer: C)
9. Which software is NOT mentioned for PCB design in the document?
o A) KiCAD
o B) Eagle
o C) Altium
o D) SolidWorks
(Answer: D)
10. What is a "via" in PCB design?
o A) A trace connecting components
o B) A type of solder mask
o C) A hole that electrically connects different layers
o D) An insulating layer
(Answer: C)
11. What is the main purpose of etching in PCB manufacturing?
o A) To clean the copper surface
o B) To remove unnecessary copper and leave the desired circuit traces
o C) To drill holes for components
o D) To apply a protective coating
(Answer: B)
12. What is a characteristic of multi-layer PCBs compared to single-layer PCBs?
o A) Easier to repair
o B) Reduced design time
o C) Higher durability and complexity
o D) Less efficient power distribution
(Answer: C)
13. What is a "blind via"?
o A) A hole that connects all layers of the PCB
o B) A via connecting only inner layers
o C) A via connecting an outer layer to an inner layer
o D) A defect in the PCB design
(Answer: C)
14. What process is used to ensure the solder mask only covers specific areas of the
PCB?
o A) Mechanical etching
o B) UV light exposure
o C) Laser drilling
o D) Thermal lamination
(Answer: B)
15. What is the function of prepreg in a multi-layer PCB?
o A) To serve as a conductive layer
o B) To insulate and bond adjacent layers
 o C) To drill holes for vias
o D) To create power and ground planes
(Answer: B)
16. Which factor does NOT influence trace width in PCB design?
o A) Signal type
o B) Current carried
o C) Manufacturing limitations
o D) Surface finish type
(Answer: D)
17. What is the purpose of the silk-screen layer on a PCB?
o A) To provide a protective coating
o B) To offer labeling and component identification
o C) To insulate the PCB
o D) To prevent solder bridges
(Answer: B)
18. Which of the following is NOT an advantage of using PCBs over breadboards?
o A) Better grounding
o B) Easier debugging
o C) Stability and reliability
o D) Compact design
(Answer: B)
19. What is the minimum recommended clearance between components on a PCB?
o A) 10 mil
o B) 20 mil
o C) 40 mil
o D) 100 mil
(Answer: C)
20. What is the purpose of the solder paste in PCB assembly?
o A) To protect the PCB from corrosion
o B) To clean the board before soldering
o C) To bond components to the PCB during reflow soldering
 o D) To insulate the PCB traces
(Answer: C)
21. What is the first step in PCB design?
o A) Adding drill holes
o B) Creating the schematic
o C) Generating layout files
o D) Assembling components
(Answer: B)
22. Which layer in a PCB stack-up serves as a reference for reducing electromagnetic
interference (EMI)?
o A) Signal layer
o B) Ground plane
o C) Power plane
o D) Insulation layer
(Answer: B)
23. What type of assembly is suitable for automated placement of components?
o A) Through-hole assembly
o B) Hand soldering
o C) Surface-mount assembly
o D) Wave soldering
(Answer: C)
24. What is the most common color for a solder mask?
o A) Red
o B) Black
o C) Green
o D) Blue
(Answer: C)
25. What is the final step in PCB fabrication?
o A) Cutting individual PCBs
o B) Applying a solder mask
o C) Final inspection and packaging
o D) Electrical testing
(Answer: C)