CB2S Module Datasheet

Version: 20240902

Online Version
 Contents

Contents

1. Product overview ................................................................ 2

1.1. Features ......................................................................................... 2
1.2. Applications ................................................................................... 2
2. Module interfaces ............................................................... 4
2.1. Dimensions and package ............................................................... 4
2.2. Pin definition .................................................................................. 5
3. Electrical parameters .......................................................... 9
3.1. Absolute electrical parameters ...................................................... 9
3.2. Normal working conditions ............................................................ 9
3.3. RF power consumption ................................................................ 10
3.4. Working current ........................................................................... 10
4. RF parameters .................................................................. 13
4.1. Basic RF features ......................................................................... 13
4.2. Wi-Fi transmission performance ................................................... 13
4.3. Wi-Fi receiving performance ........................................................ 13
4.4. Bluetooth transmission performance ........................................... 14
4.5. Bluetooth receiving performance ................................................. 14
5. Antenna information ......................................................... 16
5.1. Antenna type ............................................................................... 16
5.2. Antenna interference reduction ................................................... 16
6. Packaging information and production instructions ............. 17
6.1. Mechanical dimensions ................................................................ 17
6.2. Production instructions ................................................................ 19
6.3. Recommended oven temperature curve and temperature .......... 21
6.4. Storage conditions ....................................................................... 22
7. MOQ and packaging information ........................................ 24
8. Appendix-Statement .......................................................... 25

I
 1Product overview

CB2S is an embedded low-power Wi-Fi module that Tuya has developed. It

consists of a highly integrated RF chip BK7231N and a few peripherals. CB2S not
only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.

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 1Product overview

1. Product overview

CB2S is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a
2-MB flash memory, and a 256-KB RAM, so as to support the Tuya IoT cloud
connection. The MCU instructions specially extended for signal processing can
effectively implement audio encoding and decoding.
Besides, it has rich peripherals, such as PWM and UART. There are 5 channels of
32-bit PWM output, making the chip very suitable for high-quality LED control.

1.1. Features

• Built in with the low-power 32-bit CPU, which can also function as an
application processor
• The clock rate: 120 MHz
• Working voltage: 3.0 to 3.6V
• Peripherals: 5 PWMs and 1 UART
• Wi-Fi connectivity
• 802.11 b/g/n
• Channels 1 to [email protected] GHz
• Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes
• Up to +16 dBm output power in 802.11b mode
• Support STA/AP/STA+AP working mode
• Support SmartConfig and AP network configuration manners for Android and
iOS devices
• Onboard PCB antenna with a gain of 0 dBi
• Working temperature: −40°C to 85°C
• Bluetooth connectivity
• Support the Bluetooth LE V5.2
• Support the transmit power of 6 dBm in the Bluetooth mode
• Complete Bluetooth coexistence interface
• Onboard PCB antenna with a gain of 0 dBi

1.2. Applications

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 2.3Module interfaces

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

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 2.3Module interfaces

2. Module interfaces

2.1. Dimensions and package

The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×2.8±0.15

mm (H). The dimensions of CB2S are as follows:

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 3.2Electrical parameters

2.2. Pin definition

Pin number Symbol I/O type Function

1 3V3 P Power supply 3V3
Support hardware
PWM and
2 P6 I/O
correspond to P6
of the IC
Power supply
3 GND P
reference ground
Support hardware
PWM and
4 P7 I/O
correspond to P7
of the IC

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 3.3Electrical parameters

Pin number Symbol I/O type Function

UART_RX1 , which
is used for
receiving user
data and
corresponds to
P10 of the IC. Do
5 RX1 I/O
not pull it up. By
default, the MCU
serial port should
be in low-level or
high-impedance
state.
Support hardware
PWM and
6 P8 I/O
correspond to P8
of the IC
UART_TX1 , which
is used for
transmitting user
data and
corresponds to
P11 of the IC. Do
7 TX1 I/O
not pull it up. By
default, the MCU
serial port should
be in low-level or
high-impedance
state.
ADC, which
8 ADC I/O corresponds to
P23 of the IC

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 3.3Electrical parameters

Pin number Symbol I/O type Function

Support hardware
PWM and
9 P24 I/O
correspond to P24
of the IC
10 CEN I/O Reset pin
Support hardware
PWM and
11 P26 I/O
correspond to P26
of the IC
UART_RX2 , which
corresponds to P1
Test point RX2 I/O of the IC. This pin
is not allowed to
use.
UART_TX2 , which
is used for
Test point TX2 I/O outputting logs
and corresponds
to P0 of the IC

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 3.3Electrical parameters

Pin number Symbol I/O type Function

Mode selection
pin. If it is
connected to the
ground before
being powered on,
enter the firmware
test mode. If it is
Test point CSN I/O not connected or
connected to VCC
before being
powered on, enter
the firmware
application mode.
It corresponds to
P21 of the IC.

Note:

• P indicates a power supply pin and I/O indicates an input/output pin.

• For the MCU solution, see CBx Module .

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 3.3Electrical parameters

3. Electrical parameters

3.1. Absolute electrical parameters

Minimum Maximum
Parameter Description Unit
value value
Storage
Ts −55 125 °C
temperature
Power supply
VBAT −0.3 3.9 V
voltage
Static
electricity
discharge
TAMB-25°C −4 4 KV
voltage
(human body
model)
Static
electricity
discharge
TAMB-25°C −200 200 V
voltage
(machine
model)

3.2. Normal working conditions

Minimum Typical Maximum

Parameter Description Unit
value value value
Working
Ta −40 - 85 °C
temperature
Power
VBAT supply 3 3.3 3.6 V
voltage

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 4.3RF parameters

Minimum Typical Maximum

Parameter Description Unit
value value value
I/O low
VOL level VSS - VSS+0.3 V
output
I/O high
VOH level VBAT-0. 3 - VBAT V
output
I/O drive
Imax - 6 20 mA
current
Power
θ supply 100 - - mV/ms
slope

3.3. RF power consumption

Peak
Transmit
Working Average value
Mode Rate power/ Unit
status value (Typical
receive
value))
Transmit 11b 11Mbps +16dBm 81 240 mA
Transmit 11g 54Mbps +15dBm 82 238 mA
Transmit 11n MCS7 +14dBm 85 234 mA
Constantly
Receive 11b 11Mbps 73 82 mA
receive
Constantly
Receive 11g 54Mbps 75 82 mA
receive
Constantly
Receive 11n MCS7 75 82 mA
receive

3.4. Working current

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 4.5RF parameters

Maximum
Working
Working Average value
status, Ta = Unit
mode value (Typical
25°C
value)
The module is
in the fast
Quick network
network
connection
connection 63 245 mA
state
state and the
(Bluetooth)
Wi-Fi indicator
flashes fast
The module is
in the hotspot
Quick network network
connection connection 80 270 mA
state (AP) state and the
Wi-Fi indicator
flashes slowly
The module is
in the fast
Quick network network
connection connection 78 246 mA
state (EZ) state and the
Wi-Fi indicator
flashes fast
The module is
connected to
Network
the network
connected 25 342 mA
and the Wi-Fi
state
indicator is
always on

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 4.5RF parameters

The module is
Network disconnected
disconnected and the Wi-Fi 63 242 mA
state indicator is
always off
The CEN pin
Module of the module
330 - μA
disabled is connected
to the ground.

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 4.5RF parameters

4. RF parameters

4.1. Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12,
Data transmission rate 18, 24, 36, 48, 54 (Mbps) 11n: HT20
MCS 0 to 7 11n: HT40 MCS 0 to 7
Antenna type PCB antenna

4.2. Wi-Fi transmission performance

Minimum Maximum
Parameter Typical value Unit
value value
Average RF
output power,
- 16 - dBm
802.11b CCK
Mode 11M
Average RF
output power,
802.11g - 15 - dBm
OFDM Mode
54M
Average RF
output power,
802.11n - 14 - dBm
OFDM Mode
MCS7
Frequency
−20 - 20 ppm
error

4.3. Wi-Fi receiving performance

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 5.4Antenna information

Minimum Maximum
Parameter Typical value Unit
value value
PER<8%, RX
sensitivity,
- −88 - dBm
802.11b DSSS
Mode 11M
PER<10%, RX
sensitivity,
802.11g - −74 - dBm
OFDM Mode
54M
PER<10%, RX
sensitivity,
802.11n - −73 - dBm
OFDM Mode
MCS7
PER<10%, RX
sensitivity,
- −96 - dBm
Bluetooth LE
1M

4.4. Bluetooth transmission performance

Minimum Maximum
Parameter Typical value Unit
value value
Working
2402 - 2480 MHz
frequency
Air rate - 1 - Mbps
Transmit
−20 6 20 dBm
power
Frequency
−150 - 150 KHz
error

4.5. Bluetooth receiving performance

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 5.6Antenna information

Minimum Maximum
Parameter Typical value Unit
value value
RX sensitivity - −96 - dBm
Maximum RF
−10 - - dBm
signal input
Inter-
- - −23 dBm
modulation
Co-channel
suppression - 10 - dB
ratio

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 5.6Antenna information

5. Antenna information

5.1. Antenna type

CB2S uses the PCB antenna.

5.2. Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15 mm away from other
metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper
or traces within the antenna area on the PCB.

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 6.3Packaging information and
production instructions

6. Packaging information and production

instructions

6.1. Mechanical dimensions

The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×0.8±0.1

mm (H)

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 7.2MOQ and packaging information

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 7.2MOQ and packaging information

6.2. Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual
soldering is less preferred. After being unpacked, the module must be soldered
within 24 hours. Otherwise, it must be put into the drying cupboard where the
RH is not greater than 10%; or it needs to be packaged under vacuum again
and record the exposure time (the total exposure time cannot exceed 168
hours).
2. Wave soldering devices and materials:
• Wave soldering equipment
• Wave soldering fixture
• Constant-temperature soldering iron
• Tin bar, tin wire, and flux
• Thermal profiler
3. Baking devices:

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 7.3MOQ and packaging information

• Cabinet oven
• Anti-electrostatic and heat-resistant trays
• Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.
5. Baking settings:
• Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for
tray package (please use the heat-resistant tray rather than a plastic
container).
• Time: 168 hours for reel package and 12 hours for tray package.
• Alarm temperature: 50°C for reel package and 135°C for tray package.
• Production-ready temperature after natural cooling: < 36°C.
• Re-baking situation: If a module remains unused for over 168 hours after being
baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond the
allowable time. In this case, if they are soldered at high temperatures, it may
result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective
measures.
7. To guarantee the quality of products, you must pay attention to the following
items: The amount of soldering flux, the height of the wave peak, whether the
tin slag and copper content in the wave soldering tank exceed standards,
whether the window and thickness of the wave soldering fixture are
appropriate, and whether the wave soldering oven temperature curve is
appropriate.

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 7.3MOQ and packaging information

6.3. Recommended oven temperature curve and

temperature

Set oven temperatures according to the following temperature curve of wave

soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on
Suggestions on
oven
manual
temperature
soldering
curve of wave
temperature
soldering
Preheat Soldering
80 to 130°C 360±20°C
temperature temperature
Preheat time 75 to 100s Soldering time ＜3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin
260±5°C NA NA
cylinder
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

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 7.4MOQ and packaging information

6.4. Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is
below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.

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 7.5MOQ and packaging information

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 7.5MOQ and packaging information

7. MOQ and packaging information

Shipping The number The number

Product
MOQ (pcs) packaging of modules of reels per
number
method per reel carton
CB2S 4400 Tape reel 1100 4

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 8Appendix-Statement

8. Appendix-Statement

FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential
installation. This device generates, uses, and can radiate radio frequency energy
and, if not installed and used following the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception,
which can be determined by turning the device off and on, the user is
encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an
uncontrolled rolled environment. This device should be installed and operated
with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously
with other radios in the host system except following FCC multi-transmitter
product procedures. Additional testing and device authorization may be required
to operate simultaneously with other radios.
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The availability of some specific channels and/or operational frequency bands are
country-dependent and are firmware programmed at the factory to match the
intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of
certification. The final host product still requires Part 15 Subpart B compliance
testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as
shown in this manual, including “This product must be installed and operated
with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-CB2S. The end product must be labeled in
a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-
CB2S”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the
antenna and users, and the transmitter module may not be co-located with any
other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be
required. However, the OEM integrator is still responsible for testing their end-
product for any additional compliance requirements required with this module
installed.
Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant
provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of
conformity can be found at https://www.tuya.com.

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This product must not be disposed of as normal household waste, in accordance
with the EU directive for waste electrical and electronic equipment
(WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point
of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm from the
human body.

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