Tuesday, 6 May 2025 / Oral Presentation

Conference Program PCIM 2025

Tuesday,6 May 2025

08:15 Community Coffee

Stage: Brüssel 1
09:00 Opening / Award Ceremony

Stage: Brüssel 1
09:45 Keynote
Medium Voltage Power Electronics Building Blocks for Future Electronic
Energy Networks
Dushan Boroyevich, Virginia Tech, USA
Chairperson: Drazen Dujic, Power Electronics Laboratory, EPFL, CH

10:30 Coffee break

Stage: Brüssel 1
SiC MOSFET
Chairperson: Thomas Basler, Chemnitz University of Technology, DE

11:00 SiC MOSFET Module Using Body Diode with High Reliability for Industrial
Applications
Hidetaka Matsuo, Mitusbishi Electric, JP

11:20 Impact of SBD Embedding into SiC MOSFETs on the Dynamic Behavior at
High Temperature
Shunsuke Asaba, Toshiba Electronic Devices & Storage, JP

11:40 The 1200V CoolSiC M2 Easy C and, XT Interconnection Technology:

Redefining Efficiency and Lifetime
Ainhoa Puyadena, Infineon Technologies, DE
 Tuesday, 6 May 2025 / Oral Presentation

Stage: Brüssel 2
Packaging Concepts
Chairperson: Katsuaki Saito, Nexperia, JP

11:00 The Novel High Reliability Materials for Power Module

Yuta Ikari, Sumitomo Bakelite, SG

11:20 High Reliability Al Bonding Wire for Power Devices

Tomohiro Uno, Nippon Steel, JP

11:40 Comparison Between a Single-Side Cooled and Two Double-Side Cooled

Power Module Layouts
Konstantin Kostov, Rise Research Institutes, SE

Stage: München 1
Converter Design Optimisation
Chairperson: Thomas Brückner, University of the Federal Armed Forces Munich, DE

11:00 22kW High-Power-Density Bidirectional DC-DC Converter with Top-Side-

Cooled SiC MOSFETs for OBCs
Yuequan Hu, Wolfspeed, US

11:20 Innovative 12 kW Three-level Power Supply for AI Servers Empowered by

400 V SiC MOSFET Technology
Martin Wattenberg, Infineon Technologies, AT

11:40 A Quasi 2-Level Modulation Technique to Increase Efficiency and Reduce

Motor Overvoltage
Sebastian Gick, University of Bayreuth, DE

Stage: München 2
Modeling and Simulations I
Chairperson: Jacques Laeuffer, Dtalents, FR

11:00 Double-Injection Based Plasma SPICE Modeling in IGBTs with High Carrier
Confinement
Arnab Biswas, Infineon Technologies, DE

11:20 Evidence of Frequency-dependent SiC Power MOSFET Capacitances in

Switching Transients
Michel Nagel, ETH Zurich, CH

11:40 Digital Design for High-Performance IGBT Devices Using Machine Learning
and Multi-Physics Simulation
Nayeon Choi, Dong-Eui University, KR
 Tuesday, 6 May 2025 / Oral Presentation

Stage: Mailand
Monitoring and Testing
Chairperson: Thomas Ebel, University of Southern Denmark, DK

11:00 Precision Junction Temperature Monitoring with Integrated Sensor: and

Comparison with In-situ Methods
Ismail Recepi, Silicon Austria Labs, AT

11:20 On the Importance of Appropriate Current Probes for Double Pulse Tests
and How to Select them
Sebastian Sprunck, Fraunhofer IEE, DE

11:40 AI Techniques for Continuous Monitoring of Winding Insulation Health of

Transformers
Gayan Wickramasinghe, University of Central Lancashire, UK

Stage: Athen
Virtual Prototyping
Chairperson: Jens Schmenger, Siemens, DE

11:00 Intelligent Methodology for Efficient Power Module Design by SPICE-based

Virtual Prototyping
Taegyun Lee, STMicroelectronics, DE

11:20 Method to Fit a HV-IGBT TCAD-Model to Match the Switching Behaviour in

Measurements
Tim Scheel, University of Rostock, DE

11:40 Thermal Neural Networks for Temperature Estimation of Traction Inverters in

Electric Vehicles
Jessica Yu, Volkswagen, DE

12:00 Lunch Break

12:45 Poster/Dialogue Session & Coffee Time (Hall 10.1)

 Tuesday, 6 May 2025 / Poster Presentation

IGBT Devices
Chairperson: Serge Bontemps, Microchip Technology, FR

PP002 Automation-Optimized Design for 62mm Power Modules Enabling Enhanced

Performance
Sven Matthias, SwissSEM Technologies, CH

PP004 MMC Output Power Enhancement with IGBT and Diode Desaturation Control
Vishwas Acharya Nayampalli, University of Rostock, DE

PP005 High Power Density 2300V X2 IGBT Module with 7th Technology
Di Li, Zhuzhou CRRC Times Semiconductor, CN

PP006 HV LinPak Platform Featuring Si IGBT Trench and SiC Technology for
Enhanced Traction Reliability
Lluis Santolaria Perez, Hitachi Energy, CH

PP007 A Double Pulse Test Based IGBT On-State Capacitance Extraction of ANN-
assisted Hybrid Model
Abby Shih, Keysight Technologies, DE

PP008 Infineon IHV-A 6.5 kV IGBT4 Module for HVDC (High Voltage Direct Current)
Converter Design
Martin Knecht, Infineon Technologies, DE

PP009 A New, Fully molded IPM with 7th Generation IGBTs and Diodes
Taejin Lee, Infineon Technologies, KR

PP010 Thermal Performance of the New 600 V CIPOS Micro IPM for HVAC and Heat
Pump Fan Motor Drive
David Jo, Infineon Technologies, KR
 Tuesday, 6 May 2025 / Poster Presentation

Advanced Semiconductor Devices

Chairperson: Elison Matioli, POWERlab, EPFL, CH

PP011 Electrical Characterization and Modes of Operation of 1200V Cascode

B-TRAN Device
Jeff Knapp, Ideal Power, US

PP013 2.7 kV Low-On-Resistance Gallium Oxide Trench Schottky Barrier Diodes

with Double Drift Layer
Sai Charan Vanjari, University of Bristol, UK

PP014 Size Up Challenge of β-Ga2O3 Crystal Growth with Cold Container Called
OCCC Method
Masanori Kitahara, FOX, JP

PP015 Optimised MOSFETs Design for EMC Performance

Sami Ould-Ahmed, Nexperia, UK

PP016 SuperQ Technology: A Game-Changer in Power Device Innovation - Analysis

of SuperQ 200V MOSFET Industry Leading Design, Manufacture and
Performance
Christopher Kocon, Ideal Semiconductor, US

System Reliability
Chairperson: Peter Wallmeier, AEG Power Solutions, DE

PP017 Enhancing Stability by Mitigating Gate Voltage Spike using a Novel Gate
Power Supply Circuit
Yuequan Hu, Wolfspeed, US

PP018 Characteristics of SiC MOSFET Switching and Thermal Properties for Power
Semiconductor Applications
Chang-Seung Ha, Korea Electrotechnology Research Institute (KERI), KR

PP019 Integrity of Power Electronic Components on a Rotating PCB

Milijana Odavic, University of Sheffield, UK

PP020 Investigation of Humidity Prevention Coatings for Silicon Gel used in Power
Electronic Modules
Arne Iskra, Kiel University of Applied Sciences, DE

PP021 Comparison of Short-Circuit Detection and Protection Methods for SiC

MOSFETs in EV Applications
Vinay Kumar Krishnappa, Flex Automotive, DE

PP022 Statistical and Probabilistic Optimization of Data Centre Capacity

Component Power Redundancy
Amal Kaluarachchi, Buckingham Magnetics, UK
 Tuesday, 6 May 2025 / Poster Presentation

Power Quality
Chairperson: Thiago Batista Soeiro, University of Twente, NL

Comparative Analysis of Asymmetric Loop Compensation of PLL for Grid-

Connected VSCs Under Weak Grid
PP024 Wei Wu, Hefei University of Technology, CN

Standalone Current Sensor for Real-Time Supraharmonic Analysis (2–150

kHz) in Bidirectional Chargers for Electric Vehicles
PP025 Antonio Miguel Muñoz Gomez, CIRCE Research Centre, ES

DC-DC Converters for EVs: EMI-Comparison of a Phase-Shifted Bridge to an

Interleaved Buck Topology
PP026 Shounak Shashishekhar Kulkarni, Helmut-Schmidt-University, DE

Multiple Feedback Architecture to Improve the Low-Frequency Immunity of

an Active EMI Filter
PP027 Timothy Hegarty, Texas Instruments, US

Passive Components Design I

Chairperson: Daniel Chatroux, CEA-LITEN, FR

PP028 Low Capacitive Design of Planar Transformers in High Voltage Isolated

Power Supply for Gate Drivers
Priyanka Ghosh, Helmut-Schmidt-University, DE

PP029 Modelling of the Hotspot Temperature in Gapped Single Layer Inductor

Windings Using a Conductor Homogenisation Technique
Bastian Korthauer, ETH Zurich, CH

PP030 High-Frequency Inductors using an Air Gap Fringing Shield: Cost-effective

Design without Litz Wire
Thomas Ewald, ETH Zurich, CH

PP031 Improvement of Coupled Inductors by Combining Two Different Magnetic

Materials
Michael Schmidhuber, SUMIDA Components & Modules, DE

PP032 A Ferrite Transformer Design for a Medium Voltage High Power Charging
System
Christian Blaum, SUMIDA Components & Modules, DE

PP033 Simple Calculation Method of DC Superimposition Characteristics for

Gapped Inductor
Yuto Matsui, Fuji Electric, JP
 Tuesday, 6 May 2025 / Poster Presentation

PP327 Design of 50 kW 100 kHz Oil Immersed Transformer for Deep Sea
Applications
Gayan Wickramasinghe, University of Central Lancashire, UK

PP037 500W Ultra-low Profile Full GAN LLC Converter

Gokhan Sen, Infineon Technologies, AT

PP276 Effect of Cutting Technology on the Soft Magnetic Properties of

Nanocrystalline Cut Cores
Inge Lindemann-Geipel, Fraunhofer Institute IFAM, DE

Packaging Materials
Chairperson: Christina DiMarino, Virginia Tech, US

PP040 The development of High durability Si3N4 for insulating heat dissipation
substrates
Yoshihito Yamagata, Toshiba Materials, JP

PP041 Micrometer Cantilever Beam Measurements at Joining Interfaces of AMB-

Si3N4-Copper Substrates
Axel Rost, Fraunhofer IKTS, DE

PP042 Influence of Transfer Molding Process on the Reliability of High Mass Epoxy
Mold Compound Molded Package
Dong Hu, BESI, NL

PP043 Failure Evolution and Reliability Assessment of Epoxy Mold Compounds in

Power Module Encapsulation
Yanfei Zhao, Hitachi Energy, CH
 Tuesday, 6 May 2025 / Poster Presentation

Thermal Management Measurement

Chairperson: Aylin Bicakci, University of Applied Sciences Kiel, DE

PP045 Dynamic Junction Temperature Evaluation: On-State Voltage Measurement

Device vs. IR Thermography
Max Plumeier, University of Applied Sciences Hanover, DE

PP046 Thermal-Interface-Material Degradation Detection Method via Internal Gate

Resistance in an IGBT Chip
Yuta Yamaoka, Mitsubishi Electric Corporation, JP

PP047 Constructing a High-Current Zth-Test Bench with Low-Voltage MOSFETs for

Power Semiconductor Modules
Tobias Heise, University of Rostock, DE

PP048 Zth-Scope: Thermal Impedance Measurement System for Power

Semiconductors with Variable Sample Time
Paul Fuchs, University of Rostock, DE

PP049 Thermal Characterization of an EMI Filter for a Traction Inverter

Maurizio Tranchero, Ideas & Motion, IT

PP050 Comprehensive Electric and Thermal Evaluation of SiC High Power Discrete
Packages
Josef Wildauer, Infineon Technologies, AT

PP051 Reliability Assessment of Sinter and Solder Interconnections at Power

Module-Heatsink Level
Andres Socarras, MacDermid Alpha Electronics Solutions, DE

PP052 Electro-Thermal Influence of Interconnection Methods for PTC-Elements on

Ceramic Substrates
Mirko Kirchhoff, Fraunhofer IKTS, DE

High Power AC-AC, AC-DC and DC-AC Converters

Chairperson: Marco Jung, University of Applied Sciences Bonn-Rhein-Sieg, DE

PP053 MW-Capable DC Supplies, their Adaptation to Application’s Needs and

Resulting Consequences
Martin Schulz, Littelfuse Europe, DE

PP054 Novel Top-Side Cooling Methods for Industrial Inverters with Discrete SMD
Wide-Bandgap Semiconductors
Niklas Stöcklein, Friedrich-Alexander-University Erlangen-Nuremberg, DE

PP055 Effective Space Vector Sequences for Bootstrapped Operation of a Three-

level NPC Inverter
Anantha Hegde, Panasonic Industry, JP
 Tuesday, 6 May 2025 / Poster Presentation

PP056 Exploring Power-Frequency Ranges in Series Resonant Inverters: Study of

a Versatile Industrial Induc
Irma Villar, IKERLAN, ES

PP057 Mitigation of Current Spikes in Totem-Pole PFCs Which Use Discrete Boost-
PFC Controllers
Jim Honea, Nexperia, US

PP058 Performance Analysis of Discrete and Power Module SiC MOSFETs in On-
Board Charger Applications
Francesco Gennaro, STMicroelectronics, IT

PP059 Three-Stage/-Phase Voltage/Current DC-link AC-AC Converter with

Synergetic Control
Christos Leontaris, Technical University of Munich, DE

PP060 Analysis and Optimization of GaN-Based AC-DC Converters for Enhanced

ZVS Performance
Michael Patt, University of Applied Sciences Kempten

PP061 High-Density High-Performance Server PSU with 3-Level Flying Capacitor

PFC and 500 kHz LLC
Theodoros Mouselinos, Infineon Technologies, AT

Railway and Avionic Applications

Chairperson: Mark M. Bakran, University of Bayreuth, DE

PP062 Methodology for Implementing Simulation Models of 25 kV 50 Hz Traction

Systems with Converter Power Stations
Jan Leuchter, University of Pardubice, CZ

PP064 Saliency-based Encoderless Railway Traction Drives Considering Current

Unbalance
Markus Vogelsberger, ALSTOM, AT

PP065 Modeling of Aircraft Transformer Rectifier Unit using SPICE Models for
analyzing the Effects of SiC
Ngoc Nam Pham, Brno University of Technology, CZ

PP066 Ultracompact Symmetrical Medium Voltage DC-DC Converter for Electrified

Aircraft
Malavika Santhosh Kumar, Fraunhofer IISB, DE

PP067 Feasibility Study of a Hybrid Battery/Fuel Cell-Powered Electric General

Aviation Aircraft
Wolfgang Granig, Infineon Technologies, AT

PP068 Mission Profile-Based ANPC Inverter Design Aspect and Reliability

Analysis
Robert Keilmann, Technical University of Braunschweig, DE
 Tuesday, 6 May 2025 / Poster Presentation

PP069 Revolutionizing Electric Aviation: The Role of Silicon Carbide

Semiconductors
Arun Ashok, Wolfspeed, DE

PP070 Cryogenic Inverter Design for Superconducting Electric Propulsion in Next

Generation Aircraft
Florian Kapaun, Airbus Central Research & Technology, DE

PP071 Prototyping and Evaluation of a Fault-Tolerant Three-Level TNPC Inverter

for Aircraft Propulsion
Chanuch Chaisakdanugull, Helmut-Schmidt-University, DE

AC-DC and DC-AC Converters

Chairperson: Bernhard Strzalkowski, Analog Devices, DE

PP073 Integrated GAN AC-DC Charger with VCC Self-biasing and Peak Power
Capability
Roberto Scibilia, Texas Instruments, DE

PP074 Design of a SiC-based High Bandwidth Switch-Mode Power Amplifier as

Grid Emulator for a PHIL-System
Anton Gorodnichev, Fraunhofer IEE, DE

PP075 A Plug and Play Three Terminal Active Power Decoupling Circuit
Sagar De, Indian Institute of Technology Bombay, IN

PP076 GaN-Based 5 kW Four-Level Totem-Pole PFC Converter for AI Servers

Power Supply
Marco Palma, Efficient Power Conversion (EPC), IT

PP077 Series Connected Active Power Buffer Using a Coupled Inductor for a Grid
Inverter
Pelle Weiler, University of Tokyo, JP

PP078 GaN Based Class DE Inverter Operating Up to 40.68MHz with Dead Time
Optimization
Vincent Blanchon, CEA Leti, FR

PP079 Prediction of voltage build up in an electrically floating high voltage high

power supply
Kapila Warnakulasuriya, University of Teesside, GB

PP080 Voltage Overshoot Reduction for Bidirectional Switches in Current Source

Inverters
Max Wagner, University of Applied Sciences Kaiserslautern, DE

PP081 High Power Density and High Efficiency ac-dc 250W Adapter based on GaN
HEMTs
Marco Torrisi, STMicroelectronics, IT
 Tuesday, 6 May 2025 / Poster Presentation

Charging Station Technologies

Chairperson: Marc Cousineau, Toulouse-INP, FR

PP082 The Effect of Load Impedance on the Efficiency of a Wireless Power

Transfer System with an Additional Resonant Coil
Nikolay Madzharov, Technical University of Gabrovo, BG

PP083 New Integrated Wired and Wireless Charging Systems for Electric Vehicles
Cheol-Hee Jo, Chonnam National University, KR

PP084 Impact of Insulator Thickness and Material on Partial Discharge in High-

Frequency OBC Transformers
Hasan Mousavi-Somarin, Valeo, FR

PP085 Novel Voltage Control for Dual Active Bridge CLLC EV Fast DC Chargers
Carlos Costas Sos, CIRCE Foundation, ES

PP086 Improved Sensorless Synchronous Rectification for Resonant Based DC-

DC Convertes
Faissal Mataich, Valeo, FR
 Tuesday, 6 May 2025 / Oral Presentation

Stage:Brüssel 1
High Power Converters
Chairperson: Drazen Dujic, Power Electronics Laboratory, EPFL, CH

14:30 Active Power Decoupling using Zero-Sequence Inductance of Three-Phase

Transformer
Yi Han, University of Toronto, CA

14:50 A 2MW Power Stack Design with LV100-Package IGBT Modules for
Renewable Energy Application
Zheng Feng Li, Mitsubishi Electric, JP

15:10 Test Rig for Investigation of New Generation of 3.3kV SiC MOSFET based
Traction Converters
Pavel Drabek, University of West Bohemia, CZ

Stage: Brüssel 2
Hybrid Device Concepts
Chairperson: Hans-Günter Eckel, University of Rostock, DE

14:30 Evaluation of a 650 V GaN Si SiC Hybrid Power Switch

Alireza Sheikhan, University of Sheffield, UK

14:50 Parallel Operating SiC MOSFET and Si RC-IGBT in SLIMDIP for Higher
Efficiency Air Conditioners
Toma Takao, Mitsubishi Electric, JP

15:10 Soft Switching Method for MOSFETs used in Low Voltage DC Solid-State
Circuit Breakers
Kenan Askan, Eaton Industries, AT

Stage: München 1
Condition Health Monitoring
Chairperson: Marc Hiller, Karlsruhe Institute of Technology, DE

14:30 Neural Network-Enabled Condition Monitoring of DC-Link Capacitors in

Three-Phase Inverters
Youssof Fassi, CEA-Leti, FR

14:50 Machine Learning and Digital Twins for RUL Prediction of DC

Semiconductor Circuit Breakers
Lena Köhler, Fraunhofer IISB, DE

15:10 Film Capacitors in the High Voltage - Temperature Humidity Bias (HV-THB)
Test
Sven Clausner, University of Bremen, DE
 Tuesday, 6 May 2025 / Oral Presentation

Stage: München 2
Package Reliability
Chairperson: Uwe Schilling, Semikron Danfoss, DE

14:30 Physics-Based Reliability Analysis of Power Modules at Substrate and

Component Level
Anu Mathew, Fraunhofer ENAS, DE

14:50 Power Semiconductor Package Structure Highly Robust against Power

Cycling Stress at ΔTvj=165°C
Yuki Tanaka, Resonac, JP

15:10 Influence of Low Temperature Swings and Short Heating Times on the
Power Cycling Capability of IGBTs in Discrete Housings
Patrick Heimler, Chemnitz University of Technology, DE

Stage: Mailand
Pulse Width Modulation
Chairperson: Michael Hartmann, Graz University of Technology, AT

14:30 Hybrid Pulse Width Modulation for Optimizing Key Index Parameters in
Multi-Level Traction Inverters
Kooros Moabber, Volvo Cars, SE

14:50 Angle Synchronized PWM to Enable High Degree of Overmodulation for

Increased E-Drive Performance
Thomas Zeltwanger, Robert Bosch, DE

15:10 Selective DPWM (SDPWM) method for inner modulation ANPC with
paralleled SiC MOSFET and IGBT
Gergő Varga, Vincotech, HU

Stage: Athen
Measurement Methods
Chairperson: Francisco Javier Azcondo, University of Cantabria, ES

14:30 Thermal Impedance Spectroscopy by Varying the Gate Voltage during

Inverter Operation
Michael Gleissner, University of Bayreuth, DE

14:50 Accuracy Comparison of Temperature Sensors for the Thermal

Characterization of GaN Transistors
Aline Reck, University of Stuttgart, DE

15:10 Novel Short Circuit Detection Using an Isolated Add-on Coil on Type-B LV-
nHPD2 Package
Akira Mima, Hitachi, JP

15:30 – 17:00 Poster/Dialogue Session & Coffee Time (Foyer)

 Tuesday, 6 May 2025 / Poster Presentation

SiC Reliability
Chairperson: Ulrike Grossner, ETH Zurich, CH

PP087 Dynamic Reverse Bias: Lifetime Modeling for SiC MOSFET Automotive
Application
Alessandro Sitta, STMicroelectronics, IT

PP088 Investigation of the Degradation of 1200V SiC-MOSFETs Stressed by

Different Gamma Radiation Dose
Martin Rasch, Helmut-Schmidt-University, DE

PP089 Analysis of the Surge Capability and Degradation Characteristics of 1.2 kV

SiC SBD Embedded MOSEFTs
Gyuhyeok Kang, Kumoh National Institute of Technology, KR

PP090 SmartSiC 150 & 200mm Engineered Substrate: Addressing Bipolar

Degradation of SiC MOSFETs Body Diode
Eric Guiot, SOITEC, FR

PP091 Package Dependency Investigation of Short Circuit Capability of SiC

MOSFETs under Type 1 Condition
Rony Thomas, Nexperia, DE

PP092 Computation of Dynamic Rds(ON) for WBG devices using mathematical

modelling on Oscilloscopes
Vivek Shivaram, Tektronix, IN

PP093 Impact of Gate Turn-off Voltage on Body Diode Degradation of the Latest
Generation SiC MOSFET
Mohammed Amer Karout, University of Warwick, UK

PP094 Analysis of Threshold Voltage Hysteresis on Switching Speed of SiC

MOSFET with Kelvin and Non-Kelvin Packages
Ziheng Yuan, Hefei University of Technology, CN

PP095 Analysis of SiC MOSFET Degradation in Gate Switching Stress by Small-

Signal Gate Impedance Method
Rishi Krishna Balasubramanian Saraswathy, Onsemi, SW
 Tuesday, 6 May 2025 / Poster Presentation

GaN Devices I
Chairperson: Nando Kaminski, University of Bremen, DE

PP096 Experimental Dynamic Saturation Current Evaluation of 650V GaN GITs

Borja Alberdi, University of Mondragon, ES

PP097 Modeling of the Dynamic On-State Resistance of GaN-HEMTs

Benedikt Kohlhepp, Technical University of Berlin, DE

PP098 Extraction of Dynamic Threshold Voltage and on-state Resistance of GaN

HEMT in Hard-Switching Operation
Tianyu Li, Otto-von-Guericke-University Madgeburg, DE

PP099 Analysis of Instability of Dynamic Ron in GaN eHEMTs by VDS,

Temperature and Hot-Electron-Stress
Xiangyu Wang, University of Bristol, UK

PP100 Investigation of a Single-Gate GaN HEMT as Bidirectional Switch in a Low

Voltage Multilevel Topology
Daniel Grieshaber, Fraunhofer IAF, DE

PP101 Investigation of Very Low Ron 650V GaN FETs in Copper Clip Package for
Use in High Power Converters
Sebastian Klötzer, Nexperia, DE

PP102 Enhancing DC-DC Boost Converter Performance with Vertical GaN Split-
RSO-MOSFET
Nilesh Kumar Jaiswal, University of Southern Denmkark, DK

PP103 Optimization of Current Aperture Length for Enhanced RF Performance in

GaN CAVET Devices
Ashrafun Naher Pinky, University of Southern Denmark, DK

PP104 650V Half-bridge GaN with Integrated Driver for 1kW Motor Drive
Applications without Heatsink
Zhemin Zhang, Infineon Technologies, US

PP105 Comparative Analysis of CoolGaN BDS and B2B UDS Dynamic Ron and
Switching Loss Performance
Prodyut Das, Infineon Technologies, DE

PP106 Enabling Features for GaN in Motor Drive Applications

Matteo Uccelli, Navitas Semiconductor, US
 Tuesday, 6 May 2025 / Poster Presentation

Renewable Energy and Storage Systems

Chairperson: Silvio Colombi, ABB, CH

PP107 A 10kW Dual Channel MPPT with Three-Level Topology Implemented Using
a Single 32-bit ARM MCU
Fabrizio Di Franco, STMicroeletronics, IN

PP108 Repair Techniques for Ceramic Based Sustainable Power Electronic

Modules
Lars Rebenklau, Fraunhofer IKTS, DE

PP109 Investigation of a Modular AC Stacked Pure Sine Inverter for Low- Voltage
Grid Storage Applications
Martin Hübner, University of Applied Sciences Munich, DE

PP111 Enhancing Automotive Batteries: Onboard EIS with a Dedicated Converter

Solution
Roger Bautista Florensa, FICOSA Automotive, ES

PP112 Parameterization of Traction Battery Models for Performance Evaluation in

Ecological Rail Transport
Jan Leuchter, University of Pardubice, CZ

Reliability Testing
Chairperson: Jürgen Schuderer, Hitachi Energy Switzerland, CH

PP113 Transient Junction Temperature Measurement Error of SiC MOSFETs in

Power Cycling – A Parameter Study
Jakob Breuer, Fraunhofer IISB, DE

PP114 Dynamic Gate Stress: Advanced Characterization of an Automotive Grade

Planar-Gate 1200 V SiC MOSFET
Michele Fiore, STMicroelectronics, IT

PP115 Thermally stable Operating Point for SiC MOSFETs in the Power Cycling
Test
Fabian Dresel, Fraunhofer IISB, DE

PP116 Unipolar and Bipolar Test Voltage in Conventional Partial Discharge

Measurement Setups
Manuel Wild, Robert Bosch, DE

PP117 Improving POL Thermal Cycling Reliability to 200deg.C through CTE

Matching of a Back Side Substrate
Kenichi Koi, Shinko Electric Industries, JP

PP118 10 MHz Accelerated Gate-Switching Stress Tests with In-Situ Degradation

Monitoring of SiC MOSFETs
Ruben Schnitzler, University of Stuttgart IHT, DE
 Tuesday, 6 May 2025 / Poster Presentation

PP119 Long-term Reliability of Discrete 1200 V SiC Trench MOSFETs at 200°C

Junction Temperature
Ingo Voss, Infineon Technologies, DE

PP120 Improving the Encapsulation Reliability of Epoxy Sealing Interface through

Surface Treatment
Liu Jun, ZhuZhou CRRC Times Semiconductor, CN

PP121 Evaluation of Multilayer Passivation for Enhanced HV-H3TRB Reliability of

High Power FRD Modules
Muhammad Waseem, Dynex Semiconductor, UK

Power Electronics for E-Mobility I

Chairperson: Robert Plikat, Volkswagen, DE

PP122 An Investigation of Supercapacitor Energy Storage System for Electric

Vehicle Regenerative Braking
Borislav Dimitrov, University of Warwick, UK

PP123 Power Loss Devices Stress Optimisation for Hybrid Si-SiC Switch Design
Under High Current Load
Oleksii Zinchenko, University of Warwick, UK

PP124 Evaluation of a Next Generation 750 V SiC MOSFET for 400 V EV Powertrain
Applications
Jeffrey Casady, Wolfspeed, US

PP125 Economic Feasibility of Soft Magnetic Materials in an Electric Vehicle

Onboard Charger
Mariana Perez de Oliveira, CBMM, BR

PP126 Analysis of Aged Power Modules considering the Loss Calculation of a

Heavy-Duty Fuel Cell Truck
Yavuz Gürlek, Daimler Truck, DE

PP127 High-Current 800 V Ultra-Low Inductive Power Module with SiC MOSFETs
on Insulated Metal Substrates
Bernhard Jahn, University of Applied Sciences Landshut, DE

PP128 Performance of Ultra-Thin Inverter Structure with WBG Devices

Kohei Yamauchi, Fuji Electric, JP

PP129 Investigation of Switching Losses in a T-Type Phase Leg

Vishal Undre, BorgWarner Systems Engineering, DE
 Wednesday, 7 May 2025 / Oral Presentation

Wednesday, 7 May 2025

Foyer Brüssel Community Coffee

08:15

Stage: Brüssel 1
08:45 Keynote
Monolithically Integrated Bi-Directional Switch (BDS) GaN HEMT Technology
Michael Harrison, Enphase Energy, US
Chairperson: Johann W. Kolar, ETH Zürich, CH

09:30 Coffee break

Stage: Brüssel 1
Power Electronics for E-Mobility II
Chairperson: Klaus F. Hoffmann, Helmut-Schmidt-University, DE

09:50 Using Embedding Die Technology in GaN Half Bridge Module for 48V Inverter
Application
Olcay Korkmaz, AVL Software and Functions, DE

10:10 Optimal Design of the DAB as a Single Stage DC/DC Interface for Bidirectional
DC Chargers
Simon Fuchs, ambibox, DE

10:30 Optimized Modulation of Isolated Bidirectional Single-Stage Three-/Single-

Phase X-Rectifier for EV On-Board Chargers
Sven Weihe, ETH Zurich, CH

10:50 Coffee break

11:10 An Evaluation of the Performance and Efficiency of a Si/SiC Fusion Power

Module Based Inverter
Nikolaj Gorte, Infineon Technologies, DE

11:30 New HybridPACK HD – Key to Reliable Highest Performance eTRUCK Inverters

for Heavy-Duty Operation
Christian Müller, Infineon Technologies, DE
 Wednesday, 7 May 2025 / Oral Presentation

Stage: Brüssel 2
SiC Robustness
Chairperson: Peter Kanschat, Infineon Technologies, DE

09:50 A Novel Test Method for Bipolar Degradation under Short Dead Times
Clemens Herrmann, Chemnitz University of Technology, DE

10:10 Surge Current Robustness of 1.2 kV SiC JFETs for Active Short Circuit
Events in Automotive Applications
Tim Ringelmann, University of Bayreuth, DE

10:30 Robustness of SiC MOSFETs Design Under Repetitive Short Circuit and
Avalanche Cycles Stress
Andrea Piccioni, Infineon Technologies, AT

10:50 Coffee break

11:10 Short-Circuit Behavior of Quasi Series Connected SiC-MOSFETs:

Measurements and Simulative Validation
Christian Bäumler, Chemnitz University of Technology, DE

11:30 SiC MOSFET Reliability Assessment Under Accelerated Dynamic Reverse

Bias Methodology
Abdul Haleem Malik, University of Warwick, UK

Stage: München 1
Materials for Thermal Management
Chairperson: Anton Z. Miric, Heraeus, DE

09:50 Advanced Copper-Based CTE-Composites with High Performance vs Cost

Ratio Made by a Novel Technology
Andreas Zeller, EPoS Technologies, CH Liquid Metal Embedded Elastomers as

10:10 The Usage of Power Metallurgy in Power Electronic Applications

Markus Schneider, GKN Powder Metallurgy, DE

10:30 Reliability Testing of Liquid Metal Embedded Elastomers for Power Modules
Cara Rossetti, Arieca, US

10:50 Coffee break

11:10 Novel Interlayer Alloy for Bonding High Conductivity Metals to Silicon Using
Laser Powder Bed Fusion
Andrea Mistrini, Polytechnical University of Milan, IT

11:30 LIME: Liquid Metal Interconnections for Power Semiconductors

Nick Baker, University of Alabama, US
 Wednesday, 7 May 2025 / Oral Presentation

Stage: München 2
Inductors & Transformers Design
Chairperson: Petar J. Grbovic, University of Innsbruck, AT

09:50 Improved Insulation Design of Medium-Frequency Transformers Using a

Semiconductive Coil Former
Bastian Korthauer, ETH Zurich, CH

10:10 Fast Analytical Model for Losses of Litz Wire in Transformers with Arbitrary
Winding Arrangements Based on Triple 2D Concept
Qingchao Meng, ETH Zurich, CH

10:30 Analysis of Transient Voltage Distribution in Conventional and Flyback

Power Inductor Windings
Lukas Reißenweber, Coburg University of Applied Sciences and Arts, DE

10:50 Coffee Break

11:10 AI based Multi Criterion Optimization Solution for Magnetic Design

Gayan Wickramasinghe, University of Central Lancashire, UK

11:30 Extremely High Q-factor Inductor for Loss Reduction in Power Converters
for MHz Range
Franci Zajc, FRAZA, SI

Stage: Mailand
Intelligent Gate Drivers
Chairperson: Eckart Hoene, Fraunhofer IZM, DE

09:50 A Gate Drive Circuit for GaN GIT Power Semiconductors with a Minimal
Number of Components
Bikash Sah, Bonn-Rhein-Sieg University of Applied Sciences, DE

10:10 Low-Loss Active Gate Driver with Surge Voltage Detection for SiC MOSFET
Hironori Akiyama, MIRISE Technologies, JP

10:30 Gate Drive Concept for Power Semiconductors in Cryogenic Applications

Marek Galek, University of Applied Sciences Munich, DE

10:50 Coffee break

11:10 An Active Gate Driver to Enhance SiC-MOS Performance Utilising a

Controlled Parasitic Turn-on Effect
Michael Frank, University of Bayreuth, DE

11:30 IGBT Module Demonstrator for High Frequency Applications with Integrated
Driver and DoL Technology
Ruman Mahapatra, SDU, DK
 Wednesday, 7 May 2025 / Oral Presentation

Stage: Athen
Innovative Drive Systems for E-Mobility
Chairperson: Manfred Schrödl, Vienna University of Technology, AT

09:50 The Impedance Matrix Approach - Machine Modulation Effects from kHz to
MHz
Jan Allgeier, Robert Bosch, DE

10:10 Meeting Standby Energy Requirements in Motor Drive Applications

Juan Paolo Quismundo, Power Integrations, PH

10:30 Integrated High-Resolution Flux Sensing Array for Next Generation High
Performance Traction Drives
Michael Saur, Mercedes-Benz, DE

10:50 Coffee Break

11:10 A Modular Rapid Prototyping Test Bench Platform for Accelerated Electric
Drive Research
Stephan Goehner, Karlruhe Institute for Technology, DE

11:30 Position Sensorless Control of a Motor-Pump-Unit for an Active Suspension

in Automotive Applications
Andreas Lang, Vienna University of Technology, AT

11:50 Lunch Break

12:45 Poster/Dialogue Session & Coffee Time (Hall 10.1)

 Wednesday, 7 May 2025 / Poster Presentation

Design Methods and Tools for Power Electronics

Chairperson: Klaus F. Hoffmann, Helmut-Schmidt-University, DE

PP130 Optimizing Chip Area in Power Module Design: Comparison of

Traditional and AI Surrogate Models for Thermal Resistance
Calculation
Dhruvil Patani, Volkswagen, DE

PP131 Optimization of Semiconductor Bare Die Placement in Multi-Chip Power

Modules
Rando Raßmann, University of Applied Sciences Kiel, DE

PP132 Optimal Transistor Dimensioning in T-Type Topology for Reduced Quasi-2-

Level Switching Loss
Adrian Söllner, University of Stuttgart, DE

PP133 A Novel Fully Compatible Gate Driver Design Methodology for both E-mode
SGT and GIT GaN HEMTs
Yung-Ping Tong, Infineon Technologies, TW

PP134 Machine Learning Assisted Visual Design Space Exploration for GaN Half-
Bridges with Output Filter
Philipp Czerwenka, University of Applied Sciences Reutlingen, DE

PP135 Practical Guidelines to Train Reinforcement Learning Based Control of

Electrical Drives
Nándor Szécsényi, Budapest University of Technology and Economics, HU

PP136 Device Screening Approach based on Genetic Algorithm for Parallel

Connection of SiC MOSFET
Qianchen Yin, Hefei University of Technology, CN

PP137 AI-Based Surrogate Model for DC EMI Filter Optimization for Electric Vehicle
Applications
Ben Esser, Volkswagen, DE

Interconnection Materials
Chairperson: Geraldo Nojima, Eaton, US

PP138 Copper Salt-Based Sinter Paste for Use Under Air and Pressureless
Conditions
Andreas Sy, Stannol, DE

PP139 Advancements in Formic Acid Soldering Materials Technology for Power

Device Packaging
Dean Payne, Indium Corporation, US

PP141 Comparison of Mounting Methods for Directly Attached SiC Power MOSFET
Bare Dies on a PCB
Mario Wasner, Munich University of Applied Sciences, DE
 Wednesday, 7 May 2025 / Poster Presentation

PP142 Experimental Validation of Parasitic Inductance Reduction by Meander-

shaped Cover-all Interconnectio
Sang Won Yoon, Seoul National University, KR

PP144 A Quantitative Method for the Development and Evaluation of a Soldered

Package-Attach Assembly in Power Electronics
Ryan Mayberry, Indium, US

SiC Devices
Chairperson: Francesco Gennaro, STMicroelectronics, IT

PP145 Optimisation of Silicon Carbide Gate Commutated Thyristor

Arne Benjamin Renz, University of Warwick, UK

PP146 Influence of SiC MOSFET Device Parameters on Zero-Voltage Switching

Losses
Martin März, Friedrich-Alexander University Erlangen-Nuremberg, DE

PP147 Statistically Relevant Comparison of 6.5kV SiC MOSFETs with and without
Integrated Schottky Diodes
Arthur Boutry, University of Alamaba, US

PP148 New 1200V SiC MOSFET with Improved both Figure of Merits and Short-
Circuit Capability
Wonsuk Choi, PowerMaster Semiconductor, KR

PP149 New 1400V SiC MOSFET for Performance and Efficiency Boost in eTruck
Inverters
Gernot Stracke, Infineon Technologies, DE

PP150 New High-Performance XHP2 Module with 2.3 kV CoolSiC MOSFET for a
Variety of Demanding Applications
Tilo Poller, Infineon Technologies, DE

PP151 Enhanced Performance of 1200 V CoolSiCTM G2 MOSFET in TO-247

Package for Industrial Applications
Syeda Qurat ul ain Akbar, Infineon Technologies, DE

PP152 Switching characterization of SmartSiC semiconductor devices under

temperature
Gaetan Perez, CEA, FR

PP153 Effect of Variable Lateral Doping (VLD) on Avalanche Ruggedness Capability

of SiC Power MOSFETs
Pallavi Srivastava, STMicroelectronics, IT

PP154 Qualitative Study on Laser Backside Ohmic Contact Formation of a SiC-Ni

Interface
Maurice Clair, 3D-Micromac, DE
 Wednesday, 7 May 2025 / Poster Presentation

PP155 New 2.3 kV High-Current All-Silicon Carbide Module for Medium Voltage
Power Conversion Applications
Ashish Kumar, Wolfspeed, US

Passive Components Design II

Chairperson: Jürgen Biela, ETH, CH

PP156 Study on Flux-Parallel Core Segmentation in High-Frequency Transformers

for LLC-Converter Applications
Till Piepenbrock, University of Paderborn, DE

PP157 Realizing the Potential of Rapidly Evolving Semiconductor Devices with the
State-of-the-Art Magnetic
Kapila Warnakulasuriya, Teesside University, UK

PP158 Integrated Inductors for Interleaving Buck and Boost Converters

David Prados, Prax, ES

PP159 Design Optimization of an AC Filter Inductor for 350kW High-Efficiency

Inverter Applications
Prasanth Thummala, CRRC Times UK Innovation Centre, UK

PP161 Advanced PEEC Thermal Model for Passive Components with Adaptive
Integration of Cooling Solutions
Sascha Langfermann, BLOCK Transformatoren-Elektronik, DE

PP162 Design of a 150kW Transformer with Integrated Series Inductance for Hybrid
Electric Regional Aircraf
Miroslav Vasic, Polytechnical University of Madrid, ES

PP163 Indirect Core Loss Measurement of Ferrite and Powder Cores under
Rectangular AC Voltage and DC Bias
Tianxiao Chen, Huawei Technologies, DE

PP164 Cauer Circuit-based Equivalent Model for Transformers in LLC Resonant

Converters
Masaki Okawa, Aoyama Gakuin University, JP

Switched Mode Power Supplies

Chairperson: Junichi Itoh, Nagaoka University of Technology, JP

PP166 Design Considerations of a Dual-phase Interleaved Boost Converter in

Class-H Audio Amplifier System
Wei Qiu, Texas Instruments, CN

PP167 Ultra-Flat SMPS Enabled by Hybrid Flyback

Cristina Martos-Contreras, Infineon Technologies, DE
 Wednesday, 7 May 2025 / Poster Presentation

PP168 Evaluation of a Bidirectional Single-Stage Three-Phase Converter with Wide

Input Voltage Range
Philipp Schanz, Karlsruhe Institute of Technology, DE

PP169 A Novel Method to Estimate Primary Inductance for Transformer Saturation

in Flyback Converters
Fabio Cacciotto, STMicroelectronics, IT

PP170 Multi-Output Flyback Converter for Metering Applications that Protects

Against Magnetic Interference
Thomas Anthony Capobianco, Power Integrations, US

PP171 Achieving High Efficiency Across Load in a 2-Stage 140 W Flyback USB PD
3.1 Compact Notebook Adapter
Mark Gerald Manango, Power Integrations, US

PP172 Phase Shifted LLC Converter Using GaN Switches for Wide Voltage Range
Operation for OLED TV SMPS
Gokhan Sen, Infineon, AT

PP173 Optimizing Efficiency and Output Regulation for Dual-Output Flyback

Converters with 1700V GaN Switch
Han Cui, Power Integrations, US

Condition and Health Monitoring

Chairperson: Uwe Schilling, Semikron Danfoss, DE

PP174 A Digital Twin-Based Condition Monitoring Method for a Three-Phase

Inverter
Jie Kong, Aalborg University, DK

PP176 Analysing Motor Health using Sensors and Oscilloscopes enables Predictive
Analysis
Vivek Shivaram, Tektronix, IN

PP177 Junction Temperature Estimation in IGBT Modules using Machine Learning

based Finetuning
Venkata Yoganand Konda, Fraunhofer ISIT, DE

PP178 AI-Based Condition Monitoring and RUL Estimation for DC/DC Converters
Deployed on Embedded Systems
Robert Keilmann, Technical University of Braunschweig, DE

PP179 Condition Monitoring Approach for DC Link Capacitors in MW-Scale Power

Converters
Sören Fröhling, Fraunhofer IWES, DE

PP180 State of Health Estimation of SiC MOSFETs Using Convolutional Neural

Networks and Long Short-Term Memory Recurrent Neural Networks
Elena Blazhevska-Ivanoski, Virtual Vehicle Research, AT
 Wednesday, 7 May 2025 / Poster Presentation

Motor Drives for Automotive and Special Applications

Chairperson: Jose Mario Pacas, University of Siegen, DE

PP182 Transient Response for Sensorless Field-Oriented Control Using Integrated

Current Sensing
Juan Paolo Quismundo, Power Integrations, PH

PP183 Single-Phase BLDC Motors for External Fan Applications

John Emmanuel Tan, Power Integrations, PH

PP184 Analysis of Power Losses in SiC-based Dual Inverter with Open-end Winding
Motor Drive System
Tiago Jappe, Vincotech, DE

PP185 Enhanced Active Short Circuit Technique for Fault Management in Electric
Vehicle Powertrains
Vivek Tailor, SEG Automotive, DE

Advanced Control
Chairperson: Marcelo Lobo Heldwein, Technical University of Munich, DE

PP186 Adaptive Average Current Control to Improve Steady-State Performance in

PFC Converters
Marco Torrisi, STMicroelectronics, IT

PP187 Implementation of Small-Scale Artificial Neural Networks for Power

Electronics Applications
Ozturk Sahin Alemdar, Middle East Technical University, TR

PP188 Maximizing the Voltage Utilization in Automotive Traction Drives Applying

Optimized Pulse Patterns
Maximilian Hepp, Mercedes-Benz, DE

PP189 Virtual Flux-Based Modulation Schemes for Adaptive Stress Reduction of

Degraded Submodules in CHB-Based MMCs
Mohsen Asoodar, KTH Royal Institute of Technology, SE
 Wednesday, 7 May 2025 / Poster Presentation

High Power DC-DC Hard- and Soft-Switched Converters

Chairperson: Pavol Bauer, Delft University of Technology, NL

PP190 Analysis of LLC Converters in ISOP-Systems with Iterative First Harmonic

Approximation
Daniel Breidenstein, Optoelectronics, FAU Erlangen-Nürnberg, DE

PP191 Robust Synchronous Rectification Driving for Bidirectional CLLC Resonant

Converters
Ivan Clemente Massimiani, STMicroelectronics, IT

PP192 LLC Resonant Converter Base on Variable Inductor Without Auxiliary

Switches
Tae-Jun Jeong, Chonnam National University, KR

PP193 Design and Optimize of Active Capacitor Converter for Pulse Load Power
Supply
Cai Chen, Huazhong University of Science and Technology, CN

PP194 Analysis of ZVS of the Multi-Input Port Three-Phase Interleaved LLC

Considering Magnetic Coupling
Xuchen Sun, Huazhong University of Science and Technology, CN

PP195 Experimental Evaluation of Switching Losses in IGBT based Resonant

Switched Capacitor DC-DC Converters
Lucia Clavero, Huawei Technologies Duesseldorf, DE

Thermal Modelling
Chairperson: Andreas Lindemann, Otto-von-Guericke-University Magdeburg, DE

PP196 Heat Transfer Estimation from Isothermal Fluid Flow

Philipp Hickisch, University of Rostock, DE

PP197 FEM Temperature Simulation of a PMSM with a Temperature Dependent

Lookup based MTPA Control Approach
Lukas Schmieden, Kempten University of Applied Sciences, DE

PP198 A FEM-based Method for Determining the Thermal Equilibrium in Self-Heating

of Magnetic Components
Luis Sievers, Bonn-Rhein-Sieg University of Applied Sciences, DE

PP199 Optimization of a High Power-Density Inverter for Automotive Application by

Means of Top-Side Cooled Power Devices
Maurizio Tranchero, Ideas & Motion, IT

PP200 Physical Network Model and experimental Investigation of an active Cooling

Loop for Power Electronic
Arif Cömert, Universität der Bundeswehr München, DE
 Wednesday, 7 May 2025 / Poster Presentation

PP201 Thermal Modeling of SiC Power Module: A CFD-Based Approach for

Junction-to-Fluid Resistance Estimate
Lorenzo Colombini, HPE, IT

PP202 Large Size and Flexible Pinout Hybrid Modules for PV and PCS Applications
Shuai Cao, MACMIC Science & Technology, CN

PP203 Advanced Methods for Extrapolating Thermal Measurement Data to

Accelerate Electric Drive Testing
Moritz Aron, Brose Fahrzeugteile, DE

High Frequency Applications and EMI

Chairperson: Prasad Venkatraman, Onsemi, US

PP204 Conducted EMI MIitigation of SiC Based Three-Phase Three-Level T-Type

Neutral Point Clamped Inverter
Chen Wei, Wolfspeed, CN

PP205 Experimental Comparison of Radiated EMI in Si MOSFETs and WBG GaN for
Low Voltage Motor Drives
Kieran Burrows, Newcastle University, UK

PP207 Development and Characterization of a Surface-Mounted Device Qi-

Compliant Wireless Power Coil
Christian Merz, Wurth Electronics Midcom, DE

PP208 Comprehensive Evaluation of Three-Phase Wireless Power Transfer System

with DD Type Receiver for AGV
Keito Miyamoto, Aoyama Gakuin University, JP

PP209 Design and Evaluation of a High-Frequency Wireless Power Transfer System

with Synchronous Rectification
Tim Krigar, TU Dortmund University, DE
 Wednesday, 7 May 2025 / Oral Presentation

Stage: Brüssel 1
Converter Design for E-Mobility
Chairperson: Gianmario Pellegrino, Polytechnic University of Turin, IT

14:30 Single-Stage Isolated AC/DC Converter for Highly Efficient On- Board Charger
Xiaoshan Liu, Valeo, FR

14:50 Future of Bidirectional On-Board Charging: A comparative Analysis of CLLC and

DAB topologies
Hector Sarnago, University of Zaragoza, ES

15:10 GaN based FC and ANPC Three-Level Topologies: A Performance Study for OBC
Applications
Francesco Gennaro, STMicroelectronics, IT

Stage: Brüssel 2
Reliability in Power Electronics
Chairperson: Klaus Rigbers, SMA Solar Technology, DE

14:30 Optimal Reliability-aware Current Sharing in Adjustable Hybrid Switch (AHS)

Power Converter
Tanya Thekemuriyil, University of Applied Sciences and Arts Northwestern Switzerland,
CH

14:50 PELCA: An Open-Source Research Power Electronics Life Cycle Assessment

Tool
Nicolas Degrenne, Mitsubishi Electric R&D Centre Europe, FR

15:10 Cosmic Ray Robustness: 2kV SiC-based B6 Topology vs Prominent Industrial

Solutions for 1500V DCLinks
Carlos Fuentes, ROHM Semiconductor, DE

Stage: München 1
Advanced Cooling Technology
Chairperson: Shiori Idaka, Mitsubishi Electric Europe, DE

14:30 Stabilizer with Included Pulsating Heat Pipe for Stability, Electrical Insulation and
Heat Dispersal
Claus Brede, Siemens, DE

14:50 Practical Considerations for Pulsating Heat Pipe and Embedded Heat Pipe Heat
Spreaders
Nathan Van Velson, Advanced Cooling Technologies, US

15:10 Physics of Failure Based Lifetime Modelling of Double Side Cooled Power
Electronics Modules of Electric Vehicles Under Power Cycling
Saeed Akbari, RISE Research Institutes, SE
 Wednesday, 7 May 2025 / Oral Presentation

Stage: München 2
Paralleling Devices
Chairperson: Frank Osterwald, Gesellschaft für Energie und Klimaschutz Schleswig-Holstein, DE

14:30 Technical Verification of an Over-2kV New SiC Power Module Aimed at High-
Speed Operation
Tetsuo Yamashita, Mitsubishi Electric, JP

14:50 A Gain Maximized Gate Circuit Feedback Loop and its Effect on Current
Mismatches of Paralleled IGBTs
Lukas Tomforde, University of Rostock, DE

15:10 Parallelization of XHP2 CoolSiC 3.3 kV Devices

Andreas Fischer, Infineon Technologies, DE

Stage: Mailand
Server Power Supplies
Chairperson: Marcelo Lobo Heldwein, Technical University of Munich, DE

14:30 IISB² Topology for 48 V to 1 V Point of Load Applications

Stefan Zeltner, Fraunhofer IISB, DE

14:50 5 kW Isolated 400 V to 50 V, DC-DC Converter for Server Power Supplies

Michael de Rooij, Efficient Power Conversion, US

15:10 High-Density and High-Efficiency of an 8 kW Power Supply Unit for AI Datacenters

in 100 W/in3
Antonello Laneve, Infineon Technologies, AT

Stage: Athen
Power Electronics for E-Mobility III
Chairperson: Uwe Scheuermann, Friedrich-Alexander-University Erlangen-Nuremberg, DE

14:30 Estimating Semiconductor Switch Temperature in Automotive Applications Using

DeSat Voltage
Nima Saadat, SEG Automotive, DE

14:50 Compact Highly Integrated 1kW Peak Motor Drive

Martin Schiestl, Infineon Technologies, AT

15:10 Pushing the Boundaries of High Current LV GaN Motor Drive with a Dual Side
Parallel Approach
Marco Cannone, Infineon Technologies, AT

15:30 – 17:00 Poster/Dialogue Session & Coffee Time (Foyer)

 Wednesday, 7 May 2025 / Poster Presentation

SiC Application and Modelling

Chairperson: Josef Lutz, Chemnitz University of Technology, DE

PP210 Benefits of Parameterizable SiC MOSFET Compact Models for Virtual

Prototyping
Andreas Hürner, Infineon Technologies, DE

PP211 1 A Simulation Model for SiC Power Devices Including Thermal Effects and
Package Parasitics
Mathias Weiser, University of Stuttgart, DE

PP213 Analysis of Deskew Methods used in Double Pulse Test and Their
Challenges
Nirali Patel, ON Semiconductor, DE

PP214 Partial Turn-On in SiC MOSFETs: Experimental Analysis on Switching

Dynamics and Converter Efficiency
Adam Anders, Wolfspeed, US

PP215 Soft- and Hard-Switched Performance Evaluation of a Monolithic

Bidirectional WBG Device Over a T-Type GaN-Based Circuit
Reza Barzegarkhoo, University of Kiel, DE

PP216 Design Aspects of Paralleling 2.3 kV CoolSiC XHP 2 Power Modules in

Multimegawatt Applications
Marcel Morisse, Infineon Technologies, DE

PP217 Socket Based Test Bench for Dynamic Characterization of SiC MOSFET
Bare Dice
Alonso Gutierrez Galeano, CEA, FR

PP218 SiC MPS Diodes – Impacts of Package Inductance and Charge Carriers on
Dynamic Switching Behavior
Simon Ginzel, Helmut-Schmidt-University, DE
 Wednesday, 7 May 2025 / Poster Presentation

Smart DC Grids
Chairperson: Martin März, Fraunhofer IISB, DE

PP219 Combining Earth-Leakage and Short-Circuit Protection in DC Grids

Peter van Duijsen, The Hague University of Applied Sciences, NL

PP220 Droop Control in a Bidirectional DC Grid Manager

Diego Zuidervliet, The Hague University of Applied Sciences, NL

PP221 Resonances and Oscillations in DC Grids

Thomas Effenberger, Rosenheim Technical University of Applied Sciences, DE

Packaging Integration Technologies

Chairperson: Thomas Neyer, Infineon Technologies, DE

PP224 Life Cycle Inventory for an Organic Substrate-Based Power Electronic

Converter
Taha Moaz, Virginia Tech Center for Power Electronic Systems, US

PP225 3D Wiring Technology Development for Power Modules to Achieve High-

Power Density and High-Frequency
Tsubasa Watakabe, Fuji Electric, JP

PP227 Low-Inductive HybridPack HD Power Module for Future Proofen eTruck

Inverters
Michael Ditz, Infineon Technologies, DE

PP228 High Power Density 2-Level Switching Cells based on SiC MOSFET in Q-
DPAK Top Side Cooled Package
Manuel Gomez, Infineon Technologies, AT

PP229 Planar Integration of High Current Measurement Shunts in Die on Lead

Frame Power Modules
Christian Hennig, University of Applied Sciences Kiel, DE

PP230 Busbar Laser Welding for SiC-Optimized Power Systems

Leonardo Montoya, Wolfspeed, US

PP231 High-Efficiency SiC Half-Bridge Coupled Package for 3.5kW-class

Commercial Induction Heating Systems
Myungbok Kim, Korea Institute of Industrial Technology, KR
 Wednesday, 7 May 2025 / Poster Presentation

Control Methods I
Chairperson: Wolfram Teppan, LEM INTERNATIONAL, CH

PP233 Modular Gate Driver for Parallel Connection of Full-SiC 3k3V MOSFETs
Victor M Lopez Martin, IKERLAN, ES

PP234 Active Temperature Balance Control of Parallel Connected SiC Power

MOSFETs
Dimitrios Deldimos, Polytechnical University of Turin, IT

PP236 Voltage Control with Pole Placement for two Boost Converter Topologies: A
Comparison
Johannes V. Gragger, University of Applied Sciences Vienna, AT

PP237 An Enhanced PWM Control Technique Optimized for High Conversion

Efficiency Across Input Line and Load
Trung Huynh, Power Integrations, US

PP238 Modeling Frequency Response of a Novel Pulse Width Modulated Flyback

Control Scheme
Adrian Umadhay, Power Integrations, PH

PP239 A true Anti-Windup Scheme for a Discrete Frequency- and Phase- Adaptive
Resonant Controller
Benjamin Hoepfner, Otto-von-Guericke-University Magdeburg, DE

PP240 Fast and Accurate Balancing Methods Based on Flyback Converters for
Series-connected Supercapacitors
Mohammad Sadegh Golsorkhi Esfahani, University of Southern Denmark, DK

Reliability Testing II
Chairperson: Bernd Eckardt, Fraunhofer IISB, DE

PP241 Optimization Potential for Lifetime-Oriented Junction Temperature Control

Considering Predicted Load Cycles
Chris Hermann, University of Stuttgart, DE

PP242 Highly Accurate Condition Monitoring Using Digital Gate Control and
Convolutional Neural Networks
Thatree Mamee, Kyushu University,JP

PP243 Device Level Degradation Due to Power Cycling Test in SiC Power Module
Dahui Yoo, Korea Electrotechnology Research Institution, KR

PP244 AC Cycling Testing of SiC MOSFET Power Module

Tugce Yilmaz, Semikron Danfoss, DE
 Wednesday, 7 May 2025 / Poster Presentation

PP245 On-Chip Sensor Substrate Requirements for Accurate Junction

Temperature Measurements
Nathan Carlson, University of Alabama, US

PP248 Factors influencing the power cycling lifetime of paralleled IGBT chips
James Abuogo, Chemnitz University of Technology, DE

PP249 Lifetime Testing and In-Situ Condition Monitoring of Embedded SiC-

MOSFETs
David Strahringer, University of Freiburg, DE
 Thursday, 8 May 2025 / Oral Presentation

Thursday, 8 May 2025

08:15 Community Coffee

Stage: Brüssel 1
08:45 Keynote
Challenges of Green Growth – Limited Energy Return on Energy Invested &
Critical Raw Material Shortage
Johann W. Kolar, ETH Zürich, CH
Chairperson: Marc Hiller, Karlsruhe Institute of Technology, DE

09:30 Coffee break

Stage: Brüssel 1
Special Session: Circular Economy in Power Electronics
Chairperson: Ole Gerkensmeyer, Nexperia, DE

09:50 „Circular Economy in Power Electronics“ - Generate More Energy for More
Innovation
Regina Roos, Typhoon HIL, CH

10:10 Life Cycle Assessment Tool enabling Ecodesign of PCBs for Power
Applications
Christof Wernbacher, AT&S, AT

10:30 Circular Economy in Power Electronics – Power Semiconductors

Tobias Keller, Hitachi Energy, CH

10:50 Sustainability in Power Electronics for Automotive Applications

Raphael Hartwig, Volkswagen, DE
 Thursday, 8 May 2025 / Oral Presentation

Stage: München 1
GaN Devices II
Chairperson: Nando Kaminski, University of Bremen, DE

09:50 140-mΩ GaN Bidirectional Switch for Single-Stage Power Converters

Davide Bisi, Renesas Electronics, US

10:10 Highly-Integrated 1200 V GaN-Based Monolithic Bidirectional Switch

Michael Basler, Fraunhofer IAF, DE

10:30 Demonstration of a Novel Monolithically Integrated GaN-on-AlN/SiC Half-bridge

Xiaomeng Geng, Technical University of Berlin, DE

10:50 Characterizations of a 1200 V / 150 A GaN Power Module

Guillaume Piquet Boisson, CEA, FR

Stage: München 2
Control Methods II
Chairperson: Stéphane Lefebvre, CNAM - SATIE, FR

09:50 Reactive Power Control of an Inverter Based Totem Pole Topology Using Low
Frequency Leg
Rami Troudi, Valeo Power Division, FR

10:10 Enhanced Full-Mode Modulation Scheme for Switching Oscillation Reduction in

SiC 3L-ANPC Inverter
Hangxian Gao, Hitachi, JP

10:30 Impact of Deadtime and Modulation Schemes on 800 V / 40 kW IMS-based 3L-

ANPC Inverter
Pouya Ahmadi, University of Warwick, UK

10:50 Optimal Trajectory Tracking of IPMSM Drives using Continuous Control Set
Model Predictive Control
Kristóf Gábor Bándy, Budapest University of Technology and Economics, HU
 Thursday, 8 May 2025 / Oral Presentation

Stage: Mailand
Inverter Design and Reliability
Chairperson: Bernhard Strzalkowski, Analog Devices, DE

09:50 Medium-Voltage versus Low-Voltage Converter Reliability in Wind Turbines: A

Field-Data Based Study
Sören Fröhling, Fraunhofer IWES, DE

10:10 Practical Use of xEVCap: The Modular and Std. DC-Link Capacitor for the Main
Powertrain Inverter
David Olalla, TDK Electronics, DE

10:30 Design of GaN FET-Based Multilevel Three-Phase Inverter for High Voltage
Automotive Applications
Fabio Mandrile, Polytechnical University of Turin, IT

10:50 Characterization of the Power Stage for a GaN-Embedded-based Traction

Inverter
Maurizio Tranchero, Ideas & Motion, IT

Stage: Athen
High-Power Modular Converters
Chairperson: Daniel Chatroux, CEA-LITEN, FR

09:50 Evaluation of Magnetic Integration in Modularized-Bridge-Rectifier Solid-State

Transformer
Zhenchao Li, Federal Polytechnic University of Lausanne, CH

10:10 Novel Control Strategy for Modular Multilevel Resonant Converter based Solid-
State Transformer
Zhengzhao Li, Delft University of Technology, NL

10:30 Grid Friendly Supply of Nonlinear Dynamic Loads by a Scalable Hybrid

Multilevel Converter
Pierre-Louis Garmier, GE Vernova Power Conversion, FR

10:50 Testbench Converter to Validate Control Algorithms for a High-Cell-Count

Cascaded H-Bridge System
Paul Aspalter, Technical University of Vienna, AT

11:15 – 12:45 Poster/Dialogue Session & Coffee Time Hall 10.1

 Thursday, 8 May 2025 / Poster Presentation

SiC Application
Chairperson: Chiara Corvasce, Hitachi Energy, CH

PP250 Heat Pump Today and Tomorrow

Cam Pham, Microchip Technology, DE

PP251 Evaluation of Novel High-Bandwidth Current Sensors for High-Current SiC-

Applications
Felix Haag, Helmut-Schmidt-University, DE

PP253 Gate Drive and PCB Layout Design Considerations for Improving Current
Sharing of Three SiC MOSFETs
Chen Wei, Wolfspeed, CN

PP254 Influence of Inductances and Asymmetries on Short-Circuit Behavior for

SiC-Based Traction Inverters
Jonathan Hackel, Robert Bosch, DE

PP255 Optimizing SiC MOSFET Short Circuit and Transient Behaviors via Common
Source Inductance Voltage
Hao Wang, University of Rostock, DE

PP256 Enhancing Short-Circuit Protection in SiC MOSFET Using Vgs Clamping

and Desaturation Detection
Jan Fuhrmann, Univeörsity of Rostock, DE

PP257 Next Generation SiC Technology Targeting Long Distance Driving

Christoph van der Broeck, Infineon Technologies, DE

Modeling and Simulations II

Chairperson: Mark M. Bakran, University of Bayreuth, DE

PP259 Accurate Power MOSFET Modeling with Off-the-shelf Instruments

Hajime Takayama, Kyoto Institute of Technology, JP

PP260 Review of Small Signal Models for Dual Active Bridge with Triple Phase
Shift Modulation
Federico Ibanez, ES

PP261 Accurate IGBT Circuit Model Considering Impact of Dynamic Avalanche

Phenomenon
Kazuyasu Takimoto, Toshiba, JP

PP262 Versatile Compact Model for SiC Power MOSFET Body-Diode Reverse-
Recovery
Cristino Salcines, Robert Bosch, DE

PP263 Equivalent Circuit Design for Inductors with Artificial Neural Networks
Kevin Talits, HELLA, DE
 Thursday, 8 May 2025 / Poster Presentation

PP264 Simulation of dv/dt and Overvoltages at Motor Terminals Using 3D Finite

Element Models of Cabling
Victor M Lopez Martin, IKERLAN, ES

PP266 Model-Based Cost-Benefit Analysis on Si/SiC Hybrid Switches for Traction

Inverters
Yohei Nakamura, ROHM, JP

PP267 Introduction of Soft-Switching Loss Determination to Behavioral Modeling

Techniques
Finn Tenzer, Helmut-Schmidt-University, DE

Passive Components Design III

Chairperson: Thomas Ebel, University of Southern Denmark, DK

PP268 Sustainable Busbar Sizing Under Resource Constraints: Integrating Low-

Carbon and Circular Approches
Enagnon Appolinaire Dantondji, University of Grenoble, FR

PP269 Reduction of ESL in Energy Storage Capacitor for Pulse Power Applications
Vijay Mohale, Walchand College of Engineering, IN

PP270 Comparison of a new Characterization Technique of Electrical Properties of

Radial Aluminium Electrolytic Capacitors Versus Traditional
Characterization Methods
Jonas Wittmaack, University of Southern Denmark, DK

PP271 Optimum Design of a 24-Pulse Transformer for a 200 kW Fully Isolated 5000
VDC Power Supply
Kapila Warnakulasuriya, University of Teesside, UK

PP273 A Hybrid Approach for the Data Center Power Efficiency and Reliability
Improvement
Amal Kaluarachchi, Buckingham Magnetics, UK

PP274 Novel Rectifier Technology for Power Efficiency Improvement of

Telecommunications Base Stations
Gayan Wickramasinghe, University of Central Lancashire, UK

PP275 Nanocrystalline Alloys with High Saturation Polarization by Rapid Heat-

Treating Methods
Merlin Thamm, Fraunhofer IFAM, DE

PP277 Nanocrystalline Application in Safer and More Efficient Trans-former for

Photovoltaic Grid Integration
Andre Oliveira, CBMM, BR
 Thursday, 8 May 2025 / Poster Presentation

Thermal Management Cooling Strategies

Chairperson: Peter Kanschat, Infineon Technologies, DE

PP278 A Study on Power Dissipation and Thermal Resistance of Liquid-Immersion

Cooled SiC Power Modules
Claudia Ferreira, Compound Semiconductor Applications Catapult, UK

PP279 Advanced Cooling of Power Electronics with Copper Cold-Sprayed

Aluminium Heatsinks & Busbars
Michael Dasch, Impact Innovations, DE

PP280 Large-area Ag Sintering (40 mm × 51 mm) Application for Transfer Molded

Power Module and Al Cooler
Ryotaro Seo, ROHM, JP

PP281 Development of TO-247 Direct Liquid Cooling Structure with Ultra High
Thermal Conductive Film
Tomoki Kato, Mitsubishi Chemical, JP

PP282 Emerging Cu-Graphene Composites for Enhanced Thermal Management in

SiC Power Modules
JH Chen, PowerX Semiconductor, TW

PP283 Analysis of Coolant Transients Impact on SiC Power Module in Traction

Inverter
Chi Zhang, Volvo Cars, SW

Solid State Breakers

Chairperson: Christof Sihler, GE Vernova, FR

PP284 Overvoltage Protection of Power Semiconductors in Solid-State DC Breaker

Applications
Karsten Haehre, Littelfuse Europe, DE

PP285 New Solid-State Isolators Enable Superior Pulse-Current Robustness in Si-

MOSFETs
Wolfgang Frank, Infineon Technologies, DE

PP286 A predictive maintenance concept for LVDC power electronics-based circuit

breakers using AI
Dong Liu, Eaton Research Labs, DE

PP287 Modular Clamping Circuit for SSCBs, Operated in Cryogenic

Florian Kapaun, Airbus Central Research & Technology, DE

PP288 Ultra-Fast Response Bidirectional SiC-SSCB for Fault Protection in 800V DC

Aircraft Grids
Christopher Dahmen, Airbus, DE
 Thursday, 8 May 2025 / Poster Presentation

Multilevel and HVDC Converter

Chairperson: Bernd Eckardt, Fraunhofer IISB, DE

PP289 Switched Capacitor Cascaded Multilevel Inverter with Extended Sinusoidal

Modulation Range for Drives
Vaidika Pardhi, Indian Institute of Science, IN

PP290 Analytical Chip Area Optimization of SiC Half-Bridge MMC-Submodules

Covering all Operating Points
Michael Rauh, University of Bayreuth, DE

PP291 High Efficiency Interleaved Flying Capacitor For Fuel Cell And Li-Ion Battery
Charger
Thibault Bertin Riviere De La Souchere, CEA, FR

PP292 Unfolded Resonant Converter with Large Conversion Ratio

Francisco Javier Azcondo, University of Cantabria, ES

PP294 Analog Regulation of Voltage from an Alternating High Voltage Source

Priyanka Ghosh, Helmut-Schmidt University, DE

Measurement and Testing

Chairperson: Jacques Laeuffer, Dtalents, FR

PP295 High Impedance High Bandwidth High Immunity Voltage Dividers

Dominik Schlaefli, LEM International, CH

PP296 Improving the Usability of Calorimetric Measuring Chambers for Reliable

Thermal Measurements
Nikolas Förster, University of Paderborn, DE

PP297 Compensation Techniques for Inductive-Distorted Measurements of Fast

Transients in Double Pulse Test
Christian Lottis, Bonn-Rhein-Sieg University of Applied Sciences, DE

PP298 In-Circuit Switching Loss Measurement of a Three-Level T-Type Inverter

with Heterogeneous Switches
Niklas Krug, University of Applied Sciences Munich, DE

PP299 Power Losses Measurement Method for High Efficiency MV Oil-Insulated

DC-DC Converter
Pierre Le Métayer, SuperGrid Institute, FR

PP300 Non-Intrusive Switching Loss Measurement vs. Double Pulse Test:

Accuracy Analysis
Anliang Hu, ETH Zurich, CH

PP301 Application of Measurements in a PV Inverter for the Determination of

Aging and its Driving Factors
Niclas Reitz, Fraunhofer IEE, DE
 Thursday, 8 May 2025 / Poster Presentation

PP302 Design Criteria for Output Current Measurement Circuit in High- Frequency
Series-Resonant Inverter
Fernando Gonzalez-Hernando, IKERLAN, ES

PP303 Back-to-back test benches for application-close evaluation of power

electronics
Nicolas Degrenne, Mitsubishi Electric, FR

DC-DC Hard- and Soft-Switched Converters

Chairperson: Paolo Mattavelli, University of Padova, IT

PP304 High Frequency Step-Up DC-DC Converter with Integrated Inductances

Oleksandr Matiushkin, Tallinn University of Technology, EE

PP305 Hybrid Switched Capacitor Converter with GaN Devices

Daniel Kostynski, Infineon Technologies, AT

PP306 Design of a High Power Interleaved Bididrectional DC-DC Converter Based

on Sic MOSFETs
Alejandro Palacio, Kempten University of Applied Sciences, DE

PP307 Power Loss Analysis of the SI-SIDO Boost-Buck-Boost Converter during

the Continuous Switching Method
Babak Rooholahi, University of Rostock, DE

PP308 Flyback-based Input Series Converter as a Wide Input Auxiliary Power

Supply
Ashish John Thomas, Delft University of Technology, NL

PP309 Analysis and Characterization of the LLC Resonant Converter in Sub-

Resonant Operation Region
Daniel Urbaneck, University of Paderborn, DE

PP311 LLC Converter for Power Switch Evaluation in Resonant Topology and
back-to-back Loading Method
Tomislav Turscak, Infineon Technologies, AT

PP312 Design of High-Density and High-Efficiency 8kW LLC converter

Theodoros Mouselinos, Infineon Technologies, AT
 Thursday, 8 May 2025 / Poster Presentation

Intelligent Gate Drive Units

Chairperson: Michael Hartmann, Graz University of Technology, AT

PP313 GaN Gate Driver for SiC MOSFETs in a Megawatt Inverter Application
Yijun Ye, Siemens, DE

PP314 Enhanced Dynamic Active Discharge Approach for SiC MOSFETs Utilizing
Advanced Gate Drivers
Lan Fang, Robert Bosch, DE

PP315 GaN HEMT Gate Driver Circuit Utilizing Variable Capacitors

Pawel Kubulus, Aalborg University, DK

PP316 Utilization of a Reinforcement Learning Algorithm to Optimize a Multi-Level

Gate Driver Circuit
Celine Lawniczak, TU Dortmund University, DE

PP317 A Current Source Active Gate Driver for dvdt Control and Voltage
Overshoot Reduction for SiC MOSFETs
Lukas Kappel, TU Dortmund University, DE

PP318 A Desaturation-based Short Circuit Protection Technique for Quasi-Two-

Level Converters
Anand Krishnamurthy Iyer, University of Twente, NL

PP319 Impact of Gate Resistor Configuration when Paralleling Discrete WBG

Devices
Yifu Zhang, Infineon Technologies, DE

PP320 A 350V Power Management IC for GaN-Based PV Inverters with Local High-
/Low-Side Sensing and Control
Bernhard Wicht, Leibniz University Hannover, DE

PP321 Dynamic Gate Driver – Demonstrator Setup and System Efficiency Analysis
for an Automotive EDU
Shino George, InfiMotion Technology, SW
 Thursday, 8 May 2025 / Poster Presentation

Control in DC-DC Converters

Chairperson: Spasoje Miric, University of Innsbruck, AT

PP322 A Novel Method for V2COT Control with Internal Ramp Compensation for
Automotive Applications
Niccolo’ Brambilla, STMicroelectronics, IT

PP323 Self-Synchronized Multifrequency Plant Measurement of a Boost Converter

Sophia Rösel, Friedrich-Alexander-University Erlangen-Nuremberg, DE

PP324 Modelling and Control of a Dual Active Bridge Applied to an Uninterruptible

Power Supply
Florian Weiß, University of Applied Sciences Aalen, DE

PP325 Continuous Control of Bidirectional Series-Resonant Converters using

Pulse-Skipping
David Bohne, Cologne University of Applied Sciences, DE

PP326 A Novel Predictive Dead Time Control Method for High-Voltage Applications
with SiC/GaN Devices
Hongming Zhao, Robert Bosch, DE
 Thursday, 8 May 2025 / Oral Presentation

Stage: Brüssel 1
IGBT Technologies
Chairperson: Masahito Otsuki, Fuji Electric, JP

14:00 New 3.3kV XB-Series HVIGBT Module for High-Speed-Switching

Saito Shuhei, Mitsubishi Electric, JP

14:20 900 A 1200 V ED Module with New Micropattern Trench IGBT Featuring Local
Carrier Confinement Control
Nick Gilles Schneider, SwissSEM Technologies, CH

14:40 Next-generation 670 V RC IGBT in HCC Enhances Performance and

Ruggedness in PFC Application
Ajith Kumar Sekar, Infineon Technologies, AT

15:00 Double- and Single Gate Desaturated Turn-off of Low Saturation IGBTs for
Reduced Turn-off Losses
Vishwas Acharya Nayampalli, University of Rostock, DE

Stage: München 1
Smart Battery and DC Grids
Chairperson: Serge Bontemps, Microchip Technology, FR

14:00 Automotive Li-Ion Cells Representative Abusive Test at Megawatt Scale

Daniel Chatroux, CEA, FR

14:20 Cloud-connected Battery Management System for Secure Battery-Passport

Implementation
Wenzel Prochazka, NXP Semiconductors, AT

14:40 Experimental Evaluation of Droop Control Characteristics in an Industrial DC

Microgrid
Normann Schwingal, Technical University of Dresden, DE

15:00 High-Frequency 360kW Motor Control Using Modular Switched Battery

Technology
Ghislain Despesse, CEA, FR
 Thursday, 8 May 2025 / Oral Presentation

Stage: München 2
High Frequency Converters
Chairperson: Christopher Kocon, iDEAL Semiconductor Devices, US

14:00 GaN-Based Bi-Directional 7.2kW OBC with 10kW/L Power Density and High
Efficiency
Esmaeil Jalalabadi, Carleton University, CA

14:20 Electrolytic Capacitor-Less Integrated Stage Converter for AC-DC Applications

Alireza Ramezan Ghanbari, V-Research, AT

14:40 A Common-Mode Active EMI Filter for Low-Voltage Distribution System in

Automotive Application
Weihao Zhao, Silicon Austria Labs, AT

15:00 Design Approach to Passive and Active Hybrid Integrated EMI Filters for High-
Frequency Converters
Mohammad Ali, BLOCK Transformatoren-Elektronik, DE

Stage: Mailand
Sintering Technology
Chairperson: Jacek Rudzki, Semikron Danfoss, DE

14:00 Benefits of SiC Power Module Package Sintering for Inverter Applications
Argirios Papagianis, Wolfspeed, US

14:20 Copper Sintering Paste that can Sinter without Pressure in Nitrogen
Hideo Nakako, Resonac, JP

14:40 Oxidation-free Bonding of Cu Sintering in the Air on Cold-rolled Bare Cu

Substrate
YehRi Kim, Korea Insititue of Industrial Technology, KR

15:00 Wetting Force-Assisted Solvent-Drying Method for Large-Area, Low- or No-

Pressure Sintering
Masanao Yamasaki, Hitachi, JP
 Thursday, 8 May 2025 / Oral Presentation

Stage: Athen
Special Passives Design
Chairperson: Eric Favre, Consultant, CH

14:00 High Temperature Capacitors with Minimal Derating of Operating Voltage for
DC-Link Applications
Adel Bastawros, SABIC, US

14:20 Ultra-Thin Film Capacitors with Gradient Nanocomposite Layers

Bartosz Gackowski, University of Southern Denmark, DK

14:40 Comprehensive Analysis of Magnetic Flux Distribution in Planar Cores and

Surface Flux Density in Airgap
Ismail Recepi, Silicon Austria Labs, AT

15:00 Design and Control of a Variable Inductor for Power Grid Applications
Jonas Pfeiffer, SUMIDA Components & Modules, DE