Datasheet

2ch High Side Switch ICs

Current Limit High Side Switch ICs

BD6516F BD6517F BD2042AFJ BD2052AFJ
General Description Key Specifications
BD6516F, BD6517F, BD2042AFJ and BD2052AFJ  Input Voltage Range:
are dual channel high side switch ICs with an over BD6516F/BD6517F 3.0V to 5.5V
current protection for Universal Serial Bus (USB) BD2042AFJ/BD2052AFJ 2.7V to 5.5V
power supply line. The IC’s switch unit has two  ON-Resistance:
channels of N-Channel power MOSFET. Over BD6516F/BD6517F 110mΩ(Typ)
current detection circuit, thermal shutdown circuit, BD2042AFJ/BD2052AFJ 100mΩ(Typ)
under voltage lockout and soft start circuit are built  Continuous Current: 0.5A
in.  Current Limit Threshold:
BD6516F/BD6517F 1.2A(Min), 2.5A (Max)
Features BD2042AFJ/BD2052AFJ 0.7A(Min), 1.8A (Max)
■ Dual N-MOS High Side Switch  Standby Current: 0.01μA (Typ)
■ Control Input Logic  Output Rise Time: 1.8ms (Typ)
 Active-Low: BD6517F, BD2042AFJ  Operating Temperature Range:
 Active-High: BD6516F, BD2052AFJ BD6516F/BD6517F -25°C to +85°C
■ Soft Start Circuit BD2042AFJ/BD2052AFJ -40°C to +85°C
■ Over Current Detection
■ Thermal Shutdown Packages W(Typ) D(Typ) H(Max)
■ Under Voltage Lockout
■ Open Drain Error Flag Output
■ Reverse-Current Protection when Switch Off
■ Flag Output Delay

Applications
USB Hub in Consumer Appliances, Note PC,
PC Peripheral Equipment, and so on.
SOP8 SOP-J8
Typical Application Circuit 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm

5V(Typ)

GND /OC1
CL
IN OUT1
CIN
/EN1
OUT2
(EN1)
Data
/EN2
/OC2
(EN2) CL

Data

Lineup
Current Limit Threshold
Control Input Logic Package Orderable Part Number
Min Typ Max
1.2A 1.65A 2.5A High BD6516F-E2
SOP8
1.2A 1.65A 2.5A Low BD6517F-E2
Reel of 2500
0.7A 1.0A 1.8A High BD2052AFJ-E2
SOP-J8
0.7A 1.0A 1.8A Low BD2042AFJ-E2

○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
1/31
TSZ22111･14･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Block Diagrams
BD6516F/BD6517F BD2042AFJ/BD2052AFJ

FLAGA /EN1 TSD1

Delay
CTRLA Gate EN1 /OC1
Logic1 Gate Delay
Logic1
Charge
OCD1 Charge
Pump1 OCD1
Pump1

VDD OUTA
IN OUT1
UVLO TSD
OUTB UVLO
CTRLB OUT2
/EN2
EN2
Charge Charge
OCD2 OCD2
Pump2 Pump2

Gate FLAGB Gate /OC2

Logic2 Logic2 Delay
Delay
GND GND
TSD2

Pin Configurations
BD6516F/BD6517F BD2042AFJ/BD2052AFJ
TOP VIEW TOP VIEW

1 CTRLA OUTA 8 1 GND /OC1 8

2 FLAGA VDD 7 2 IN OUT1 7

3 FLAGB GND 6 3 /EN1 OUT2 6

(EN1)
4 CTRLB OUTB 5 4 /EN2 /OC2 5
(EN2)

Pin Descriptions
BD6516F/BD6517F BD2042AFJ/BD2052AFJ
Pin Pin
Symbol I/O Pin Function Symbol I / O Pin Function
No. No.
Enable input.
Switch on at low level.
(BD6517F)
CTRLA
1, 4 I Low level input < 0.7V. 1 GND I Ground.
CTRLB
Switch on at high level.
(BD6516F)
High level input > 2.5V.
Error flag output.
Power supply input.
FLAGA Low at over current, thermal
2, 3 O 2 IN I Input terminal of the switch and
FLAGB shutdown.
power supply of internal circuit.
Open drain output.
Enable input.
/EN: Switch on at low level.
/EN1
(BD2042AFJ)
OUTA /EN2,
5, 8 O Switch output. 3, 4 I Low level input < 0.8V
OUTB EN1
EN: Switch on at high level.
EN2
(BD2052AFJ)
High level input > 2.0V.
Error flag output.
/OC2 Low at over current, thermal
6 GND I Ground. 5, 8 O
/OC1 shutdown.
Open drain output.
Power supply input.
OUT2
7 VDD I Input terminal of the switch and 6, 7 O Switch output.
OUT1
power supply of internal circuit.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
2/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Absolute Maximum Ratings

BD6516F/BD6517F

Parameter Symbol Rating Unit

Input Voltage VDD -0.3 to +6.0 V

CTRL Voltage VCTRL -0.3 to V DD +0.3 V

FLAG Voltage VFLAG -0.3 to +6.0 V

Output Voltage VOUT -0.3 to +6.0 V

Storage Temperature Tstg -55 to +150 ºC

(Note 1)
Power Dissipation Pd 0.67 W

BD2042AFJ/BD2052AFJ

Parameter Symbol Rating Unit

Input Voltage VIN -0.3 to +6.0 V

EN, /EN Voltage VEN, V/EN -0.3 to +6.0 V

/OC Voltage V/OC -0.3 to +6.0 V

/OC Current IS/OC 10 mA

OUT Voltage VOUT -0.3 to +6.0 V

Storage Temperature Tstg -55 to +150 ºC

(Note 1)
Power Dissipation Pd 0.67 W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ C above Ta=25 oC
o

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.

Recommended Operation Conditions

BD6516F/BD6517F
Rating
Parameter Symbol Unit
Min Typ Max
Input Voltage V DD 3.0 - 5.5 V
Operation Temperature Topr -25 - +85 °C
Continuous Output Current I LO 0 - 500 mA

BD2042AFJ/BD2052AFJ
Rating
Parameter Symbol Unit
Min Typ Max
Input Voltage V IN 2.7 - 5.5 V
Operation Temperature Topr -40 - +85 °C
Continuous Output Current I LO 0 - 500 mA

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
3/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Electrical Characteristics
BD6516F/BD6517F (V DD =5V, Ta=25 ºC, unless otherwise specified.)
Limit
Parameter Symbol Unit Conditions
Min Typ Max
V CTRL =5V(BD6516F), 0V(BD6517F)
Operating Current I DD - 100 140 μA
OUT=OPEN
V CTRL =0V(BD6516F), 5V(BD6517F)
Standby Current I STB - 0.01 2 μA
OUT=OPEN
- - 0.7 V Low Level Input Voltage
CTRL Input Voltage V CTRL
2.5 - - V High Level Input Voltage
CTRL Input Current I CTRL -1 +0.01 +1 μA V CTRL =0V or 5V
FLAG Output Resistance R FLAG - 250 450 Ω I FLAG =1mA
FLAG Output Leak Current I FLAG - 0.01 1 μA V FLAG =5V
FLAG Output Delay t/FL - 1 4 ms
- 110 150 mΩ V DD =5V, I OUT =500mA
ON-Resistance R ON
- 140 180 mΩ V DD =3.3V, I OUT =500mA
Over-Current Threshold I TH 1.2 1.65 2.5 A
Short Circuit Output Current I SC 1.2 1.65 2.2 A V OUT =0V
Output Leak Current I LEAK - - 10 μA V CTRL =0V(BD6516F), 5V(BD6517F)
Thermal Shutdown
T TS - 135 - ºC At Tj Increase
Threshold
Output Rise Time t ON1 0.1 1.3 4.0 ms R L =10Ω
Output Turn ON Delay Time t ON2 0.2 1.5 6.0 ms R L =10Ω
Output Fall Time t OFF1 - 1 20 μs R L =10Ω
Output Turn OFF Delay Time t OFF2 - 3 20 μs R L =10Ω

BD2042AFJ/BD2052AFJ (V DD =5V, Ta=25 ºC, unless otherwise specified.)

Limit
Parameter Symbol Unit Conditions
Min Typ Max
V /EN = 0V, OUT = OPEN (BD2042AFJ)
Operating Current I DD - 110 140 μA
V EN = 5V, OUT = OPEN (BD2052AFJ)
V /EN = 5V, OUT = OPEN (BD2042AFJ)
Standby Current I STB - 0.01 1 μA
V EN = 0V, OUT = OPEN (BD2052AFJ)
V /ENH ,
2.0 - - V High Input
V ENH
/EN, EN Input Voltage - - 0.8 V Low Input
V /ENL ,
V ENL - - 0.4 V Low Input 2.7V≤ V IN ≤4.5V
/EN, EN Input Current I /EN , I EN -1.0 +0.01 +1.0 μA V /EN ,V EN = 0V or V /EN ,V EN = 5V
/OC Output Low Voltage V /OC - - 0.5 V I /OC = 5mA
/OC Output Leak Current I L/OC - 0.01 1 μA V /OC = 5V
ON-Resistance R ON - 100 130 mΩ I OUT = 500mA
Over-Current Threshold I TH 0.7 1.0 1.8 A
V IN = 5V, V OUT = 0V,
Short Circuit Output Current I SC 0.7 1.0 1.3 A
C L = 100μF (RMS)
Output Rise Time t ON1 - 1.8 10 ms
Output Turn ON Time t ON2 - 2.1 20 ms
R L = 10Ω , C L = OPEN
Output Fall Time t OFF1 - 1 20 μs
Output Turn OFF Time t OFF2 - 3 40 μs
V TUVH 2.1 2.3 2.5 V Increasing V IN
UVLO Threshold
V TUVL 2.0 2.2 2.4 V Decreasing V IN

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
4/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Measurement Circuits
BD6516F/BD6517F

VDD
VDD
VCTRL CTRLA OUTA
A
VCTRL CTRLA OUTA
FLAGA VDD RL CL
FLAGA VDD 1µF
1µF FLAGB GND
FLAGB GND
VCTRL CTRLB OUTB
VCTRL CTRLB OUTB
RL CL

A. Operating Current B. CTRL Input Voltage, Output Rise / Fall Time

VDD VDD VDD

10k 10k IFLAG IFLAG

VCTRL CTRLA OUTA VCTRL CTRLA OUTA

FLAGA VDD IOUT CL FLAGA VDD

1µF 1µF
FLAGB GND FLAGB GND

VCTRL CTRLB OUTB VCTRL CTRLB OUTB

IOUT CL

C. ON-Resistance, Over Current Detection D. FLAG Output Resistance

BD2042AFJ/BD2052AFJ

VDD VDD
1µF 1µF
A
GND /OC1 GND /OC1

IN OUT1 IN OUT1
RL CL
VEN EN1 OUT2 VEN EN1 OUT2
RL CL
VEN EN2 /OC2 VEN EN2 /OC2

E. Operating Current F. EN, /EN Input Voltage, Output Rise / Fall Time
VDD
VDD VDD
1µF 10k 10k 1µF IOUT IOUT

GND /OC1 GND /OC1

IN OUT1 IN OUT1

VEN EN1 OUT2 IOUT VEN EN1 OUT2

VEN EN2 /OC2 IOUT VEN EN2 /OC2

G. ON-Resistance, Over Current Detection H. /OC Output Low Voltage

Figure 1. Measurement Circuits

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
5/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Timing Diagram

BD6517F/BD2042AFJ BD6516F/BD2052AFJ
tOFF1 tOFF1

tON1 tON1

90% 90% 90% 90%

VOUT VOUT

10% 10% 10% 10%

tON2 tON2
tOFF2 tOFF2

VCTRL VCTRL VCTRL VCTRL VCTRL VCTRL

V/EN V/ENL V/ENH VEN VENH VENL

Figure 2. Timing Diagram

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
6/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves

BD6516F/ BD6517F

120 120
Ta=25ºC VDD=5.0V
[μA]

Operating Current: I [μA]

I DD [uA]
DD [uA]

100 100
Current:: IIDD

OPERATING CURRENT : DD
80 80
OperatingCURRENT

60 60
OPERATING

40 40

20 20

0 0
2 3 4 5 6 -50 0 50 100

Supply VOLTAGE
SUPPLY Voltage :: V
VDD [V]
DD [V] Ambient TEMPERATURE
AMBIENT Temperature : :Ta[
Ta[°C
℃]

Figure 3. Operating Current Figure 4. Operating Current

vs Supply Voltage vs Ambient Temperature

1.0 1.0

Ta=25ºC VDD=5.0V
IDD[μA]

Standby Current: ISTB[μA]

[uA]

OPERATING CURRENT : IDD [uA]

0.8 0.8
Current: I:STB
Standby CURRENT

0.6 0.6

0.4 0.4
OPERATING

0.2 0.2

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY Voltage
Supply VOLTAGE : VDD[V]
:V [V] AMBIENT
Ambient TEMPERATURE : Ta[
Temperature : Ta[ ℃] ]
°C
DD

Figure 5. Standby Current vs Figure 6. Standby Current vs

Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
7/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

3.0 3.0
VCTRL[V]

VDD=5.0V
[V]

CONTROL INPUT VOLTAGE : VCTRL[V]

Ta=25ºC

CTRL Input Voltage : VCTRL[V]

CONTROL INPUT VOLTAGE : CTRL

2.5 2.5
CTRL Input Voltage : V

2.0 2.0

1.5 1.5

1.0 1.0

0.5 0.5

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY
SupplyVOLTAGE
Voltage :: V
VDD [V]
[V] AMBIENT TEMPERATURE : Ta[℃]
DD Ambient Temperature : Ta[°C]

Figure 7. CTRL Input Voltage vs Figure 8. CTRL Input Voltage

Supply Voltage vs Ambient Temperature
(BD6516F) (BD6516F)

3.0 3.0
[V]

VDD=5.0V
CTRL Input Voltage : VCTRL[V]
CTRL [V]

CONTROL INPUT VOLTAGE : VCTRL[V]

Ta=25ºC
: VCTRL

2.5 2.5
VOLTAGE: V

2.0 2.0 Low to High

INPUTVoltage

Low to High
1.5 1.5
High to Low
CTRL Input

High to Low
1.0 1.0
CONTROL

0.5 0.5

0.0 0.0
2 3 4 5 6 -50 0 50 100
SupplyVOLTAGE
SUPPLY Voltage ::VVDDDD [V]
[V] Ambient
AMBIENT Temperature: :Ta[
TEMPERATURE Ta[ ] ]
℃°C

Figure 9. CTRL Input Voltage Figure 10. CTRL Input Voltage

vs Supply Voltage vs Ambient Temperature
(BD6517F) (BD6517F)

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
8/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

200 200

Ta=25ºC
ON-Resistance : RON[mΩ]

ON-Resistance : RON[mΩ]
ON RESISTANCE : RON [mΩ]

ON RESISTANCE : RON [mΩ]

150 150
VDD=3.3V

100 100 VDD=5.0V

50 50

0 0
2 3 4 5 6 -50 0 50 100
SUPPLYVoltage
Supply VOLTAGE: V:DD
VDD [V]
[V] AMBIENT TEMPERATURE : Ta[ ]
Ambient Temperature : Ta[°C℃
]

Figure 11. ON-Resistance vs Figure 12. ON-Resistance vs

Supply Voltage Ambient Temperature

4.0 4.0
Output Rise Time: tON1[ms]

[ms]

Ta=25ºC
ON1 [us]
ON1 [us]

Output Rise Time: tON1

3.0 3.0
TURN ON RISE TIME : T
TURN ON RISE TIME : T

VDD=3.3V
2.0 2.0

1.0 VDD=5.0V
1.0

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY VOLTAGE : VDD [V]
Supply Voltage : VDD[V] AmbientTEMPERATURE
AMBIENT Temperature :: Ta[℃]
Ta[°C]

Figure 13. Output Rise Time vs Figure 14. Output Rise Time vs
Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
9/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

Output Turn ON Delay Time: tON2[ms]

4.0 4.0

Delay Time: tON2[ms]

Ta=25ºC

ON DELAY : T ON2 [us]

[us]

3.0 3.0
ON2
TURN ON DELAY : T

VDD=3.3V
2.0 2.0

Turn ON
VDD=5.0V

Output TURN
1.0 1.0

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY
Supply VOLTAGE [V]
Voltage : :VVDD[V] AmbientTEMPERATURE
AMBIENT Temperature : :Ta[ °C]
Ta[℃]
DD

Figure 15. Output Turn ON Delay Figure 16. Output Turn ON Delay
Time vs Supply Voltage Time vs Ambient Temperature

5.0 5.0
Ta=25ºC
[μs]
[μs] OFF1 [us]

OFF1 [us]

4.0 4.0
TIME : TtOFF1
TURN OFF FALL TIME : TOFF1
Output Fall Time: t

Fall Time:

3.0 3.0
OFF FALL

2.0 2.0
VDD=3.3V
Output
TURN

1.0 1.0
VDD=5.0V
0.0 0.0
2 3 4 5 6 -50 0 50 100
Supply
SUPPLYVoltage
VOLTAGE:V
:V
DD
DD[V]
[V] Ambient TEMPERATURE
AMBIENT Temperature : Ta[ ℃]]
: Ta[°C

Figure 17. Output Fall Time vs Figure 18. Output Fall Time vs
Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
10/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

TOFF2[us]tOFF2[μs]
Output Turn OFF Delay Time: tOFF2[μs]

5.0 5.0
Ta=25ºC
TURN OFF DELAY : TOFF2[us]

4.0 4.0

Delay: Time:
VDD=3.3V
3.0 3.0

OFF DELAY
2.0

Turn OFF
2.0
VDD=5.0V

Output TURN
1.0 1.0

0.0 0.0
2 3 4 5 6 -50 0 50 100
Supply
SUPPLYVoltage
VOLTAGE: V:DD [V][V]
VDD AmbientTEMPERATURE
AMBIENT Temperature :: Ta[
Ta[℃°C] ]

Figure 19. Output Turn OFF Delay Figure 20. Output Turn OFF Delay
Time vs Supply Voltage Time vs Ambient Temperature
: ISC[A]
Circuit Output Current : I [A]

3.0 3.0
SHORT CIRCUIT CURRENT : I [A]SC

Ta=25ºC
: ISC [A]
SC

Current
CURRENT

2.0 2.0
VDD=5.0V
CIRCUITOutput

VDD=3.3V
SHORTCircuit

1.0 1.0
Short
Short

0.0 0.0
2 3 4 5 6 -50 0 50 100
Supply Voltage
SUPPLY VOLTAGE :V
:VDD
DD [V]
[V] AmbientTEMPERATURE
AMBIENT Temperature : :Ta[ ℃]]
Ta[°C

Figure 21. Short Circuit Output

Figure 22. Short Circuit Output
Current vs Supply Voltage
Current vs Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
11/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

[Ω] [Ω]
[Ω]

500 500

RFLAG
[Ω]
FLAG

Ta=25ºC
FLAG OUTPUT RESISTANCE : RFLAG

: RFLAG
FLAG Output Resistance: R

400 400

Resistance:
RESISTANCE
300 300
VDD=3.3V

Output
200 200

OUTPUT
VDD=5.0V
100

FLAG
100

FLAG
0 0
2 3 4 5 6 -50 0 50 100
Supply
SUPPLYVoltage
VOLTAGE: V:DD
VDD[V]
[V] AmbientTEMPERATURE
AMBIENT Temperature: :Ta[ ℃]]
Ta[°C

Figure 23. FLAG Output Resistance Figure 24. FLAG Output Resistance
vs Supply Voltage vs Ambient Temperature

4 4
FLAG Output Delay: t/FL [ms]

FLAG Output Delay: t/FL [ms]

VDD=5.0V
FL [ms]

Ta=25ºC
FLAG OUTPUT DELAY : TDFL[ms]

3 3
FLAG OUTPUT DELAY : TD

2 2

1 1

0
0
2 3 4 5 6
-50 0 50 100
SUPPLY VOLTAGE : VDD [V]
Supply Voltage : VDD[V] AmbientTEMPERATURE
AMBIENT Temperature : :Ta[ ℃]]
Ta[°C

Figure 25. FLAG Output Delay Figure 26. FLAG Output Delay
vs Supply Voltage vs Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
12/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

BD2042AFJ/ BD2052AFJ

Ta=25ºC VIN=5.0V
Operating Current : IDD[μA]

Operating Current : IDD[μA]

Supply Voltage : VIN[V] Ambient Temperature : Ta[°C]

Figure 27. Operating Current vs Figure 28. Operating Current vs

Supply Voltage Ambient Temperature
(EN, /EN Enable) (EN, /EN Enable)

1.0 1.0
Ta=25ºC VIN=5.0V
I STB[uA]

0.8 0.8
Standby Current : ISTB[μA]

CURRENT : ISTB: [μA]

0.6 0.6
Standby Current

0.4 0.4
OPERATING

0.2 0.2

0.0 0.0
2 3 4 5 6 -50 0 50 100
Supply Voltage : VIN[V] AMBIENT
AmbientTEMPERATURE : Ta[℃]
Temperature : Ta[ °C]

Figure 29. Standby Current vs Figure 30. Standby Current vs

Supply Voltage Ambient Temperature
(EN, /EN Disable) (EN, /EN Disable)

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
13/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

2.0
VEN, V:/EN[V]

Ta=25ºC VIN=5.0V

Enable Input Voltage: VEN, V/EN[V]

VOLTAGE

1.5
Low to High
Low to High
Voltage:
VEN, V/EN [V] 0

High to Low
High to Low
INPUT

1.0
Input
ENABLE
Enable

0.5

0.0
2 3 4 5 6
SUPPLY VOLTAGE
Supply Voltage IN [V]
: V: V[V] Ambient Temperature : Ta[°C]
IN

Figure 31. EN, /EN Input Voltage Figure 32. EN, /EN Input Voltage
vs Supply Voltage vs Ambient Temperature

0.5
Ta=25ºC VIN=5.0V
V/OC[V]

/OC Output Low Voltage: V/OC[V]

VOLTAGE :

0.4
Voltage:

0.3
V/OC [V]
LowLOW
OUTPUT

0.2
Output

0.1
/OC/OC

0.0
2 3 4 5 6
SUPPLY VOLTAGE : VDD [V]
Supply Voltage : VIN [V]
Ambient Temperature : Ta[°C]

Figure 33. /OC Output Low Voltage Figure 34. /OC Output Low Voltage
vs Supply Voltage vs Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
14/31
TSZ22111･15･001 21.Aug.2014 Rev.003
 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

2.0 2
Ta=25ºC VIN=5.0V

ON RESISTANCE :RON[mΩ]
/OC Output Delay: t/OC[ms]
1.5
/OC Output Delay: t/OC[ms]

1.5
ON RESISTANCE :
RON[mΩ]

1.0 1

0.5 0.5

0.0 0
2 3 4 5 6 -50 0 50 100
SUPPLY
Supply Voltage : V [V]DD[V]
VOLTAGE : V Ambient TEMPERATURE
AMBIENT Temperature : Ta[ °C]
: Ta[℃]
IN

Figure 35. /OC Output Delay vs Figure 36. /OC Output Delay vs
Supply Voltage Ambient Temperature

200 200
Ta=25ºC VIN=5.0V

150 150
ON-Resistance : RON[mΩ]

ON-Resistance : RON[mΩ]
ON RESISTANCE :
RON[mΩ]

100 100

50 50

0 0
2 3 4 5 6 -50 0 50 100
SUPPLY VOLTAGE : VDD [V] AMBIENT TEMPERATURE
Ambient Temperature : Ta[:°C
Ta[℃]
]
Supply Voltage : V [V]
IN

Figure 37. ON-Resistance vs Figure 38. ON-Resistance vs

Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
15/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

2.0 2.0
SC [A]

Ta=25ºC VIN=5.0V

CURRENT :ITH[A]
Over Current Threshold: ITH[A]
SHORT CIRCUIT CURRENT :I

1.5 1.5

Threshold:
1.0 1.0

SHORT CIRCUIT
Over Current
0.5 0.5

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY VOLTAGE : VIN [V]
Supply Voltage : V [V]
AMBIENT TEMPERATURE : Ta[℃]
Ambient Temperature : Ta[°C]
IN

Figure 39. Over Current Threshold vs Figure 40. Over Current Threshold vs
Supply Voltage Ambient Temperature

2.0 2.0
SC [A]

Ta=25ºC VIN=5.0V
Short Circuit Output Current : ISC[A]

Short Circuit Output Current : ISC[A]

SHORT CIRCUIT CURRENT :I

1.5 1.5

1.0 1.0

0.5 0.5

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY VOLTAGE : VIN [V]
Supply Voltage : V [V] AMBIENT TEMPERATURE : Ta[℃]
Ambient Temperature : Ta[°C]
IN

Figure 41. Short Circuit Output Current vs Figure 42. Short Circuit Output Current vs
Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
16/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

5.0
Ta=25ºC VIN=5.0V
4.0
Output Rise Time : tON1[ms]

Output Rise Time : tON1[ms]

RISE TIME :
3.0

TON1[ms]
2.0

1.0

0.0
-50 0 50 100
Supply Voltage : VIN[V] AMBIENTTemperature
Ambient TEMPERATURE: Ta[: °C
Ta[]℃]

Figure 43. Output Rise Time vs Figure 44. Output Rise Time vs
Supply Voltage Ambient Temperature

5.0
Ta=25ºC VIN=5.0V
Output Turn ON Time: tON2[ms]

Output Turn ON Time: tON2[ms]

ON2 [ms]

4.0

3.0
TURN ON TIME :T

2.0

1.0

0.0
-50 0 50 100
Supply Voltage : VIN[V] Ambient Temperature
AMBIENT TEMPERATURE : Ta[: °C]
Ta[℃]

Figure 45. Output Turn ON Time vs Figure 46. Output Turn ON Time vs
Supply Voltage Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
17/31
TSZ22111･15･001 21.Aug.2014 Rev.003
 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

5.0

Ta=25ºC VIN=5.0V
4.0
Output Fall Time : tOFF1[µs]

Output Fall Time : tOFF1[µs]

FALL TIME :

3.0
TOFF1[us]

2.0

1.0

0.0
2 3 4 5 6
SUPPLY
Supply VOLTAGE
Voltage : VIN: [V]
VIN [V] Ambient Temperature : Ta[°C]

Figure 47. Output Fall Time vs Figure 48. Output Fall Time vs
Supply Voltage Ambient Temperature

6.0 5.0
Ta=25°C VIN=5.0V
Output Turn OFF Time: tOFF2[µs]

[µs]

5.0
4.0
OFF TIME :OFF2
TURN OFF TIME :

Time: t

4.0
3.0
TOFF2[us]

TOFF2[us]

3.0
Turn OFF

2.0
Output TURN

2.0

1.0 1.0

0.0 0.0
2 3 4 5 6 -50 0 50 100
SUPPLY
Supply VOLTAGE
Voltage : VIN:[V]
VIN [V] AMBIENT TEMPERATURE : Ta[
Ambient Temperature : Ta[°C] ℃]

Figure 49. Output Turn OFF Time Figure 50. Output Turn OFF Time
vs Supply Voltage vs Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
18/31
TSZ22111･15･001 21.Aug.2014 Rev.003
 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Performance Curves - continued

2.5 1.0
UVLOH ,
UVLO Threshold : VTUVH, VTUVL[V]

UVLO Hysteresis Voltage: VHYS[V]

2.4 0.8
UVLO THRESHOLD VOLTAGE : V

VTUVH
2.3 0.6
V UVLOL [V]

VTUVL
2.2 0.4

2.1 0.2

2.0 0.0
-50 0 50 100 -50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Ambient Temperature : Ta[°C] Ambient Temperature : Ta[°C]
AMBIENT TEMPERATURE : Ta[℃]

Figure 51. UVLO Threshold Voltage vs Figure 52. UVLO Hysteresis Voltage vs
Ambient Temperature Ambient Temperature

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
19/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Wave Forms

VCTRL VEN
(5V/div.) (5V/div.)

VFLAG V/OC
(5V/div.) (5V/div.)
VOUT VOUT
(5V/div.) (5V/div.)

VDD=5V
VIN=5V
RL=47Ω
RL=10Ω
CL=47μF
IOUT CL=100μF
IOUT
(0.2A/div.) (0.2A/div.)

TIME(200ms/div.)
TIME(200ms/div.)

Figure 54. Output Rise / Fall Characteristic

Figure 53. Output Rise / Fall Characteristic (BD2052AFJ)
(BD6516F)

VFLAG
(5V/div.) V/OC
(5V/div.)

VOUT
(5V/div.) VOUT
(5V/div.)

VDD=5V VIN=5V
IOUT CL=47μF IOUT
(0.5A/div.) (0.5A/div.)

TIME (2ms/div.) TIME (2ms/div.)

Figure 55. Over-Current Response Figure 56. Over-Current Response

Ramped Load Ramped Load
(BD6516F) (BD2052AFJ)

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
20/31
TSZ22111･15･001 21.Aug.2014 Rev.003
 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Wave Forms - continued

VCTRL
(5V/div.) VEN
(5V/div.)

VFLAG V/OC
(5V/div.) (5V/div.)
VOUT VOUT
(5V/div.) (5V/div.)

1ms Delay
VDD=5V 1.3ms Delay VIN=5V
IOUT CL=47μF IOUT CL=100μF
(0.5A/div.) (0.5A/div.)

TIME (2ms/div.) TIME (2ms/div.)

Figure 58. Over-Current Response

Figure 57. Over-Current Response
Enable to 1Ω Short Circuit
Enable to Short Circuit
(BD2052AFJ)
(BD6516F)

VFLAG V/OC
(5V/div.) (5V/div.)

VOUT VOUT
(5V/div.) (5V/div.)

VDD=5V
CL=47μF VIN=5V
CL=100μF

Thermal Shutdown Thermal Shutdown

IOUT IOUT
(2A/div.) (2A/div.)

TIME (100ms/div.) TIME (200ms/div.)

Figure 59. Over-Current Response Figure 60. Over-Current Response

1Ω Load Connected at Enable 1Ω Load Connected at Enable
(BD6516F) (BD2052AFJ)

Regarding the output rise/fall and over current detection characteristics of BD6517F, BD2042AFJ refer to the characteristic of BD6516F, BD2052AFJ.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
21/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Typical Application Circuit

5V(Typ)
10k to100k

10k to100k

VBUS
IN OUT
ON/OFF GND /OC1
D+ CL
OC IN OUT1
D- CIN
/EN1
OC OUT2
Regulator (EN1)
GND Data
/EN2
ON/OFF /OC2
(EN2) CL
Data BD2042AFJ/52AFJ

USB Controller
Data

Application Information
Excessive current flow due to output short circuit, or so, may induce ringing because of the presence of an inductance
between the supply line and IC. This event may cause IC malfunction during operation. To avoid this, connect a bypass
capacitor between IN and GND pins. 1μF or higher is recommended.

Pull up flag output (/OC) by resistance value from 10kΩ to 100kΩ.

Set up values of C L which satisfies the application.

The application circuit above does not guarantee its operation.

When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as IC transient characteristics.

Functional Description

1. Switch Operation
VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. The VDD(IN) pin is
also used as a power source for internal control circuit.
When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT are connected. In a normal condition,
current flows from VDD to OUT. If the voltage at OUT is higher than VDD, current flows from OUT to VDD since the
There is no parasitic diode and it is possible to prevent current flow from OUT to VDD(IN).

2. Thermal Shutdown (TSD)

Thermal shutdown circuit turns off the switch and outputs an error flag when the junction temperature in the chip exceeds
a threshold temperature. The thermal shutdown circuit works when either of the two control signals is active.
In BD6516F/BD6517F, the switches of both OUTA and OUTB turn off and output error flags;. BD2042AFJ/ BD2052AFJ has dual
threshold temperature for its thermal shutdown. Since thermal shutdown works at a lower junction temperature, only the
switch with an over current state turns off whenever over current occurs and outputs an error flag.
Thermal shutdown detection has hysteresis. Therefore, when the junction temperature goes down, switch turns on and
error flag is cancelled. Unless the increase of the chip’s temperature is removed or the output of power switch is turned
off, this operation repeats.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
22/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

3. Over-Current Detection/Limit Circuit

The over current detection circuit limits current (I SC ) and outputs an error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (CTRL, EN signal is active).

(1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
(2) When the output short-circuits or high-current load is connected while the switch is on, very large current flows until
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.

4. Under Voltage Lockout (UVLO)

UVLO circuit turns off the switch to prevent malfunction when the supply voltage is below the UVLO threshold level, The
UVLO circuit works when either of two control signals is active.
◎BD2042AFJ/BD2052AFJ
UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V(Typ). If the V IN drops below 2.2V(Typ)
while the switch is ON, then UVLO shuts OFF the switch. UVLO has hysteresis of 100mV(Typ).

5. Error Flag (/OC) Output

Error flag output is an N-MOS open drain output.
At detection of over current limit and thermal shutdown, /OC outputs a low level signal. Error flag output (/OC) at over
current detection has a delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch ON, or applying external power supplies. If fault flag output is unused, /OC pin should be connected to open or
ground line.

VCTRL
V CTRL
CTRL
V
VEN
EN

VOUT Output Short

Output shortcircuit
Circuit
V
VOUT
OUT

Thermal shut down

Thermal Shutdown
IOUT
IOUT
OUT

VFLAG
V FLAG
FLAG
V
V/OC
/OC
FLAG
delay Output Delay

Figure 61. BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ Over Current Detection, Thermal Shutdown Timing Diagram
(V CTRL , V /EN of BD6517F/BD2042AFJ Active Low)

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
23/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Power Dissipation
(SOP8, SOP-J8)

700

600
POWER DISSIPATION : Pd [mW]

500
Power Dissipation: Pd[mW]

400

300

200

100

0
0 25 50 75 100 125 150
AMBIENT
AmbientTEMPERATURE
Temperature:: TaTa[°C]
[℃]

70mm x 70mm x 1.6mm Glass Epoxy Board

Figure 62. Power Dissipation Curve

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
24/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

I/O Equivalence Circuit

BD6516F/BD6517F
Symbol Pin No. Equivalence Circuit

CTRLA
CTRLA CTRLB
1, 4
CTRLB

FLAGA
FLAGB
FLAGA
2, 3
FLAGB

OUTA
OUTA
5, 8 OUTB
OUTB

BD2042AFJ/BD2052AFJ
Symbol Pin No Equivalence Circuit
/EN1(EN1)
/EN2(EN2)
/EN1(EN1)
3, 4
/EN2(EN2)

/OC1
/OC2
/OC1
5, 8
/OC2

OUT1
OUT1 OUT2
6, 7
OUT2

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
25/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
26/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Operational Notes - continued

11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E

P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 63. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.

15. Thermal design

Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
27/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Ordering Information

B D 6 5 1 x F - E2

Part Number Package Packaging and forming specification

6516 F: SOP8 E2: Embossed tape and reel
6517 (SOP8)

B D 2 0 x 2 A F J - E2

Part Number Package Packaging and forming specification

2042 FJ:SOP-J8 E2: Embossed tape and reel
2052 (SOP-J8)

Marking Diagrams

SOP8 (TOP VIEW) SOP-J8 (TOP VIEW)

Part Number Marking Part Number Marking

LOT Number LOT Number

1PIN MARK 1PIN MARK

Part Number Part Number Marking Part Number Part Number Marking
BD6516F D6516 BD2042AFJ D042A
BD6517F D6517 BD2052AFJ D052A

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
28/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Physical Dimension, Tape and Reel Information

Package Name SOP8

(Max 5.35 (include. BURR))

(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
29/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Physical Dimension, Tape and Reel Information – continued

Package Name SOP-J8

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
30/31
TSZ22111･15･001 21.Aug.2014 Rev.003
BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet

Revision History

Date Revision Changes

11.Mar.2013 001 New Release
25.Jun.2013 002 Changed character color from RED to BLACK on page 6.
Applied the ROHM Standard Style and improved understandability.
21.Aug.2014 003
Delete BD6512F and BD6513F.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300240-1-2
31/31
TSZ22111･15･001 21.Aug.2014 Rev.003
 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.