Lmx24-N, Lm2902-N Low-Power, Quad-Operational Amplifiers: 1 Features 3 Description
Lmx24-N, Lm2902-N Low-Power, Quad-Operational Amplifiers: 1 Features 3 Description
LM124-N, LM224-N
LM2902-N, LM324-N
SNOSC16D – MARCH 2000 – REVISED JANUARY 2015
– Power Drain Suitable for Battery Operation (1) For all available packages, see the orderable addendum at
the end of the datasheet.
– In the Linear Mode the Input Common-Mode,
Voltage Range Includes Ground and the Schematic Diagram
Output Voltage
– Can Swing to Ground, Even Though Operated
from Only a Single Power Supply Voltage
– Unity Gain Cross Frequency is Temperature
Compensated
– Input Bias Current is Also Temperature
Compensated
2 Applications
• Transducer Amplifiers
• DC Gain Blocks
• Conventional Op Amp Circuits
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM124-N, LM224-N
LM2902-N, LM324-N
SNOSC16D – MARCH 2000 – REVISED JANUARY 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 11
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 11
3 Description ............................................................. 1 8 Application and Implementation ........................ 13
4 Revision History..................................................... 2 8.1 Application Information............................................ 13
8.2 Typical Applications ............................................... 13
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 23
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 23
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 23
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 23
6.4 Thermal Information .................................................. 5 11 Device and Documentation Support ................. 24
6.5 Electrical Characteristics: LM124A/224A/324A ........ 5 11.1 Related Links ........................................................ 24
6.6 Electrical Characteristics: LM124-N/224-N/324- 11.2 Trademarks ........................................................... 24
N/2902-N ................................................................... 6 11.3 Electrostatic Discharge Caution ............................ 24
6.7 Typical Characteristics .............................................. 8 11.4 Glossary ................................................................ 24
7 Detailed Description ............................................ 11 12 Mechanical, Packaging, and Orderable
7.1 Overview ................................................................. 11 Information ........................................................... 24
7.2 Functional Block Diagram ....................................... 11
4 Revision History
Changes from Revision C (November 2012) to Revision D Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1
J Package
14-Pin CDIP
Top View
D Package
14-Pin SOIC
Top View
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
OUTPUT1 1 O Output, Channel 1
INPUT1- 2 I Inverting Input, Channel 1
INPUT1+ 3 I Noninverting Input, Channel 1
V+ 4 P Positive Supply Voltage
INPUT2+ 5 I Nonnverting Input, Channel 2
INPUT2- 6 I Inverting Input, Channel 2
OUTPUT2 7 O Output, Channel 2
OUTPUT3 8 O Output, Channel 3
INPUT3- 9 I Inverting Input, Channel 3
INPUT3+ 10 I Noninverting Input, Channel 3
GND 11 P Ground or Negative Supply Voltage
INPUT4+ 12 I Noninverting Input, Channel 4
INPUT4- 13 I Inverting Input, Channel 4
OUTPUT4 14 O Output, Channel 4
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See .
LM124-N/LM224-N/LM324-N
LM2902-N
LM124A/LM224A/LM324A
MIN MAX MIN MAX UNIT
Supply Voltage, V+ 32 26 V
Differential Input Voltage 32 26 V
Input Voltage −0.3 32 −0.3 26 V
Input Current (VIN < −0.3 V) (3) 50 50 mA
Power PDIP 1130 1130 mW
Dissipation (4)
CDIP 1260 1260 mW
SOIC Package 800 800 mW
Output Short-Circuit to GND +
V ≤ 15 V and TA = 25°C Continuous Continuous
(One Amplifier) (5)
Lead Temperature (Soldering, 10 seconds) 260 260 °C
Dual-In-Line Soldering (10 seconds) 260 260 °C
Soldering Package
Information Small Vapor Phase (60 seconds) 215 215 °C
Outline
Infrared (15 seconds) 220 220 °C
Package
Storage temperature, Tstg –65 150 –65 150 °C
(1) Refer to RETS124AX for LM124A military specifications and refer to RETS124X for LM124-N military specifications.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of
the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is
also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the op amps to go to
the V+voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and
normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than −0.3 V (at 25°C).
(4) For operating at high temperatures, the LM324-N/LM324A/LM2902-N must be derated based on a 125°C maximum junction
temperature and a thermal resistance of 88°C/W which applies for the device soldered in a printed circuit board, operating in a still air
ambient. The LM224-N/LM224A and LM124-N/LM124A can be derated based on a 150°C maximum junction temperature. The
dissipation is the total of all four amplifiers—use external resistors, where possible, to allow the amplifier to saturate of to reduce the
power which is dissipated in the integrated circuit.
(5) Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of 15 V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) These specifications are limited to −55°C ≤ TA ≤ +125°C for the LM124-N/LM124A. With the LM224-N/LM224A, all temperature
specifications are limited to −25°C ≤ TA ≤ +85°C, the LM324-N/LM324A temperature specifications are limited to 0°C ≤ TA ≤ +70°C, and
the LM2902-N specifications are limited to −40°C ≤ TA ≤ +85°C.
(2) VO ≃ 1.4V, RS = 0 Ω with V+ from 5 V to 30 V; and over the full input common-mode range (0 V to V+ − 1.5 V) for LM2902-N, V+ from 5
V to 26 V.
(3) The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
(4) The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3 V (at 25°C). The
upper end of the common-mode voltage range is V+ − 1.5 V (at 25°C), but either or both inputs can go to 32 V without damage (26 V for
LM2902-N), independent of the magnitude of V+.
(5) Due to proximity of external components, insure that coupling is not originating via stray capacitance between these external parts. This
typically can be detected as this type of capacitance increases at higher frequencies.
(6) Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of 15 V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM124-N LM224-N LM2902-N LM324-N
LM124-N, LM224-N
LM2902-N, LM324-N
SNOSC16D – MARCH 2000 – REVISED JANUARY 2015 www.ti.com
VIN+ = +1V,
Source VIN− = 0V, 10 20 10 20 10 20
Output V+ = 15V
VO = 2 V mA
Current VIN− = +1V, 10 15 5 8 5 8
Sink VIN+ = 0V,
V+ = 15V
(1) These specifications are limited to −55°C ≤ TA ≤ +125°C for the LM124-N/LM124A. With the LM224-N/LM224A, all temperature
specifications are limited to −25°C ≤ TA ≤ +85°C, the LM324-N/LM324A temperature specifications are limited to 0°C ≤ TA ≤ +70°C, and
the LM2902-N specifications are limited to −40°C ≤ TA ≤ +85°C.
(2) VO ≃ 1.4V, RS = 0 Ω with V+ from 5 V to 30 V; and over the full input common-mode range (0 V to V+ − 1.5 V) for LM2902-N, V+ from 5
V to 26 V.
(3) The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
(4) The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3 V (at 25°C). The
upper end of the common-mode voltage range is V+ − 1.5 V (at 25°C), but either or both inputs can go to 32 V without damage (26 V for
LM2902-N), independent of the magnitude of V+.
(5) Due to proximity of external components, insure that coupling is not originating via stray capacitance between these external parts. This
typically can be detected as this type of capacitance increases at higher frequencies.
6 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
V+ = 30 V (LM2902-N, RL = 2 kΩ 26 26 22
Output VOH V
Voltage V+ = 26 V) RL = 10 kΩ 27 28 27 28 23 24
Swing
VOL V+ = 5 V, RL = 10 kΩ 5 20 5 20 5 100 mV
VIN+
= 1 V,
Source VO = 2 V VIN−
= 0 V, 10 20 10 20 10 20 mA
+
Output V = 15 V
Current VIN− = 1 V,
Sink VIN+ = 0 V, 5 8 5 8 5 8 mA
V+ = 15 V
(6) Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of 15 V,
continuous short-circuits can exceed the power dissipation ratings and cause eventual destruction. Destructive dissipation can result
from simultaneous shorts on all amplifiers.
Figure 7. Voltage Follower Pulse Response Figure 8. Voltage Follower Pulse Response (Small Signal)
Figure 9. Large Signal Frequency Response Figure 10. Output Characteristics Current Sourcing
Figure 11. Output Characteristics Current Sinking Figure 12. Current Limiting
Figure 13. Input Current (LM2902-N Only) Figure 14. Voltage Gain (LM2902-N Only)
7 Detailed Description
7.1 Overview
The LM124-N series are op amps which operate with only a single power supply voltage, have true-differential
inputs, and remain in the linear mode with an input common-mode voltage of 0 VDC. These amplifiers operate
over a wide range of power supply voltage with little change in performance characteristics. At 25°C amplifier
operation is possible down to a minimum supply voltage of 2.3 VDC.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 19. LED Driver Figure 20. “BI-QUAD” RC Active Bandpass Filter
Figure 28. Pulse Generator Figure 29. High Compliance Current Sink
Figure 30. Low Drift Peak Detector Figure 31. Comparator With Hysteresis
VO = VR
Figure 32. Ground Referencing a Differential Input Figure 33. Voltage Controlled Oscillator Circuit
Signal
Q=1 AV = 2
Figure 34. Photo Voltaic-Cell Amplifier Figure 35. DC Coupled Low-Pass RC Active Filter
Figure 41. Using Symmetrical Amplifiers to Reduce Input Current (General Concept)
fO = 1 kHz Q = 25
10 Layout
GND
GND
GND
VIND
GND
VINC
2 2 2 2
GND VOUTA VOUTD GND
VOUTA 1: VOUTA 14: VOUTD VOUTD
1
VINA 1 1 1 1 1
IN-A IN-A 13: IN-D IN-D IN-D VIND
IN-A 2: IN-A IN-D
2
IN+A 2
IN+A 3: IN+A 12: IN+D IN+D
IN+D
1 2
GND
GND V+
V+ 4: V+ 11: GND GND
NC
VI
2 1
2 IN+B 5: IN+B 10: IN+C IN+C
IN+C VINC
VINC
IN+B
VINB
VOUTD
GND GND
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 23-May-2025
PACKAGING INFORMATION
Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)
LM124AJ/PB Active Production CDIP (J) | 14 25 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 LM124AJ
LM124J/PB Active Production CDIP (J) | 14 25 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 LM124J
LM224J Active Production CDIP (J) | 14 25 | TUBE No Call TI Level-1-NA-UNLIM -25 to 85 LM224J
LM2902M/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LM2902M
LM2902M/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM2902M
LM2902MT/NOPB Active Production TSSOP (PW) | 14 94 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM290
2MT
LM2902MT/NOPB.B Active Production TSSOP (PW) | 14 94 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM290
2MT
LM2902MTX/NOPB Active Production TSSOP (PW) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM290
2MT
LM2902MTX/NOPB.B Active Production TSSOP (PW) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM290
2MT
LM2902MX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LM2902M
LM2902MX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM2902M
LM2902N/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes Call TI | Nipdau Level-1-NA-UNLIM -40 to 85 LM2902N
LM2902N/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2902N
LM324AM/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324AM
LM324AM/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM324AM
LM324AMX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324AM
LM324AMX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM324AM
LM324AN/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM324AN
LM324AN/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM324AN
LM324M/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324M
LM324M/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM324M
LM324MT/NOPB Active Production TSSOP (PW) | 14 94 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM324
MT
LM324MT/NOPB.B Active Production TSSOP (PW) | 14 94 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM324
MT
LM324MTX/NOPB Active Production TSSOP (PW) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM324
MT
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 23-May-2025
Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)
LM324MTX/NOPB.B Active Production TSSOP (PW) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM324
MT
LM324MX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM324M
LM324MX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM324M
LM324N/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes Call TI | Nipdau Level-1-NA-UNLIM 0 to 70 LM324N
LM324N/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM324N
(1)
Status: For more details on status, see our product life cycle.
(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 23-May-2025
• Automotive : LM2902-Q1
• Enhanced Product : LM2902-EP
• Space : LM124-SP
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-May-2025
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-May-2025
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-May-2025
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
7 8
C SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
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EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A
1 14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
7 8
SYMM
METAL
4214771/A 05/2017
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PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
C
6.2
TYP SEATING PLANE
5.8
A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1
8.75 2X
8.55 7.62
NOTE 3
7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4
0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE
0.25
0 -8 1.27 0.10
0.40
DETAIL A
TYPICAL
4220718/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.
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EXAMPLE BOARD LAYOUT
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
14X (0.6)
12X (1.27)
SYMM
7 8
(R0.05)
TYP
(5.4)
4220718/A 09/2016
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(5.4)
4220718/A 09/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1
2X
5.1 3.9
4.9
NOTE 3
4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220202/B 12/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
12X (0.65)
7 8
(5.8)
4220202/B 12/2023
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
12X (0.65)
7 8
(5.8)
4220202/B 12/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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