DR. A.P.J.

ABDUL KALAM TECHNICAL

UNIVERSITY, LUCKNOW

Evaluation Scheme & Syllabus for

Master of Technology
(Electronics Design and Technology)

(Effective from the Session: 2019-20)

 COURSE AND EXAMINATION SCHEME
M.Tech (Electronics Design and Technology) Regular Semester I

S. Course Subject Periods Credit Evaluation Scheme Subject

N Code Theory Practical Total

Theory L Tut. Pr. CT TA ESE TA ESE

1 MDT Power Electronics 3 0 0 3 20 10 70 - - 100
101 System Design
2 MDT Design of Digital 3 0 0 3 20 10 70 - - 100
102 Systems
3 MDT Electronics Product 3 0 0 3 20 10 70 - - 100
103 Design
4 MDT Electromagnetic & 3 0 0 3 20 10 70 - - 100
104 Radio Frequency
Interference Compatible
System Design
5 Open Elective 1 3 0 0 3 20 10 70 - - 100
6 MDTL Power Electronic Lab 0 0 3 2 - - - 20 30 50
151
7 MDTL Digital System Design 0 0 3 1 - - - 20 30 50
152 Lab
Total 15 0 6 18 - - - - - 600

Semester II
S. Course Subject Periods Credit Evaluation Scheme Subject
N Code Theory Practical Total

Theory L Tut. Pr. CT TA ESE TA ESE

1 MDT Analog and Data 3 0 3 3 20 10 70 - - 100
201 Conversion Systems
2 MDT Embedded System 3 0 0 3 20 10 70 - - 100
202 Design
3 MDT VLSI Design 3 0 0 3 20 10 70 - - 100
203
4 MDT Reliability of Electronic 3 0 0 3 20 10 70 - - 100
204 Equipment’s
5 Open Elective 2 3 0 0 3 20 10 70 - - 100
6 MDTL Embedded System Lab 0 0 3 2 - - - 20 30 50
251
7 MDTL Seminar I 0 0 3 1 - - - 50 - 50
252
Total 15 0 6 18 - - - - - 600

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 Semester III
S. Course Subject Periods Credit Evaluation Scheme Subject
N Code Theory Practical Total

L Tut. Pr. CT TA ESE TA ESE

1 MDTL Seminar II 0 0 6 3 - - - 100 - 100
351
2 MDTL Dissertation 0 0 30 15 - - - 200 300 500
352
Total 0 0 36 18 - - - - - 600

Semester IV
S. Course Subject Periods Credit Evaluation Scheme Subject
N Code Theory Practical Total

L Tut. Pr. CT TA ESE TA ESE

1 MDTL Dissertation 0 0 36 18 - - - 200 400 600
451 (Final )
Total 0 0 36 18 - - - - - 600

MDT-101 POWER ELECTRONICS SYSTEM DESIGN:

Characteristics & protection of power devices such as - GTOs, IGBTs, RCTs, MCTs,
SITHs, LASCRs, MOSFET, Solar Renewable energy systems, Design of Transformers,
selection of core material, insulating material and wires, Design of high frequency
transformer, Design of inductors, Linear power supply, Switch Mode Power
Supplies, Converter topology - buck, boost, buck-boost, derived converter topologies,
flyback converter, forward converter, push-pull converter, half Bridge converter, full
Bridge converter, special converters, PWM control techniques, study of PWM control
ICs and driver IC’s, design of base drive circuits, design of input section, output section
& control section, protection circuit design for power supplies, design concept of
uninterrupted power supplies, CVT.

RECOMMENDED BOOKS:
 George Chryssis, “High Frequency Switching Power Supplies: Theory & Design”
Mc Graw Hill Book Co., 1984.
 K. Kitsum, “Switch Mode Power Conversion - Basic Theory and Design” Marcel
Deckker Inc., 1984.
 N. Radhakrishnan and S.R. Bhat, “Design and Technology of Low Power
Transformers and Inductors ” CEDT, July 1988.
 Rashied, Power Electronics Circuit Device and Application.

MDT-102 DESIGN OF DIGITAL SYSTEMS:

Introduction to Digital design; Variable entered mapping (VEM), plotting theory and
reading theory, minimizing function of more than six variables, Hierarchical design,
controller (FSM), case study, FSM issues, timing issues, pipelining, resource sharing,
testability, synchronization, fault analysis in combinational circuit, setup/hold time of
various types of flip-flops, synchronization between multiple clock domains, reset

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 recovery, proper resets. VHDL: different models, simulation cycles, process, concurrent
and sequential statements, loops, delay models, library, packages, functions, procedures,
coding for synthesis, test bench. FPGA: logic block and routing architecture, design
methodology, special resources, programming FPGA, constraints, timing closure, case
study.

RECOMMENDED BOOKS:
 Wakerly, J. F., Digital Design: Principles and Practices 4th Edition, Pearson, 2008
 Skahil, K., VHDL For Programmable Logic 1st Edition, Pearson, 2004
 J. Bhasker, VHDL Primer
 David Pellerin, Edward A. Thibault Ph.D, Practical FPGA Programming in C 22
Apr 2005

MDT-103 ELECTRONICS PRODUCT DESIGN:

Introduction to Industrial Design, the design process, product design methodology,
product planning, anatomy of design process, Aesthetics, Elements of design,
Ergonomics, ergonomic issues in designing electronic products, design of controls,
design of display. Ergonomics & Aesthetics consideration for development of control
panel, Engineering considerations for Control panel layouts, layout of components,
control mountings, structural design, Overview of PCB design ,general considerations for
PCB layout, rules and parameters, Design rules for analog circuit PCB, Design rules for
digital circuit PCB, Design rules for PCBs

RECOMMENDED BOOKS:
 Dan Cuffaro, Isaac Zaksenberg, The Industrial Design 2013
 A.K. Chitale, R.C. Gupta, Product design and manufacturing, Prentice, Hall of
India.
 Kevin Otto, Kristin Wood, Product Design.
 C.H. Flurschiem, Industrial Design in Engineering Design Council London and
Springer Verlog, 1993.

MDT-104 ELECTROMAGNETIC & RADIO FREQUENCY INTERFERENCE

COMPATIBIL SYSTEM DESIGN:
Introduction to electromagnetic interference and compatibility, Noise pickup modes and
reduction techniques for analog circuits. Grounding Techniques, Near and Far fields
impedance, Mechanism of EMI/RFI emission/ coupling in cables, Shield Factor, Use of
fibers & co-axial cables, Conducted and radiated noise emission and control in power
circuits. EMI/RFI induced failure, mechanisms in power circuits. Power supply and
ground line distribution in digital circuits. Cross talk and reflection issues in digital
circuits. Shielding of electronic equipment, Electrostatic Discharge (ESD) issues. EMC
standards and test equipment.

RECOMMENDED BOOKS:
 Paul, C.R., Introduction to electromagnetic compatibility, John Wiley and sons, Inc.,
1991.
 Henry W. Ott, Electromagnetic Compatibility Engineering August 2009
 Donald R. White, Electromagnetic Interference and Compatibility Jun 1981
 James S. Hill, Donald J. White, A Handbook Series on Electromagnetic
Interference and Compatibility Volume 6. Second Edition

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MDT-201 ANALOG AND DATA CONVERSION SYSTEMS:
Linear IC applications, Design and error budget analysis of signal conditioners for low
level ac and DC applications. Analog to digital and digital to analog converters. SHA and
analog multiplexers, Signal Conditioners with Instrumentation Auto-
zero/chopper/isolation/charge amplifier, scaling & level shifting circuits, V to F & F to V
converters, V to I & I to V converters. Design of analog circuits for capacitive and
inductive transducers. Data transmission, General requirements, types of transmission,
EIA standards in circuits design.

RECOMMENDED BOOKS:
 Franco, S., Design with operational amplifiers and analog integrated circuits. Mc.
Graw Hill book Co. 1988.
 Horowitz, P., and Hill, W., The art of electronics (2nd edition), Cambridge
University Press.1992
 Jones, B.E. Instrumentation, Measurement and Feedback, Tata Mc Graw Hill, New
Delhi, 1978
 DE Pippenger & EJ Tobuben, Linear & Interface Circuits Applications, Mc Graw
Hill

MDT-202 EMBEDDED SYSTEM DESIGN:

Concept of embedded system design, embedded computing, RISC architecture,
embedded software development, S/W Development environment – Cross Compiler,
Linker, Debugger, Stand-alone systems. Introduction to ARM and Cortex architecture
and ARM/THUMB instruction set, Memories, Interfacing memory with processor,
Different Peripheral devices. Clocks and Power Management, Embedded system
development process, Determine the requirements, Design the system architecture,
Choose the operating system, Choose the processor, development platform and
programming language, Testing and debugging.

RECOMMENDED BOOKS:
 Hennessy, J.L. and Patterson, D.A., Computer Architecture: A Quantitative
Approach Computer Systems (5thedition), The Morgan Kaufmann Series Elsevier ,
2012.
 Furber, S., ARM System-on-Chip Architecture (2ndEdition), Pearson Education
Limited. 2000.
 Levine J. R., Linkers and Loaders, Morgan Kaufmann Publishers, 1999.
 The Definitive Guide to the ARM Cortex-M3, (2nd Edition), Newnes (imprint of
Elsevier), 2009
 Devid E Simon, An Embedded software primer, Pearson education Asia, 2001

MDT-203 VLSI DESIGN:

Basic electrical properties of MOS and Bi-CMOS circuits: MOS transistor operation in
linear and saturated regions, MOS transistor threshold voltage, MOS switch and inverter,
Bi- CMOS inverter, latch-up in CMOS inverter, inverter properties, Stick Diagram & Lay
out - λ-rules, System Design - FSM - Model, ASM Chart. ASIC design flow,
Partitioning, Floor planning, Placement, Routing, Field Programmable Gate Arrays
(FPGA)

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 RECOMMENDED BOOKS:
 Pucknell & Eshraghian - Basic VLSI Desing, PHI, 1995.
 C. K. Wong & M. Sarrafzaden - An Introduction to VLSI Physical Design, McGraw
Hills International Edition, 1996
 CMOS digital integrated circuits by Kang and Leblibici, TATA McGRAW HILL.
 CMOS: Circuit Design, Layout, and Simulation, R. Jacob Baker, John Wiley & Sons

MDT-204 RELIABILITY OF ELECTRONIC EQUIPMENTS:

Introduction to concepts of reliability, nature of reliability problems in electronic
equipment, series configuration, Parallel Configuration, Mixed Configuration, Methods
of Solving Complex Systems, Mean Time to Failure (MTTF) and Mean Time between
Failure (MTBF) of Systems, Maintainability, Availability Concepts, System Downtime,
Mean time to Repair (MTTR), Trade Off, Reliability Improvement, Improvement of
Components, Redundancy, element Redundancy, Unit Redundancy, Standby
Redundancy, Reliability Prediction, Similar Equipment Techniques, Similar Complexity
Techniques, Similar Function Techniques, Part Count Techniques, Part Stress Analysis
Techniques, Fault Analysis Techniques, System Safety Analysis, Failure Modes and
Effects Analysis, Fault Tree Analysis- Concepts and Procedures, Rules for Fault Tree
Construction, Reliability Calculation through Fault Tree.

RECOMMENDED BOOKS:
 Fquna, Reliability Engineering for Electronic Design, Marcel Dekker, 1988.
 Dr. R.K. Aggarwal, Reliability Engineering
 Dr. A.K. Govil, Reliability Engineering
 L.S. Srinath: Reliability Engineering , 3rd ed. East-West Press,
ELECTIVE PAPERS 1

E-01 3D PRINTING & REVERSE ENGINEERING

Introduction to Reverse Engineering, Reverse Engineering–The Generic Process, Scanning, Point
Processing, Application Geometric Model Development.
Methodologies and Techniques for Reverse Engineering– The Potential for Automation with 3-D
Laser Scanners, Computer-aided Reverse Engineering, Computer Vision and Reverse
Engineering, Structured-light Range Imaging, Scanner Pipeline, Reverse Engineering Hardware,
Reverse Engineering Software, Selecting a Reverse Engineering System, Introduction to Rapid
Prototyping, Relationship Between Reverse Engineering and Rapid Prototyping, Legal Aspects of
Reverse Engineering, Barriers to Adopting Reverse Engineering

RECOMMENDED BOOKS:
1. Product Design: Techniques in Reverse Engineering and New Product Development by K.
Otto and K. Wood Prentice Hall, 2001.
2. Reverse Engineering: An Industrial Perspective by Raja and Fernandes. Springer-Verlag
2008

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E-02 DESIGN OF PHOTOVOLTAIC SYSTEM:
Introduction to photovoltaic energy conversion, Solar radiation and measurement, Solar cell and
their characterization, Influence of insolation and temperature, Maximum power point tracking,
Electrical storage with Batteries, controllers, DC power conditioning, AC power conditioners for
grid connection, Solar power drives, Applications for pumping/refrigeration, Economic analysis
of PV system, Energy analysis of PV system.

RECOMMENDED BOOKS:
 Chenming, H. and White, R.M., Solar Cells from B to Advanced Systems, McGraw Hill
Book Co, 198: Ruschenbach, HS, Solar Cell Array Design Hand Varmostrand, Reinhold,
NY, 1980.
 Chetan Singh Solanki, Solar Photovoltaic Technology and Systems, 2013
 S. Sukhatme, J Nayak, SOLAR ENERGY : PRINCIPLES OF THERMAL COLLECTION
AND STORAGE 17 Jun 2008

E-03 WIRELESS COMMUNICATION:

Wireless Communication Systems, Evolution of mobile radio communications; the cellular
concept; frequency reuse; channel assignment strategies; handoff strategies; interference and
system capacity; improving capacity in cellular systems. Mobile Radio Propagation, free space
propagation model; basic propagation mechanisms; outdoor propagation models; indoor
propagation models . Frequency modulation vs. amplitude Modulation; amplitude modulation;
angle modulation, digital modulation; BPSK, DPSK, QPSK; RAKE Receiver; characteristics of
speech signals; quantization techniques; adaptive differential pulse code modulation; linear
predictive coders; FDMA; TDMA; Wireless Networking, fixed network transmission hierarchy;
traffic routing in wireless networks; wireless data services.

RECOMMENDED BOOKS:
 Theodore & Rapport, by Wireless Communications: Principles & Practices PHI 2nd ed.-2001
 William Stalling, Wireless Communications & Networks: PHI 1st Edn.
 Andreas F. Molisch, Wireless Communications, 2nd Edition

E-04 ADVANCE DIGITAL SIGNAL PROCESSING:

Review of fourier transform, Z- transform, discrete fourier transform, first fourier transform,
Modeling of Filters, Minimum delay property spectral factorization theorem. Linear Estimation,
Linear Prediction, Auto representative model, Analysis and synthesis of lattice filters, Spectrum
Estimation, Adaptive Filter, Adaptive implementation of Wiener filter, Adaptive linear combiner,
Adaptive FIR Wiener filter, Adaptive Channel equalizer, Adaptive echo cancellers, Adaptive
noise canceling, Adaptive linear prediction.

RECOMMENDED BOOKS:
 Sphoclas J Orfanidis, Optimum Signal Processing, McGraw Hill, 1990
 J.G. Proakis, C.M. Rader, F. Ling and C.L. Nikis, Advanced Digital Signal Processing
Maxwell Macmillan International Edition, 1992.
 J.V. Candy, Signal Processing, McGraw Hill, New York, 1986.
 B. Mulgrew and Colin F.N. Cowan, Adaptive Filters & Equalisers, Kuluwer Academic
Publishers, Boston, 1998

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 ELECTIVE PAPERS 2

E-01 OPTICAL FIBER COMMUNICATION

Introduction to EM theory, wave propagation in conductors & Dielectrics, boundary conditions.
Optical fibers: Dielectric slab waveguides, optical fiber structures, optical fiber modes &
configurations, mode theory for circular waveguides, single mode fibers, manufacturing of optical
fibers & cables.
Signal degradation in optical fibers: Attenuation, dispersion-intramodal & intermodal, Design
optimization of SM fibers.
Optical Sources: Light Emitting diodes, Laser diodes, reliability consideration, Materials,
performance parameters and specifications.
Power Launching and Coupling: Source to fiber power launching, Lensing schemes for
coupling improvement, Fiber to Fiber joints, LED coupling to single mode fibers, fiber splicing,
optical fiber connectors.
Photodetector: Physical principles of photodiode- PIN, APD performance parameters and
specifications.
Optical phenomena: Wave propagation in isotropic media, in crystals, Birefringence, Linear &
quadratic Electro- Optic effect, Acousto-optic effect, Magneto-Optic devices, nonlinear optics.
Integrated Optics: Optoelectronic Integrated Circuits, Application of OEITCTS, Materials for
optics, Integrated transmitters & Receivers, guided wave devices.
Optical Fiber Sensors: Multimode passive, Multimode active, single mode fiber sensors.

RECOMMENDED BOOKS:
 Gerd Keiser (McGraw Hill), Optical Fiber Communication
 John Gowar (PHI 1993), Optical Communications System
Pallale Bhattacharya, Semiconductor Optoelectronic Devices. Prentic Hal of India
(EEE), 1995 Edition:
 J.wilson-J.F.B. Hawkes “ Opto Electronics, an Introduction”

E-02 ELECTRONIC SYSTEM PACKAGING:

Electronic systems and needs, physical integration of circuits, packages, boards and complete
electronic systems; system applications like computer, automobile, medical and consumer
electronics with case studies and packaging levels. Electrical design considerations – power
distribution, signal integrity, RF package design and Power delivery in systems. CAD for Printed
Wiring Boards (PWBs) and Design for Manufacturability (DFM). PWB Technologies, Single-
chip (SCM) and Multi-chip modules (MCM), flex circuits. Recent trends in manufacturing like
microvias, sequential build-up circuits and high-density interconnect structures. Materials and
processes in electronics packaging, joining methods in electronics; lead-free solders. Surface
Mount Technology– design, fabrication and assembly. Embedded passive components; thermal
management of PWBs, thermo-mechanical reliability, design for reliability, electrical test and
green packaging issues.

RECOMMENDED BOOKS:
 Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.
 Brown, W.D., Advanced Electronic Packaging, IEEE Press, 1999.
 Charles Harper, Electronic Packaging and Interconnection Handbook 4/E 4th Edition
 Prof. G.V. Mahesh, An Introduction to Electronics Systems Packaging.

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E-03 DESIGN OF CONTROL FOR RENEWABLE ENERGY SYSTEM OPTIMIZATION:
Introduction, fundamentals of automatic control, automatic control principle, design aspects of
proportional, integral, derivative and PID controllers and their tuning. Advance control
techniques: batch, cascade, ratio, feed forward, adaptive and their applications to industry.Design
aspects of digital control system. Case study on process control systems i.e. sugar, fertilizer, steel,
power and chemical industries.

RECOMMENDED BOOKS:
 Donald P. Eckman, “Automatic Process Control”, Willey Eastern Ltd.
 E.A. Parr, “Industrial Control Handbook” - BSP Professional Books.
 Bela. G. Liptak, “Instrument Engineers Handbook - IIIrd Edition” : Chilton book
company.
 Patranabis, Automatic Process Control
 F.G. Shinskey: Process Control System, MC Graw Hill.

E-04 EMBEDDED IOT SYSTEM DESIGN:

Rise of embedded systems and their transition to intelligent systems and to Internet of Things -
RFIDs, NFC, Web of Things - Network of interconnected and collaborating objects. Embedded
systems architecture: Key hardware and software elements, typical embedded processors like
ATOM. Low power and very low power embedded systems, peripherals and sensors in embedded
systems, peripheral interfacing - SPI and I2C, Hardware and software protocol stacks - MAC,
Routing and application layers, performance considerations. Embedded Systems Design:
Partitioning to hardware and software; principles of co-design; performance of these systems
estimation of speed, throughput, power and energy consumption; hardware design elements
design, validation, and testing tools; software platforms OS and applications, code optimization,
validation and robust code generation; system integration, debugging and test methodology; tools
for coding, debugging, optimization, and documentation; measurement of system performance,
Linux distributions for embedded systems using tools from Yocto project; Creating virtual
prototypes - hardware software emulation. Applications: Healthcare and home automation
examples.

RECOMMENDED BOOKS:
 Barry, P., and Crowley, P., Modern Embedded Computing, Morgan Kaufmann, 2012
 Wolf, M., Computers as components Third edition, Morgan Kaufmann, 2012
 Adrian McEwen, Hakim Cassimally, Designing the Internet of Things, 8 Nov 2013
 Cuno Pfister, Getting Started with the Internet of Things, 17 May 2011

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