Copper (Commercially Pure – ASTM B152, EN 1976, UNS C11000)
Chemical Composi on (Typical)
Copper (Cu): ≥ 99.9%
Oxygen (O): ≤ 0.04% (in electroly c tough pitch copper, ETP)
Silver (Ag): ≤ 0.015%
Other impuri es (Bi, Pb, Fe, Ni, As, Sb, S): ≤ 0.05% (combined)
Special grades:
ETP Copper (C11000): High electrical conduc vity, small oxygen content
Oxygen-Free Copper (C10200): 99.95% Cu, no oxygen → be er duc lity, conduc vity
Mechanical Proper es
Tensile Strength: 200 – 400 MPa (depends on temper)
Yield Strength: 50 – 350 MPa
Elonga on: 10 – 45%
Hardness: 40 – 110 HB
Fa gue Strength: ~ 90 MPa
Modulus of Elas city (E): ~ 115–130 GPa
Physical Proper es
Density: 8.96 g/cm³
Mel ng Point: 1,083 °C
Boiling Point: 2,562 °C
Thermal Conduc vity: 390 – 400 W/m·K (excellent)
Electrical Conduc vity: ~ 100% IACS (best among commercial metals)
Coefficient of Thermal Expansion: 16.5 µm/m·K
Key Characteris cs
Excellent electrical & thermal conduc vity
High corrosion resistance in atmosphere, seawater, and chemicals
Very duc le & malleable → easily drawn into wires, sheets, tubes
Non-magne c, recyclable
Applica ons
1. Electrical: Power cables, busbars, windings, motors, transformers
2. Electronics: Printed circuit boards (PCB), connectors, semiconductors
3. Construc on: Roofing sheets, plumbing pipes, cladding
4. Industrial: Heat exchangers, condensers, chemical equipment
5. Alloys:
o Brass (Cu–Zn)
o Bronze (Cu–Sn)
o Cu–Ni (marine alloys)