MBI6663 Macroblock
MBI6663 Macroblock
Features
6~65V wide input voltage range
Surface Mount Device
Maximum 1A constant output current
PWM/DC input for dimming control
Hysteretic PFM operation eliminates external compensation design
Integrated power switch with 0.3ohm low Rds(on)
Full protections: UVLO/ Start-Up/ OCP/ Thermal/
LED Open/Short-Circuit
GSD: TO-252-5L
Only 5 external components required
Package MSL Level : 3
Small Outline Package
Product Description
MBI6663 is a step-down constant-current high-brightness LED driver to
provide a cost-effective design solution for interior/exterior illumination
GD: SOP8L-150-1.27
applications. It is designed to deliver constant current to light up high
power LED with only 5 external components. With hysteretic PFM control
scheme, MBI6663 eliminates external compensation design and makes
the design simple.
The output current of MBI6663 can be programmed by an external resistor and dimmed via pulse width
modulation (PWM) or DC voltage through DIM pin to achieve higher efficiency linear current modulation.
MBI6663 features completed protection design to handle faulty situations. The start-up function limits the inrush
current while the power is switched on. Under voltage lock out (UVLO), over temperature protection (OTP), and
over current protection (OCP) guard the system to be robust and keep the driver away from being damaged which
results from LED open-circuited, short-circuited and other abnormal events. MBI6663 provides thermal-enhanced
SOP-8 and TO-252 packages to handle power dissipation more efficiently.
Applications
Signage and Decorative LED Lighting
High Power LED Lighting
Constant Current Source
Functional Diagram
VIN SEN SW
Blanking
LV-Bandgap
VCCD
Vref
Dim
IV Reference
TSD GATE Driver
OCP
VCCA VCCA
GND
VIN 1 8 SEN
DIM 2 Thermal
7 NC
Pad
NC 3 6 GND
SW 4 5 GND
Pin Description
Note: The performance of thermal dissipation is strongly related to the size of thermal pad, thickness and layer
numbers of the PCB. The empirical thermal resistance may be different from simulative value. Users should plan
for expected thermal dissipation performance by selecting package and arranging layout of the PCB to maximize
the capability.
Efficiency, %
80.0 1-LED 80.0 1-LED
70.0 70.0
Efficiency, %
1-LED 1-LED
80.0 80.0
70.0 70.0
Efficiency, %
80.0 80.0
70.0 70.0
1000 1000
990
Output Current, mA
Output Current, mA
990 3-LED
980 1-LED 1-LED
3-LED 980
970 6-LED
6-LED
970 10-LED
960 10-LED
RSEN = 0.1Ω 12-LED RSEN = 0.1Ω
950 960 L1 = 120μH 12-LED
L1 = 68μH
CIN = COUT = 10μF CIN = COUT = 10μF
940 950
0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70
Input Voltage, V Input Voltage, V
760 740
RSEN = 0.14Ω RSEN = 0.14Ω
750 L1 = 68μH L1 = 120μH
Output Current, mA
Output Current, mA
420 400
RSEN = 0.28Ω RSEN = 0.28Ω
410 L1 = 68μH L1 = 120μH
Output Current, mA
Output Current, mA
350 600
300 500
68uH
250
400
200 120uH
300 120uH
150
200
100 RSEN = 0.1Ω RSEN = 0.1Ω
VIN = 24V 100 VIN = 48V
50 CIN = COUT = 10μF CIN = COUT = 10μF
0 0
1 2 3 4 5 6 1 3 5 7 9 11 13
LED Cascaded Number LED Cascaded Number
450 800
Switching Frequency, kHz
350 68uH
600
300
500
250 120uH 120uH
400
200
300
150
RSEN = 0.14Ω 200 RSEN = 0.14Ω
100
VIN = 24V VIN = 48V
50 CIN = COUT = 10μF 100 CIN = COUT = 10μF
0 0
1 2 3 4 5 6 1 3 5 7 9 11 13
LED Cascaded Number LED Cascaded Number
800 1200
Switching Frequency, kHz
700 68uH
Switching Frequency, kHz
1000
600
68uH
800
500 120uH
400 600
120uH
300 400
200 RSEN = 0.28Ω RSEN = 0.28Ω
VIN = 24V 200 VIN = 48V
100 CIN = COUT = 10μF CIN = COUT = 10μF
0 0
1 2 3 4 5 6 1 3 5 7 9 11 13
LED Cascaded Number LED Cascaded Number
1020 390
1010 380
IOUT, mA
370
IOUT, mA
1000
990 360
RSEN = 0.1Ω RSEN = 0.28Ω
L1 = 120μH L1 = 120μH
CIN = COUT = 10μF 350 CIN = COUT = 10μF
980 1-LED 1-LED
Package: SOP-8 Package: SOP-8
970 340
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Ambient Temperature, ℃ Ambient Temperature, ℃
400
350
300
Rds(on), mΩ
250
200
150
100
‐40 ‐20 0 20 40 60 80 100
Ambient Temperature, ℃
Dimming Functions
Dimming is achieved by applying either a PWM signal or a DC voltage at the DIM pin. For analog dimming
application, the LED current increases linearly with the rising VDIM, and the dimming range of VDIM is from 0.3V to
2.5V. For PWM dimming application, the LED current can be adjusted digitally, by applying a PWM logic signal to
the DIM pin to turn the device on and off, as shown on Fig. 14.
IOUT, mA
600.0 600.0
400.0 400.0
RSEN = 0.1Ω RSEN = 0.1Ω
200.0 VIN = 12V, 1-LED 200.0 VIN = 24V, 3-LED
Fsw = 930kHz Fsw = 501kHz
0.0 0.0
0.0% 20.0% 40.0% 60.0% 80.0% 100.0% 0.0% 20.0% 40.0% 60.0% 80.0% 100.0%
PWM dimming duty, % PWM dimming duty, %
IOUT, mA
30.0 30.0
20.0 20.0
RSEN = 0.1Ω RSEN = 0.1Ω
10.0 VIN = 12V, 1-LED 10.0 VIN = 24V, 3-LED
Fsw = 930kHz Fsw = 501kHz
0.0 0.0
0.0% 1.0% 2.0% 3.0% 4.0% 5.0% 0.0% 1.0% 2.0% 3.0% 4.0% 5.0%
PWM dimming duty, % PWM dimming duty, %
1000
800
IOUT, mA
600
400
RSEN = 0.1Ω
200 VIN = 12V, 1-LED
L1 = 10uH
0
0 0.5 1 1.5 2 2.5
Analog voltage, V
When selecting an inductor, not only the inductance but also the saturation current that should be considered as
the factors to affect the performance of module. In general, it is recommended to choose an inductor with 1.5 times
of LED current as the saturation current. Also, the larger inductance gains the better line/load regulation. However,
the inductance and saturation current become a trade-off at the same inductor size. An inductor with shield is
recommended to reduce the EMI interference. However, this is another trade-off with heat dissipation.
For system stability, it is recommended to place the CIN to the VIN pin of MBI6653 as close as possible. However,
the PCB size might limit this requirement. Therefore, to avoid the noise interference, a bypass capacitor, whose
capacitance range is from 0.1uF to 1uF and the material is ceramic, parallels with the VIN and GND pins of
MBI6653 is recommended. The rated voltage of the bypass capacitor should be at least 1.5times of the input
voltage.
The rated voltage and capacitance are not the only concerns when selecting capacitors, but also the maximum
ripple current. If the actual ripple current is larger than the specified maximum ripple current, the capacitor and the
IC might be damaged. In general, the ripple current is related to the inductor ripple current. The specification of
maximum ripple current of capacitor should be larger than 1.3 times of the inductor ripple current.
The maximum power dissipation, PD(max)=(Tj–Ta)/Rth(j-a), decreases as the ambient temperature increases.
2.0
1.5
1.0
0.5
0.0
0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
For managing MSL3 Package, it should refer to JEDEC J-STD-020C about floor life management & refer to JEDEC
J-STD-033C about re-bake condition while IC’s floor life exceeds MSL3 limitation.
Temperature (℃)
300
255℃ 260℃+0℃
-5℃
250 245℃±5℃
240℃
217℃
30s max
200
Average ramp-up Ramp-down
6℃/s (max)
rate= 0.7℃/s
Average ramp-up
rate = 0.4℃/s Average ramp-up
50 rate= 3.3℃/s
25
*For details, please refer to Macroblock’s “Policy on Pb-free & Green Package”.
Note: Please use the maximum dimensions for the thermal pad layout. To avoid the short circuit risk, the vias or
circuit traces shall not pass through the maximum area of thermal pad.
MBIXXXX ○ ○
Manufacture
Code Device Version Code
Product No. Package Code
Process Code
GSD (TO-252-5L)
MBIXXXX ○ ○○
Manufacture
Device Version Code
Code
Product No. Package Code
Process Code