San Jose Thermal DSC
San Jose Thermal DSC
(DSC)
Q-series
Discovery
DSC2500
DSC250
DSC25
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Agenda for the course
Applications
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TA Instruments DSC Models
DSC 25
DSC 250
DSC 2500
Q2000
3 AutoQ20 Discovery DSC TAINSTRUMENTS.COM
What is a Differential Scanning Calorimetry
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Simple Heat Flux DSC Cell Schematic
Sample
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Endothermic Heat Flow – Heat Absorbed by
Sample
4
Endothermic Events
• Glass transition
2
• Melting
0
• Evaporation/
volatilization
Heat Flow (Normalized) (W/g)
-2 • Enthalpic recovery
• Polymorphic
-4
transitions
• Some
-6
decompositions
-8
-10
25 50 75 100 125 150 175
Exo Up Temperature (°C)
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Exothermic Heat Flow – Heat Released by
Sample
4
Exothermic Events
2
• Crystallization
• Cure reactions
0
• Polymorphic transitions
• Oxidation
Heat Flow (Normalized) (W/g)
-2
• Decomposition
-4
-6
-8
-10
25 50 75 100 125 150 175
Exo Up Temperature (°C)
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DSC Heat Flow
dH dT
Cp f (T, t)
dt dt
dT f (T, t) Heat flow that is function of time
Heating Rate (C/min)
dt at an absolute temperature (kinetic)
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DSC Heat Flow
dH dT
Cp f (T, t)
dt dt
Heat
Kinetic
Capacity
Crystallization
Some melting
Glass
Transition Cure reactions
Some Melting Volatilization
Decomposition
Denaturation
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DSC heat flow modes – T1 vs T4 vs T4P mode
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Measurement of Temperature
• What temperature is being measured and displayed by the DSC?
Sample Sensor Temperature
Used by most DSCs
Measured at the sample platform with a thermocouple,
thermopile or PRT
• The actual temperature of the sample is never measured by DSC
There is no thermocouple in direct contact with the sample
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Conventional DSC Measurements, T1 Heat Flow
Heat Balance Equations
Heat Flow
Measurement Model
T fs Ts T fr Tr
qs qr
qs qr Rs Rr
Conventional DSC Heat
Ts Tr Flow Rate Measurement
Rs Rr q q s qr
Tr Ts T
q
R R
Tfs Tfr
This model assumes that the sample and reference calorimeter thermal resistances are identical and that
the furnace temperature is uniform throughout the cell.
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Conventional DSC - Assumptions
• The heat flow baseline is usually curved and has large slope
and offset. Loss of sensitivity as a result of curvature in the
baseline.
• The heating rate of the sample and reference calorimeters are
not identical, resulting in reduced resolution.
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Expanded Principles of DSC Operation
Accounting for Imbalances
Tfs Rs Rr Tfr
Ts Tr
Cs Cr
Not being
measured with
Conventional
DSC
Q = Ts - Tr + A + B + C
R
Thermal Thermal Heating
Resistance Capacitance Rate
Imbalance Imbalance Imbalance
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What is Tzero Technology? (T4/T4P Heat Flow)
Tf
Rs Rr
Ts To Tr
Cs Cr
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Tzero™ Heat Flow Measurement
T0 dT
Rs Rr qs Cs
Rs dt
T0 T dT
T0 qr Cr
Rr dt
The sample and reference calorimeter thermal resistances and heat capacities
obtained from Tzero calibration are used in the heat flow rate measurements.
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Tzero Heat Flow Equation
Heat Flow Besides the three temperatures
Sensor Model (Ts, Tr, T0);
qs qr What other values do we need
C s C r to calculate Heat Flow?
Ts Tr
R s R r
T 1 1 dTs dT
q T0 Cr Cs Cr
Rr Rs Rr d d
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Measuring the Sensor C’s and R’s
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Tzero Heat Flow Equation
T 1 1 dTs d T
qT 4 T0 Cr C s Cr
Rr Rs Rr d d
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Benefit of the Tzero heat flow measurements
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Empty cell baseline using the TzeroTM heat flow
equation
100
50
DSC Q2000
Heat Flow (µW)
4.94°C
5.40µW
0
-29.38°C
31.23µW
-50
-100
22 -50 0 50 100 150 200 250 300 350
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Exo Up Temperature (°C)
Tzero Benefit: Improved Peak Resolution
T 1 1 dTs d T
qT 4 T0 Cr C s Cr
Rr Rs Rr d d
1
-1
-2
Heat Flow (W/g)
-3
-4
-5
-6
Heat Flow T1
-7 Heat Flow T4
-8
150 152 154 156 158 160 162 164
Temperature (°C)
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Advanced Tzero Technology (T4P)
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Advanced Tzero™ Model
Advanced Tzero is a further refinement of the Tzero model and takes the
measurement up to the sample pan, one step closer to the actual sample
q sam
Advanced Tzero m ps c pan m pr c pan Cpan
model includes
T ps T pr Rp
the pans
Rs
qs Rp Rp qr
T4P
T4 Ts Tr
Cs Cr
Tzero models the Rs Rr
Calorimeters
T0
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Indium with T1, T4 and T4P Heat Flow Signals
Improvements to Sensitivity and Resolution
Theoretical
Melting of
Indium
T4P heat flow
T4 Heat flow
T1 heat flow
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Modulated DSC® Theory
(MDSC®)
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What is MDSC?
• MDSC separates the Total heat flow of DSC into two parts
based on the response of the system to a changing heating
rate. The changing heating rate is effected by ‘superimposing’ a
sinusoidal heating rate on a linear heating rate.
• In general, only heat capacity and melting respond to the
changing heating rate resulting in an increase in signal. Kinetic
events tend to occur at different temperatures as a function of
heating rate. For example, increasing the heating rate can shift
decomposition to a higher temperature.
• The Reversing and Nonreversing signals of MDSC are not
necessarily a measure of reversible and nonreversible
properties.
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MDSC® Theory: Heat Flow Signals
dQ dT
Cp f (T, t)
dt dt
Total Heat Reversing Heat Non-Reversing Heat
Flow Flow Flow
•Heat Capacity
•All Transitions •Glass Transition •Enthalpic Recovery
•Melting •Evaporation
•Crystallization
•Thermoset Cure
•Denaturation
•Decomposition
•Some Melting
•Chemical Reactions
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Isothermal @ 25°C
Isothermal @ 25°C
Exo Up
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MDSC - Quasi-Isothermal @ 25°C
Quasi-Isothermal @ 25°C
Modulate ±1°C every 60 sec
Exo Up
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MDSC – 1°C amplitude, every 60 sec, @
2°C/min
Exo Up
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MDSC® Theory: Calculation of MDSC® Signals
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MDSC® Raw Data Signals
Polylactic Acid
Heating Rate: 1 °C / min
Period: 60s
Amplitude: +/- 0.159 °C
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MDSC Theory: Calculation of MDSC® Signals – Simple
Deconvolution
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MDSC® Raw Data Signals: Modulated Heat Flow and Modulated
Heating Rate with Calculated Total (or Average) Heat Flow and
Average Heating Rate
Polylactic Acid
Heating Rate: 1 °C / min
Total Heat Flow Period: 60s
Amplitude: +/- 0.159 °C
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MDSC Theory: Heat Flow Signals
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MDSC® Theory: Calculation of MDSC® Reversing Heat
Flow and Reversing Cp
Reversing Cp
Modulated Reversing
Heat Flow Heat Flow
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MDSC® Theory: Calculated MDSC® Heat Flow Signals
Summary
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Calibration &
Verification
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The DSC Heat Flow Rate Equation
dH dT
Cp f (T, t)
dt dt
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International Standards pertaining to DSC
calibrations
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ASTM Standards for DSC Heat Flow,
Temperature and Enthalpy Calibration
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Calibration of specific instrument models
Tzero Baseline
calibration Cell constant
Measurement of
Rs and Cs Measurement of and temperature
slope and offset
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Calibration Setup in Trios
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General calibration and verification guidelines
• Calibration
Use Calibration Mode
Calibrate upon installation
Re-calibrate if does not pass verification or if instrument setup is
modified (see previous slide)
• Verification
Determine how often to verify data
Run a reference material as a sample (in standard mode)
Compare results vs literature values
If results are within your tolerance – system checks out and
does not need re-calibration
If results are out of tolerance, then re-calibrate
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Requirements Prior to Calibration
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ASTM E 967 - Standard Test Method for
Temperature Calibration of DSC’s
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Instrument setup factors affecting calibration
• Purge Gas
Re-calibrate baseline/Tzero, temperature and cell constant
Thermal conductivity of helium ≠ Thermal conductivity of
nitrogen/air/oxygen ≠ Thermal conductivity of argon
• Cooling Accessories
Re-calibrate baseline/Tzero, temperature and cell constant
The position of the cooling head around the cell will affect the
calibration of the instrument. Uninstallation and reinstallation of a
cooling accessory or changing the cooling accessory warrants a
complete re-calibration
• Pan selection
Re-calibrate temperature and cell constant
It will not impact the baseline/Tzero calibration
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ASTM E 967 - Temperature Calibration of DSC’s
Indium (156.6°C)
Can be re-used, can pre-melt
Tin (231.9°C)
Has multiple crystalline forms,
use once – no pre-melt
Zinc (419.5°C)
Can easily oxidize and alloy with
container, use once – no pre-melt
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Temperature and Cell Constant Calibration
Premelt
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Verifying Cell Constant & Temperature
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Calorimetric and Temperature Calibration
(Un-calibrated Data – No Correction Factors Applied)
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Verifying Cell Constant & Temperature
5
1 5 6 .6 4 ° C
-2 8 .6 0 J /g
0
-5
Temp is within 0.04°C
Heat Flow (mW)
-1 5
-2 0
1 5 7 .0 6 °C
-2 5
140 145 150 155 160 165 170 175 180
T e m pera ture (°C )
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Temperature Calibration of DSC’s
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Verifying Baseline
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Verifying Baseline
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Verifying Baseline
0 .5
0 .4
0 .3
1 7 6 .6 6 ° C
0 .0 2 1 3 8 m W
0 .2
2 1 m ic ro W b o w
4 2 m ic ro W d rif t
0 .1
Heat Flow (mW)
0 .0
-0 .1 - 0 .0 0 3 2 5 2 m W
-0 .0 4 5 6 2 m W
-0 .2
-0 .3
-0 .4
-0 .5
-1 0 0 0 100 200 300 400
T e m p e ra tu re (°C )
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Verifying Baseline
0 .4
0 .2
Heat Flow (mW)
0 .0
B a s e lin e c h e c k - s till g o o d
-0 .2
-0 .4
20
15
10
5
(µW)
0
Heat Flow
-5
-10
-15
-20
-100 -50 0 50 100 150 200 250 300 350 400
Temperature (°C)
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MDSC Calibration – Discovery Series
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Cp Calibration in Trios
T4P
only
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MDSC Cp calibration using TRIOS
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MDSC Cp verification using TRIOS
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Experimental Design:
Instrument Set Up
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Instrument Hardware and Gas Selection
Considerations
Temperature Range Dependent On The Cooling System
•Finned Air Cooling System (FACS): Ambient to 725°C
•Quench Cooling Accessory (QCA): -180°C to 400°C
•Liquid Nitrogen Cooling System (LN2P): -180°C to 550°C
•RCS120: -120°C to 400°C
•RCS90: -90°C to 550°C
•RCS40: -40°C to 400°C
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Cooling Accessories
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Performance of the cooling accessories
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Selecting the cooler – Discovery DSC
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Selecting the purge gas – Discovery DSC
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Setting the purge gas flow rate – Discovery DSC
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Recommended Purge Gas Flow Rates
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Experimental design:
Sample Preparation and Considerations
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TGA for DSC Experimental Design
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Selecting Optimum Experimental Conditions
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Typical TGA data: TGA of Drug A Monohydrate
105 6
4.946%
(0.7505mg) Decomposition
100
4
90
0
85
Sample: Drug A Monohydrate
Size: 15.1740mg
Heating Rate: 10°C/min
80 -2
0 50 100 150 200 250 300
Temperature (°C) Universal V3.4C TA Instruments
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Selecting Optimum Experimental Conditions
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DSC Pan Selection
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Sample Pans
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TA Instruments Tzero Pans
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Tzero Press (P/N 901600.901)
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TA Instruments Tzero Pans
Tzero Lid
• Tzero Lid (P/N: 901671.901) -
Lightweight aluminum lids for use in
sample encapsulation with the Tzero
Pans and the Tzero Low-Mass Pans.
The seal is not hermetic.
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Standard Series DSC Pans (Crimped lid)
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Sample Shape
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Hermetic DSC Pans
135 °C 165 °C
Aluminum
Hermetic
Heat Flow (Normalized) (W/g)
Experimental conditions:
3 atm
20 mg of water
Tzero Aluminum pan with hermetic lid, 40 ul internal volume
Heating rate of 10C/min
Sample:
1. Liquid
Exo Up 2. Solid with
volatile
content
High Volume Gold
Stainless
Steel Hermetic
40 atm 6 atm
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Hermetic Pans (Sealed)
• Hermetic Pans are available in:
Aluminum: <600°C; <3 atm (300 kPa gage)
Alodined Aluminum: <200°C; <3 atm (300 kPa gage)
Gold: <725°C; <6 atm (600 kPa gage)
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It Can Matter What Pan You Use
Monohydrate
Pharmaceutical
sample
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What if Sample Spills out of the Pan?
Keeping the DSC Cell Clean
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Cleaning the cell
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Cleaning Cell: Bakeout procedure
• Bake out
Should be used as a last resort if none of the previous steps are
effective
Involves Air purge and/or an open lid
Heat @ 20°C/min to appropriate temp (max of 550°C on Q series,
max. 400°C in Discovery)
Do NOT hold Isothermal @ the upper temperature
Cool back to room temp & brush cell again
• Check out the TA Tech tip video on cleaning the DSC cell:
https://www.youtube.com/watch?v=cclJXrbUICA
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Sample preparation: Optimization of Sample
Mass
• Sample Preparation
Weight of 5-10 mg for polymers; 10-15 mg for cross-linked
thermosets; 3-5 mg for metal or chemical melting
Goal is to achieve a change of 0.1-10mW heat flow in
going through the transition
dH dT
Cp f (T, t)
dt dt
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Heat Flow Change During a Transition
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Method development
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Method Design: DSC • The Ramp segment heats or cools
Segment List the sample at a fixed rate until it
reaches the specified temperature,
producing a linear plot of temperature
versus time
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DSC General Method Recommendations
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Why have 2 minutes of baseline?
• Start Temperature
Generally, the baseline should have two (2) minutes to completely
stabilize prior to the transition of interest. Therefore, at 10°C/min.,
start at least 20°C below the transition onset temperature
• End Temperature
Allow a two (2) minute baseline after the transition of interest in order
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Heating/Cooling Methods
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Method Development
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Heat Cool Heat Cycles of High Density
Polyethylene (HDPE)
4
3
Heat Flow (Normalized) (W/g)
Cool Cycle
2
-1
-4
-100 -50 0 50 100 150 200
Exo Up Temperature (°C)
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Oxidative Stability (OIT) Method
An OIT Method
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Oxidative Induction Time of Polyolefin Film
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Modulated® DSC Method
An MDSC Method
1) Equilibrate at 25°C
2) Modulate ± 0.318°C every 60 seconds
3) Isothermal for 5.00 minutes
4) Data storage: On
5) Ramp 2°C/min. to -90°C
6) Ramp 2°C/min. to 25°C
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MDSC of a Process Oil
Separation of a Tg from Crystallization
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Applications
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Typical DSC Transitions
Oxidation
Or
Crystallization Decomposition
Heat Flow -> exothermic
Melting
Glass
Transition Cross-Linking
(Cure)
Composite graph
Temperature
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The Glass Transition Temperature (Tg)
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The Glass Transition (Tg)
Below Tg Above Tg
Tg Transition
• Rigid, Glassy • Rubbery Flow
• Immobile, no long 2nd Order • Increased Mobility
range molecular Transition • Disordered Solid
movement
• Disordered Solid
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Heat Flow & Heat Capacity at the Tg
-0.3
Polystyrene
2.0 -0.4
-0.5
Heat Flow
-0.7
Temperature Below Tg
- lower Cp
- lower Volume
1.0 - lower CTE -0.8
- higher stiffness
- higher viscosity
- more brittle
- lower enthalpy
-0.9
0.5 -1.0
70 90 110
Exo Up Temperature (°C) Universal V3.8A TA Instruments
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What Affects the Glass Transition?
Selected Start
-0.1
Extrapolated Onset
-0.2
23.00°C(H)
0.5853J/(g·°C)
Midpoint at ½ Cp or
-0.3
Heat Flow Change
34.18°C
25.02°C
Extrapolated End
5 10 15 20 25 30 35 40 45
Exo Up Temperature (°C) Universal V4.7A TA Instruments
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Step Change in Cp at the Glass Transition
PET
9.43mg
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A Glass Transition is Reversible
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10mg PMMA Sample at Different Heating Rates
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Glass transition measurements using other
techniques
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The measured value of Tg will depend on the
experimental technique as well as the setup…
• The molecular motion associated with the glass transition
is time dependent. Therefore,
it takes place over a temperature range
is dependent on the test frequency (in case Modulated
DSC®, DMA, etc.).
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MDSC: Effect of Frequency on Tg
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DMA: Effect of Frequency on Tg
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Aged Epoxy: The Tg On The First Heat Cycle
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Enthalpic Relaxation and Recovery
• Enthalpic Relaxation
The process of a meta-stable glass relaxing towards
equilibrium at a temperature below Tg
Occurs as the sample is being cooled to temperatures
below Tg
Occurs as the sample is being stored at temperatures
below Tg
• Enthalpic Recovery
The recovery of energy (J/g) lost during Enthalpic
Relaxation. It (peak in DSC data @ Tg) occurs as the
sample is heated to a temperature above Tg
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Effect of Annealing on the Tg
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Importance of Enthalpic Relaxation
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Glass Transition Summary
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Thermosets
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Thermosetting Polymers
A+B C
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Commonly used thermoset materials
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Typical properties of crosslinking reactions
These techniques give useful information about the impact of the polymerization
conditions on the end product’s thermo-mechanical properties.
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DSC: General considerations for selecting
optimum experimental Conditions
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DSC: General considerations for selecting
optimum experimental Conditions
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DSC: General considerations for selecting
optimum experimental Conditions
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Comparison of First and Second Heats
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Epoxy Cured 48 Hours: Heat Cool Heat
4
1st Heat @ 10°C/min
Cool @ 10°C/min
2nd Heat @ 10°C/min
2
Heat Flow (mW)
-2
-4
5 Min Epoxy - 9.85mg
Cured 2 nights @ RT
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Percent Cure Calculation by DSC
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Calculation of % Cure: An Epoxy
% Cure = 79.86%
6 .5
7 9 .1 7 °C
4 1 0 .6 J /g
Heat Flow (mW)
1 .5
9 1 .4 2 °C
8 2 .6 9 J /g
7 9 .8 6 % c u re d
3 3 .6 5 ° C (H )
-3 .5
S a m p le c u re d fo r 1 7 h o u rs a t R T ;
th e n ra m p e d a t 1 0 °C /m in .
-1 0 0 -5 0 0 50 100 150 200 250
E xo U p Tem pera ture (°C ) U n iversa l V 4 .4 A T A In stru m en ts
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Thank You
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