ST1S03

1.5 A, 1.5 MHz adjustable, step-down switching regulator

Datasheet - production data

Description
The ST1S03 is a step-down DC-DC converter
optimized for powering a low voltage digital core
in HDD applications and, generally, to replace the
high current linear solution when the power
DFN6D (3 x 3 mm)
dissipation may cause a high heating of the
application environment. It provides up to 1.5 A
over an input voltage range of 3 V to 16 V. A high
Features switching frequency (1.5 MHz) allows the use of
tiny surface-mount components: as well as the
 Step-down current mode PWM (1.5 MHz) resistor divider to set the output voltage value,
DC-DC converter only an inductor, a Schottky diode and two
 2% DC output voltage tolerance capacitors are required. Besides, a low output
 Internal soft-start for STARTUP current ripple is guaranteed by the current mode PWM
limitation and power on delay of 50 - 100 µs topology and by the use of low ESR SMD ceramic
capacitors. The device is thermal protected and
 Typical efficiency: > 70% over all operating current limited to prevent damages due to an
conditions accidental short-circuit. The ST1S03 device is
 1.5 A output current capability available in a DFN6D package.
 Not switching quiescent current: max 2.5 mA
over temperature range Table 1. Device summary

 Switch VDS: max. 350 mV at ISW = 750 mA Order code Package Packaging

 Uses tiny capacitors and inductors ST1S03PUR DFN6D (3 x 3 mm) Tape and reel
 Available in DFN6D 3 x 3 mm package with
exposed pad

November 2014 DocID10992 Rev 7 1/16

This is information on a product in full production. www.st.com
Contents ST1S03

Contents

1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Application notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6 Typical application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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ST1S03 Diagram

1 Diagram

Figure 1. Schematic diagram

&6

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Pin configuration ST1S03

2 Pin configuration

Figure 2. Pin connections (top view)

Table 2. Pin description

Pin no. Symbol Name and function

1 VFB Voltage of feedback

2 GND System ground
3 SW Output of the internal power switch
4 VIN_SW Power supply for the MOSFET switch
5 VIN_A Power supply for the analog circuit
6 N.C. Not connected
7 EP Exposed pad should be connected to GND

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ST1S03 Maximum ratings

3 Maximum ratings

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

VIN_SW Positive power supply voltage -0.3 to 16 V

VIN_A Positive power supply voltage -0.3 to 16 V
SWITCH voltage Max voltage of output pin -0.3 to 16 V
VFB Feedback voltage 2.5 V
IVFB Common mode input voltage ±1 mA
TJ Max junction temperature 150 °C
TSTG Storage temperature range -25 to 150 °C
TLEAD Lead temperature (soldering) 10 s 300 °C

Note: Absolute maximum ratings are those values beyond which damage to the device may occur.
Functional operation under these conditions is not implied.

Table 4. Thermal data

Symbol Parameter Value Unit

RthJC Thermal resistance junction case 10 °C/W

RthJA Thermal resistance junction ambient 55 °C/W

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Electrical characteristics ST1S03

4 Electrical characteristics

Table 5. Electrical characteristics (VIN_SW = VIN_A = 5 V, CI = 4.7 µF, CO = 22 µF, L1 = 3.3 µH,
TJ = 0 to 125 °C, unless otherwise specified. Typical values are referred to 25 °C)
Symbol Parameter Test conditions Min. Typ. Max. Unit

FB Feedback voltage IO = 100 mA 784 800 816 mV

IFB VFB pin bias current 600 nA
IQ Quiescent current No switching 2.5 mA
IO Output current VIN = 3 V to 16 V 1.5 A
IMIN Minimum output current 1 mA
%VO/VIN Reference line regulation VIN = 3 V to 16 V 0.032 0.06 % VO/VIN
%VO/IO Reference load regulation IO = 10 mA to 1.2 A 0.0014 0.003 % VO/mA
PWM fS PWM switching frequency(1) VFB = 0.8 V, TA =25 °C 1.2 1.5 1.8 MHz
DMAX Maximum duty cycle 87 %
ISWL Switching current limitation 1.65 A
VDS Switch VDS ISW = 750 mA 200 350 mV
E Efficiency IO = 10 mA to 1.2 A 70 %
TSHDN Thermal shutdown(1) 130 150 °C
THYS Thermal shutdown hysteresis(1) 15 °C
IO = 100 mA to 700 mA
VO/IO Load transient response(1) -5 +5 % VO
tR = tF 100 ns, TA = 25 °C
VO/IOat
Short-circuit removal response(1) IO = 10 mA to short, TA = 25 °C +5 % VO
IO = short
1. Guaranteed by design, but not tested in production.

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ST1S03 Application notes

5 Application notes
The ST1S03 is an adjustable current mode PWM step-down DC-DC converter with an
internal 1.5 A power switch, housed in a 6-lead DFN 3 x 3 mm package.
It’s a complete 1.5 A switching regulator with its internal compensation eliminating an
additional component.
The constant frequency, current mode, PWM architecture and stable operation with ceramic
capacitors results in a low, predictable output ripple. However, in order to keep the output
regulated, the devices goes in pulse skipping mode when a very light load is required.
To clamp the error amplifier reference voltage, a soft-start control block generating a voltage
ramp has been implemented. Besides an on-chip power on reset of 50 = 100 µs ensures the
proper operation when switching on the power supply. Other circuits fitted to the device
protection are the thermal shutdown blocks which turn off the regulator when the junction
temperature exceeds 150 °C typically and the cycle-by-cycle current limiting that provides
protection against shorted outputs.
Being the ST1S03 an adjustable regulator, the output voltage is determined by an external
resistor divider. The desired value is given by the following equation:

VO = VFB [1 + R1 / R2]
To make the device working, only other four external components are required: a Schottky
diode, an inductor and two capacitors. The chosen inductor must be able to not saturate at
the peak current level. Besides, its value can be selected keeping in account that a large
inductor value increases the efficiency at a low output current and reduces an output voltage
ripple, while a smaller inductor can be chosen when it is important to reduce the package
size and the total cost of the application. Finally, the ST1S03 device has been designed to
work properly with the X5R or X7R SMD ceramic capacitors both at the input and at the
output. This kind of capacitors, thanks to their very low series resistance (ESR), minimize
the output voltage ripple. Other low ESR capacitors can be used according to the need of
the application without invalidating the right functioning of the device. Due to the high
switching frequency and peak current, it is important to optimize the application environment
reducing the length of the PCB traces and placing all the external components near the
device.

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Typical application ST1S03

6 Typical application

Figure 3. Application circuits

&6

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ST1S03 Typical performance characteristics

7 Typical performance characteristics

(L1 = 3.3 µH, CI = 4.7 µF, CO = 22 µF, unless otherwise specified).

Figure 4. Load voltage feedback vs. temp. Figure 5. Voltage feedback vs. temperature

&6 &6

Figure 6. Line output voltage regulation vs. Figure 7. Line voltage feedback vs. temperature
temperature

&6 &6

Figure 8. Voltage feedback vs. output current Figure 9. PWM Switching frequency vs. temp.

&6 &6

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Typical performance characteristics ST1S03

Figure 10. Quiescent current vs. temperature Figure 11. Quiescent current vs. input voltage

&6 &6

Figure 12. Minimum operating voltage vs. Figure 13. Efficiency vs. temperature
output voltage

&6 &6

Figure 14. Efficiency vs. output current Figure 15. Switch VDS vs. temperature

&6 &6

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ST1S03 Typical performance characteristics

Figure 16. Switch RDS-ON vs. temperature Figure 17. Switch current limitation vs.
temperature

&6 &6

Figure 18. Load transient response Figure 19. Load transient response

VCC = 5 V, IO = 100 mA to 780 mA, CI = 4.7 µF, VCC = 5 V, IO = 200 mA to 1.2 A, CI = 4.7 µF, CO = 22 µF,
CO = 22 µF, L = 3.3 µH, TON = 38 µs, TJ = 25 °C L = 3.3 µH, TON = 38 µs, TJ = 25 °C

Figure 20. Startup transient Figure 21. Startup transient

VCC = 5 V, TJ = 25 °C VCC = 5 V, TJ = 25 °C

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Package information ST1S03

8 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

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ST1S03 Package information

Figure 22. DFN6D (3 x 3 mm) package outline

%

Table 6. DFN6D (3 x 3 mm) package mechanical data

Dimensions (mm) Dimensions (inch)
Symbol
Min. Typ. Max. Min. Typ. Max.

A 0.80 1.00 0.031 0.039

A1 0 0.02 0.05 0 0.001 0.002
A3 0.20 0.008
b 0.23 0.45 0.009 0.018
D 2.90 3.00 3.10 0.114 0.118 0.122
D2 2.23 2.50 0.088 0.098
E 2.90 3.00 3.10 0.114 0.118 0.122
E2 1.50 1.75 0.059 0.069
e 0.95 0.037
L 0.30 0.40 0.50 0.012 0.016 0.020

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Package information ST1S03

Figure 23. Tape and reel QFNxx/DFNxx (3 x 3 mm) package outline(1)

1. Drawing is not in scale.

Table 7. Tape and reel QFNxx/DFNxx (3 x 3 mm) package mechanical data

Dimensions (mm) Dimensions (inch)
Symbol
Min. Typ. Max. Min. Typ. Max.

A 330 12.992
C 12.8 13.2 0.504 0.519
D 20.2 0.795
N 60 2.362
T 18.4 0.724
Ao 3.3 0.130
Bo 3.3 0.130
Ko 1.1 0.043
Po 4 0.157
P 8 0.315

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ST1S03 Revision history

9 Revision history

Table 8. Document revision history

Date Revision Changes

11-Nov-2004 1 First Release.

08-Feb-2005 2 Maturity Change.
03-Mar-2005 3 Mistake on Figure 1, TJ is changed 125 ==> 150°C on Table 3.
13-Jul-2005 4 Add new package SO-8 exposed pad.
29-Mar-2007 5 Package SO-8 removed.
07-Mar-2008 6 Removed: package mechanical data DFN6.
Updated Table 1: Device summary on page 1 (updated Packaging).
Updated Figure 2: Pin connections (top view) on page 4 (replaced by new figure).
Updated Table 2: Pin description on page 4 (added row 7).
14-Nov-2014 7 Updated Section 8: Package information on page 12 (updated and added titles,
updated ECOPACK text, reversed order of Figure 22 and Table 6, Figure 23 and
Table 7, updated headings of Table 6 and Table 7).
Minor modifications throughout document.

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 ST1S03

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