CMOS Technology
Modern CMOS Technology
We will describe a modern CMOS process flow. In the simplest CMOS technologies, we need to realize simply NMOS and PMOS transistors for circuits like those illustrated in the next slide. Typical CMOS technologies in manufacturing today add additional steps to implement multiple device VTH, TFT devices for loads in SRAMs, capacitors for DRAMs etc. Process described here will require 16 masks (through metal 2) and > 100 process steps. There are many possible variations on CMOS process flow e.g. Device Isolation using Field Oxide or Shallow Trench Formation.
Examples of Simple CMOS Circuits
+V IN 1 +V
PMOS OUTPUT
IN 2
OUTPUT INPUT NMOS
GND
GND
An Inverter
A NOR Gate
CMOS Process Flow
Final result of the process flow we will consider.
CMOS Process Flow
Photoresist Si3N4 SiO2
Si, (100), P Type, 5-50 cm
Substrate selection: moderately high resistivity, (100) orientation, P type. Wafer cleaning, thermal oxidation ( 40 nm), nitride LPCVD deposition ( 80 nm), photoresist spinning and baking ( 0.5 - 1.0 m).
CMOS Process Flow
Mask #1 patterns the active areas. The nitride is dry etched.
CMOS Process Flow
Field oxide is grown using a LOCOS process. Typically 90 min @ 1000 C in H2O grows 0.5 m.
CMOS Process Flow
Boron
P Implant
Mask #2 blocks a B+ implant to form the wells for the NMOS devices. Typically 1013 cm-2 @ 150-200 KeV.
CMOS Process Flow
Phosphorus
N Implant
P Implant
Mask #3 blocks a P+ implant to form the wells for the PMOS devices. Typically 1013 cm-2 @ 300+ KeV.
CMOS Process Flow
N Well
P Well
A high temperature drive-in produces the final well depths and repairs implant damage. Typically 4-6 hours @ 1000 C - 1100 C or equivalent Dt.
CMOS Process Flow
Boron
N Well
P Well
Mask #4 is used to mask the PMOS devices. A VTH adjust implant is done on the NMOS devices, typically a 1-5 x 1012 cm-2 B+ implant @ 50 - 75 KeV.
CMOS Process Flow
Mask #5 is used to mask the NMOS devices. A VTH adjust implant is done on the PMOS devices, typically 1-5 x 1012 cm-2 As+ implant @ 75 - 100 KeV.
CMOS Process Flow
The thin oxide over the active regions is stripped and a new gate oxide grown, typically 3 - 5 nm, which could be grown in 0.5 - 1 hrs @ 800 C in O2.
CMOS Process Flow
Polysilicon is deposited by LPCVD ( 0.5 m). An unmasked P+ or As+ implant dopes the poly (typically 5 x 1015 cm-2).
CMOS Process Flow
Mask #6 is used to protect the MOS gates. The poly is plasma etched using an anisotropic etch.
CMOS Process Flow
Mask #7 protects the PMOS devices. A P+ implant forms the LDD regions in the NMOS devices (typically 5 x 1013 cm-2 @ 50 KeV).
CMOS Process Flow
Mask #8 protects the NMOS devices. A B+ implant forms the LDD regions in the PMOS devices (typically 5 x 1013 cm-2 @ 50 KeV).
CMOS Process Flow
Conformal layer of SiO2 is deposited (typically 0.5 m).
CMOS Process Flow
Anisotropic etching leaves sidewall spacers along the edges of the poly gates.
CMOS Process Flow
Mask #9 protects the PMOS devices, An As+ implant forms the NMOS source and drain regions (typically 2-4 x 1015 cm-2 @ 75 KeV).
CMOS Process Flow
Mask #10 protects the NMOS devices, A B+ implant forms the PMOS source and drain regions (typically 1-3 x 1015 cm-2 @ 50 KeV).
CMOS Process Flow
A final high temperature anneal drives-in the junctions and repairs implant damage (typically 30 min @ 900C or 1 min RTA @ 1000C.
CMOS Process Flow
An unmasked oxide etch allows contacts to Si and poly regions.
CMOS Process Flow
Ti is deposited by sputtering (typically 100 nm).
CMOS Process Flow
The Ti is reacted in an N2 ambient, forming TiSi2 and TiN (typically 1 min @ 600 - 700 C).
CMOS Process Flow
Mask #11 is used to etch the TiN, forming local interconnects.
CMOS Process Flow
A conformal layer of SiO2 is deposited by LPCVD (typically 1 m).
CMOS Process Flow
CMP is used to planarize the wafer surface.
CMOS Process Flow
Mask #12 is used to define the contact holes. The SiO2 is etched.
CMOS Process Flow
A thin TiN barrier layer is deposited by sputtering (typically a few tens of nm), followed by W CVD deposition.
CMOS Process Flow
CMP is used to planarize the wafer surface, completing the damascene process.
CMOS Process Flow
Al is deposited on the wafer by sputtering. Mask #13 is used to pattern the Al and plasma etching is used to etch it.
CMOS Process Flow
Intermetal dielectric and second level metal are deposited and defined in the same way as level #1. Mask #14 is used to define contact vias and Mask #15 is used to define metal 2. A final passivation layer of Si3N4 is deposited by PECVD and patterned with Mask #16.
This completes the CMOS structure.
Summary of Key Ideas
An initial discussion on the CMOS process flow provides an introduction to the modern VLSI technology.
It provides a perspective on how individual technologies like oxidation and ion implantation are actually used. There are many variations on CMOS process flows used in the industry. The process described here is intended to be representative, although it is simplified compared to many current process flows.
Summary of Key Ideas
Perhaps the most important point is that while individual process steps like oxidation and ion implantation are usually studied as isolated technologies, their actual use is very much complicated by the fact that IC manufacturing consists of many sequential steps, each of which must integrate together to make the whole process flow work in manufacturing.
