Chapter 1 - Introduction
What is materials science? Why should we know about it? Materials drive our society Stone Age Bronze Age Iron Age Now?
Silicon Age? Polymer Age?
Chapter 1 - 1
Population Density
Intel Quad Core Extreme, 2007, 45 nm, 0.82 billion transistors over 300 billion transistors per wafer
7 billion people October 2011
Chapter 1 -
How to make computer chip
FET:
Chapter 1 -
Shape Memory Alloys
Shape Memory Alloys (SMA) are novel and special materials (http://www.youtube.com/watch?v=fLGaF6cWl04&feature=related)
--They can remember their shape when heated above a certain transition temperature --Also called muscle wires
SMAs change shape based on a solid state phase transformation Atomic level changes
--Rearrangement of atoms
Change in shape occurs at a specific temperature
--Shape Memory Effect
Chapter 1 - 4
SMA Major applications:
Nanomuscles Surgical instruments
Tissue Spreader Stents (angioplasty) Coronary Probe Brain Spatula
Endoscopy: miniature zoom device, bending actuator Force sensor Smart skin (wing turbulence reduction)
Chapter 1 -
Invisible Cloak?
Metamaterial: tiny, artificial structures that are smaller than the wavelength of light (they have to be to divert them) and exhibit negative electromagnetic properties (such as negative index of refraction) that affect how an object interacts with electromagnetic fields.
http://www.youtube.com/watch?v=z0-kUEiLWPU&feature=related http://www.youtube.com/watch?v=taSfueSfmag
Chapter 1 - 6
Types of Materials
Metals:
Strong, ductile high thermal & electrical conductivity opaque, reflective.
Polymers/plastics: Covalent bonding sharing of es
Soft, ductile, low strength, low density thermal & electrical insulators Optically translucent or transparent.
Ceramics: ionic bonding (refractory) compounds of metallic
& non-metallic elements (oxides, carbides, nitrides, sulfides) Brittle, glassy, elastic non-conducting (insulators)
Chapter 1 - 7
The Materials Selection Process
1. Pick Application
Determine required Properties
Properties: mechanical, electrical, thermal, magnetic, optical, deteriorative.
2. Properties 3. Material
Identify candidate Material(s)
Material: structure, composition.
Identify required Processing
Processing: changes structure and overall shape ex: casting, sintering, vapor deposition, doping forming, joining, annealing.
Chapter 1 - 8
Structure, Processing, & Properties
Properties depend on structure
ex: hardness vs structure of steel
(c)
6 00
Hardness (BHN)
5 00 4 00 3 00 2 00
30 mm 30 mm
30 mm
(a)
(b)
Data obtained from Figs. 10.30(a) and 10.32 with 4 wt% C composition, and from Fig. 11.14 and associated discussion, Callister 7e. Micrographs adapted from (a) Fig. 10.19; (b) Fig. 9.30;(c) Fig. 10.33; and (d) Fig. 10.21, Callister 7e.
100 0.01 0.1
1 10 100 1000 Cooling Rate (C/s)
Processing can change structure
ex: structure vs cooling rate of steel
Chapter 1 - 9
ELECTRICAL
Electrical Resistivity of Copper:
6 5
Adapted from Fig. 18.8, Callister 7e. (Fig. 18.8 adapted from: J.O. Linde, Ann Physik 5, 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids, 2nd edition, McGraw-Hill Company, New York, 1970.)
Resistivity, r
(10-8 Ohm-m)
4 3 2 1
-200
-100
T (C)
Adding impurity atoms to Cu increases resistivity. Deforming Cu increases resistivity.
Chapter 1 - 10
THERMAL
Space Shuttle Tiles:
--Silica fiber insulation offers low heat conduction.
Adapted from chapteropening photograph, Chapter 19, Callister 7e. (Courtesy of Lockheed Missiles and Space Company, Inc.)
Thermal Conductivity of Copper:
--It decreases when you add zinc!
400 300 200
Thermal Conductivity (W/m-K)
100
0 0 10 20 30 40 Composition (wt% Zinc)
100 mm
Adapted from Fig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems, Sunnyvale, CA) (Note: "W" denotes fig. is on CD-ROM.)
Adapted from Fig. 19.4, Callister 7e. (Fig. 19.4 is adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker, (Managing Editor), American Society for Metals, 1979, p. 315.)
Chapter 1 - 11
MAGNETIC
Magnetic Storage:
--Recording medium is magnetized by recording head.
Magnetic Permeability
vs. Composition:
--Adding 3 atomic % Si makes Fe a better recording medium!
Magnetization
Fe+3%Si Fe
Magnetic Field
Fig. 20.23, Callister 7e. (Fig. 20.23 is from J.U. Lemke, MRS Bulletin, Vol. XV, No. 3, p. 31, 1990.) Adapted from C.R. Barrett, W.D. Nix, and A.S. Tetelman, The Principles of Engineering Materials, Fig. 1-7(a), p. 9, 1973. Electronically reproduced by permission of Pearson Education, Inc., Upper Saddle River, New Jersey.
Chapter 1 - 12
OPTICAL
Transmittance:
--Aluminum oxide may be transparent, translucent, or opaque depending on the material structure.
single crystal polycrystal: low porosity polycrystal: high porosity
Adapted from Fig. 1.2, Callister 7e. (Specimen preparation, P.A. Lessing; photo by S. Tanner.)
Chapter 1 - 13
DETERIORATIVE
Stress & Saltwater...
--causes cracks!
Heat treatment: slows
crack speed in salt water!
crack speed (m/s)
10-8 as-is held at 160C for 1 hr before testing
Alloy 7178 tested in saturated aqueous NaCl solution at 23C
10-10
increasing load
Adapted from chapter-opening photograph, Chapter 17, Callister 7e. (from Marine Corrosion, Causes, and Prevention, John Wiley and Sons, Inc., 1975.)
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown Boveri Co.)
Chapter 1 - 14
SUMMARY
Course Goals:
Use the right material for the job.
Understand the relation between properties, structure, and processing.
Recognize new design opportunities offered by materials selection.
Chapter 1 - 15
Assignments
Reading: Chapter 6, sections 6.1-6.3, 6.6 Microlecture: Mechanical Properties: Stress and Strain Microlecture: Basic Mechanical Properties Homework: Question 1 Register clickers
Chapter 1 - 16