SEMINAR
0N
LITHOGRAPHY
Submitted in the partial fulfillment of requirement for the
award of degree
Bachelor of Engineering
In
Electronics and communication
Submitted By
Ravijit Singh (90/16)
Under the guidance of
Prof.Ajay Sharma
Department of Electronics and Communication Engineering
Mahant Bachittar Singh College of Engineering and Technology,Jammu
2019
Lithography
CONTENTS
- INTRODUCTION TO LITHOGRAPHY
- MAIN TECHNIQUES OF LITHOGRAPHY
- MECHANISM AND PROCEDURE OF
THESE TECHNIQUES
- SUMMARY
INTRODUCTION
Lithography = “Photoengraving”
- Transfer pattern into reactive polymer film (“resist”)
- Use resist to replicate pattern into thin film or substrate
• MAIN TYPES OF LITHOGRAPHY:
* Photolithography
* Electron beam lithography
– X-ray lithography
– Focused ion beam lithography
– Neutral atomic beam lithography
* = most common, we will talk about these!
“The invention of
photolithography is arguably
as important as that of the
wheel, bronze, or movable
type in terms of its impact on
society. It is, however, a
technology that is specialized
for use in microelectronics.”
Techniques of lithography
- PHOTOLITHOGRAPHY
- E BEAM LITHOGRAPHY
- X RAY LITHOGRAPHY
PHOTOLITHOGRAPHY
Photolithography, also called optical lithography or UV lithography, is a process used
in microfabrication to pattern parts of a thin film or the bulk of a substrate (also called a wafer).
It uses light to transfer a geometric pattern from a photomask (also called an optical mask) to
a photosensitive (that is, light-sensitive) chemical photoresist on the substrate.
STEPS:
1. Coat substrate with resist
2. Mask
3. Expose with light
4. Develop (dissolve exposed
(POSTIVE) OR unexposed
areas with chemicals
(NEGATIVE))
5. Etch unprotected areas or
deposit layer of metal
6. Strip resist (take it off)
Fun with Playdough…
The maximum resolution (minimum size) of
individual features is limited by diffraction…
Diffraction:
• bending of light
- around an edge
- through a slit
- past an object
(edges)
Electron Beam Lithography
E-beam:
– Finely focused beam of electrons (few nm diameter)
– Electrons deflected accurately and precisely to “write”
pattern without mask
• Resolution
– Diffraction not an issue
• λ < 1 A (0.1 nm)
– Scattering (is an issue)
• Forward (in resist layer)
• Backwards (substrate)
It’s more expensive and WAY SLOWER
Scanning Electron Beam Lithography
How it works…
– Electron source (gun)
• Thermionic
– Heat material until electrons emitted from surface
• Field emission
– Use electric field to extract electrons from the tip of a
very sharp point of tungsten
– Electron column (forms beam)
– Mechanical stage (moves around under beam)
– Control Computer
• Controls subsystems and transfers pattern data
Electron Beam Lithography
Electron scattering
• E beam loses energy as it enters a solid
• Electrons have elastic and inelastic collisions
• Leads to broadening of beam, exposure sites,
images
• Depends on velocity of electrons, atomic number
and density of substrate and resist
Scanning Electron Beam Lithography
• Mechanical Stage
– Moves substrate through the deflected e-beam
X RAY LITHOGRAPHY
• X-ray lithography, is a process used in
electronic industry to selectively remove
parts of a thin film. It uses X-rays to
transfer a geometric pattern from a mask
to a light-sensitive chemical photoresist,
or simply "resist," on the substrate. A
series of chemical treatments then
engraves the produced pattern into the
material underneath the photoresist.
Mechanisms
X-ray lithography originated as a candidate for next-generation lithography for
the semiconductor industry, with batches of microprocessors successfully produced.
Having short wavelengths (below 1 nm), X-rays overcome the diffraction limits
of optical lithography, allowing smaller feature sizes. If the X-ray source isn't
collimated, as with a synchrotron radiation, elementary collimating
mirrors or diffractive lenses are used in the place of the refractive lenses used in
optics. The X-rays illuminate a mask placed in proximity of a resist-coated wafer. The
X-rays are broadband, typically from a compact synchrotron radiation source, allowing
rapid exposure. Deep X-ray lithography (DXRL) uses yet shorter wavelengths on the
order of 0.1 nm and modified procedures such as the LIGA process, to fabricate deep
and even three-dimensional structures.
Summary
Photolitholgraphy:
Photolithography is the selective process that allows the patterning of a
desired design onto the material we want to fabricate with (the wafer in the
semiconductor industry).
Electron Beam (e-beam) Lithography:Today, Electron-Beam Lithography
(EBL) is employed to make the smallest components on silicon substrates
and is the most effective method of creating patterns on substrates such as
photo masks and x-ray masks.
X-Ray Lithography
X-ray lithography is the alternative process of electron-beam lithography,
and it creates a submicrometer element size in a much cheaper way.
