I am an experienced Materials and Semiconductor Packaging Engineer with a Master's degree in Materials Science from Harbin Institute of Technology (哈尔滨工业大学). My career has provided me with end-to-end experience, from fundamental materials analysis (SEM, TEM) to leading R&D in advanced packaging technologies like 2.5D TSV.
My passion lies in solving complex, multi-disciplinary engineering challenges at the intersection of materials, process, and device performance. I am now eager to apply my industrial expertise to academic research.
I am actively seeking a PhD position in Germany to research high-density, low-loss advanced packaging technologies for co-packaged optics (CPO) and silicon photonics. My interests include:
- Photonics-Electronics Co-Packaging (e.g., CPO)
- 3D/2.5D Integration & Through-Silicon Via (TSV) Technology
- Thermal Management and Signal Integrity for High-Speed Optical Modules
- Novel Materials and Processes for Optoelectronic Packaging
- Microscopy: Scanning Electron Microscopy (SEM/EDS), Transmission Electron Microscopy (TEM), Atomic Force Microscopy (AFM), Metallographic Microscope
- Spectroscopy: X-ray Diffraction/Fluorescence (XRD/XRF), Infrared/Ultraviolet Spectroscopy (IR/UV)
- Thermal Analysis: Thermogravimetric Analysis/Differential Scanning Calorimetry (TGA/DSC)
- Other: Laser Particle Size Analyzer, Universal Testing Machine, RoHS Compliance Testing
- Advanced Packaging: 2.5D/3D Integration, Through-Silicon Via (TSV) Etching (Deep Si Etching - Bosch Process), PECVD (SiO₂/Si₃N₄)
- Assembly & Test: Die Bonding, Wire Bonding, Optical Alignment, Wafer Thinning, CMP, Chip Performance Testing (CrystalDiskMark, H2testw), Reliability Testing (High/Low-Temp Cycling, Burn-in, Data Retention)
- Process Control: Quality Control (QC), Failure Analysis (FA), Statistical Process Control (SPC)
- Simulation & Design: Lumerical, COMSOL Multiphysics, Ansys, AutoCAD
- Data Analysis & Scripting: Python (with Pandas, NumPy), MATLAB
- Productivity: LaTeX, Microsoft Office Suite, ERP Systems
- Email: [email protected]
- LinkedIn: [www.linkedin.com/in/haochenma-packaging/]