SURFACE MOUNT
CERAMIC SMD MULTI-LAYER HIGH CAPACITANCE DS
TAPE DIMENSIONS (mm)
D0
Type P
Type C
E
F
A0
W
B0
G
t
t
K1
P
P0
P2
directional of unreeling
W
Type
C
D0
P
P0
Pꢃ
E
F
G
t
8.0 0.3
8.0 0.3
12.0 0.3
1.5 +0.1, -0
1.5 +0.1, -0
1.5 +0.1, -0
4.0 0.1
4.0 0.1
8.0 0.1
4.0 0.1
4.0 0.1
4.0 0.1
2.0 -0.05
2.0 0.05
2.0 0.05
1.75 0.1
1.75 0.1
1.75 0.1
3.5 0.05
3.5 0.05
5.5 0.05
0.75 min
0.75 min
0.75 min
1.1 max
0.3 max
0.1 max
P
P
C = Card P = Plastic
REEL DIMENSIONS (mm)
2 ± 0.5
+0.15
-0
12.75
Nom. Tape Width
A
W1
62
± 1.5
8
180 or 330 +0-2
180 or 330 +0-2
8.4 +1.5-0
12.4 +2-0
12
+0.5
-0
20.5
W1
PERFORMANCE CHARACTERISTICS
PERFROMANCE CHARACTERISTICS
1. ELECTRICAL
Dielectric Code
X7R
X5R
Y5V
Z5U
General
X7R dielectrics offer higher X5R dielectrics offer higher Y5V dielectrics offer the
Z5U dielectrics offer the
highest cpacitance for a
capacitance for a given
case size than COG.
capacitance for a given
case size than X7R.
highest capacitance for
a given case size than X5R. given case size than Y5V.
Examples of Applications
Applications would include Applictaions would include Applications would include Applications would include
bypass, coupling and filter- bypass, coupling and filter- bypass and decoupling bypass and decoupling
ing circuits.
ing circuits.
circuits or where tempera- circuits or where tempera-
ture dependence is not of ture dependance is not of
major importance.
major importance.
Temperature Range
-55° to + 125°
- 55° to + 85°
- 25° to + 85°
- 25° to + 85°
Insulation Resistance (I.R.) >100G ohms or 1000 sec >100G ohms or 1000sec
>10G ohms or 100 sec
whichever is less.
>10G ohms or 100 sec
whichever is less.
after 1 min charging at
Rated Voltage
whichever is less
whichever is less.
Voltage Ratings dc
Proof Voltage
10, 16, 25, 50
2.5 x rated voltage
15%
10,16,25
10, 16, 25, 35
2 x rated voltage
+30% to - 80%
10, 16, 25, 35
2.5 X rated voltage.
15%
2.5 x rated voltage
+22% to - 56%
Max allowable Capaci-
tance
Variation over Temperature
Range
ꢃ. ENVIRONMENT
Test
Conditions
Requirement
Resistance to soldering heat
Components completely immersed in a solder 25% Max leaching on each edge
bath at 260 10° for 5 secs.
Adhesion
Component mounted to substrate a force of
5N applied normal to the line joining the termi-
nation and in a line parallel to the substrate.
No visible damage
Rapid change or Temperature
- 55 to 125°C, 5 cycles (1B, 2C1)
- 25 to +85°, 5 cycles (2F4)
No visible damage. After recovery
∆ C/C
∆ C/C
∆ C/C
∆ C/C
Tan
≤ 1% or pF
≤ 10%
COG
X7R
X5R
Y5V
≤ 10%
≤ 20%
≤1.5 x specified value
≤0.25 x specified value
IR.
ꢃ1
Fax: 01371 875075 www.dubilier.co.uk Tel: 01371 875758
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