3MF

https://zou3d.com/ 3MF is quickly becoming the default file format for sharing not only single parts, but multi-geometry, multi-material and full build information for everything from industrial components, to consumer facing products such as those made available by ZOU3D. When you need to share data for #3Dprinting, consider the benefits of storing and communicating all required information in a single 3MF file.

HP AM and Würth Additive Group Partner to Simplify Supply Chains Worldwide   As part of the ongoing mission to accelerate the adoption of additive manufacturing across industries, HP AM and Würth Additive Group have teamed up to integrate HP’s scalable, quality-assured manufacturing with Würth’s Digital Inventory Services (DIS) and global logistics network. This enables manufacturers to shift from physical stock to on-demand spare parts management, anywhere in the world.   By embedding digital inventory directly into Würth’s logistics ecosystem, the integration ensures real-time availability and consistent part validation. This collaboration marks the first official implementation of the 3MF Secure Content extension, enabling secure printing workflows directly to HP MJF printers. Together, the two global leaders are making complexity simple by reducing inventory costs, accelerating delivery, and building more resilient, sustainable supply chains worldwide. https://lnkd.in/dnCTcUth

I will be at Formnext - Where ideas take shape Tuesday to Wednesday next week if you would like to meet up to discuss how 3MF can help with your #additivemanufacturing data flow. It is a free, open source, ISO - International Organization for Standardization backed by the The Linux Foundation and developed by the leading experts at HP, 3D Systems Corporation, EOS, Stratasys, nTop, Autodesk, Siemens, PTC, Dassault Systèmes, Altair, Materialise, Prusa Research, UltiMaker and more... More than just replacing the dreaded STL, 3MF enables full fidelity communication of the entire build, materials, security, parameters, colour, slices, beam lattices, implicits, booleans, surface displacement and we are now working on the toolpath extension to replace/augment CLI and Gcode for 2.5D, 3D and 6 axis systems. So, ping me to make a time to talk.... https://3mf.io/spec/

With over 100 applications now supporting 3MF, let us know if you hear of any company at Formnext - Where ideas take shape that does 𝘯𝘰𝘵 support 3MF, and we can help them with their adoption of the 𝗳𝗿𝗲𝗲, 𝗼𝗽𝗲𝗻 𝘀𝗼𝘂𝗿𝗰𝗲 𝗮𝗻𝗱 𝗜𝗦𝗢 𝘀𝘁𝗮𝗻𝗱𝗮𝗿𝗱...

https://lnkd.in/eH75kKzi Learn more about how 3MF has become the standard for data storage and communication for additive manufacturing from desktop 3D printing to industrial systems.

JTC 1 Q 3 2025 Newsletter JTC 1/WG 12's activities were introduced as the first news in Q3 articles. We are deeply grateful to JTC 1/AG 1 convener Tony Holland for his great support and help. 3D and 4D scanning workshop Professor Kyu Won Shim, the convenor of working group 12, along with a number of experts joined together on July 23rd to hold a virtual workshop on Interoperable file formats related to 3D/4D scanning and printing. Seventy participants joined the specialized Zoom workshop designed to expand people’s understanding of key 3D and 4D file formats — including STL, OBJ, PLY, 3MF, DICOM, glTF, and USD. By examining the characteristics and use cases of these formats, they explored how they are used across a wide range of industries, from manufacturing and healthcare to digital twins and the metaverse. A key focus of the session was to examine the challenges associated with interoperability among diverse 3D/4D file formats. The workshop facilitated discussions on existing barriers to seamless data exchange and explored potential solutions to enhance compatibility and integration across various platforms and applications. The workshop also featured contributions from other ISO and IEC committees working in related areas, offering participants a broader view of the evolving landscape of 3D/4D scanning and printing. Kyu Won Shim, Prof. (WG 12 Convenor) Yaeseul Park (Committee Manager) #JTC1 #JTC1WG12 #3Dprinting #3Dscanning #IECacademy

Steering Members of the 3MF Consortium meet every two weeks online, and 3 to 4 times a year in person to continue their work on improving the ISO/IEC 25422:2025 3D Manufacturing Format (3MF) specification suite Standard and it's extensions. This month we were hosted by Materialise in their HQ in Leuven where they were joined in person by representatives from Altair, Autodesk, EOS, PTC and Siemens, as well as remotely by HP, Stratasys and a number of associate members helping us work on the new toolpath extension. The consortium is open to organizations that wish to contribute to the adoption and advancement of open standards for additive manufacturing. If your company is working with 3D printing or digital manufacturing, consider joining the 3MF Consortium to help shape the future of interoperability in our industry. DM or email 3MF@Bits-to-atoms . com to discuss joining the consortium. Thanks to Kurt Renap for hosting, Alexander Oster, Vijai Kumar Suriyababu, Jan O., Mark Forsyth, James Olliff, Joseph Flynn, @hamid attar and Duann Scott