2G, 3G, 4G and 5G mobile technologies have evolved in the technology side of development.
The 6G mobile technology is the next generation wireless mobile resources and the 6g
technology will surely make a phenomenal changes in mobile technologies.
On the contrary, mobile manufacturers have reduced the mobile prices drastically such that each
and every single individual is owning a mobile and it also has become a necessity for better and
good communication. People earn money with these mobile technologies and this isn't
surprising. The how end and high end mobiles perform well which is needless to doubt.
6g mobile technology have become more familiar in most of the developed countries and in the
under developing countries. With the 3g becoming more and more familiar, the next level
technology 4g have evolved. Apple is going to the next levels which is the 5g and it also has
introduced ipods and other devices. They did not stop there, they took the next step and
forwarded for 6g technology and launched the iPod Nano 6G. iPod nano 6G is available in 8GB
and 16GB versions and carries the price tag of $149 and $179 respectively
What is 6g technology ?
Increase performance and maximize your data throughput and IOPS
Protect your system and secure your data
Ease your service and build efforts and expand your data center configuration options
Iops=(Input/Output Operations Per Second, pronounced eye-ops)
(with the answer typically
converted to MegabytesPerSec)
6g speeds are fast approaching
The importance of electronics in the modern world is hard to overstate, touching every aspect of
life. A good example is the telephone. For the first century of its existence, the telephone was
strictly a voice communication device. Today’s smart phone has a wide range of functions that
have nothing to do with voice, including email, web browsing and personal entertainment.
Tablets are another example. In just a few short years, they have become not only highly popular
consumer devices but productivity tools for enterprises, healthcare institutions and governments,
enhancing communications and providing a mobile communications work platform.
Telecommunications offers a striking example of the rapidity of the electronics revolution. The
move from 1G to 4G took a full decade. The pace of new technologies is accelerating, meaning
that the time to 5G and 6G will be much shorter — it may be a little as three years until 6G is a
reality.Higher Speed, Lower Power, Smaller Packages — and Increasing Demands on System
Designers
What are the driving forces behind this revolution? One key factor is the continuing evolution of
the integrated circuit (IC) toward higher speeds and lower power consumption, providing the
ability to make products of all kinds smaller and more powerful. Today, ICs are the brains of a
wide range of consumer products, from personal computers and smart phones to entertainment
devices, automobiles and home appliances. They are at the core of industrial products such as
industrial machinery and equipment, medical devices, renewable energy equipment, oil and gas
exploration systems, digital homes, networking components, process control equipment, aircraft,
and construction equipment.
At the system level, designers are being asked to pack more and more capability into devices and
electronic systems with ever-decreasing dimensions. The designers of the today’s smart phones
have to introduce new products that are lighter and thinner — and more frequently than before,
on an annual basis. At the same time, the telecommunications equipment industry must continue
to make faster and faster networking devices to accommodate the increasing traffic caused by
these nextgeneration smart devices. In such an environment, every design decision, from the
choice of components to the location of ports and switches, affects every aspect of the product.
Taken together, these trends create challenges for designers in a number of areas: Signal integrity
(SI) and electromagnetic interference: Signals are closer together in chips, on printed circuit
boards (PCBs), inside product enclosures and in cables. Therefore, it is more likely that
electromagnetic fields from one signal could interfere with and distort an adjacent signal,
resulting in product failure.Thermal performance: Higher current densities in chips, PCBs and
cables can create hot spots, influencing signal timing and potentially leading to component
failures. In some cases, a component fails because the temperature exceeds the limit of the
materials. But even temperatures below the threshold can produce failures due to
electromigration.
The Race to 6G — Faster Networks and Devices Promise a World of New Possibilities
Electro migration is the transport of material caused by the gradual movement of ions in a
conductor running at high current densities. The material moves due to the momentum transfer
between conducting electrons and diffused metal atoms. The effect is more pronounced as the
dimensions of an integrated circuit shrink. Mechanical integrity: Thermal cycling (the heating
and cooling of specific locations on a chip or PCB) can create stresses that lead to material
failure.
Typical failure mechanisms include delamination of copper traces inside the integrated circuit,
joint fatigue in the solder bumps near a PCB via and high mechanical loading due to vibrations
or dropping.
Complexity — and Market Pressure — on the Rise
In recent years, a number of factors have changed the nature of electronic design in a
fundamental way. Products are much more complex, leaving little or no room for error. And
there’s less time to complete the task: The design cycle is being compressed to beat competitors
and bring products to market faster. Adding to the challenge, heightened competition and tight
budgets create enormous pressure on engineering managers.
Management’s message is clear: “You can’t make a mistake.”
What about the designers themselves? For one thing, the engineering
profession has become increasingly specialized. Recent years have
seen the spawning of new disciplines such as signal integrity and power
consumption. Unlike the early days of the integrated circuit — when a
single engineer could, and often did, create the entire design — the typical
design group today requires a larger number of engineering specialties.
And those groups are not located in one place anymore. It’s not unusual
to have engineers in three or four countries — or even continents. A
typical electronic enterprise can have programmers in Moscow, hardware
engineers in San Jose and manufacturing engineers in Taiwan — and they
all have to work together to ensure success.
Design Methodology Hasn’t Kept Pace
While the demands on designers have increased almost exponentially,
the basic methodology and workflow for designing electronic products
has strayed little over the last 25 years. First, system architects develop
the overall architectural design of the product. Then the architecture is
partitioned into modules, which are assigned to individual engineers.
These engineers design their own modules, build prototypes and test
the prototypes to module specifications. After the modules meet module
specifications, they are integrated into a system prototype that is tested to
system specifications.
This approach worked well in the past but is inadequate to support today’s
designers. Problems that show up at the system level require changes
at the module level, a time-consuming and resource-intensive process.
This iterative methodology leads to unacceptably long time to market
and consumes far more resources than necessary. The need is to identify
system-level problems earlier in the process — when changes can be made
efficiently and quickly.
The Race to 6G — Faster Networks and Devices
Promise a World of New Possibilities The Crucial Need for What-If Testing
In today’s highly competitive marketplace, it is vital that design engineers
be able to optimize designs in terms of variables such as cost, size, weight,
power consumption and functionality. Optimization requires the ability to
run a number of what-if cases, changing a single aspect of the design and
assessing its impact on the overall system. Highly successful companies
use this approach to gain an edge over their competitors.
However, analyzing multiple what-if cases poses practical problems.
Building and testing a large number of physical prototypes is time
consuming and expensive. Simulation offers a faster, more accurate and
less expensive alternative.
Multiphysics Simulation Tools Speed Design Process
Over recent years, engineers have been turning to simulation as a way
to shorten the design process and pinpoint problems earlier. However,
these tools were usually specific to one aspect of the product design, for
example:
Circuit simulators model signal propagation within electronic circuits
and devices.
Computational fluid dynamics (CFD) tools predict temperatures on a chip
or PCB.
Electromagnetic simulation tools help engineers design RF components
and antennas, conduct compliance analyses, and analyze digital signal
propagation in high-speed channels.
With today’s more complex products, design decisions in one discipline
often impact other aspects of the design. For example, the thermal engineer
could recommend rerouting a signal on a chip to reduce the current load
at a hot spot. The signal integrity engineer might recommend against this
change because the proposed new signal route increases RF emissions and
compromises FCC compliance. Each engineer is working with a simulation
tool, but the tools cannot take into account both factors at once.
Multiphysics simulation tools represent the next stage in the evolution
of design methodology. They model interactions between structural
mechanics, heat transfer, fluid flow and electromagnetics behavior. Using
multiphysics tools, engineers and designers from various disciplines
can collaborate to create virtual prototypes of designs operating under
real-world multiphysics conditions. This new generation of simulation
tools accurately predicts how complex products will behave in real-world
environments — in which multiple types of coupled physics interact. The
software gives designers the tools they need to collaboratively optimize
designs and take advantage of the full capabilities of components and
materials in the product.
The Race to 6G — Faster Networks and Devices
Promise a World of New Possibilities Multiphysics simulation tools offer significant benefits to
both engineers
and engineering managers in time to market, production optimization, cost
control and business implications.
Time to Market
The legacy design process created “design silos.” Engineers focused on
their own disciplines as they created their module designs and did not — in
many cases, could not — assess the impact on other modules. The result?
Complex products often failed at the system level due to interactions that
could not be predicted at the module level.
Discovering these problems at the system prototype stage of the design
process can be costly. Such a process introduces delays in product
introductions, which result in missed market windows, delayed revenue
and competitive disadvantage. Simulating system-level interactions before
the completion of the module design phase leads to fewer system-level
failures and reduces redesign time, which in turn shortens time to market.
Reliability
Virtually every major manufacturer today has a horror story about a
product failure that led to expensive recalls and negative publicity.
These incidents almost always revolve around failures at the system level
— interactions between components that are difficult or impossible to
identify with conventional tools and processes. Multiphysics tools offer the
ability to more accurately simulate real-world conditions and interactions,
reducing the likelihood and severity of after-market product problems.
Companies that invest heavily in multiphysics simulation tools see a
significant payback by reducing the costs of recalls as well as the adverse
impact on the corporate brand.
Product Optimization
When they lack precise system-level analysis tools, engineers often
compensate by building in safety margins to reduce system-level failures.
For example, a thermal engineer might “pad” his calculations by 5 degrees
due to uncertainty in the actual behavior of the circuit. That strategy can
work, but it results in suboptimal designs. Getting that extra 5 degrees of
safety could involve moving components farther apart than they need to be,
resulting in a product that has a size disadvantage compared to others on
the market.
With accurate simulation, engineers can design more aggressively,
resulting in smaller, faster, more reliable products that are optimized for
size and other key competitive factors.
The Race to 6G — Faster Networks and Devices
Promise a World of New Possibilities Cost Control
When design engineers have access to multiphysics simulation during
the module design phase, they can address potential system-level
problems much earlier, before the system integration team begins building
prototypes. Solving problems at the module level is usually easier, less
costly and — most importantly — less likely to impact time to market or
lead to missed opportunities in the marketplace. Sophisticated simulation
tools also enhance the skills of engineers, leading to more robust and
functional designs and less need for expensive consultants in specialized
areas such as FCC compliance and signal integrity.
Business Implications
Multiphysics simulation is usually thought of as an engineering tool, but
it has business implications as well. The kinds of problems identified by
multiphysics simulation often have a direct effect on product specifications
such as product size, battery life, regulatory compliance and mean time
between failures. Identifying problems early in the design cycle also
broadens the domain of possible solutions.
Take a case in which early simulation shows that the overall power budget
for an integrated circuit will exceed design specifications. If this problem is
found close to product release, the only option may be a costly and laborintensive redesign of
key parts of the circuit. However, discovering it early
would allow the company to qualify a different IC manufacturer whose
process brings the power budget back within specifications.
