Advanced

Manufacturing
Technology
Lead-Free Reflow
Profile Study
October 2003

IPC-JEDEC 4th International Conference on

Lead-free Electronic Components and
Assemblies

Nabel Ghalib & Quyen Chu Girish S. Wable

Advanced Manufacturing Engineering Electronics Manufacturing Research and Services
Jabil Circuit, Inc. Department of Systems Science and Industrial
10800 Roosevelt Blvd. Engineering
St.Petersburg, Fl. 33716 State University of New York, Binghamton
727.803.3094
[email protected] [email protected]
Outline

‰ Objectives

‰ Observed Specifications:
‰ IPC-JEDEC 020B
‰ JEITA ED 4701/301A
‰ Paste Manufacturer Reflow Parameters Recommendations
‰ Jabil Reflow Parameters Specifications

‰ General Procedure

‰ Project Details

‰ Profile Results for PCB-A, PCB-B, PCB-C, and PCB-D

‰ Results Summary

‰ Comments on Experiment
Objectives

‰ Determine whether the selected component/PCB configurations

violate the maximum component body temperature according to
existing IPC/JEDEC STD 020 and JEITA ED 4701/301A, while
attempting to meet minimum solder joint temperature/time
requirements

‰ Compare time and temperature values on various components for

different board complexities
IPC-JEDEC STD 020B Component Classification Specification
JEITA ED-4701/301A Component Classification Specification

‰ Component Classification Temp

Volume (mm3)
Thickness
<350 350-2000 >2000
<1.6 260C 260C 260C
1.6-2.5 260C 250C 245C
>2.5 245C 245C 245C
Table taken from ED-4701/301A
Paste Manufacturer Reflow Profile Recommendations

‰ Reflow specifications of two leading paste suppliers

Ramp Time >217C Peak

Paste MFG Temperature (T)
(C/sec) (sec)
MFG-1 1-2 35-80 230 –240
MFG-2 0.5-2 30-70 238-248
Low-High Range 0.5-2 30-80 230-248

Yellow box indicates the combined reflow specification range.

 Jabil Reflow Profile Specification
‰ Combines component package qualification requirements and
paste specifications to establish a wide process window
Recommended Solder Alloy: Sn3-4Ag0.5Cu
Reflow

-5o C/se
ec
(45-120 sec)
250

3 oC/s
217-220oC 230oC (10 seconds) Minimum

c
(Melting) @ All Solder Joints

200 Soak
ec
Temperature (C)

ec
3 oC/s

(60-180 sec)

3 oC/s
150
Example
Profiles

-5o C/se
Measured
At the Solder
100 Preheat Cooldown

c
Joint
ec
3 oC/s

50
Gray Text and Solid Lines are “Max rates”

60 120 180 240 300 360 420 480 540 600 660 720 880
Time (sec)
General Procedure

‰ Select test PCBA’s categorized as small, medium, and large which

represent average to high complexity component mix and layout
densities.

‰ Select high risk areas (hot and cold spots) to attach

thermocouples.

‰ Develop reflow profiles for each board complexity.

‰ Compare results against IPC-JEDEC J-STD-020B and JEITA Comp.

Specifications.

‰ Modify reflow profiles to achieve optimal package and solder

paste requirements.

‰ Summarize findings.
 Project Details

‰ Thermal Profiler
‰ 9 Channel Profiler
‰ Reflow Oven
‰ 10 Zone Oven
‰ Test PCBAs

PCBA-A
6 x 4.6 x 0.093”
PCBA-B 13.4 x 8.7 x 0.062”

Note :All PCBAs used in this study were Jabil PCBA-C: 14.4 x 15.7 x 0.093” PCBA-D: 14.25 x 16.25 x 0.110”
MRB and customer donated non repairable
products.
Thermo-Couple Attachment Method

‰ Select hot spot (package body) A

and cold spot (solder joint)
locations on PCBA

D
‰ Attach thermo-couples:
‰ For leaded devices: Attach
thermo-couple at solderjoint
using high temp solder location A,
and on top of component body
using epoxy.
‰ For Array Packages: Drill a D
~30mil hole to approximate
center of solderjoint. Apply epoxy
in and around the hole, insert TC
into hole.
‰ Location A- foot of component lead
‰ Location B- center of package
‰ Location C- perimeter of package
B C
‰ Location D- top of component
PCBA-A: Board Details & TC Attachment

‰ Board S/N: PCBA – A

‰ Length: 6 in.
‰ Width: 4.6 in.
‰ Thickness: 0.093 in.
‰ Targeted TC Locations:
‰ TC1: Top of Cap
‰ TC2: Top of QFP
‰ TC3: Top of BGA
‰ TC4: Lead SO8
‰ TC5: Lead QFP
‰ TC6: Corner Joint BGA
‰ TC7: Center joint BGA
‰ TC8: Top of QFP
PCBA-A: Reflow Profile (1st Attempt)

Belt Speed: 35 in/min

 PCBA-A: Reflow Profile Parameters (1st Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Top of Cap 805 Cap 0.6 76.5 51.9 245.5 250 260

TC 2 Top of QFP 1021.0 1.0 76.6 47.0 241.9 250 260

TC 3 Top of BGA 1057.0 2.0 69.3 45.2 243.2 245 250

TC 4 Lead SO8 32.4 1.6 72.9 45.4 241.6 - -

TC 5 Lead QFP 2979.5 3.9 67.4 34.9 238.8 - -

TC 6 Corner Joint BGA 1057.0 2.0 64.9 36.2 238.5 - -

TC 7 Center joint BGA 1057.0 2.0 67.5 38.0 238.6 - -

TC 8 Top of QFP 2236.0 2.0 61.7 32.8 237.3 245 245

Yellow boxes indicate TC attachment on package body.
PCBA-B: Board Details & TC Attachment

‰ Board S/N: PCBA – B

‰ Length: 13.4 in.
‰ Width: 8.7 in.
‰ Thickness: 0.062 in.
‰ Targeted TC Locations:
‰ TC1: Top SOIC 24
‰ TC2: Connector Body
‰ TC3: Top BGA
‰ TC4: Center Joint BGA
‰ TC5: Joint PLCC 84
‰ TC6: Top SOIC 40
‰ TC7: Lead SOIC 48
‰ TC8: Lead SOIC 24
PCBA-B: Reflow Profile (1st Attempt)

Belt Speed: 36 in/min

 PCBA-B: Reflow Profile Parameters (1st Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Top SOIC 24 256.5 2.4 75.5 51.4 241.9 250 260

TC 2 Connector Body 1400 3.7 77.9 59.2 245.6 245 245

TC 3 Top BGA 750 1.2 72.7 49.9 242.7 245 260

TC 4 Center Joint BGA 750 1.2 74.8 45.9 240.4 - -

TC 5 Joint PLCC 84 3841.3 4.0 63.9 27.7 235.4 - -

TC 6 Top SOIC 40 25.74 0.9 71.4 51.5 243.7 250 260

TC 7 Lead SOIC 48 302.0 2.4 74.6 48.8 243.0 - -

TC 8 Lead SOIC 24 256.5 2.4 74.7 52.6 244.3 - -

Yellow boxes indicate TC attachment on package body.
PCBA-C: Board Details & TC Attachment

‰ Board S/N: PCBA – C

‰ Length: 15.7 in.
‰ Width: 14.4 in.
‰ Thickness: 0.093 in.
‰ Targeted TC Locations:
‰ TC1: Top of SOIC 48
‰ TC2: Center Joint CBGA
‰ TC3: Center Joint BGA Socket
‰ TC4: Center Joint BGA
‰ TC5: Top of SOIC 40
‰ TC6: Top of BGA
‰ TC7: Center Joint CCGA
‰ TC8: Top of QFP
PCBA-C: Reflow Profile (1st Attempt)

Belt Speed: 24 in/min

 PCBA-C: Reflow Profile Parameters (1st Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Top of SOIC 48 91.2 0.9 88.4 62.7 263.2 250 260

TC 2 Center Joint CBGA 2226.4 4.6 84.1 52.1 245.9 - -

TC 3 Center Joint BGA 4371.2 5.3 85.8 54.3 252.3 - -

TC 4 Center Joint BGA 3763.8 2.3 78.0 48.7 243.8 - -

TC 5 Top of SOIC 20 25.74 0.9 83.6 53.7 263.0 250 260

TC 6 Top of BGA 650.4 1.9 63.6 34.9 259.9 245 250

TC 7 Center Joint CCGA 8877.3 6.4 64.5 35.6 239.7 - -

TC 8 Top of QFP 402.5 1.5 75.7 44.7 260.9 245 260

Yellow boxes: TC attachment on package body.
Red text: Package body temperature violation.
 PCBA-C: Reflow Parameters Comparison (1st Attempt)
Small Pkg Body (TC1)
Large Pkg Body (TC6)
190
Large Pkg Solder Joint (TC7)
170

150
Time >217C (sec)

Max Time for Package Temperature (150sec)

130

110 Jabil Max Solder Joint Time >217 (120sec)

90

70 Paste Mfg Max Solder Joint Time >217 (80sec)

50

30

265

260
JEITA Small Pkg Body Temp (260C)
255
Peak Temp (C)

250
020B Small Pkg Body Temp (250C)
245
020/JEITA Large Pkg Body Temp
240 (245C)
235

230
Jabil Min Solder Joint Temp (230C)
225

1st Attempt
PCBA-C: Reflow Profile (14th Attempt)

Belt Speed: 27 in/min

 PCBA-C: Reflow Profile Parameters (14th Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Top of SOIC 48 91.2 0.9 92.3 67.2 248.9 250 260

TC 2 Center Joint CBGA 2226.4 4.6 86.1 47.7 238.0 - -

TC 3 Center Joint BGA 4371.2 5.33 80.6 54.3 239.3 - -

TC 4 Center Joint BGA 3763.8 2.25 81 40.7 236.0 - -

TC 5 Top of SOIC 20 25.74 0.9 97.1 68.6 247.4 250 260

TC 6 Top of BGA 650.4 1.9 60.4 49.8 241.6 245 250

TC 7 Center Joint CCGA 8877.3 6.43 67.8 20.8 232.6 - -

TC 8 Top of QFP 402.5 1.5 68.3 54.9 242.4 245 260

Yellow boxes: TC attachment on package body.
Red text: Package body temperature violation.
 PCBA-C: Reflow Parameters Comparison (14th Attempt)
Small Pkg Body
Large Pkg Body
190
Large Pkg Solder Joint
170

150
Time >217C (sec)

Max Time for Package Temperature (150sec)

130

110 Jabil Max Solder Joint Time >217 (120sec)

90

70 Paste Mfg Max Solder Joint Time >217 (80sec)

50

30

265

260
JEITA Small Pkg Body Temp (260C)
255
Peak Temp (C)

250
020B Small Pkg Body Temp (250C)
245
020/JEITA Large Pkg Body Temp
240 (245C)
235

230
Jabil Min Solder Joint Temp (230C)
225

1st Attempt 14th Attempt

PCBA-C: Reflow Profile (32nd Attempt)

Belt Speed: 32 in/min

 PCBA-C: Reflow Profile Parameters (32nd Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Top of SOIC 48 91.2 0.9 76.9 60.9 252.9 250 260

TC 2 Center Joint CBGA 2226.4 4.6 74.7 38.5 237.1 - -

TC 3 Center Joint BGA 4371.2 5.33 72.3 43.8 242.0 - -

TC 4 Center Joint BGA 3763.8 2.25 71.7 30.1 234.5 - -

TC 5 Top of SOIC 20 25.74 0.9 72.0 56.3 252.5 250 260

TC 6 Top of BGA 650.4 1.9 76.5 46.8 251.3 245 250

TC 7 Center Joint CCGA 8877.3 6.43 62.0 12.6 231.5 - -

TC 8 Top of QFP 402.5 1.5 61.0 48.2 246.8 245 260

Yellow boxes: TC attachment on package body.
Red text: Package body temperature violation.
 PCBA-C: Reflow Parameters Comparison (32nd Attempt)
Small Pkg Body
Large Pkg Body
190
Large Pkg Solder Joint
170
150
Time >217C (sec)

Package Max Temp

130

110 Jabil Max Time

90
70 Paste Mfg Max Time
50
30

265
260
JEITA Small Pkg
255
Peak Temp (C)

250
020B Small Pkg
245
020/JEITA Large Pkg
240
235
230
Jabil Min Temp
225

1st Attempt 14th Attempt 32nd Attempt

PCBA-C Package Temp Analysis Summary

‰ Optimal Reflow Profile for Package Peak Temp: Attempt 21

‰ Specification Analysis Breakdown
‰ J-Std 020B Analysis

Volume (mm3)
<350 >350
250C 245C

‰ JEITA ED-4701/301A
Volume (mm3)
Thickness
<350 350-2000 >2000
<1.6 260C 260C 260C
1.6-2.5 260C 250C 245C
>2.5 245C 245C 245C
PCBA-D: Board Details & TC Attachment

‰ Board S/N: PCBA–D

‰ Length: 16.25 in.
‰ Width: 14.25 in.
‰ Thickness: 0.110 in.
‰ Targeted TC Locations:
‰ TC1: Center Joint CCGA Large
‰ TC2: Center Joint CCGA MED
‰ TC3: Center Joint BGA
‰ TC4: Top of BGA
‰ TC5: Top of LED
‰ TC6: Top of SOIC 24
‰ TC7: Lead PLCC 28
‰ TC8: Top of BGA
PCBA-D: Reflow Profile (1st Attempt)

Belt Speed: 23 in/min

 PCBA-D: Reflow Profile Parameters (1st Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Center Joint CCGA 9522.4 5.1 31.1 0.0 219.3 - -

TC 2 Center Joint CCGA 4725.0 3.0 87.3 45.1 236.2 - -

TC 3 Center Joint BGA 2643.8 1.9 93.5 68.8 241.7 - -

TC 4 Top of BGA 2643.8 1.9 87.2 70.1 243.2 245 245

TC 5 Top of LED 17.7 0.8 103.6 83.3 255.8 250 260

TC 6 Top of SOIC 24 256.5 2.4 94.7 82.4 251.0 250 260

TC 7 Top of PLCC 28 435.6 3.6 80.0 67.8 250.7 245 245

TC 8 Top of BGA 410.1 0.9 87.2 65.9 247.1 245 260

Yellow boxes: TC attachment on package body.
Red text: Package body temperature violation.
 PCBA-D: Reflow Parameters Comparison (1st Attempt)
Small Pkg Body (TC5)
Large Pkg Body (TC7)
190 Large Pkg Solder Joint (TC1)
170

150
Time >217C (sec)

Max Time for Package Temperature (150sec)

130
110 Jabil Max Solder Joint Time >217 (120sec)
90
70 Paste Mfg Max Solder Joint Time >217 (80sec)
50

30

265
260 JEITA Small Pkg Body Temp (260C)
255
250
Peak Temp (C)

020B Small Pkg Body Temp (250C)

245
020/JEITA Large Pkg Body Temp
240 (245C)
235
230
225 Jabil Min Solder Joint Temp (230C)

220
215

1st Attempt
PCBA-D: Reflow Profile (14th Attempt)

Belt Speed: 18 in/min

 PCBA-D: Reflow Profile Parameters (14th Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Center Joint CCGA 9522.4 5.1 112.2 14.8 230.4 - -

TC 2 Center Joint CCGA 4725.0 3.0 145.6 103.3 245.8 - -

TC 3 Center Joint BGA 2643.8 1.9 154.3 121.1 253.4 - -

TC 4 Top of BGA 2643.8 1.9 148.8 120.8 255.6 245 245

TC 5 Top of LED 17.7 0.8 153.7 137.8 260.8 250 260

TC 6 Top of SOIC 24 256.5 2.4 159 124.5 257.4 250 260

TC 7 Top of PLCC 28 435.6 3.6 141.1 123.4 258.6 245 245

TC 8 Top of BGA 410.1 0.9 147.4 115.3 259.9 245 260

Yellow boxes: TC attachment on package body.
Red text: Package body temperature violation.
 PCBA-D: Reflow Parameters Comparison (14th Attempt)
Small Pkg Body
PCBA-DLarge Pkg Body
190 Large Pkg Solder Joint
170
Time >217C (sec)

150
Max Time for Package Temperature (150sec)
130
110 Jabil Max Solder Joint Time >217 (120sec)
90
70 Paste Mfg Max Solder Joint Time >217 (80sec)
50
30

265
260
JEITA Small Pkg Body Temp (260C)
255
250
Peak Temp (C)

020B Small Pkg Body Temp (250C)

245
020/JEITA Large Pkg Body Temp
240 (245C)
235
230
225 Jabil Min Solder Joint Temp (230C)

220
215

1st Attempt 14th Attempt

PCBA-D: Reflow Profile (21st Attempt)

Belt Speed: 18 in/min

 PCBA-D: Reflow Profile Parameters (21st Attempt)

Time Package Body

Package Dimension Time >217C (sec)
>230C Temp (C)
TC Package Peak Temp
P.MFG: 30-80 -SJ
No. Descript. Volume Thickness min. (C)
J-std: 60-150-Pkg 020B 020C
(mm3) (mm) 10sec
JBL: 45-120-SJ

TC 1 Center Joint CCGA 9522.4 5.1 104.2 12.9 230.4 - -

TC 2 Center Joint CCGA 4725.0 3.0 153.6 94 242.2 - -

TC 3 Center Joint BGA 2643.8 1.9 170.1 120.2 245.1 - -

TC 4 Top of BGA 2643.8 1.9 161.2 115.9 246.6 245 245

TC 5 Top of LED 17.7 0.8 187.1 144.4 249.3 250 260

TC 6 Top of SOIC 24 256.5 2.4 183.1 138.4 244.1 250 260

TC 7 Top of PLCC 28 435.6 3.6 157.2 120.4 247.0 245 245

TC 8 Top of BGA 410.1 0.9 167.3 125.9 249.1 245 260

Yellow boxes indicate TC attachment on package body.
 PCBA-D: Reflow Parameters Comparison (21st Attempt)
Small Pkg Body
PCBA-DLarge Pkg Body
190 Large Pkg Solder Joint
170
Time >217C (sec)

150
Package Max Temp
130
110 Jabil Max Time
90
70 Paste Mfg Max Time
50
30

265
JEITA Small Pkg
260
255
020B Small Pkg
250
Peak Temp (C)

245
020/JEITA Large Pkg
240
235
230
225 Jabil Min Temp

220
215

1st Attempt 14th Attempt 21st Attempt

PCBA-D: Package Temp Analysis Summary

‰ Optimal Reflow Profile for Package Peak Temp: Attempt 21

‰ Specification Analysis Breakdown
‰ J-Std 020B Analysis
Volume (mm3)
<350 >350
250C 245C

‰ JEITA ED-4701/301A
Volume (mm3)
Thickness
<350 350-2000 >2000

<1.6 260C 260C 260C

1.6-2.5 260C 250C 245C
>2.5 245C 245C 245C
Results Summary

‰ Board A Package Summary

‰ IPC-JEDEC J-STD 020B
‰ Monitored packages met time/temp requirements
‰ JEITA ED-4701/301A
‰ Monitored packages met time/temp requirements
‰ Paste Manufacturer Spec.
‰ Monitored solder joints met requirements

‰ Board B Package Summary

‰ IPC-JEDEC J-STD 020B
‰ Monitored packages met time/temp requirements
‰ JEITA ED-4701/301A
‰ Monitored packages met time/temp requirements
‰ Paste Manufacturer Spec.
‰ Monitored solder joints met requirements
Results Summary

‰ Board C Package Summary

‰ IPC-JEDEC J-STD 020B
‰ Monitored packages met time/temp requirements
‰ JEITA ED-4701/301A
‰ Monitored packages met time/temp requirements
‰ Paste Manufacturer Spec.
‰ Monitored solder joints met requirements
‰ Significant profiling effort required
Results Summary

‰ Board D package Summary

‰ IPC-JEDEC J-Std 020B
‰ Small packages
‰ Borderline to max temp requirement

‰ Violated time requirement

‰ Large packages
‰ Violated time/temp requirements

‰ JEITA ED-4701/301A
‰ “Small” packages
‰ Met max temp requirement

‰ Violated time requirement

‰ “Large” packages
‰ Violated time/temp requirements

‰ Paste Manufacturer Spec.

‰ Monitored solder joints violated requirements
‰ Significant profiling effort required

‰ To meet body temperature requirements, the body time at temp was violated
and vice versa
Comments

‰ Reflow profile development was performed using “state of the

art” reflow oven and profile optimization software

‰ Reflow profile development time was not typical of production

‰ Typical production profile time: 4-8hrs
‰ Profile investigation time: >24hrs per board type for the larger boards

‰ 2-3 assemblies were used to develop “reasonable” profiles for

larger boards
‰ Not typical of production

‰ Not all packages were monitored for a given board

‰ Time-Temperature monitoring device has only 9 channels
‰ Non-monitored packages may exceed time-temp requirements