Unit 1
Unit 1
BASIC
ELECTRONICS
ENGINEERING
UNIT-1 19
Topics UNIT-2
2nd MILESTONE
2 nd
MILESTONE
6. P-N junction formation
7. P-N Junction Diode
8. Biasing – Forward bias, Reverse bias
9. V-I Characteristics of PN junction diode
10. Diode as a Switch
11. Rectifier circuits
12. Half Wave Rectifiers
13. Full Wave Rectifiers
14. Full Wave Rectifier: Center-Tap Rectifier
3rd MILESTONE
15. Full Wave Rectifier: Bridge Rectifier
3rd MILESTONE
1 6. Special purpose diodes
17. Zener diode
18. Light emitting Diode (LED)
19. Photo diode
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UNIT-1 | 1st MILESTONE
U N I T
Introduction to Electronics
1. Evolution of Electronics
Introduction
The word Electronics is derived from “electron” which is present in all materials. The behavior
of an electron under different conditions of externally applied fields is studied under electron
mechanics.
Electronics is defined as “The Science and technology of the conduction of electricity in a vacuum,
a gas, or a semiconductor etc.” as per the Chambers 20th century dictionary.
In fact, electronics is a branch which essentially deals with electronic devices and their utilization. A
device in which conduction i.e electron flow takes place through a vacuum, a gas or semiconductor
is an electronic device.
Electronics has become vital for all of us now and it impacts all the sectors today. The history of
electronics is from 19th century and today electronics exist in almost every gadget or device used.
The components that could be considered as an important part of evolution of electronics
development is vacuum tube, the solid state devices (as an example transistor) and the integrated
circuit.
Vacuum Tubes
Word Electronics comes from elementary particle Electron which was first discovered by Sir J. J.
Thomson in 1897. But when AC and DC terms became more confirming, Physist James Fleming
came with first vacuum tube i.e diode. Thomas Alva Edison discovered that electrons would flow
from one metal conductor to another through a vacuum. This discovery of conduction is known as
the Edison Effect.
This vacuum diode allowed the flow of current in one direction called ‘Fleming Valve’ which is a
diode rectifier. In those days there was no existence of p-n junction in electronics field.
Electronics has evolved by rapidly since the invention of first amplifying device known as triode
vacuum tube in 1906 by Lee forest. This device could increase the strength of the signal, thus
devising the term amplifier.
The vaccum tubes, which are three terminal devices made manipulation of electrical energy
possible so it could be amplified and made efficient for transmission.
The vacuum tube did function well, but it was bulky and used a lot of electrical power that ended
up as heat which shortened the life of the tube itself. The transistor was a much more elegant
creation giving marvelous features.
The transistor was successfully demonstrated on December 23, 1947 at Bell Laboratory in Murray
Hill, New Jersey. The three individuals credited with the invention of the transistor were William
Shockley, John Bardeen and Walter Brattain.
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Integrated circuit (IC), also called microelectronic circuit, microchip, or chip is an assembly of
electronic components, fabricated as a single unit, which includes active device(e.g., transistors
and diodes),passive devices (e.g., capacitors and resistors) and their interconnections built up on
a thin substrate of semiconductor material (typically silicon).
The resulting circuit is thus a small monolithic “chip,” which may be as small as a few square
centimeters or only a few square millimeters. The individual circuit components are generally
microscopic in size.
The Integrated circuit (IC) chip was invented during 1958–1959 by Jack Kilby and Robert Noyce.
While at Fairchild, Noyce developed first monolithic IC chip, the same concept has been invented
by Jack Kilby at Texas Instruments in Dallas a few months previously known as hybrid integrated
circuit (hybrid IC).
In the early days of simple integrated circuits, the technology’s large scale limited each chip to
only a few transistors, and the low degree of integration meant the design process was relatively
simple. As metal–oxide–semiconductor (MOS) technology progressed, millions and then billions
of MOS transistors could be placed on one chip.
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We begin with an electronic alarm in a mobile, digital watch, use microwave oven for ease of
cooking without hassle, use grinders and mixers for assistance, use a washing machine for washing
the clothes, use vacuum cleaners for cleaning the homes and to listen news, music using electronic
gadgets like iPod, computer, mobile etc. Communicate with family and friends via mobiles,
laptops etc. And now we even will use E-vehicles for transit. The list will go on and on as we think
more.
Atomization is done at homes and offices with help of electronics to assist and make our fast lives
more comfortable.
Camera helps us to full fill our hobbies like photography and retain memories at a cheap cost.
Allowing to store huge data. Millions of people are depending on television and mobile for
entertainment (music, movies etc), online education and news.
It is indeed correct to say, we are blessed because of the evolution of electronics.
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Today’s world of electronics has made deep inroads in several areas, such as healthcare and
medical diagnosis, automobiles, industries, defense, space projects etc. Hence, We must accept
that without electronics all the pleasures we live in today would have been impossible.
Healthcare and Medical Industry: Electronic devices are being used in the health field, not only
to assist in diagnosis and determination of medical problems, but to assist in providing treatment
and cures for illnesses and even genetic anomalies. Equipment such as MRI, CAT and the older
X-rays, tests for diabetes, cholesterol and other blood component tests, all rely on electronics
in order to give quick results, without direct human intervention and precisely. Pacemakers and
smaller equipment implanted in the body is now almost a routine and are the boon to the needy. In
fact, the use of electronics in medical sciences has expanded to such an extent that a new branch
in medical science has been started called bioelectronics.
Defense and Aerospace Industry: The electronic is used in defense and aeronautical applications
such as RADAR (Radio Detection and Ranging), Missile Launching systems, Rocket Launchers
for space, Aircraft systems, Cockpit controllers, Boom barrier for military applications etc.
Instrumentation and Automation Industry: The electronics is used in instrumentation
applications such as the cathode ray oscilloscope (CROs), frequency counters, pulse and
signal generators, digital multimeters, power supplies, pH meters, strain gauges etc. Without
these instruments no research laboratory is complete. Overall there is complete dependency of
laboratories for experimentation on electronic instruments.
The electronics is used in automation using control systems, such as computers or robots, and
information technologies for handling different processes and machineries in an industry to replace
a human being. It is the second step beyond mechanization in the scope of industrialization.
Automation increased productivity and reduced the time and cost.
Communication and Entertainment Industry: The electronics is used in communication and
entertainment applications such as telephony and telegraphy, optical communication, television
and mobile communication, space and satellites communication, gadgets etc.
Automotive and Automobiles Industry: The automotive industry comprises a wide range of
companies and organizations involved in the design, development, manufacturing, marketing,
and selling of motor vehicles. The electronics is used in anti-collision unit, infotainment console,
anti-lock braking system, cruise control, traction control, window regulators, electronic control
unit (ECU), airbag control etc. The most important application in automation in automobiles is
electronic ignition, which provides better timing of the ignition spark, especially at high speed.
Computer and IT industries: Electronic and information technology includes computer
hardware and software. The mother board of CPU of computers is all nothing but electronics.
Video equipment and multimedia products, information kiosks, and office products such as
photocopiers and fax machines etc; electronics has a major role.
Electronic components are the basic elements of an electronic circuit or electronic system or
electronic device.
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An electronic component is any basic discrete device or physical entity in an electronic system
used to affect electrons or their associated fields.
There are numerous basic electronic components of various shapes, sizes, types and values
depending upon their material and composition used.
Some of these components are resistors, diodes, capacitors, inductors, transistors and integrated
circuits. These components are classified into two types: passive components and active
components.
Inductors Switches IC
The electronic component, which consumes energy in the form of voltage from the source, but
does not produce or supply energy is called passive electronic component.
These components can store or maintains energy either in the form of current or voltage.
Passive components cannot amplify or energize the energy of the signal associated with them;
they can store it or absorb it or dissipate it.
Passive elements do not possess gain and they cannot give energy continuously to the circuit.
Examples – resistor, capacitor, inductor etc.
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The electronic component, which consumes energy in the form of voltage or current and produces
or supplies energy in the form of electric current or voltage is called active component.
Active components depend on the external source of energy or voltage to perform a specific
operation.
These components can produce energy either in the form of current or voltage.
Active components can energize or amplify the signal.
They possess gain. They can give energy to the circuit.
Examples- diodes, transistors, ICs etc.
The active and passive components are differentiated on the basis of various factors like nature
of the source, function of component, power gain, behavior of component etc. The difference
between active and passive components is given below in the tabulated form.
Definition They does not require any external power They require an external power supply
supply/energy source for the operations. / energy source for the operations.
Function of Devices which store energy in the Devices which produce energy in the
Component form of voltage or current. form of voltage or current.
Nature of source A passive element utilizes power or An Active component delivers power
energy in the circuit. (Energy acceptor) or energy to the circuit. (Energy donor)
Flow of current Passive components cannot control the Active components can control the
flow of the current. flow of current.
Power Gain They are incapable of providing power They are capable of providing power
gain. gain.
Nature of energy Passive components are energy acceptor. Active components are energy donor.
Behavior of Mostly the behavior of components is Mostly the behavior of components is
Component linear. nonlinear.
Examples Resistor, capacitor, inductor etc. Diodes, transistors, SCR, integrated
circuits etc.
Resistors
Resistor is most common type of electronic component used in used in any electronic equipment.
It is two terminal passive component which is used to resist the flow of electric current in a circuit.
Resistance: Property of resistor to oppose the flow of current.
Unit: Measured in Ohms (Ω)
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Power rating: Maximum power that resistor can dissipate safely i.e. without damaged.
Relation between power rating (P), current carrying capacity (I) and value of resistance (R) is
P = I2 R
Types of Resistors
(i) Varistor
(ii) Potentiometers
Symbol of Resistors
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Resistors can be placed in an electrical or electronic circuit. In some instances, the resistors may
be placed in series, whereas in others they may be placed in parallel.
Resistors in series: If the resistors are placed in series then the overall resistance is simply the
sum of the individual resistors.
R Total = R1 + R 2 + R 3 + .....
Resistors in parallel: If resistors are placed in parallel, they share the current and the equivalent
resistance is calculated as,
1 1 1 1
= + + + .....
R Total R1 R 2 R 3
When there are only two resistors in parallel the formula simplifies to:
R1 R 2
R Total =
R1 + R 2
There are many ways used by manufactures to indicate the value of a component. In one method,
the value of the resistance offered by a resistor is generally indicated by color bands on it.
Color Band Calculation: The first and second band represents the numerical value of the resistor,
and the color of the third band specifies the power-of-ten multiplier. The last band is a tolerance band.
The color bands are always read from left to right starting with the side that has a band closer to
the edge.
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The first stripe is red for 2 and the next stripe is green for 5. The red multiplier in the third stripe
means add two zeros to 25, or “this multiplier is 102”. The forth strip, which indicates the resistor
tolerance, is gold for +-5%. The result can be illustrated as follows:
Red Green Red
2 5 × 100 = 2500
The first stripe is orange for the number 3, the second stripe is blue for the number 6, and the third
stripe is green for the number 5. Therefore, the first three digits of the resistance are 3, 6, and 5,
respectively. The fourth stripe, which is the multiplier, is black, which means add no zeros. The
fifth stripe, which indicates the resistor tolerance, is green for ±0.5%.
Therefore R =365 ± 0.5%. The permissible ohmic range is calculated as 365 × 0.005 =1.825 Ω,
that is 363.175 to 366.825Ω.
Capacitors
Capacitors are the next most used component in the electronics industry. Capacitor is two terminal
passive component which is used to store charge.
They are used in all types of circuits ranging from logic circuits to power supplies and various
electronic circuits used in communication systems.
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Capacitance is effectively the ability to store charge. In its simplest form a capacitor consists of
two parallel plates.
When a battery or any other voltage source is connected to the two plates as shown, the potential
difference exists across the capacitor. The current flows for a short time and one plate receive
excess of electrons, while the other have few. That is the one with the excess of electrons becomes
negatively charge, while the other losing the electrons becomes positively charged.
Connecting Connecting
wire + wire
+
Electrically Electrically Positively + Negatively
Neutral Neutral Charged + Charged
+
+
+
+
If the battery is removed the capacitor will retain its charge. However, if a resistor is placed across
the plates, providing a closed path, the current will flow until the capacitor becomes discharged.
Capacitance: Ability of capacitor to store charge in the form of an electrostatic field.
Unit: Measured in Farad (F).
The capacitance is said to be 1F when a charge of 1 coulomb is stored by the voltage of 1 V.
Types of Capacitors
Paper Capacitor
Mica Capacitor
Plastic Capacitor
Ceramic Capacitor
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Electrolytic Capacitor
Tantalum Capacitor
Ganged Capacitor
Trimmer Capacitor
Symbol of Capacitors
Capacitors in Series: When capacitors are connected in series, the total capacitance can be
determined by taking the reciprocal of the capacitance of each capacitor, and adding these together
to give the reciprocal of the total capacitance.
1 1 1 1
= + + + .....
CTotal C1 C2 C3
Capacitors in parallel: The total value is simply the sum of the capacitance values of the individual
capacitors.
CTotal = C1 + C 2 + C3
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Inductors
Inductor: The inductor is one of the passive electrical components which is a coil of wire that is
designed to induce a magnetic field in itself or in the core when a current is flowing through the coil.
Inductance: It is a property associated with any wire or coil which is caused by the magnetic field
that is set up when the current flows through it.
Inductor is also called as a “choke”.
Inductors have the exact opposite characteristics of capacitors i.e. capacitors store energy in the
form of an electric field (produced by the voltage between two plates), inductors store energy in
the form of a magnetic field (produced by the current through wire).
Unit: Henry (H)
Types of Inductors
Variable core
Symbol of Inductors
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2 7 10 +-5%
A 270 μH Inductor
27x10 μH with a tolerance rating of ± 5%
10-18 10-16 10-14 10-12 10-10 10-8 10-6 10-4 10-2 1 102 104 106 108
conductivity σ (Ω S/cm)
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The materials can be classified on the basis of energy gap between their valence band and
conduction band.
The valence band is the band consisting of free valence electron and the conduction band is empty
band.
Conduction takes place when an electron jumps from valence band to conduction band and the
gap between these two bands is energy gap.
Wider the gap between the bands, higher the energy it requires to shift the electron to conduction
band.
The materials are classified into three types on the basis of energy gap as conductors, insulators
and semiconductors.
The energy band gap of these solid-state materials is shown in figure below.
Conduction band
No band gap
Conduction band Wide band gap
+5eV
Narrow band gap
Conduction band 1 eV
hole
In case of conductors, this energy gap is absent (~0 eV) or in other words conduction band and
valence band overlap each other. Thus, electron requires minimum energy to jump from valence
band. Example: silver, copper and aluminum.
In insulators, this gap is very large (~5 eV). Therefore, it requires large amount of energy to shift
an electron from valence to conduction band.
Thus, insulators are poor conductors of electricity, Example: mica, diamond.
Semiconductors have energy gap in between conductors and insulators (~1 eV) and thus
require energy more than conductors but less than insulators. They don’t conduct electricity
at low temperature but as temperature increases, conductivity increases Example: silicon and
germanium.
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Semiconductor
Intrinsic Semiconductor
Si Si Si
Si Si Si Si
Si Si Si
[2, 8, 4]
Extrinsic Semiconductor
The semiconductor in which impurity is added for making it conductive is known as the extrinsic
semiconductor.
An intrinsic semiconductor is capable to conduct a little current even at room temperature, but
it is not useful for the proper operation. Thus, to make it conductive a small amount of suitable
impurity is added to the material.
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Doping
Doping is a process of adding small amount of impurities to pure semiconductors to increase the
conductivity of the material.
The purpose of adding impurity in the semiconductor crystal is to increase the number of free
electrons or holes to make it conductive.
The amount and type of impurity which is to be added to a material has to be closely controlled
during the preparation of extrinsic semiconductor.
Generally, one impurity atom is added to 108 atoms of a semiconductor.
If a pentavalent impurity, having five valence electrons is added to a pure semiconductor a large
number of free electrons will exist.
If a trivalent impurity having three valence electrons is added, a large number of holes will exist
in the semiconductor.
Basis of
Intrinsic Semiconductor Extrinsic Semiconductor
Difference
Doping of Doping or addition of impurity does not A small amount of impurity is dopped
impurity take place in intrinsic semiconductor. in a pure semiconductor for preparing
extrinsic semiconductor.
Density of The number of free electrons in the The number of electrons and holes are
electrons and conduction band is equal to the number not equal.
holes of holes in the valence band.
Electrical Low electrical conductivity. High electrical conductivity.
conductivity
Dependency Electrical conductivity is a function of Electrical conductivity depends on
of electrical temperature alone. temperature as well as on the amount of
conductivity impurity doping in the pure semicon-
ductor.
Example Crystalline form of pure Silicon and Impurity like As, Al, Sb, P, In, Bi etc.
Germanium. are dopped with Germanium and Sili-
con atom.
Depending upon the type of impurity added the extrinsic semiconductor can be classified as n type
semiconductor and p type semiconductor.
N-Type Semiconductor
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An N-type semiconductor is created by doping this pure silicon crystal lattice with a pentavalent
impurity element like Antimony (Sb – atomic number 51) or Arsenic (As – atomic number 33).
Such impurities which produce n-type semiconductors are known as donor impurities. They are
called a donor impurity because each atom of them donates one free electron.
The antimony (Sb) impurity element electron form covalent bonds with only four silicon atoms.
The fifth electron of the impurity atom is not bonded with any semiconductor atom in the crystal
lattice. This electron is loosely bonded to its parent impurity atom.
Thus, as external voltage or heat is applied this fifth electron easily breaks its bond with the parent
atom and takes part in conduction.
This fifth electron majorly contributes to the current in an N-type semiconductor as shown in
figure below. In the N-type Semiconductor the electrons become the majority carrier.
Si Si Si
Si Sb Si
Si Si Si
Free electron
Antimony (Sb) Doped Silicon - Extrinsic Semiconductor
Hence, each antimony atom provides one free electron in the silicon crystal. Since an extremely
small amount of antimony, impurity has a large number of atoms; it provides millions of free
electrons for conduction.
P-type Semiconductor
When a small amount of trivalent impurity is added to a pure semiconductor providing a large number
holes in it, the extrinsic semiconductor thus formed is known as p-type semiconductor. The conduction
in the p-type semiconductor is because of the holes denoted by the trivalent impurity atoms.
A p-type semiconductor is created by doping this pure germanium crystal lattice with a trivalent
impurity element like Gallium (Ga – atomic number 31) and Indium (In – atomic number 49).
Such impurities which produce p-type semiconductors are known as acceptor impurities because
each atom of them creates one hole which can accept one electron.
A trivalent impurity like gallium, having three valence electrons is added to germanium crystal in
a small amount.
Each atom of the impurity fits in the germanium crystal in such a way that its three valence electrons
form covalent bonds with the three surrounding germanium atoms as shown in the figure below.
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Ge Ge Ge
Ge Ga Ge
Ge Ge Ge
Hole
In the fourth covalent bonds, only the germanium atom contributes one valence electron, while
gallium atom has no valence bonds.
Hence, the fourth covalent bond is incomplete, having one electron short. This missing electron is
known as a hole. Thus, each gallium atom provides one hole in the germanium crystal.
As an extremely small amount of Gallium impurity has a large number of atoms, therefore, it
provides millions of holes in the semiconductor.
The difference between a p-type semiconductor and n-type semiconductor are given below in
tabulated form.
Basis of
p Type Semiconductor n Type Semiconductor
Difference
Group of Doping III group element is added as doping V group element is added as doping
Element element in case of p Type semiconduc- element in case of n type semiconduc-
tor. tor
Nature of Doping Impurity added creates vacancy of elec- Impurity added provides extra elec-
Element trons (holes) called as acceptor atom. trons and is known as donor Atom.
Type of impurity Trivalent impurity like Al, Ga, In etc. Pentavalent impurity like P, As, Sb, Bi
added are added. etc. are added.
Majority Carriers Holes are majority carriers. Electrons are majority carriers.
Minority Carriers Electrons are minority carriers. Holes are minority carriers.
Density of Elec- The hole density is much greater than The electron density is much greater
trons and Holes the electron density. than the hole density.
nh >> ne ne >> nh
Energy level The acceptor energy level is close to The donor energy level is close to the
the valence band and away from the conduction band and away from the
conduction band. valence band.
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Basis of
p Type Semiconductor n Type Semiconductor
Difference
Fermi level Fermi level lies between acceptor en- Fermi level lies between donor energy
ergy level and the valence band. level and the conduction band.
Movement of Majority carriers move from higher to Majority carriers move from lower to
Majority carriers lower potential. higher potential.
Drift Current
The current generated because of the application of external voltage that results in the movement
of charge carriers is defined as drift current.
There are two kinds of charge carriers in a semiconductor, that is holes and electrons. Holes are
positively charged carriers whereas the electrons are negatively charged carriers.
Once the voltage is applied to a semiconductor, the electrons move toward the positive terminal of
a battery whereas the holes travel toward the negative terminal of a battery.
Semiconductor
Voltage
Hole Free electron
Drift Current
Density in Semiconductors: As the external supply is provided there is the movement in the
majority of the concentration of the carriers. Based on the type of semiconductors its majority
carriers vary. Hence the electric field is applied, due to which the motion of charge carriers
observed results in the production of current.
Drift Velocity: The velocity required for the movement of charge carriers is referred to as drift
velocity. The current direction here is dependent on the collision occurring between the atoms.
Generally, the flow of electrons will be in the Brownian motion. But here the electric field is
responsible for them to arrange in a single direction.
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Diffusion Current
The “diffusion current” can be defined as the flow of charge carriers within a semiconductor
travels from a higher concentration region to a lower concentration region.
Diffusion current is mainly generated in semiconductors. The process of diffusion mainly occurs
when a semiconductor is doped non-uniformly as shown below.
Diffusion Current
A higher concentration region is nothing but where the number of carriers present is more in the
semiconductor. Similarly, a lower concentration region is where the smaller number of carriers are
present in the semiconductor.
The movement of carriers is from higher concentration area to lower concentration area for
equilibrium throughout the substrate. While this movement, the recombination of the carriers
takes place and it achieves uniformity. The current is generated in this process.
Let us take the example of n-type semiconductor that doped non-uniformly. In this, the majority
of the concentration of carriers is of electrons and the minority of the concentration of carriers is
of holes.
But while dealing with diffusion the property of majority carriers is considered here.
The electrons in the higher concentration region are more in the semiconductor so they will
experience a repulsive force from each other.
Definition The movement of charge carriers is The diffusion current can be occurred
because of the applied electric field is because of the diffusion in charge car-
known as drift current. riers.
external energy It requires electrical energy for the Some amount of external energy is enough
process of drift current. for the process of diffusion current.
Law Obeys This current obeys Ohm’s Law. This current obeys Fick’s Law.
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Direction of The direction of the drift current, as The direction of this current can be de-
Current well as the electric field, will be the cided by the concentration of the carrier
same. slope.
Dependency on It depends on the permittivity. It is independent of permittivity.
Permittivity
Currents The direction of this current mainly The direction of this current mainly
Depends on depends on the polarity of the applied depends on the charge within the con-
electric field. centrations of carrier.
V
Applied Electric field = E = V/m
L
Important Notations
E xercise - 1.1
Problem based on 1st Milestone
Click or Scan using
FORTFLAG app
for detailed
solution.
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5. Find value of resistor for RED, BLACK, GREEN, GOLD and value of inductor for YELLOW,
VIOLET, BROWN, GOLD.
6. What is doping? Explain donor (pentavalent) and acceptor (trivalent) impurity.
7. What is intrinsic and extrinsic semiconductor?
8. What is extrinsic semiconductor? Explain the n-type and p-type extrinsic semiconductor.
9. Explain drift and diffusion current with suitable diagram.
10. A bar of n type silicon has a length of 4 cm and cross-section of 10mm2. When it is subjected
to a voltage of 1V applied across its length, the current flowing through it is 5mA . Calculate i)
Concentration of free electrons ii) Drift velocity of electrons.
(Assume q = 1.6 × 10–19C and µn = 1300 cm2/V-sec)
Junction
Hole Electron
P N
When the P-N junction is formed, the N-side donor atoms accept additional holes and they become
positively charged immobile ions. Similarly, P-side acceptor atoms accept additional electrons and
they become negatively charged immobile ions. The formation of immobile ions near the junction
is shown in figure.
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Junction
P N
Depletion Region
In this region, there exists a wall in which there are no mobile charge carriers. Such a region is
depleted of the free mobile charge carriers and hence is called as depletion region or depletion layer.
Thus, under thermal equilibrium, the depletion region gets widened up to an extent where no more
electrons or holes can cross the junction. This depletion region acts as the barrier, due to which the
hole and electrons cannot diffuse further. This condition is shown in figure.
Depletion region
E
Depletion Region
Thus, at the junction, there are immobile positive and negative ions, due to which an electric field
called barrier potential or cut-in voltage is created at the junction.
The barrier potential depends on different factors like: Type of semiconductor, the acceptor
impurity added, the donor impurity added and the surrounding temperature.
The barrier potential for Silicon is 0.7 V and the barrier potential for Germanium is 0.3 V.
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When the n-type semiconductor is joined with the p-type semiconductor, a P-N junction is formed.
A P-N junction diode is two-terminal or two-electrode semiconductor device, which allows the
electric current in only one direction, while blocks the electric current in opposite or reverse
direction.
One electrode of the semiconductor device is termed the anode i.e. positive (p) side and the other
is termed the cathode i.e. a negative (n) side as shown in figure below.
p-type n-type
)+( )-(
Anode Cathode
P-N junction semiconductor diode is also called as p-n junction semiconductor device. Like any
diode, the PN junction diode has two terminals or electrodes. This gives it its name: “di-” meaning
two and “-ode” as a shortening of electrode.
The p-n junction diode is made from the semiconductor materials such as silicon, germanium, and
gallium arsenide.
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Bias voltage: The amount of voltage that an electronic device needs in order to power on and
function. Without bias voltage, an electronic device wouldn’t have sufficient energy to turn ON
and be operated.
Based on the applied voltage, there are two possible “biasing” conditions for the P-N Junction
diode, as mentioned below:
Forward Bias: The positive terminal of the battery is connected to the p-type material and the
negative terminal of the battery is connected to the n-type material.
Reverse Bias: The positive terminal of the battery is connected to the n-type material and the
negative terminal of the battery is connected to the p-type material.
Forward Bias
In the forward bias condition, the positive terminal of the battery is connected to the p-type material
and the negative terminal of the battery is connected to the n-type material.
The biasing voltage provided must be sufficiently large to force an electron from the n-region to
cross the junction and enter the p-region.
Due to the attractive force generated in the p-region, the electrons are attracted and they start
moving towards the positive terminal.
Simultaneously the holes are attracted to the negative terminal of the battery. Due to this movement
of electrons and holes current starts flow.
In this condition, the width of the depletion region decreases due to the reduction in the number
of positive and negative ions.
If this external voltage becomes greater than the value of the potential barrier, approximate 0.7
volts for silicon and 0.3 volts for germanium, the potential barriers opposition will be overcome
and current will start to flow as shown below.
PN Junction
p-region n-region
Very small
depletion layer
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Reverse Bias
In the reverse bias condition, the negative terminal of the battery is connected to the p-type material
and the positive terminal of the battery is connected to the n-type material. This connection is also
called as giving negative voltage.
The positive voltage applied to the n-type material attracts electrons towards the positive electrode
and away from the junction, while the holes in the p-type end are also attracted away from the
junction towards the negative electrode.
The net result is that the depletion layer grows wider due to a lack of electrons and holes and
presents a high impedance path, almost an insulator.
The result is that a larger potential barrier is created thus preventing current from flowing through
the semiconductor material as shown below.
PN Junction
p-region n-region
wider depletion
layer
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Forward
Bias
Reverse “knee”
Breakdown
–VR Voltage(VBR) Is A
O +VF
A forward bias characteristic is observed in first quadrant. In forward bias condition, the p-type
of the PN junction is connected to the positive terminal and n-type is connected to the negative
terminal of the external voltage. This results in reduced potential barrier.
In forward biased P-N junction diode, VF represents the forward voltage whereas IF represents the
forward current. At some forward voltage i.e. 0.7 V for Si and 0.3 V for Ge, the potential barrier
is almost overcome and the current starts flowing in the circuit.
From this instant, i.e., from knee point the current increases with the increase in forward voltage.
Hence, a curve OB is obtained with forward bias as shown in figure above.
From the forward characteristics, it can be noted that at first i.e., region OA, the current increases
very slowly and the curve is non-linear.
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However, once the external voltage exceeds the potential barrier voltage, the potential barrier is
eliminated and the P-N junction behaves as an ordinary conductor. Hence, the curve AB rises very
sharply with the increase in external voltage and the curve is almost linear.
Reverse bias characteristics is observed in third quadrant. In reverse bias condition, the p-type
of the PN junction is connected to the negative terminal and n-type is connected to the positive
terminal of the external voltage.
This results in increased potential barrier at the junction. Hence, the junction resistance becomes
very high and as a result practically no forward current flows through the circuit.
We know that there are few free electrons in p-type material and few holes in n-type material.
These free electrons in p-type and holes in n-type are called minority carriers.
In reverse biased P-N junction diode, VR represents the reverse voltage whereas IR represents the
reverse current. However, a very small current of the order of μA, flows through the circuit in
practice. This is known as reverse saturation current (IS) and it is due to the minority carriers in
the layers.
However, if the voltage applied to the diode is increased above an extent, the P-N junction diode
reaches to a state where junction breakdown occurs, and reverse current increases rapidly. This
voltage is known as reverse breakdown voltage (VBR). In a normal pn junction diode it may damage
the diode completely.
The relation between the applied voltage ‘V’ across the diode and current ‘I’ flowing through the
diode can be expressed mathematically by the diode current equation which is given as,
I = I O [e V /hVT - 1] Amperes
Where, V = Applied voltage across the diode in volts
I = Current flow through the diode in amperes
h = 2 for Silicon P-N junction diode
h = 1 for germanium P-N junction diode
I O = Reverse saturation current flow through diode in amperes
The term ‘e’ indicates that the diode current equation is exponential in nature and is applicable
for all the conditions of the diode operating modes (i.e., whether diode is forward biased, reverse
biased or in unbiased condition).
VT is the voltage equivalent of temperature in volts. It is given by following equation.
VT = K ´ T volts
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\ VT = 8.62 ´ 10 -5 ´ 298 K
\ VT = 25.68 mV
R1 R2
ON OFF
A
K D
A switching diode has a PN junction in which p-region is lightly doped and n-region is heavily
doped.
The above circuit symbolizes that the diode gets ON when positive voltage forward biases the
diode and it gets OFF when negative voltage reverse biases the diode.
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Rectifier: The circuit which converts AC voltage to a pulsating DC voltage using P-N junction
diodes is called a rectifier.
V (RL)
0
Rectifier
Types of Rectifiers
Diode
Input AC full cycles DC Output Positive
Half Cycles
Negative Half Wave Rectifier: A negative half wave rectifier converts only the negative half cycle
of the AC into DC.
Diode
DC Output Negative
Input AC full cycles
Half Cycles
In all types of rectifiers, a half-wave rectifier is the simplest of them all as it is composed of only
a single diode.
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Step down S1 D
Transformer
P1
Vdc
Line voltage
from an Primary VS Secondary
AC Power RL
P2
S2
Operation of HWR
The AC input to be rectified is connected to the diode. The input is stepped up or down using a
transformer.
A half wave rectifier uses a step-down transformer, a diode and a load resistor RL. The AC line
voltage (230 V, 50 Hz) is lowered by a step-down transformer that provides lower AC voltage at
the secondary in order to increase compatibility.
This alternating current supplied to the halfwave rectifier circuit will have positive half and
negative half cycle.
During the positive half cycle, the diode terminal anode will become positive and the cathode will
become negative known as forward bias. This will allow positive cycle to cause current to flow
through the diode.
During the negative half cycle, the anode will become negative and the cathode will become
positive, which is known as reverse bias. The diode will act as open switch and will not conduct
current. Thus, blocking the negative cycle.
So, when an AC source is connected to the half-wave rectifier, only half cycle will flow through it
as shown in the figure below. Thus, working as positive half wave rectifier.
V (RL)
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If we look at the input-to-output graph, it shows a pulsating positive half cycle of the input.
If we connect the diode in opposite direction, then the same circuit will allow only negative cycle
to be rectified. Thus, working as negative half wave rectifier.
This is one of the most important analysis parameters in case of rectifier for diode selection.
The peak inverse voltage is the maximum negative voltage that appears across the diode in the
reverse biased condition i. e. when the diode is not conducting
Step down S1 D
Transformer
P1
Vdc
Line voltage
from an Primary VS Secondary
AC Power RL
P2
S2
Uses less number of components so there is reduction in the size of the circuit and less cost.
It is simple in construction.
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The efficiency of full wave rectifier is high as compared to the half wave rectifier.
A full wave rectifier converts both positive and negative half cycles of the AC (alternating current)
into DC (direct current).
A full wave rectifier is made up of more than one diode.
There are two types of full wave rectifier.
(i) Center-Tapped Rectifier
(ii) Bridge Rectifier
D1
Step down
Transformer A
AC RL
voltage
Source
D2
Center-tapped Transformer
Figure shows center tapped full wave rectifier circuit with input 230V, 50Hz at primary of
transformer. Circuit uses two diodes D1 and D2 connected across secondary of transformer. Center-
tapped is taken as zero reference point.
For greater efficiency, we need to utilize both halves of the incoming AC. Here only one diode
conducts in one half cycle of the AC input, thus giving full-wave rectification.
However, for proper operation, this thing is not shown in diagram of the secondary winding.
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Ideally D1 acts as closed switch and D2 as open switch. So current cannot flow through
D2. The current flows through D1 and the load resistor RL through the upper half of the
secondary winding, thus providing the load current which develops positive voltage across
load resistance.
The waveforms show that the output of a rectifier is not exactly a DC It is called a pulsating DC
i.e. The DC output of a center-tap rectifier also has ripples and it’s not smooth and steady DC. A
capacitor at the output will remove the ripple and make a steady DC output.
V (RL)
D1
+
ON +Vm
D1
Single ON
t
phase - 0
AC +
supply
RL t
D2 0 D2
- OFF
-Vm
OFF
t
+Vm 0
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The cost increases because diodes of high PIV (2Vm) are required.
A center tapped transformer is required which is costlier and complicated to design, as well as the
amount of space required here, is more.
D1 D3
AC RL
voltage Vin
Source Vout
D2 D4
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During positive half cycle, the diode D2 and D3 becomes forward bias while D1 and D4 becomes
reverse bias.
The diode D2 and D3 forms a closed loop causing current to flow through RL that provides a
positive output voltage across the load resistor RL.
During the negative half cycle, the diode D1 and D4 becomes forward bias while D2 and D3 becomes
reverse bias, causing current to flow through RL that provides a positive output voltage across the
load resistor RL again as the direction of current is still the same.
Thus, provides a positive pulsating DC output voltage across the load.
The output of full wave rectifier has low ripples compared to half-wave rectifier but still, it’s not
smooth and steady.
V (RL)
Increased TUF(Transformer utilization factor) because the transformer used is not center-
tapped.
Does not require center-tapped transformer therefore cost is less.
High rectification efficiency.
The cost gets reduced as the diodes with less PIV rating are required.
Both output voltage and current are higher.
As the circuit requires four diodes, there is additional voltage drop across them which reduce the
output voltage.
Because of their low cost compared to center tapped they are widely used in power supply circuit.
It can be used to detect the amplitude of modulated radio signal.
Bridge rectifiers can be used to supply polarized voltage in welding.
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Step down
D1 A
D1 D3
P N
Transformer A
Vdc
AC RL
Line voltage voltage Vin
from an Primary VS Secondary Vout
AC Source
AC Power voltage O
RL
Source
D2 D4
P2
S2 B B
D2
Average or DC Im 2I m 2I m
load current p p p
I L dc
Maximum Vm 2Vm 2Vm
Average or DC p p p
load voltage
V L dc
RMS (Root Im Im Im
mean square) 2 2 2
load current
I L rms
RMS (Root Vm Vm Vm
mean square) 2 2 2
load voltage
V L rms
Expression for Vm Vm Vm
the peak load Im = Im = Im =
( RS + R F + R L ) ( RS + R F + R L ) ( R S + 2R F + R L )
current
Center tapped
Not required Required Not required
transformer
DC load power I 2m 4I 2m R f 4I 2m R f
Pdc RL
p2 p2 p2
Maximum
rectification ef- 40%(Very less) 81.2% 81.2%
ficiency ( h )
Transformer 28.7%(Very less i.e. 69.3%(Higher than that of 81.2% (Much higher than
Utilization fac- transformer is not utilized HWR. So better utiliza- that of HWR and Centre
tor (TUF) effectively ) tion of transformer) Tap Rectifier. So better
utilization of transformer)
Ripple factor 121%(Very high) 48% 48%
Ripple frequency f = 50 Hz f = 100 Hz f = 100 Hz
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Number of
One Two Four
diodes used
Transformer Possible due to unidirec- Not possible as the sec- Not possible as the sec-
core saturation tional secondary current. ondary current is not ondary current is not
unidirectional. unidirectional.
Peak Inverse
Voltage(PIV) Vm 2Vm (Disadvantage) Vm
Applications Used in low power simple Used for the battery Used in Mobile, Laptops
battery charger circuit. charger circuits, for the charger circuits, in Unin-
Pulse generator circuit, high power application, in terruptable Power Supply
signal modulation circuit, earlier transistor radio. (UPS) Circuits to convert
AM radio circuits as a AC to DC, in our Home
detector, in soldering iron Inverters to convert AC to
circuit etc. DC, in Televisions, LCD,
LED TVs, in Car Alter-
nator to charge the batter-
ies during the running of
the car.
Important Notations
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Vm
Im =
R F + R L + RS
Im I
I Ldc = , VLdc = I Ldc*R L , I Lrms = m
p 2
I 2m
PLdc = VLdc I Ldc = I 2Ldc R L = RL
p2
I 2m
Pac = I Lrms
2
[R L + R F + R S ] = [R L + R F + R S ]
4
2
æI ö
Ripple factor = ç Lrms ÷ - 1 = 1.21 or 121%
è I Ldc ø
PIV of diode = Vm
Vm
Im =
R F + R L + RS
2I m
I Ldc =
p
2Vm
VLdc = I Ldc R L =
p
Im
I Lrms =
2
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4 2
PLdc = I 2Ldc R L = ImR L
p2
I 2m ( R F + R S + R L ) Vm2
Pac = I 2
Srms (R F + RS + R L ) = =
2 2( R F + R S + R L )
8R L
h=
p (R F + RS + R L )
2
8
%hmax = = 0.812 = 81.2%
p2
2
æI ö
Ripple factor = ç Lrms ÷ - 1 = 0.48 = 48%
è I Ldc ø
PIV of diode = 2 Vm ,
VNL - VFL R + RS
% Regulation = ´ 100 = F ´ 100
VFL RL
Bridge Rectifier
Vm
Im =
R S + 2R F + R L
2I m
I Ldc =
p
2Vm
VLdc = I Ldc R L =
p
Im
I Lrms =
2
4 2
PLdc = I 2Ldc R L = ImR L
p2
Pac = ISrms
2
( R S + 2R F + R L )
PLdc 8R L
h= = 2 ,
Pac p ( R s + 2R f + R L )
hmax = 0.812 or 81.2%
2
æI ö
Ripple factor = ç Lrms ÷ - 1 = 0.48, T.U.F. = 0.812 = 81.2%
è I Ldc ø
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E xercise - 1.2
Problem based on 2nd Milestone
Click or Scan using
FORTFLAG app
for detailed
solution.
1. Explain the construction and working of P - N junction diode. Draw its V - I characteristics.
2. Explain biasing and operation of diode in different biasing.
3. Sketch and explain the V-I characteristics of P-N junction diode.
4. Draw and explain operation of half wave rectifier (HWR) along with corresponding input and
output waveforms.
5. Explain operation of FWR (Centre tapped / Bridge) with suitable diagram and waveforms. State
its advantages and disadvantages.
6. Define rectifier with its types. Draw and explain operation of FWR (centre tapped / Bridge)
rectifier along with waveforms.
7. Compare HWR, FWR and Bridge rectifier.
8. In a P-N junction germanium diode, if the reverse saturation current is 10 mA . Calculate the
forward current for voltages of 0.1 V, 0.2 V and 0.3 V respectively.
9. The forward current through a diode is 10 mA at room temperature ( 27°C).
Calculate
(i) Reverse saturation current Io for Si diode if forward voltage is 0.75 volt.
(ii) Reverse saturation current Io for Ge diode if forward voltage is 0.3 volt.
10. For full wave bridge rectifier, applied input voltage is 5sinωt. Calculate average output voltage,
RMS voltage and PIV rating of diode used.
11. For the half wave rectifier circuit of Fig. Shown below, the resistance of transformer secondary
is 5 W , forward resistance of the diode R F = 50 W and the load resistance is 1 kW . Calculate the
following:
RF = 50Ω
240V IL
50Hz VS
RL = 1kΩ
–
4 : 1
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Symbol
Appearance
Schematic Symbol
The schematic symbol for a zener diode is shown above. It is very similar to that of a regular
diode, but with bent edges on the bar.
The Zener still conducts electricity in the forward direction like any other diode, but also conducts
in the reverse direction, if the voltage applied is reversed and larger than the zener breakdown
voltage.
There are two different breakdown mechanisms in Zener diode viz. Zener breakdown and avalanche
breakdown. Usually, the Zener breakdown is observed at voltages less than approximately 6 V (5
V to 8 V) and avalanche breakdown is observed at voltages greater than 8 V.
(i) Zener breakdown
When a reverse voltage (< 6 V) is applied across the Zener diode, an intense electric field, of the
order of 3 X 105 V/cm, appears across the narrow depletion layer.
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This strong electric field is capable of breaking the covalent bond and generating the free electrons
available for conduction.
A large number of such free electrons cause heavy reverse current through the diode.
This is called Zener breakdown which occurs only for heavily doped diodes.
(ii) Avalanche breakdown
Avalanche breakdown is due to collisions when a reverse voltage > 6 V is applied across the Zener
diode.
As the magnitude of the reverse bias voltage is increased, the kinetic energy of the minority
carriers gets increased. While travelling, the minority carriers collide with the stationary atoms,
which in turn results in breaking some of the covalent bonds and generating free electrons.
These electrons act as minority carriers. Again, they get accelerated by the strong reverse bias
field thereby increasing the collision and also the number of free electrons. This is known as
carrier multiplication.
This process continues leading to a very swift multiplication effect and give rise to a large reverse
current in just a few picoseconds. This effect is called as “avalanche breakdown effect”.
V-I characteristics of a Zener diode is a graphical representation of the operation of the Zener
diode.
+IF
Forward
Forward
Current
Bias region
-VZ
Reverse Bias
-VR +VF
Forward
IZ (min) VF
Bias
Knee point 0.3-0.7 v
‘Zener”
breakdown
region
IZ (max) Reverse
Current
Constant Zener -IR
voltage
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In the V-I characteristics above Vz is the zener voltage. It is also the knee voltage because at this
point the current increases very rapidly.
The Zener diode is used in its “reverse bias” or reverse breakdown mode, i.e., the diodes anode
connects to the negative supply.
From the I-V characteristics curve above, we can see that the zener diode has a region in its reverse
bias characteristics of almost a constant negative voltage regardless of the value of the current
flowing through the diode.
This voltage remains almost constant even with large changes in current providing the Zener
diodes current remains between the breakdown current IZ(min) and its maximum current rating
IZ(max).
The voltage across the zener is represented by the equation shown below.
V = VZ + IZRZ
RS RS
Zener VZ Zener
Diode Diode VZ
In the forward biased condition, zener diode operates like a normal P-N junction diode.
When a PN junction of zener diode is reverse biased as shown in figure, the depletion layer
becomes wider.
If this reverse biased voltage across the diode is increased, the depletion layer becomes more and
more wider as shown below.
And there will be a small reverse saturation current due to minority carriers.
After certain reverse voltage across the junction, the width of the depletion layer becomes thinner
than that in a normally doped diode.
If the reverse voltage is continued to increase, at a certain reverse voltage reverse breakdown
occurs and the current in the zener diode increases rapidly.
This breakdown is called zener breakdown. The voltage at which this breakdown occurs is called
zener voltage.
The zener voltage of the diode gets adjusted during manufacturing with the help of required and
proper doping.
When a zener diode is connected across a voltage source, and the source voltage is more than
zener voltage, the voltage across a zener diode remains fixed irrespective of the source voltage.
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The increase in this voltage causes only the current through the zener diode to increase. Although
at that condition current through the diode can be of any value depending on the load connected
with the diode.
That is why we use a zener diode mainly for controlling or regulating the voltage in different
circuits.
The function of a voltage regulator is to provide a constant output voltage to a load connected in
parallel with it in spite of the ripples in the supply voltage or variations in the load current.
A zener diode will continue to regulate its voltage until the diodes holding current falls below the
minimum Iz(min) value in the reverse breakdown region.
The voltage regulator is used for two main reasons
(i) To vary or regulate the output voltage.
(ii) To keep the output voltage constant at the desired value in spite of variations in the supply
voltage.
Voltage regulators are used in computers, power generators, alternators to control the output of the
plant.
Rs
50
0 100 5.00 v
5v
Volt
metre
Voltage
Control
RS
IS
+
IZ IL
Vin
RL VO
VZ
–
Zener as Voltage Regulator
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The Regulating action in Zener Shunt Regulator with Varying Input Voltage (RL Constant)
V V
We know that output of the zener regulator Vo = VZ = constant is, I L = O = Z
RL RL
We can say from the above equation, if RL and Vz are constant, the load current always remains
V - VZ
constant IS = I Z + I L = in .
RS
From the above equation, we can say that, if the input voltage Vin increases, the current through RS
increases, IL cannot increase as VZ and RL are constant.
As the zener diode resistance is much smaller than RL when it is conducting, this extra current
flows through the zener diode to keep the load current constant as long as IZ < IZmax.
Therefore, IL remains constant and so VO remains constant.
I max = I Z max + I L
I min = I Z min + I L
Regulating Action with Varying Load (Keeping Vin Constant)
Here we consider that RL is variable and Vin is constant.
V - VZ
I = in , where I is the total current.
RS
If the load resistor RL decreases, load current IL increases, the current flow through RS is constant.
Hence, the current through the Zener diode decreases to keep the output voltage VO constant.
LED Symbol
The symbol LED is similar to that of the p-n junction diode. The difference between these two
symbols is that the two arrows indicate that the diode is emitting the light.
(+) (-)
Anode Cathode
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LED Construction
LED construction is same as that of p-n junction semiconductor diode and the LED is operated in
the forward biased region.
It operates on the principle which states that when the recombination of electrons and holes takes
place, the energy is released in the form of light.
The methods used to construct LED is to deposit three semiconductor layers on the
substrate.
The three semiconductor layers deposited on the substrate are n-type semiconductor, p-type
semiconductor and active region.
Active region is present in between the n-type and p-type semiconductor layers. The light emerges
from active region in all the directions when electron hole pairs recombine.
In order to focus light in desired direction, the basic structure is placed inside a small reflective
cup. Type of construction is called cup type construction as shown in figure.
Light
p-type
Active region
n-type
When LED is forward biased, the free electrons from n-type will cross the junction and recombine
with the holes in the p type material.
These free electrons reside in the conduction band and hence are at a higher energy level than the
holes in the valance band.
When the recombination takes place, these electrons return back to the valance band which is at a
lower energy level than the conduction band.
While returning back the recombining electrons give away the excess energy in the form of light.
This process is called as “Electro-luminescence” this is the property of the material to convert
electrical energy into light energy and later it radiates this light energy.
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Depletion layer
p-region n-region
Conduction band
Efc
Ec
Energy gap
Ev
Efv
Valance band
LED Colors
Silicon or Germanium do not emit energy in the form of light. Instead, they emit energy in the
form of heat. Thus, silicon or germanium is not used for constructing LEDs.
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LED Biasing
The voltage drop across a conducting LED is in the range of 1.2 V to 3.2 V, depending on the
material used.
This voltage is much higher than that across a conventional diode.
The current range of the LED available in market is 10 to 80 mA.
It has low reverse breakdown voltage of the order 3 to 10 V. So, they should not be used in circuit
with high reverse voltage than specified.
Advantages of LED
Disadvantages of LED
Applications of LED
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19. Photodiode
A special type of PN junction device which generates current when exposed to light is called as
Photodiode.
It is also known as” photo or light detector” or “photo sensor”. The working principle of photo
diode is just opposite to the working function of LED in a sense that photodiode converts light into
an electrical signal.
The photodiode is a device that operates in reverse bias and it is a form of sensor that converts
light energy into electrical voltage or current.
Symbol
The symbol of the photodiode is similar to that of an LED but the arrows point inwards as opposed
to outwards in the LED. The following images shows the symbol and construction of a photodiode.
(+) (-)
Anode Cathode
Photodiode Symbol
Construction of Photodiode
Principle of Photodiode
It works on the principle of “Photoelectric effect”. The operating principle of the photodiode is
such that when the junction of this two-terminal semiconductor device is illuminated, then the
electric current starts to flow through it.
Only minority current flows through the device when certain reverse potential is applied to it.
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Working of Photodiode
Incident photon
wider depletion
layer
The electrons present in the p side and holes present in n side are the minority carriers.
When a certain reverse-biased voltage is applied, then minority carrier holes from n-side
experiences repulsive force from the positive potential of the battery.
Similarly, the electrons present in the p side experience repulsion from the negative potential of
the battery.
This results in recombination of these minority carriers at the junction.
This causes a very small reverse current flows through the device known as dark current.
It is called so because this current is the result of the flow of minority carriers and when the device
is not exposed to radiation i.e. in the absence of light.
When the junction of the device is illuminated with light as shown in figure above, and the light
falls on the surface of the junction, the temperature of the junction increases. This causes the
electron and hole to get separated from each other.
So, we can say the intensity of light energy is directly proportional to the current through the
device.
In forward biased condition the change in current due to light intensity is insignificant. Hence, it
is obvious to use in reverse bias condition.
Characteristics of Photodiode
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Reverse Forward
bias voltage bias voltage
-4 -3 -2 -1 0.5
-V +V
Dark current
-100
-200 Reverse
current
-300
-400
μA
Here, the vertical line represents the reverse current flowing through the device and the horizontal
line represents the reverse-biased potential.
The first curve represents the dark current that generates due to minority carriers in the absence of
light. As we can see in the above figure that all the curve shows almost equal spacing in between
them. This is so because current proportionally increases with the luminous flux.
Dark current: It is the current flowing through a photodiode in the absence of light.
Dark current flows due to the thermally generated minority carriers and hence increases with
increase in temperature. Dark current should be as low as possible.
The reverse current (photocurrent) depends only on the intensity of light incident on the junction.
It is almost independent of the reverse voltage.
The figure below shows the curve for current versus illumination.
800
600
Current
400
200
Illumination, E
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Advantages of Photodiode
High sensitivity: That means a large change in the photocurrent for the small change in light
intensity.
High speed of operation as compared to LDR (Light Dependent Resistor).
Disadvantages of Photodiode
Applications of Photodiode
Photodiodes are applied in safety electronics like fire and smoke detectors.
It is used in TV units.
Utilized in cameras, they act as photo sensors.
Photodiodes are also widely used in numerous medical applications.
In optocouplers.
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E xercise - 1.3
Problem based on 3rd Milestone
Click or Scan using
FORTFLAG app
for detailed
solution.
IZ IL
24V VL
RL
10. For a Zener regulator, input voltage varies from 22 V to 28 V, VO = 18 V. The load current varies
from 200 mA to 2 A. Design the suitable zener regulator.
11. Design a zener diode shunt regulator to have an output voltage 7.3 V and load current is changed
from 25 mA to 110 mA. The input voltage applied to the regulator is 12 V.
12. For Zener voltage regulator, if Izmin = 2mA, Izmax = 20mA, Vz = 4.7V. Determine the range of input
voltage over which output voltage remains constant. Rs = 1KΩ, RL = 1KΩ, ZZ = 0Ω.
55
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