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LM3480
SNVS011H – JUNE 1999 – REVISED SEPTEMBER 2015

LM3480 100-mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator

1 Features 3 Description
•
1 Input Voltage Range: up to 30 V The LM3480 is an integrated linear voltage regulator.
It features operation from an input as high as 30 V
• 3.3-V, 5-V, 12-V, and 15-V Versions Available and an ensured maximum dropout of 1.2 V at the full
• Packaged in the Tiny 3-Lead SOT-23 Package 100-mA load. Standard packaging for the LM3480 is
• 30-V Maximum Input for Operation the 3-lead SOT-23 package.
• 1.2-V Ensured Maximum Dropout Over Full Load The 5-V, 12-V, and 15-V members of the LM3480
and Temperature Ranges series are intended as tiny alternatives to industry
• 100-mA Ensured Minimum Load Current standard LM78Lxx series and similar devices. The
1.2-V quasi-low dropout of LM3480 series devices
• ±5% Ensured Output Voltage Tolerance Over Full makes them a nice fit in many applications where the
Load and Temperature Ranges 2-V to 2.5-V dropout of LM78Lxx series devices
• −40 to +125°C Junction Temperature Range for precludes their (LM78Lxx series devices) use.
Operation
The LM3480 series also features a 3.3-V member.
The SOT-23 packaging and quasi-low dropout
2 Applications features of the LM3480 series converge in this device
• Tiny Alternative to LM78Lxx Series and Similar to provide a very nice, very tiny, 3.3-V, 100-mA bias
Devices supply that regulates directly off the system 5-V ±5%
power supply.
• Tiny 5-V ±5% to 3.3-V, 100-mA Converter
• Post Regulator for Switching DC/DC Converter Device Information(1)
• Bias Supply for Analog Circuits PART NUMBER PACKAGE BODY SIZE (NOM)
LM3480 SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.

space
space
space
Typical Application Circuit
6.5 V IN 5 V, 100 mA OUT
2 1
LM3480IM3-5.0

CIN 3 COUT
0.1 µF 0.1 µF

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3480
SNVS011H – JUNE 1999 – REVISED SEPTEMBER 2015 www.ti.com

Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 10
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 10
3 Description ............................................................. 1 8 Application and Implementation ........................ 11
4 Revision History..................................................... 2 8.1 Application Information............................................ 11
8.2 Typical Application ................................................. 11
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 13
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 13
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 13
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 13
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 14
6.5 Electrical Characteristics: LM3480-3.3, LM3480-5 ... 5 11.1 Community Resources.......................................... 14
6.6 Electrical Characteristics: LM3480-12, LM3480-15 .. 6 11.2 Trademarks ........................................................... 14
6.7 Typical Characteristics .............................................. 7 11.3 Electrostatic Discharge Caution ............................ 14
7 Detailed Description ............................................ 10 11.4 Glossary ................................................................ 14
7.1 Overview ................................................................. 10 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 10 Information ........................................................... 14

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (February 2015) to Revision H Page

• Replaced Functional Block Diagram .................................................................................................................................... 10

• Changed text of External Capacitors subsection ................................................................................................................ 11
• Changed text of Output Capacitor subsection ..................................................................................................................... 11

Changes from Revision F (December 2014) to Revision G Page

• Changed pin numbers indicated in Typical Application drawing; fix typos............................................................................. 1

• Deleted soldering specs - found in POA ................................................................................................................................ 4
• Changed Handling Ratings to ESD Ratings format ............................................................................................................... 4

Changes from Revision E (March 2013) to Revision F Page

• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section; add updated Thermal Information ............................................................................................................................. 1

Changes from Revision D (March 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format ............................................................................................................. 9

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5 Pin Configuration and Functions

DBZ Package
3-Pin SOT-23
Top View

Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
OUT 1 O Output voltage
IN 2 I Input voltage supply
GND 3 — Common ground

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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
MIN MAX UNIT
Input voltage (IN to GND) –0.3 35 V
Power dissipation (3) Internally
Limited
Junction temperature (3) –40 150 °C
Storage temperature, Tstg −65 150 °C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.
(2) If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ – TA) / RθJA where
TJ is the junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. The 370-mW
rating results from substituting the Absolute Maximum junction temperature, 150°C for TJ, 50°C for TA, and 269.6°C/W for RθJA. More
power can be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures.
The Absolute Maximum power dissipation can be increased by 3.7 mW for each °C below 50°C ambient. It must be derated by 3.7 mW
for each °C above 50°C ambient. Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction
temperature to about 150°C.

6.2 ESD Ratings

VALUE UNIT
Electrostatic Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000
V(ESD) V
discharge Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Maximum input voltage (IN to GND) 0 30 V
Junction temperature (TJ) –40 125 °C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.

6.4 Thermal Information

LM3480
THERMAL METRIC (1) SOT-23 (DBZ) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 269.6
RθJC(top) Junction-to-case (top) thermal resistance 141.1
RθJB Junction-to-board thermal resistance 63.1 °C/W
ψJT Junction-to-top characterization parameter 24.2
ψJB Junction-to-board characterization parameter 62.1

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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6.5 Electrical Characteristics: LM3480-3.3, LM3480-5

Typical and other limits apply for TA = TJ = 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 3.3 V or 5
V. (1) (2) (3)
VNOM = 3.3 V VNOM = 5 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V
3.17 3.3 3.43 4.8 5 5.2
1 mA ≤ IOUT ≤ 100 mA
VOUT Output voltage VIN = VNOM + 1.5 V V
1 mA ≤ IOUT ≤ 100 mA 3.14 3.46 4.75 5.25
−40°C ≤ TJ ≤ 125°C
VNOM + 1.5 V ≤ VIN ≤ 30 V
10 12
IOUT = 1 mA
ΔVOUT Line regulation VNOM + 1.5 V ≤ VIN ≤ 30 V mV
IOUT = 1 mA 25 25
−40°C ≤ TJ ≤ 125°C
VIN = VNOM + 1.5 V
20 20
10 mA ≤ IOUT ≤ 100 mA
ΔVOUT Load regulation VIN = VNOM + 1.5 V mV
10 mA ≤ IOUT ≤ 100 m 40 40
−40°C ≤ TJ ≤ 125°C
VNOM + 1.5 V ≤ VIN ≤ 30 V
2 2
No Load
IGND Ground pin current VNOM + 1.5 V ≤ VIN ≤ 30 V mA
No Load, 4 4
−40°C ≤ TJ ≤ 125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9
IOUT = 10 mA V
1 1
VIN - −40°C ≤ TJ ≤ 125°C
Dropoutvoltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1
IOUT = 100 mA V
1.2 1.2
−40°C ≤ TJ ≤ 125°C
VIN = 10 V
en Output noise voltage 100 150 µVrms
Bandwidth: 10 Hz to 100 kHz

(1) A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.

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6.6 Electrical Characteristics: LM3480-12, LM3480-15

Typical and other limits apply for TA = TJ = 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 12 V or 15
V. (1) (2) (3)
VNOM = 12 V VNOM = 15 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V
11.52 12 12.48 14.4 15 15.6
1 mA ≤ IOUT ≤ 100 mA
VOUT Output voltage VIN = VNOM + 1.5 V V
1 mA ≤ IOUT ≤ 100 mA 11.4 12.6 14.25 15.75
−40°C ≤ TJ ≤ 125°C
VNOM + 1.5 V ≤ VIN ≤ 30 V
14 16
IOUT = 1 mA
ΔVOUT Line regulation VNOM + 1.5 V ≤ VIN ≤ 30 V mV
IOUT = 1 mA 40 40
−40°C ≤ TJ ≤ 125°C
VIN = VNOM + 1.5 V
36 45
10 mA ≤ IOUT ≤ 100 mA
ΔVOUT Load regulation VIN = VNOM + 1.5 V mV
10 mA ≤ IOUT ≤ 100 mA 60 75
−40°C ≤ TJ ≤ 125°C
VNOM + 1.5 V ≤ VIN ≤ 30 V
2 2
No Load
IGND Ground pin current mA
VNOM + 1.5 V ≤ VIN ≤ 30 V
4 4
No Load, −40°C ≤ TJ ≤ 125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9
IOUT = 10 mA, V
1 1
VIN - −40°C ≤ TJ ≤ 125°C
Dropout voltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1
IOUT = 100 mA , V
1.2 1.2
−40°C ≤ TJ ≤ 125°C
VIN = 10 V
en Output noise voltage 360 450 µVrms
Bandwidth: 10 Hz to 100 kHz

(1) A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.

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6.7 Typical Characteristics

Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.

Figure 1. Dropout Voltage vs Load Current Figure 2. Dropout Voltage vs Junction Temperature

Figure 3. Ground Pin Current vs Input Voltage Figure 4. Ground Pin Current vs Input Voltage

Figure 5. Ground Pin Current vs Load Current Figure 6. Ground Pin Current vs Junction Temperature

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Typical Characteristics (continued)

Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.

Figure 7. Input Current vs Input Voltage Figure 8. Input Current vs Input Voltage

Figure 9. Output Voltage vs Input Voltage Figure 10. Output Voltage vs Input Voltage

Figure 11. Output Voltage vs Input Voltage Figure 12. Output Voltage vs Input Voltage

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Typical Characteristics (continued)

Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.

Figure 13. Output Short-Circuit Current Figure 14. Output Short-Circuit Current

Figure 15. Power Supply Rejection Ratio Figure 16. Power Supply Rejection Ratio

Figure 17. DC Load Regulation

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7 Detailed Description

7.1 Overview
The LM3480 is an integrated linear voltage regulator with inputs that can be as high as 30 V. It ensures a
maximum dropout of 1.2 V at the full load of 100 mA. The LM3480 has different output options including 3.3-V, 5-
V, 12-V, and 15-V outputs, making LM3480 the tiny alternative to industry standard LM78Lxx series and similar
devices.

7.2 Functional Block Diagram

IN OUT

Current Thermal NPN

Limit Shutdown
PNP

Bandgap
Reference

LM3480

GND

7.3 Feature Description

7.3.1 3.3-V, 5-V, 12-V, and 15-V Versions Available
The 3.3-V, 5-V, 12-V, and 15-V versions of LM3480 series are intended as tiny alternatives to industry standard
LM78Lxx series and similar devices.

7.3.2 1.2-V Ensured Maximum Dropout

The 1.2-V quasi-low dropout of the LM3480 series devices make them a nice fit in many application where the 2-
V to 2.5-V dropout of LM78Lxx series devices precludes their use.

7.4 Device Functional Modes

7.4.1 Operation with VIN = 5 V
The 3.3-V member of LM3480 can operate with an input of 5 V ±5%, its tiny SOT-23 package and quasi-low
dropout makes it suitable for providing a very tiny, 3.3-V, 100-mA bias supply from 5-V power supply.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM3480 is a linear voltage regulator with 1.2-V ensured maximum dropout and 100-mA ensured minimum
load current. This device has 3.3-V, 5-V, 12-V, and 15-V versions. The implementation of LM3480 is discussed in
this section.

8.2 Typical Application

6.5 V IN 5 V, 100 mA OUT
2 1
LM3480IM3-5.0

CIN 3 COUT
0.1 µF 0.1 µF

8.2.1 Design Requirements

DESIGN PARAMETER EXAMPLE VALUE

Input voltage 6.5 V
Output voltage 5V
Output current 100 mA

8.2.2 Detailed Design Procedure

8.2.2.1 External Capacitors

A minimum input and output capacitance value of 0.1 µF is required for stability and adequate transient
performance. There is no specific ESR limitation, although excessively high ESR will compromise transient
performance. There is no specific limitation on a maximum capacitance value on the input or the output.

8.2.2.1.1 Output Capacitor

The minimum output capacitance required to maintain stability is 0.1 µF. Larger values of output capacitance can
be used to improve transient behavior.

8.2.3 Application Curves

Unless indicated otherwise, VIN = 6.5 V, VOUT = 5 V, COUT = 0.1 µF, and TA = 25°C

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Figure 18. Line Transient Response Figure 19. Line Transient Response

Figure 20. Load Transient Response Figure 21. Load Transient Response

Figure 22. Load Transient Response Figure 23. Load Transient Response

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9 Power Supply Recommendations

The LM3480 is designed to operated from up to a 30-V input voltage supply. This input supply must be well
regulated. If the input supply is noisy, additional input capacitors with low ESR can help to improve the output
noise performance.

10 Layout

10.1 Layout Guidelines

For best overall performance, place all the circuit components on the same side of the circuit board and as near
as practical to the respective LDO pin connections. Place ground return connections to the input and output
capacitors, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,
copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and
negatively affects system performance. This grounding and layout scheme minimizes the inductive parasitic, and
thereby reduces load-current transients, minimizes noise, and increases circuit stability.
A ground reference plane is also recommended and is either embedded in the PCB itself or located on the
bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output
voltage, shield noise, and behaves similar to a thermal plane to spread heat from the LDO device. In most
applications, this ground plane is necessary to meet thermal requirements.

10.2 Layout Example

2 1 VOUT
VIN
IN OUT

GND
3 GND

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11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM3480IM3-12 NRND SOT-23 DBZ 3 1000 Non-RoHS Call TI Call TI -40 to 125 L0C
& Green
LM3480IM3-12/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0C

LM3480IM3-15/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0D

LM3480IM3-3.3 NRND SOT-23 DBZ 3 1000 Non-RoHS Call TI Call TI -40 to 125 L0A
& Green
LM3480IM3-3.3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0A

LM3480IM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS Call TI Call TI -40 to 125 L0B
& Green
LM3480IM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0B

LM3480IM3X-12/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0C

LM3480IM3X-15/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0D

LM3480IM3X-3.3 NRND SOT-23 DBZ 3 3000 Non-RoHS Call TI Call TI -40 to 125 L0A
& Green
LM3480IM3X-3.3/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0A

LM3480IM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L0B

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

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(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM3480IM3-12 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3480IM3-12 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

Pack Materials-Page 2
4203227/C
 PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA

0.95
3.04
1.9 2.80
3

2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01

0.25
GAGE PLANE 0.20
TYP
0.08

0.6
TYP SEATING PLANE
0 -8 TYP 0.2

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.3)
1

3X (0.6)

SYMM

3
2X (0.95)

(R0.05) TYP
(2.1)

LAND PATTERN EXAMPLE

SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214838/C 04/2017

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG

3X (1.3)
1

3X (0.6)

SYMM
3
2X(0.95)

(R0.05) TYP
(2.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.

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