201

Applications of MEMS in CommunicationsSatellites

Slawomir Jerry Fiedziuszko
Space SystemsLORAL
3825 Fabian Way, Palo Alto, CA 94303

ABSTRACT: Micro-Electro-Mechanical-Systems (MEMS) are finding more and more applications in

microwave systems. Communications satellites ,which typically have a large microwave hardware
content, will be discussed as an example of these potential applications. In the first part, general MEMS
technology and early examples will be described. Next, space applications of MEMS ( sensors, actuators,
propulsion etc.) in communications satellite vehicle (bus) will be shown. Finally, microwave applications
of MEMS in satellite payloads (switches, micromachined structures, tunable filters, and phased array
antennas) will be presented.

I. Introduction to MEMS
For centuries people were fascinated by the prospect of making mechanical devices smaller and smaller,
while maintaining their functionality. Limits of miniaturization were studied extensively in 1959 by such
renown physicists as Nobel laureate Richard P. Feynman who is considered the “father” of MEMS
technology. He explored basic technological limitations for making very small mechanical devices. This
included: forces( weight and inertia insignificant- material strength important), materials(grain structure
and inhomogenity), magnetic behavior ( magrietic domains) and friction ( superlubricity). Richard
Feynman sponsored several prizes for very small manmade objects - claimed by a superminiature electric
motor, and very small prints. These objects are considered ‘‘early’’ MEMS(Figure 1).

Figure 1. Example of “early” MEMS(Piezoe1ectric micromotor on finger, Kyushu University, Yaskawa

Electric Co. Japan)

These devices were “one of a kind,” hand-made by highly skilled and inventive individuals, therefore they
were not suitable for insertion in any practical, mass produced system. The MEMS manufacturing
breakthrough came, when people realized the benefits of applying IC ( silicon) technology ( wafer
photographic and chemical etching) to MEMS fabrication . This extended IC manufacturing to
micromechanical structures and the MEMS revolution was on its way.
 202

Presently, the following MEMS fabrication techniques (with IC fabrication origin) are being used
Surface Micromachining
Bulk Miromachining
LIGA
Wafer-to-Wafer Bonding
These techniques are illustkted %Figure 2f 1’1.’

a. b.
Common MEMS Fabrication Processes Bulk Micromachining

m
ning

C. d.

LIGA*, Deep UV Wafer-to-Wafer Bonding

Pmcessm and etch m i

-in wer-
acceleration
athographie, Galvanoforming, Abformung hpS
Etch beam and bond pyrex damping

Figure 2. Fabrication techniques for MEMS : surface micromachining, bulk micromachining, LIGA and
Wafer-to-wafer bonding.

The most critical feature of these techniques (modificationsof basically planar IC technology) is the ability
to realize three-dimensional structures, which is essential in fabrication of complex mechanical devices. In
the fabrication technique called surface micromachining ( Figure 2a), a thin-filmof material to be
processed is initially deposited on a wafer or substrate. Next, this material is coated by a photoresist, which
is subsequently exposed through a desired photomask. Final processing involves steps of wet etching ,dry
etching and additional thin film deposition. Quite often in this technique a thin-film material is used as a
sacrificial material. Bulk micromachining ( Figure 2b) allows for fabrication of well defined, three
dimensional MEMS.This technique is relatively mature; however its accuracy of fabrication is limiied by
e.g. crystallographic properties of the wafer. An improvement over bulk micromachining is a fabrication
 203

process called LIGA, from German RoentgenLItographie,Galvanik, Abformung(Figure 2). which

provides increased resolution due to the X-ray lithography and improved depth resulting from an additional
molding step. Several etched wafers can be bonded together in a MEMS process called Wafer-@Wafer
bonding (Figure 2d). The resulting structures have great verticality and quite complex ,three dimensional
MEMS were demonstrated using this technique. Basic MEMS manufacturing process follows the steps
listed in Figure 3. This process can be described as producing mechanical chips.

Thicker films Multiple Processing Cycles Remaval o f uwderfymy

deeper etches materials to release
fewer steps

0
I

spectar prczhmg. se%3mmngand haMfring Encapsulate s n m e pans Test more thanjust

procedures Io protect released pans of device but expose ovlers electrtcal fUf"

Figure 3. Basic process flow for manufacturing of MEMS [ 1 1.

MEMS production is increasing very rapidly worldwide . Some MEMS are very successful commercially,
particularly in automotive applications ( Sensors for airbags) and computer accessories ( inkjet cartridges).
MEMS development activity grows rapidly, and this is evidenced by MEMS patent activity shown in
Figure4 [ 11.

US Patents a Non* Patents

Year

Figure 4. MEMS patent activity

 204

Figure 5 shows the incredible miniaturization and dimensional resolution for mechanical devices
achievable using MEMS fabrication techniques described in this paragraph.

Figure 5. Example of MEMS ( Sandia)

11. MEMS in Space: Satellite Platform (Bus) Applications

MEMS offer significant benefits for future satellite systems since they can realize various electrical and
mechanical functions in a fraction of the size, weight, and power consumption of corresponding traditional
“macro” systems. This makes these devices quite attractive in space applications, especially in commercial
communications satellites, which are constantly driven by increased capabilities, high levels of integration,
miniaturization and cost reductions. Figure 6 shows generic configuration of a communications satellite.
Essentially, it can be divided into two parts: the basic satellite vehicle or platform ( often called satellite
bus), and the satellite payload ( in this case communications payload located on satellite platform panels).

a. b.

--\

m.
U I Y ~ U O
U-

Figure 6. Generic communications satellite (a. satellite, b. exploded view)

 205

Several applications of MEMS in satellite platforms are presently under consideration. This includes
microsensors, microactuators, microheatpipes for thermal management, propulsion, active conformable
surfaces, etc.
Inertial sensors may include gyroscopes or accelerometers with integrated MEMS. An example of these
devices is shown in Figure 7.

Figure 7. Multifunctional MEMS chip (accelerometer)- Sandia

MEMS technology has led to a number of novel satellite propulsion concepts. Miniature MEMS
microrockets have been recently demonstrated. An example of a novel propulsion device is shown in
Figure 8 [ 2 I.

Figure 8. Prototype MEMS Thrusters developed at NASA Glenn.

In another implementation, MEMS actuator arrays can be used to selectively deform relatively large
surfaces (Figure 9). This technology can be applied in the aerospace industry (deformable wing) or in the
case of satellites for mechanically reconfigurable antennas.
Figure 9. Intelligent ,servo actuated surfaces using MEMS [ 1 1.
Miniaturization and increased functionality are integral to the future of satellite platforms. The MEMS
components described above are only a limited sample of vast possibilities which will revolutionize
satellite industry ( pic0 and nano-satellites, satellite clusters etc.).

111. MEMS in Space: Satellite Payload Microwave Applications

The MEMS fabrication process and novel applications of various micromachining techniques provide
accurate control of three dimensional structures at lmicron level resolution. Since the electrical
performance of passive microwave components is determined almost entirely by the mechanical
dimensions of these devices, the precision of the manufacturing process is extremely important. This
requirement makes MEMS processes very attractive for fabrication of miniature passive microwave
components and integrated assemblies. For this reason, microwave applications of MEMS technology are
one of the fastest growing area s in the microwave field. Since communications satellite payloads have
very large microwave content (Figure 10) and miniaturizationis very important, microwave MEMS are
being considered as replacement for various traditional microwave components. This can provide a
potential paradigm shift in microwave devices technology and enable dramatic size, weight, and cost
reductions.

I Potential I
t'
i
i
-
i
t

!
;A""
i
i !

I multiplexer I -
1
I (potential
MEMS) I I output
multiplexer

Figure 10. Simplified communications satellite transponder.

 207

Micromachining for Microwave Components.

The most popular micromachining technique is based on the silicon MEMS process and involves
photolithography, anisotropic etching, and electro/electroless plating. Numerous components for
frequencies ranging from a low microwave range to Terahertz frequencies can be successfully
manufactured. The micromachined transmission line structures used to implement filters and other
microwave components are shown in Figure I I [ 3 I,[ 7 1.

Figure 1 I. Micromachined transmission lines a. coplanar line on dielectric membrane b.coplanar

waveguide, c.membrane microstrip.

The micromachining of dielectric membrane structures (silicon) is successfully used to realize millimeter
wave transmission lines and filters. This was demonstrated by University of Michigan group ( Figure 12)
[SI.

I. I. 1. 1.

Figure 12. Micromachined. four section bandpass filter

Another example of high definition, three dimensional LIGA micromachining is shown in Figure 13 [ 6 1.
High performance , miniature couplers were realized using this technique. PotentiaJly,thesedevices can be
used in satellite receivers.
 208

Figure 13. SEM Photograph of a micromachined 6dB coupler ( fc=15GHz)

Microwave MEMS SwitchedSwitch Arrays

Satellite payloads utilize a large number of electromechanical switches for routing and redundancy.
These switches are quite large and heavy, and reliable actuation is always a problem. Solid state switch
arrays including MMIC implementations were developed in the past, however they suffer from excessive
power consumption and limited isolation as well as reduced reliability. MEMS technology is a natural
solution for this problem since microwave switching and tuning applications are very attractive and one of
the first applications to be explored . Many MEMS switch configurations are currently under development.
Most of them use the silicon based process. However, from the integration with MMICs , GaAs substrates

--
for these devices are most attractive. Two basic configurations for M E M S microwave switches are shown
in Figure 14 [ 3 1.
SWltCh "ClomOd Switch ' C l o w l '

'Shmt'

!a)

i l k 10 Putl-Down RF C U I Pull-Oawn
Electrode Elaclrado

I b) !dl

Figure 14. MEMS switch designs a. cantilever, c. air bridge

 209

These switches can be arranged in switch mays for further reduction of size and weight. Typical
performance of MEMS based switches, especially when optimized for a narrower band of frequencies
(allocated for satellite communications) includes .I dB insertion loss and 60 dB isolation. An example of a
MEMS switch is shown in Figure I5 [ 4 1.

Ground Membrane

un~rcair
ACCe66
Signa I Holes
Paw

Gmund

Figure 15. SPST air bridge MEMS switch developed by RaytheonRt.

MEMS Tunable Filters

High performance tunable filters are considered the “Holy Grail”of microwave technology. The
frequency and bandwidth tunability is essential for the next generation of communication satellites since
this enables user reconfigurable satellites. In addition, the custom tuned, fixed frequency filters can be
replaced by electrically tunable filters, hence standardizing the front end of the communications payload.
This has the potential to significantly reduce the satellite cost and fabrication span. MEMS tunable filters
are the primary candidates to achieve this ambitious goal. Two basic concepts are presently under
consideration: switchable filters or switchable element filters (using MEMS switches) and tunable filters
using MEMS variable capacitors. In such lumped element filters both filter elements namely inductors and
capacitors can be realized using MEMS technology. This is shown in Figure 16 [ 8 1.

Figure 16. MEMS tunable filter elements- inductor and capacitor

 210

A MEMS based tunable filter is shown in Figure 17 [ 8 1.

Figure 17. MEMS based, lumped-element tunable filter.

Applications of MEMS in Phase Array Antennas

Reconfigurable antennas are of great interest to microwave industry due to their flexibility .
MEMS technology is under consideration for these applications. Several different approaches are possible
namely: using MEMS switches to alter the conductive surface of the antenna ( Figure 18).

Figure IS. Topological view of three configurations of an array of planar elements reconfigurable by
MEMS switches [ 4 1.
 211

utilizing MEMS based phase shifters for electronically steered phased array antennas, and finally the use
of MEMS actuators ( in array form) to physically alter the shape of the antenna surface. Work is continuing
to take full advantage of this technology ,especially for wireless applications.

Conclusions

Applications of MEMS technology in microwave components and subsystems ore growing very rapidly.
This technology is very attractive for insertion in communications satellites where. size, weight, and cost
reductions are essential. Implications of this technology for these demanding systems were discussed and
examples of candidate satellite MEMS components were shown.

REFERENCES:

[ 1 ] A. Pisano " MEMS Overview" DARPA presentation, Summer 1997

[ 21 J. Riordon " Dawn of the Microrocket" Ad Astra MarcMApril 1999

[ 3 ] L.E. Larson " Microwave MEMS Technology for Next- Generation Wireless Communications"
1999 IEEE MlT-S IMS Digest, Anaheim, Ca.

" RF-MEMS Switches for Reconfigurable Integrated Circuits", IEEE Tran. on

[ 4 ] E. R. Brown
Microwave Theory and Techniques, vo1.46, No. 1 I, November 1998.

[ 51 V.M. Lubecke, K. Mizuno, G.M. Rebeiz '' Micromachining for Terahertz Applications", IEEE Tran.
on Microwave Theory and Techniques, vo1.46, No. 1 1, November 1998

[ 6 ] T.L. Willke, E. Onggosanusi and S.S. Gearhart. "Micromachined thick-metal coplanar coupled-
line filters and couplers." 1998 MTT-S International Microwave Symposium Digest 98. I (1998
Vol. I [MWSYM]): 115-1 18.

[ 7 ] K.J.Herrick, J-G.Yook, L.P.B.Katehi " Microtechnology in the Development of Three-Dimensional

Circuits", IEEE Tran. on Microwave Theory and Techniques, vo1.46, No. 1 1. November 1998.

[ 8 ] W. Tang " MEMS at DARPA' DARPA presentation, 1211999