= RST LQC Parameters. ‘BMCU (Bean Curent), continuously adjusted downhole to get constant CRNI count rate. Fluctuation correlate with porosity, veries between 35 and 120 microamps. Fluctuations also occur cue to leakage fevents in the minitron. Can be seen in the extractor. Also during a minitron arc beam wll spike up Quickiy “TAY (Target HV), nearly constant atthe value preset by the software. Must be 100 for RST-8 and 90 for RST-A. TAY can spike down quickly during a mintron arc. ~ GDCU (Grid Current), nearly constant, preset by the software which is normally 6Oma (allowable range 45 to 80 ma), ~ EXCU (Extractor Current), fluctuates typically between 10 and 40uA. Leakage events in the minitron will show up as 10-30 ua increase in extractor. Tube will arc and leakage will rop back to normal Leakage events can last afew minutes, An arc in the minitron wil also cause a quick postive spike in the extractor current reading ~ SFOP (Pressure of 5/6 gas), early constant, above 60 psig at room temp. Pressure can double as tool goes from surface temp to 300 degF. Will be seen as a gentle rise. ~ HVPV (HV chopper primary peak to peak voltage), nearly constant, between 155 and 175V. Value depends on temp/HV/beam. Can change a volt or so as beam is moved around. * FICU (Filament current), between 2 and 3 amps, slightly corelates with BMCU. ~ ACU (Cathode current), typically 1.8 to 3.0 Amps. Higher currents indicate a dying (or poisoned cathode), * BUST (Burst start postion), indicates timing of burst start, should be 3 ~ BUSP (Burst start position), indicates timing of burst stop, should be 3 * MARC (Minitron Arc Indicator) indicates a fast change in beam current, can also occur at bed boundaries. CMV (RSC -12 V Supply Value), nearly constant, between -11.4 and -12.6 * eP2V (RSC +12 V Supply Value), nearly constant, between 11.4 and 12.6 = XM2V (RSX -12 V Supply Value), nearly constant, between ~11.4 and -12.6 * XP2V (RSK +12 V Supply Value), nearly constant, between 11,4 and 12.6 * PSV (RSC'5 V Supply Value), nearly constant, between 4.8 and 5.2 ~ XPBV (RSX 5 V Supply Value), nearly constant, between 4.8 and 5.2 * CHV (RSC Head voltage), nearly constant, between 197 and 203 ~ XHV (RSX Head voltage), nearly constant, between 197 and 203 ~ ESHU (Shunt current), can change widely, should be more than zero. Typical setting should be 20 t0 ‘40 ma curing minitron operation. It is 2 buffer to keep head voltage from dropping too much during Hy, Beam changes. " NPGF (Near PMT Gain Factor), should be nearly constant, between 0.99 and 1.04, Occasionally values between 0.98 and 1.02 can be seen. This is mare prevalent in Sigma made. PGF (Far PMT Gain Factor), should be nearly constant, between 0.99 and 1.01. Or-csionally values between 0.98 and 1.02 can be seen. This © more prevalent in Sigma mode. “'NSCR (Neat Shaper Compensation Regulation Factor), should be neary constant, between -2 and + *"FSCR (Far Shaper Compensation Regulation Factor), should be nearly constant, between 1 and +3. ~ NPDE (Near PMT High Voltage Echo Value), nearly Constant, less than 2100. Increases with temperature (about +200V from 20 to 300 degF). . ~ FPDE (Far PMT High Voltage Echo Value), nearly constant, less than 2100. Increases with temperature (about +200V from 20 to 300 deaf) ~ NERD (Near Early Resolution Degradation), should be betwreen 0 and 22, This factor increases with temperature and should be < 4 at surface and about 10 at 300 degF. ~'FERD (Far Early Resolution Degradation), should be between 0 and 42. This factor increases with" w temperature and should be < 4 at surface and about 10 at 300 deg. * NSCE (Near shaper Compensation Echo Setting), nearly constant, somewhere between 0 and 5, typically between 4. and 4V, Drops with increasing temperature (about 1V from 20 to 150 deo) “"FSCE (Fer shaper Compensation Echo Setting), neary constant, some where between O and 5, typically between 1 and 4V, Drops with increasing temperature (about 1V from 20 to 150 de9C). "ERNE (Near Instantaneous Count rate), nearly constant, somewhere around 450 ki. Minimum allowable : 375 = CRRR (Count Rate Regulation Ratio, ratio between CRNI and CRSP (near desired detector count rate), nearly constant, between 0.95 2nd 1.05 in IC mode. Larger discrepancies are possible at bec ‘boundaries or when pulling into tubing. The fluctuation are larger at higher logging speeds and in CS and Sigma mode. “RFI (Far Instantaneous Count Rate), fluctuates typically between 150 and 300 kh © GRRA (Near to Far Inelastic Count Rate Ratio) usually 1.5 to 3 ~ AQTM (Aquisition time per depth frame) ~ ETM Aquisttion Cartridge (RSC) Temperature ~ XTM Aquisition Cartridge (RSX) Temperature