Design Review Checklist
Printed Circuit Board (PCB) Layout
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Sufficient clearances between high voltage traces.
Trace widths are sufficient for traces carrying large currents.
Low noise traces do not run too close to high-current traces or high-speed
digital traces.
For high-speed traces, ensure that line lengths are properly matched. The
higher end layout packages have tools to do this.
For high-speed traces also run simulations to ensure that there are no
violations, including the effects of vias on signal propagation.
Consider the effect of ground loops for designs without a proper ground
plane.
Be aware of the placement and orientation of magnetic components, if any,
to avoid cross coupling.
For very low-level signals, make sure that the appropriate guard rings are in
place.
Depending on the frequency of the signal, the typical FR4 substrate may
not be suitable, and a low loss, but more expensive, substrate should be
considered.
Ensure that any RF lines have the proper complex impedance (typically 50
ohms). This includes confirming that a ground layer is underneath the trace
(microstrip) and commonly on both sides as well (coplanar waveguide).
On-board antennas have the proper ground clearances on all layers.
Ground layers have sufficient stitching vias especially near any RF circuits.
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On-board chip antennas are placed according to the manufacturer’s
recommendations.
If the design includes multiple on-board antennas be sure they are placed
so as to maximize their distance to prevent cross interference.
Switching power regulators are carefully layed out according to the
manufacturer’s datasheet.
Power supply pins on any IC’s have decoupling capacitors placed nearby.
No footprint errors it’s best to print out the layout at scale, and then
physically lay all of the components on the printout to ensure the leads
match up properly.
Test points are included on all signal traces which aren’t easily accessed (i.e.
signals between leadless packages).
No blind or buried vias are used unless absolutely required. Their use will
significantly increase the board cost.
Final board dimensions match correctly with the enclosure design.
Any crystal connections are kept as short as possible.
All components, connectors, jumpers, and test points are properly labeled
in the silkscreen layer.
No signal traces have 90-degree bends
Signal traces don’t unnecessarily jump between different board layers. This
can also be a sign of auto-routing, which rarely produces a quality design.
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High-current traces are primarily routed on the outside layers.
Silkscreen layer includes the proper board part number and the current
revision.
Design includes the necessary shields, mounting holes, and heat sinks.
If required for assembly, confirm that the design includes the necessary
fiducial.
Polarities are marked for polarized components like some capacitors.
Pin 1 is marked on all integrated circuits.
Digital and analog sections are kept separated with grounds connected at a
single point.
Generate a 3D model of the PCB, and make sure that there is no
interference with other parts of the device assembly.
Design rules match the capabilities of the specific PCB manufacturer.
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