MOSFET Specs for Engineers
MOSFET Specs for Engineers
Typical Applications:
• White LED boost converters
• Automotive Systems
• Industrial DC/DC Conversion Circuits
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
Electrical Characteristics
Notes
a. Pulse test: PW <= 300us duty cycle <= 2%.
b. Guaranteed by design, not subject to production testing.
0.08 5
TJ = 25°C
RDS(on) - On-Resistance(Ω)
4
0.06
3
0.04
3.5V
2
0.02
4V,4.5V,6V,8V,10V 1
0 0
0 2 4 6 0 1 2 3 4
ID-Drain Current (A) VGS - Gate-to-Source Voltage (V)
1. On-Resistance vs. Drain Current 2. Transfer Characteristics
0.1 100
TJ = 25°C
TJ = 25°C
ID = 5.4A
RDS(on) - On-Resistance(Ω)
0.08
10
IS - Source Current (A)
0.06
1
0.04
0.1
0.02
0 0.01
0 2 4 6 8 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
VGS - Gate-to-Source Voltage (V) VSD - Source-to-Drain Voltage (V)
3. On-Resistance vs. Gate-to-Source Voltage 4. Drain-to-Source Forward Voltage
6 3000
10V,8V,6V,4.5V,4V F = 1MHz
2500
ID - Drain Current (A)
Capacitance (pf)
4 3.5V 2000
Ciss
1500
3V
2 1000
500
Coss
Crss
0 0
0 0.05 0.1 0.15 0.2 0.25 0.3 0 5 10 15 20
VDS - Drain-to-Source Voltage (V) VDS-Drain-to-Source Voltage (V)
5. Output Characteristics 6. Capacitance
10 2.5
VDS = 30V
9
ID = 5.4A
VGS-Gate-to-Source Voltage (V)
RDS(on) - On-Resistance(Ω)
8 2
7
(Normalized)
6
1.5
5
4
3 1
2
1
0.5
0 -50 -25 0 25 50 75 100 125 150
0 10 20 30 40
Qg - Total Gate Charge (nC) TJ -JunctionTemperature(°C)
7. Gate Charge 8. Normalized On-Resistance Vs
Junction Temperature
1000 100
1 mS
ID Current (A)
10 10 mS 60
100 mS
1 SEC
1 10 SEC 40
100 SEC
DC
0.1 1 Idm limit
20
Limited by
RDS
0.01 0
0.1 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000
1
D = 0.5
0.2
RθJA(t) = r(t) + RθJA
0.1 0.1 RθJA = 110°C /W
0.05
0.02 P(pk)
0.01 Single Pulse t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000
t1 TIME (sec)
11. Normalized Thermal Transient Junction to Ambient
0.15 5
TJ = 25°C
RDS(on) - On-Resistance(Ω)
3.5V
2
0.05
4V,4.5V,6V,8V,10V 1
0 0
0 2 4 6 0 1 2 3 4
ID-Drain Current (A) VGS - Gate-to-Source Voltage (V)
1. On-Resistance vs. Drain Current 2. Transfer Characteristics
0.2 100
TJ = 25°C TJ = 25°C
0.18
ID = -5.2A
RDS(on) - On-Resistance(Ω)
0.16
10
IS - Source Current (A)
0.14
0.12
0.1 1
0.08
0.06
0.1
0.04
0.02
0 0.01
0 2 4 6 8 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
VGS - Gate-to-Source Voltage (V) VSD - Source-to-Drain Voltage (V)
6 3000
F = 1MHz
10V,8V,6V,4.5V,4V
2500
ID - Drain Current (A)
3.5V Ciss
Capacitance (pf)
4 2000
3V
1500
2 1000
500
Coss
0 Crss
0
0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20
10 2.5
VDS = -30V
9
VGS-Gate-to-Source Voltage (V)
ID = -5.2A
RDS(on) - On-Resistance(Ω)
8
2
7
(Normalized)
6
5 1.5
4
3
1
2
1
0 0.5
0 10 20 30 40 -50 -25 0 25 50 75 100 125 150
Qg - Total Gate Charge (nC) TJ -JunctionTemperature(°C)
7. Gate Charge 8. Normalized On-Resistance Vs
Junction Temperature
1000 120
1 mS
80
ID Current (A)
10 10 mS
100 mS
60
1 SEC
1 10 SEC
100 SEC 40
DC
0.1 1 Idm limit 20
Limited by
RDS
0.01 0
0.1 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000
1
D = 0.5
0.2
RθJA(t) = r(t) + RθJA
0.1 0.1 RθJA = 110°C /W
0.05
0.02 P(pk)
0.01 Single Pulse t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000
t1 TIME (sec)
11. Normalized Thermal Transient Junction to Ambient
Package Information
Note:
1. All Dimension Are In mm.
2. Package Body Sizes Exclude Mold Flash, Protrusion Or Gate Burrs. Mold Flash, Protrusion Or Gate Burrs Shall
Not Exceed 0.10 mm Per Side.
3. Package Body Sizes Determined At The Outermost Extremes Of The Plastic Body Exclusive Of Mold Flash, Tie
Bar Burrs, Gate Burrs And Interlead Flash, But Including Any Mismatch Between The Top And Bottom Of The
Plastic Body.
4. The Package Top May Be Smaller Than The Package Bottom.
5. Dimension "B" Does Not Include Dambar Protrusion. Allowable Dambar Protrusion Shall Be 0.08 mm Total In
Excess Of "B" Dimension At Maximum Material Condition. The Dambar Cannot Be Located On The Lower Radius
Of The Foot.