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Semiconductor Electronics Compress
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Semiconductor
Pera) Ces
aM ella itaCopyright © 1996 New Age International (P) Ltd., Publishers
Reprint, 2001
NEW AGE INTERNATIONAL (P) LIMITED, PUBLISHERS
4835/24, Ansari Road, Daryaganj,
New Delhi - 110 002
Offices at:
Bangalore, Chennai, Guwahati, Hyderabad, Kolkata,
Lucknow and Mumbai
This book or any part thereof may not
be reproduced in any form without the
written permission of the publisher.
ISBN : 81-224-0802-8
345678910
Published by K.K, Gupta for New Age International (P) Ltd.,
4835/24, Ansari Road, Daryaganj, New Delhi-1 10.002 and
printed in India at ‘Taj Press, New Delhi - 110 064,CONTENTS
Preface iii
i
1.1 Atomic Structure of Hydrogen Atom 2
12 Energy Level Di: 3
13 Band of Crystals 4
1.4 Conductors, Insulators and Semiconductors 6
15 _ Crystal Structure of Semiconductor: Concept of Hole. 1
1,6 Movement of Holes Through the Crystal Lattice 8
L7__Intrinsic and Extrinsic Semiconductors 9
1.8 _ Types of Extrinsic Semiconductors 10
1.8.1 N-type Semiconductor 10
1.8.2 P-type semiconductor Lbs
1.9 Concentration of Charge Carriers in n- and p-type
Semiconductors 0
1.10 Temperature Dependence of Charge Carrier Concentration 12
LLL Solved Problems
mic ion Dis 16
2.1_The p-n Junction Diode 16
2.2 _Biasing a Semiconductor Diode 13,
2.2.1 Forward Biasing of a Diode 18
2.2.2 Reverse Biasing of a Diode 19
2.2.3 The Cut-in Voliage 20
2.3__ The Breakdown of a p-n Junction 2
‘2.3.1 Zener Breakdown 0
‘2.3.2 Avalanche Breakdown 20
24 Ideal Diode
23 Static and Dynamic Resistances 22
2S. SisticResistance
2.5.2 Dynamic Resistance 23
2.6 Effect of Temperature on a Diode 23
2.7_ Types of Diode 23
221 Zener Diode223 PowerDiode 0 CG
2.7.4 Photodiode
7.6__Light Emitting Diode
3.1__Clippers 33
3.1.1 Si Series Positive Clij
3.1.2 _ Simple Series Negative Cli
3.1.3 Biased Series Positive Clippers
pele
3.1.4 Biased Series Negative Clippers 34
3.1.5_ Si Parallel Positive Cig 35
3.1.6_ Simple Parallel Negative Clippers 35
3.1.7__ Biased Parallel Positive Clippers 36
3.18 Biased Parallel Negative Clippers 36
3.1.9 _Double-ended Clippers 37
3.2_Clampers 37
33 38
3.4_ Rectifiers 39
3.4.1 _Half-wave Rectifier 2.4... 8D
3.4.2 Full-wave Rectifier 40
3.4.3 Bridge Rectifier 41
3.5.1 Capacitor Filter 43
35.2_R-C Filter 0
3.5.3__meFilter
3.6 Voltage Multiplying Circuits 46
3.6.1 Half-wave Voltage Doubler 46
3.6.2_ Full-wave Ve Doubler 47
3.6.3 Voltage Tripler and Quadrupler 48
3._Solved Problems 2.
4._ Transistors, Integrated Circuits, and Their Fabrications 55
4.1 Bipolar Junction Transistor (BIT) 55
4.2 “Transistor Operating Modes 56
4.3_Transistor Action 56
4.4. Transistor Biasing Configurations and Characteristics 58
4.4.1_Common-base Configuration 39
4.4.2 Common-emitter Configuration 60Contents vil
443 Common-collector Configuration 61
4.5__ Transistor Ratings 61
4.6 The Ebers-Moll Model 62
7 Field Effect Transi 6
4.7.1 Junction Field Effect Transistor (JFET) 64
7.2 Metal Oxide Som Heid Effera Tanai 61
(MOSFET
4.7.3 FET Parameters 900 CD
48 _Intes Circuits 70
48.1 of ICs 70
48.2 Analog and Digital ICs: Classification a
84 Somi Eabricati aI
48.4 Planar Technology: Fabrication of Monolithic ICs B
48.5 Monolithic Passive and Active Circuit Components 76
48.6 Typical IC Low Frequency Amplifier i)
48.7 __New Technology Trends ny
49 Solved Problems 81
5._ Transistor Biasing Techniques 85
5.1__Operating Point of a Transistor 85
' ae 85
4 Emitter Feedhack Bise Ci BR
ee 29
5.5 _Common-collector Bias (Emitter Follower) Circuit o1
5.6 _Q-Point Stabilization 2
$.7__Q-Point Stabilization from Various Bias Circuits. 93
5.8 Stability Factors 4
5.9 _ Diode Compensation Bias Circuit 95
JFET Biasiny
8
5.11.2 Voltage Divider Gate Bias (Fixed Bias) Circuit
12 MOSFET Bizsi
3.12.1 Feedback Biasing for Enhancement Mode MOSFET
5.12.2 Fixed Biasing for Enhancement Mode MOSFET
5.12.3 Self-biasing for Depletion Mode MOSFET.
5.12.4 Fixed Biasing for Depiction Mode MOSFET
5.13__ Solved Problems.
I
is
6.__Two-Port Network Theory and Circuit Models
6.1__Two-Port Network Analysis 104
6.1.1 Hybrid Parameters 105vill Contents
6.1.2 Impedance Parameters 106
6.1.3 Admittance Parameiers =
6.2 _ Transistor Hybrid Model 107
6.3 Impedance Parameters Circuit Model 108
— F Cine
.t Cina
6.6 _ High-frequency n-Hybrid Circuit Model 112
6.7 _ Voltage Amplifier Circuit Model U3
6.8 Current Amplifier Circuit Model 113
6.9 _ Transresistance Amplifier Circuit Model 113
6.10 Hybrid Parameters for CE, CB, and CC Configurations 114
6.11 FET Circuit Mode} 20
6.12 Solved Problems LS
7,_Small Signal Basic Amplifiers 11
7.1 Basic BT Amplifier 121
7.1.1 Current Gain A, 121
71.2 Voltage Gain. 122
7.13 Input Impedance Z, 123,
7.1.4 Output Impedance Z, 123
7.15 Output Admittance ¥, 124
7.1.6 Power Gain A, 124
7.2_Common-emitier BIT Amplifier 124
7.3__Common-base BIT Amplifier 125
7.4 Common-collector BIT Amplifier 126
7.5 Comparison of CE, CB, and CC Amplifier 128
7.6 Applications of CE Amplifier 129
71.7_ Applications of CB Amplifier 129
7.8 _ Applications of CC Amplifier 129
7.9 Basic FET Amplifiers 130
7.9.1_Common Source Amplifier 130
7.9.2 Common Drain Amplifier (Source Follower Circuit) 131
‘L10__Solved Problems 08
& Multistage Amplifiers 137
8.1 Resistance-Capacitance Coupling 137
8.2 _ Transformer Coupling 138
8.3 Direct Coupling 139
8.4 _ Frequency Response of R-C Coupled Amplifier 140
8.5 Low Frequency Response. 41
8.5.1 Role of Capacitance Cs 143Contents bk
8.5.2 Role of i cy 144
8.53 Role of Capacitance C, 144
8.6 High Frequency Response . 144
&.7__Decibol as UnitofGain
8.8 Bode Plot for R-C Cc lifier 148,
8.9 Bode Plot for Multistage Amplifier 149
8.10 Solved Problems SD
9. Feedback Amplifiers 158
9.1 Types of Feedback 158
9.1.1 Voltage Feedback 158
912 Current Feedback 50
9.2 Voli lfier with Negative Feedback 160
9.2.1 Voltage Gain with Feedback 160,
9.2.2 Input Resistance with Feedback 161
9.2.3 Output Resistance with Feedback 162
9.2.4 BIT Circuit for Voltage Amplifier with Negative
Feedback
9.3 Transresistance Amplifier with Negative Feedback 165,
9.3.2 Input Resistance with Feedback 166
93.3 Output Resistance with Feedback 167
9.3.4 BIT Circuit for Transresistance Amplifier with
legative Feedback 167
94 Transconductance Amplifier with Negative Feedback 169
9.4.1 Transconductance Gain with Feedback 169
9.4.2 _Input Resistance with Feedback 170
9.4.3 Output Resistance with Feedback 1
9.4.4 BIT Circuit for Transconductance Amplifier with 172
Negative Feedback
9.5 Current Amplifier with Negative Feedback 173,
9.5.1 Current Gain with Feedback NT.
9.5.2 Input Resistance with Feedback 174
9.5.3 Output Resistance with Feedback 174
95.4 BIT Circuit for Current Amplifier with
Negative Feedback 175
9.6. rison of Feedback Ampli 176
9.7__Gain Stabili Feedback, 176
98 Reduction in Noise and Nonlinear Distortion by Negative
Feedback 200 TT
9.9 _ Effect of ‘Feedback on the 178
Urheborrecttlich geschitztes Materialx Contents
9.10 Solved Problems TD
10.__ Power (Large Signal Low Frequency) Amplifiers 185
10.1 _ Classification of Power Amplifiers 185,
10.2 ciency of a Power li - 187
10.3__ Class-A Power Amplifier with Load Resistor 188
10.4 Class-A Power lifier with a Transformer 189
10.5 __Class-B Push-Pull Power Amplifier with a Transformer, 192
10.6 __Class-B Transformerless Push-Pull Amplifier 194
10.6.1 Phase Splitier to Re ‘Transformer 194
10.6.2 Circuit to Replace 195
Input and ‘Transformers
10.7__ Class C Power Amplifier 196
10.8 _ Distortion in Power Amplifiers 198"
10.9 _ Heat Sit in Power Transis 200
10.10 ‘Thermal Analogy of a Power Transistor 200
10.11_Neutralization Cirenits 0
10.12_Solved Problems ___202
ik. Wie Amy
‘LL1__The Parallel Tuned Circuit ______________209
11.2 _Single-tuned Amplifier: Bandwidth 21
11.3 _Cascaded Single-tuned Amplifiers 213
‘11.4 Stagger-tuned Amplifiers 215
11.5 Coupling Methods in Tuned Amplifiers 217
115.1 Sit lis - 217
115.2 Tuned Primary and Tuned | i 218
11.5.3 Double Tuned li 218
11.6 Tuned Primary Amplifier 218
11.7_ Tuned Secondary Amplifier 220
% edbac scillations: B sen Criterion _228
22 Basick Cicmnit Oscil 2
12.3 Colpitts Oscillator : 232
4 ‘Oscillator 235
12.5 _Resistance-Capacitance Oscillators 238
12.5.2 _Wien-Bridge Oscillator 240
Urheberrecttich geschitztes MaterialContents x1
12.6 Crystal Oscillator: Frequency Stability 243
12.6.1 Characteristics of a Piezo-Electric tal 243
12.6.2 Oscillator in Series Resonant Mode 244
12.6.3 Crystal Oscillator in Parallel Resonant Mode 245,
12.7_Solved Problems 0S
13._Multivibrators J _______2s80
13.1 Switching Action of a Transistor 250
3.2.1 Time Period of Oscillat 25.
M - 256
13.4 Bistable Multivibrator SR
13.5 Role of Commutating Capacitors 259
13.6 Emitter Coupled Binary: Schmitt Trigger Circuit 261
13.6.1__When Loop Gain A, <1 261
13.6.2 _When Loop Gain A,> 1 262
13.7_Solved Problems
14. Basic Logic Gates 267
14.1__ Binary Numbers 267
14.1.1 Conversion of Binary to Decimal Numbers. 268
14.1.2 Conversion of Decimal to Binary Numbers. 268
14.1.3 Addition of Binary Numbers 269
14.1.4 Subtraction of Binary Numbers. 270
14.1.5 Multiplication of Binary Numbers 272
14.1.6 Division of Binary Numbers 272
14.2 Boolean Algebra 213
143 De Morgan's Laws 274
14.4 _ Types of Logic 274
14,5 Truth Tables 20S
14.6 Diode ANDGate TS
14.7__Diode ORGale
148 NOT Gate 278
149 _NAND Gate 279
14.10 NOR Gate 219
14.11 Exclusive OR Gate 280
14.12 ICDTLNAND Gate 28.
14.13 ICTTLNAND Gate 00RD
14.14 Resistor-Transistor Logic NOR Gate 283xil_ Contents
15.__ Modulation and Demodulation. 285
15.1__Modwlation 0S
15.2 _ Amplitude Modulation 286
15.2.1 Radi jencies in AM Wave. 286
15.2.2 Power Distribution in AM Wave 288
15.3 _ Basic Technique of Amplitude Modulation 289
15.4 Collector Modulated Class-C Amplifier 290
15.5__Balanced Modulator _________200
15.6 SSB Su Modulation 293
15.7_ Frequency Modulation 294
15.8 Radiofrequencies in FM Wave 294
15.9 Oscillator Circuit for Frequency Modulation: 296
15.10 _Demodulation of AM Wave by Diode Detector 296
18.11 litude Limiter 298,
15.12 _Demodulation of FM Wave by Discriminator 298
15.13 Demodulation of FM Wave by Ratio Detector 300
18.14 Solved Problems 20028
References 305
Subject Index 306Semiconductor:
An Introduction
Before the advent of semiconductors, all solids were divided into two groups,
viz, conductors and insulators. A conductor ¢.g. aluminium which is most fre-
quently used, has a very low resistivity of about 10 (—m at room tempera-
ture, On the other hand, an insulating material, e.g. silicon dioxide, which is
used in integrated circuits, has a very high resistivity of sbout 10'° O-cm;
being 22 orders of magnitude higher than of aluminium, For electrical applica-
tions, resistivity is the sole criterion 0 classify materials. The resistivity of
conductors lies below 10° Q-cm, whereas the materials having resistivity
greater than 10° Q~cm are called insulators. A new class of materials was
found, which could not be included in either of these groups. These materials
having resistivity in the intermediate region are known as semiconductors or
half conductors. These gradually acquired much importance because their
resistivity can be varied by design under precise control,
It was also found that the effect of temperature on conductivity of con-
ductors and semiconductors is quite the opposite. In conductors, the conduc
tivity decreases with increase in temperature, whereas the conductivity of a
semiconductor increases sharply with temperature. Another important property
of a semiconductor is its sharp increase in conductivity by the introduction of a
negligibly small amount of certain impurities. Irradiation or bombardment of a
semiconductor by a beam of light also causes a rapid increase in its conductiv-
ity. Because of these types of peculiar properties, the semiconductor material is
used in the construction of all solid state electronic devices. In order to
understand the operation of semiconductors and semiconductor devices, it is
necessary to have some familiarity with the basic concepts of the atomic
structure of matter.2 Semiconductor Electronics
1.1, ATOMIC STRUCTURE OF HYDROGEN ATOM
In 1913, the Danish Physicist Niels Bohr introduced an atomic model using the
quantum theories of Planck and Einstein and used it to explain successfully the
absorption and emission spectra for hydrogen. The picture of an atom accepted
by Bohr consists of a nucleus of positive charge containing nearly all the mass
Of the atom, with electrons revolving around this nucleus as shown in Fig. 1.1.
Bohr formulated two postulates for his atomic model.
M( shew)
Lishen)
Fig. 1.1. Atomic structure.
Bohr’s first postulate explains that an electron can only be in an orbit or
shell, for which its angular momentum is a multiple of h/2x, h being the
Planck's constant. Each of these allowed orbits corresponds to a certain energy
and is called stationary or nonradiating state as the clectron does not emit any
energy so long as it remains in this orbit, This postulate can be expressed as
h
myn ane (1)
where n = 1,2,3,...., i8 an integer called the principal quantum number and mv
is the momentum of the electron in the orbit of radius r.
‘According to Bohr’s second postulate, the absorption or emission of light
by an atom occurs only when an electron undergoes a transition from one sta-
tionary state to anther. In each such transition, the energy hv is absorbed or
‘emitted by the atom and is equal to
hy =£,-E, (1.2)Semiconductor: An Introduction 3
where v is the frequency of the radiant energy, and £, and E, are the energies
of the two states involved in the transition. Combining Eqs. 1.1 and 1.2, the
energy level in joules of each state is found 10 be
me’ 1
8h7e5 n?
1
vhere e is the ch: the electron and ——
where ¢ is the charge oa the electron and 7.
(13)
Bohr labelled these stationary energy states as L. M, N, and Q. The maxi-
mum number of electrons that can exist in these states is 2, 8, 18 and 32
respectively. The outermost shell of the ator containing electrons is known as
the valence shell and the electrons in this valence shell are called the valence
electrons,
Bohr's model was modified by Pauli’s exclasion principle, which intro-
duced subshells in a shell. According to the Pauli's exclusion principle, no two
lectrons in an atom can have exacily the same quantum state, These subshells
are labelled as 5, p, d and f. The maximum number of electrons that these
subshells can have is 2, 6, 10 and 14 respectively.
1.2, ENERGY LEVEL DIAGRAM
‘The energy level diagram for the hydrogen atom is shown in Fig. 1.2, This
diagram is obtained by putting 1 = 1, 2, 3,... ., in Eq. 1.3 and drawing
Energy E(eV) noe
he tonizat Rg
8 et
“he 2 039
<0 Normat state :
Fig. 1.2. Energy level diagram for hydrogen atom.
horizontal Lines arranged vertically in accordance with the energy values, cal-
culated from Eq. 1.3 for n= 1, 2,3,...... . Theoretically, an infinite number
of states exist for each atom, but only the first five and the state for n =< are4 Semiconductor Electronics
depicted. Expressing the energy of stationary states in electron volt using
Eq, 1.2, the wavelength A of the emitted radiation may be given by
(1.4)
The lowest energy state is called the normal o the ground state and the
other stationary states of the atom are called excited, radiating, critical, or res-
conance levels. The energy required to move an electron completely out of the
field of the nucleus is called ionization potential and is shown as the highest
energy state in the energy level diagram shown in Fig. 1.2. The ionization
potential for hydrogen is 13.60 eV.
1.3. BAND THEORY OF CRYSTALS
The x-ray and other studies show that most metals and semiconductors have a
crystalline structure, ie. a regular and repetitive atomic or molecular arrange-
‘ment in three dimensions, In these crystalline materials, the electronic enerey
level diagram discussed in Sec. 1.2 is not applicable. This is because the atoms
begin to experience the influence of their neighbours, which is, in a way, simi-
lar to the influence of an extemal electric field. As the atoms converge, come
closer, the interaction between them becomes stronger. Because of this
interaction, the energy levels of the inner-shells’ electrons are not affected
appreciably, but the levels of the outer-shells* electrons are changed to a
marked extent, since these electrons are now shared by more than one atom in
the crystal, [tis observed that the coupling between the outer-shell electrons of
the atoms in crystal resulls in a band of closely spaced energy states, instead of
widely separated energy Ievels of the isolated atom as shown in Fig. 1.3.
Fig. 1.3. Bands of closely spaced energy states.Semiconductor: An Introduction 5
In order to understand this band structure, a crystal of WV atoms of one of
the elements of group IV A of the periodic table e.g. Si or Ge, may be consid-
ered, The electronic configurations of these elements are 1s°25°2p"3s°3p? and
15°2572p73573p8d"4s*4p? respectively. The outer two subshells for each
contain two s electrons and two p electrons, Since the 5 atomic subshell has
two possible states at the same energy, there will be 2 possible s states in a
crystal of N atoms and the number of s electrons will be 2N. So, there will be
2N electrons completely filling the 2N s-subshells. But in case of the p atomic
subshell, there are six possible states, therefore, there will be 2N electrons
filling 2N p-subshells (out of possible 6N states) at the same energy.
Now, if it is possible to decrease the spacing between atoms without
changing the crystal structure of this imaginary crystal (moving from right to
left in Fig. 1.4, the neighbouring
Isolated,
pe tton
fou! states
ANP plectrone
0 electrons
(4N states
conduction band
1
2Ns states
2N 3 electrons 4 electrons
1
GN states
valence band
we np abe
Inner shell atomic
levels unattec tes
crystal formation
Interatomie spacing 3
“ta) (b)
Fig. 1.4. Formation of energy bands in erystalline material
‘toms start interacting and their atomic wavefunctions overlap. As a result, the
crystal becomes an electronic system obeying the Pauli’s exclusion principle.
If the interatomic distance is decreased sufficiently, the 2V degenerate s states
and 6N degenerate p states spread out in energy of the order of several electron
volts. These large number of discrete but closely spaced energy statcs are
known as energy bands [Fig, 1.4(a)}. These two energy bands arc separated by
an energy gap known as a forbidden band. If the interatomic distance is further
decreased to the limit of crystal lattice spacing, these bands overlap and 6N
upper states (p states) merge with 2N lower states (s states), giving a total of 8N
states. As the available electrons are 4N, half of the 8N states are filled. So,
each atom contributes 4 electrons 10 the band and now these electrons no6 Semiconductor Electronics
longer belong to the s or p subshell of an isolated atom, but rather to the crystal
as a whole, The band occupied by these electrons is called the valence band.
Hence, at the crystal lattice spacing, there is a valence band filled with 4
clectrons separated by a forbidden band of energy Eq from an empty band
having 4N states. This empty upper band is known as the conduction band [Fig.
140)).
1.4, CONDUCTORS, INSULATORS AND SEMICONDUCTORS
On the basis of the energy band structure, a material may be called a conductor,
insulator, or semiconductor.
Conduction S
“| “y
Cx Ga
(a) (b) (c)
Fig. 1.5. Energy Level Diagram for: (a) A conductor (b) A semicon-
ductor and (¢) An insulator.
At the crystal lattice spacing, Fig. 1.5(a) illustrates an energy level dia-
gram for a conductor, This shows an overlapping of conduction and valence
bands, implying that it kes very small or no energy for electrons to jump from
the valence band to the conduction band and therefore, all the valence electrons
are free to take part in the conduction, Hence, the conductivity of a conductor
is very high.
Figure 1.5(¢) illustrates an energy level diagram for an insulator. In this
case, the forbidden energy gap is of several electron volts (Eg =6eV), thus
separating the valence and the conduction bands. Since the electron cannot be
supplicd energy more than 6 eV (say by an electric field), the valence band
‘lecirons cannot be raised to the conduction band. Hence conduction is impos-
sible in an insulator.
Figure 1.5(b) illustrates an energy level diagram for a semiconductor. The
energy of the forbidden band is approximately 1 eV at room temperature. The
‘most commonly used semiconductors are germanium and silicon, which haveSemiconductor: An Introduction 7
this forbidden band of 0.72 eV and 1.1 eV respectively. The energies of this
order of magnitude normally cannot be acquired from an applied field. Hence,
these semiconductors are insulators at low temperatures. As the temperature is
increased, some of the valence electrons acquire thermal energy more than the
band. gap energy and reach the conduction band The insulator has now become
slightly conducting i.e. a semiconductor.
Actually, the division between insulators and semiconductors is quite
arbitrary, because many generally known dielectrics are now used as semicon-
ductors. For example, silicon carbide (E, = 3 eV) is used now in semiconductor
devices. Even diamond is being investigated for a possible application in the
‘scmiconductor technology.
1.5, CRYSTAL STRUCTURE OF SEMICONDUCTOR
(Concept of Hole)
‘The most commonly used semiconductors in electronic devices are germanium
(Ge) and silicon (Si), As discussed in Sec, 1.3, in each case, there are four
electrons in the outermost shell. In a pure Ge or Si crystal, these four valence
electrons are bonded to four adjoining atoms by covalent bonds (formed by
sharing of electrons), as shown in Fig. 1.6. At 0°K all valence electrons are
firmly bonded in covalent bonds and there are no free electrons available for
lecirical conduction. From the point of view of band theory, al O°K a
Fig. 1.5. Crystal structure of Ge, showing covalent bonding of atoms in
two dimensions.& Semiconductor Electronics
semiconductor has a completely filled valence band and an empty conduction
band, thus behaving as an insulator.
At room temperature, the crystal littice is thermally excited and the
valence electrons get additional energy. When electrons receive sufficient
‘energy, more than the energy of the covalent bonds, they rupture the covalent
bonds and wander in the lattice space as free negative charge carriers. The
‘energy required to rupture a covalent bond is about 0.72 eV for Ge and 1.1 eV
for Si al room temperature, If the temperature of the crystal is increased, more
covalent bonds are broken and more free electrons are available in the crystal,
showing an increase in the conductivity or a decrease in the resistance. This
shows that a semiconductor has a negative temperature coefficient of
resistance. When an electron becomes free by rupturing a covalent bond, the
absence of electron in its parent position in the bond is represented by a small
circle and is known as hole. (Fig. 1.7(a)] Since a hole consists of a missing
negative charge e, it is accepted as equivalent to a positive charge e. Hence,
there is always an attractive force bewween a hole and an electron and at any
given temperature, the rate of recombination of holes and electrons is always
equal to the rate of production of new holes and electrons. Therefore, the total
number of free electrons and holes in a crystal remains constant. On the energy
evel diagram, the creation of electron-hole pair corresponds with the electron
uansition from the valence band to the conduction band as shown in Fig.
1.70).
Valence bend
(b)
Fig. 1.7. (a) Ge crystal with electron-hole pair (b) Band structure dia-
‘gram showing electron-hole pair.
1.6. MOVEMENT OF HOLES THROUGH THE CRYSTAL LATTICE
When an electron escapes from a covalent bond, it leaves behind a hole. Simi-
lar to clectron, the hole also takes part in the conduction and its movement in
the crystal is opposite to that of the electron. Figure 1.8 illustrates theSemiconductor: An Introduction 9
rf at at +
. > : >
Gey. (Ge) o[ Ge) e tp( Se
St % + at
(o)| . . 2, .
Bye e(S) rele o( 5 67
s sels 42) (o) ese
° . *] ce eee
. : . .
(a) eee
Seve a(Se)e (Sle o( Se
es oy a 2) ve eee
Fig. 1.8. Movement of hole in a crystal.
movement of hole through the crystal lattice. In Fig.1.8(a), the hole has moved
from atom 4 to atom 1, The detailed mechanism of this movement is shown in
Figs. 1.8 (b, ¢, d and ¢). Suppose by the rupturing of a covalent bond, a hole is
created in the atom 4, as shown in Fig. 1,8(0). Now, imagine that an electron
from atom 3 jumps into the hole of atom 4, so that the configuration of Fig,
1,8(¢) results. Now, the electron from atom 2 jumps into the hole of atom 3 and
we get the configuration of Fig. 1.8(4). Similarly, Fig. 1.8(¢) is obtained when
an electron from atom 1 jumps into the hole of atom 2. If we compare these
four configurations, it looks as if the hole has moved from atom 4 to atom 1
Actually, the movement of a hole means the electron movement in the opposite
direction. Hence. the holes can be considered as physical entities and free pos-
itive charge carriers, whose movements also contribute the electric current. Itis
important to note that the holes travel more slowly than do electrons. This is
because the movement of a hole in a particular direction actually consists of a
series of discontinuous electron movements in the opposite direction,
1.7. INTRINSIC AND EXTRINSIC SEMICONDUCTORS
Semiconductors are classified as intrinsic and extrinsic: or doped. The
intrinsic semiconductors are those that are very pure. In these, the properties of
the crystal are determined only by the properties of atoms of the semiconductor
material itself, The details of intrinsic semiconductors are discussed in Sec. 1.5
and 1.6.
If an extremely small (approximately 1 in 10* atoms), carefully controlled
amount of an impurity clement (generally trivalent or pentavalent atoms) is
introduced into the intrinsic semiconductor, say Ge, each of the impurity atoms
take the place of one of the Ge atoms in the lattice. Since the impurity atoms10 Semiconductor Electronics
are very small in number as compared to the Ge atoms, it can be assumed that
the lattice remains undisturbed and that each impurity atom is surrounded by
four Ge atoms. This process of introducing impurity atoms into an intrinsic
semiconductor is known as doping and the crystal thus obiained is called a
doped or an extrinsic semiconductor,
1.8, TYPES OF EXTRINSIC SEMICONDUCTORS
Depending upon the impurity atoms, the extrinsic semiconductors are further
divided into two groups viz. n-type and p-type semiconductors.
1.8.1 n-type Semiconductor
If the doping is done by any pentavalent substance belonging to group V of the
periodic table of the clements (arsenic, antimony, or phosphorus), four valence
clectrons of the impurity atoms form covalent bonds with four electrons of the
neighbouring Ge atoms and the fifth electron of the impurity atom becomes
free 1o wander in the lattice. This is shown in Fig, 1.9 (a), Since each impurity
atom has donated one free electron to the crystal, this pentavalent impurity is
known as donor. The crystal is said to be n-type semiconductor as the number
of electrons (negative charge carriers) in the crystal is much greater than the
number of holes produced by thermal agitation.
(a) (b)
Fig. 1.9. n-type Semiconductor: (a) Crystal structure (b) Energy band
‘The energy band structure of n-type semiconductor is shown in Fig.
1.9 (b). In an intrinsic semiconductor, the allowed energy levels are only either
in the valence band or in the conduction band and their presence in the forbid-
den band is ruled out. But, because of impurity atoms, additional allowed
energy levels appear in the energy spectrum in the forbidden band and at very
small energy below the conduction band as shown in Fig. 1.9(b). In Ge, the
ccnergy of these new discrete allowed energy levels is only 0.01 eV (0.05 cV inSemiconductor: An Introduction 11
Si) below the conduction band, This is the reason why at room temperature
almost all the fifth electrons of the donor are raised into the conduction band.
In n-type semiconductor, the recombination rate of electrons and holes also
increases because of the presence of an increased number of electrons donated
by the donor and as a result, the number of holes decreases.
1.8.2, P-type Semiconductors
If the doping is done by any trivalent substance belonging to group IIT of the
Periodic table of the elements (indium, aluminium, or gallium), three valence
electrons of the impurity atom form covalent bonds with the three electrons of
neighbouring Ge atoms. The fourth covalent bond has a missing electron, thus
ahole is introduced for cach impurity atom (Fig. 1.10 (a)}. This hole is mobile
as discussed in Sec.1.6. Since each impurity atom has a tendency to accept one
electron, this trivalent impurity is called an acceptor. The crystal is said to be
p-type semiconductor as the holes (positive Charge Carriers) are in the major-
ity.
Conduction band
fe [sown vow | ec
Acceptor energy
level
-_ ----&
rp Ev
cote] Valence band
(a) (b)
Fig. 1.10, p-type semiconductor: (a) Crystal structure, (b) Energy band
diagram.
The energy band structure of p-ype semiconductor is shown in Fig,
1.10 (b). The p-type impurity introduces an allowable discrete energy level just,
above the valence band (0.01 eV) as shown in Fig. 1.10 (b). The presence of
this energy level helps the etectrons to leave the vatence band and occupy this
acceptor level because the energy required is very small. The holes generated
in the valence band by these electrons constitute the largest number of carriers
in the p-ype semiconductor.
‘The n-type or the p-type semiconductor is electrically neutral because
cach impurity atom is itself neutral. Tn n-type semiconductor, the electrons are
the majority charge carriers and the holes are the minority charge carriers. In
p-type semiconductor, the electrons are the minority charge carriers and holes
are the majority charge carriers.12. Semiconductor Electronics
1.9. CONCENTRATION OF CHARGE CARRIERS IN
n-TYPE AND p-TYPE SEMICONDUCTORS
As discussed in Sec. 1.5, at any temperature the rate of recombination of holes
and electrons r() is always equal 10 the rate of production of new holes and
electrons pit), ic.
rO=PO (15)
Farther, the rate of recombination depends on the number of encounters of
holes and electrons, therefore, r(1) is proportional to p and 2, the densities of
holes and electrons respectively, so
r()=p@=kap (0.6)
where £ is a constant of proportionality. As in pair production n= p = n, (say),
np=np (7)
where n, is the intrinsic concentration.
‘Suppose 'V, and N, are the concentrations of donor atoms in the n-type
and of acceptor atoms in the p-type semiconductors respectively. Since in the
n-type semiconductor, the majority charge carriers are electrons, the hole con-
centration p, in comparison (o electron concentration #, may be ignored. Also,
since each donor atom contributes one clectron to the crystal, the electron
concentration in the n-type semiconductor is approximately equal 10 the
concentration of donor atoms, i
= Np (1.8)
and using Eq, 1.7, the hole concentration in n-type semiconductor is
2
(19)
In
Similarly, in the p-type semiconductor, the hole and the clectron
concentrations are
Pp=Ny (1.10)
and aay
1.10, TEMPERATURE DEPENDENCE OF CHARGE
CARRIER CONCENTRATION
‘The purity and the temperature are the main factors on which the concentrationSemiconductor: An Introduction 13
toon
(a) (b)
Fig. 1.11, Temperature dependence of charge carrier concentration
(a) Intrinsic, and (b) n-type Semiconductor,
of charge carriers in a semiconductor depends. A semiconductor becomes con-
ducting only when the temperature is increased considerably higher than abso-
lute zero. Figure 1.11 shows the variation of the concentration of charge
carriers in the intrinsic and the exuinsic (say, n-type) semiconductors. The
charge carrier concentration rises with temperature because electrons from
deeper and deeper states of the valence band move to the conduction band (Fig.
1.11 (a)]. In Figure 1.11(b), there is not a continuous rise in carrier concentra-
tion with temperature, As the temperature is increased above absolute zero,
electrons from the donor level being very close to conduction band reach the
conduction band much earlier than in the case of intrinsic semiconductor. As
the temperature is further increased, more electrons from the donor level reach
the conduction band and at a temperature known as depletion temperature, all
the donor electrons reach the conduction band, When the temperature is
increased beyond T,, the number of electrons in the conduction band remains
‘constant up to the temperature when the thermal energy becomes sufficient 10
raisc the electrons from the valence band to the conduction band (region b c in
Fig. 1.11(b)). Further rise in temperature increases the number of electrons in
the conduction band (region ¢ d). At a temperature 7; (known as temperature of
transition of intrinsic conductivity), electrons from the valence band become
‘equal to the clectrons from the donor level. Beyond this temperature, the
extrinsic semiconductor behaves as an intrinsic semiconductor. This is because
in the conduction band the number of electrons raised from the donor level can
be ignored in comparison to the electrons raised from the valence band, In
most semiconductors, 7; exceeds room temperature considerably.14 Semiconductor Electronics
1.11, SOLVED PROBLEMS
Problem 1
Find the hole and electron concentrations in a p-type semiconductor, if the
acceptor density is 10” atoms/m? and the intrinsic concentration is 2.5 x 10" per
m? at 300° K.
Solution
In a p-type semiconductor, the hole concentration is equal to the acceptor den-
sity.
+ Pp =Nq = 10” holes/m?
and the electron concentration
10”
= 6.25% 10" electrons/m’.
Problem 2
If the wavelength of the electromagnetic radiation is 1,000 nm, find the band-
Bap encrgy.
Solution
Using Eq, 1.4, the band-gap energy in electron volt is given by,
Ep, «12400
J (000 x 10
=124eV.
‘Questions ond Problems
|. What is the effect of doping on the resistance of a semiconductor?
.. What is the effect of large pressure on a semiconductor?
|. How is semiconductor defined? What are n-type and p-type semi-
conductors?
4, How docs a hole move in a crystal lattice?
5. Explain the effect of temperature on the charge carrier concentrations in a
semiconductor.
How docs a semiconductor behave at 0°K?
.. How do the impurities change the character of an intrinsic semiconductor?
. What are the majority charge carriers in an intrinsic semiconductor?
). Why does a semiconductor have a negative temperature coefficient?
w pe
eensSemiconductor: An Introduction 15
10. Find the hole and electron densities in an n-type semiconductor if
Np =10*/m at 300°K.
11. If the band-gap cnergy is 1.1 eV, find the wavelength of the electrmag-
netic radiation emiticd by this materialSemiconductor
Junction Diode
As the name indicates, the semiconductor diode is constructed from a semni-
conductor material i.e. Ge or Si. The semiconductor diode is an electronic
device which has a high resistance to the flow of current in one direction and a
low resistance in the opposite direction. The diode is one of the fundamental
building blocks of the wide variety of electronic circuits used today. The
diodes are used as rectifiers, doublers, limiters, clippers, clampers, modulators,
demodulators, waveshaping circuits, logic gates, frequency convertors, etc.
The semiconductor diodes available in many sizes and shapes, consist of p-n
junctions formed in either Ge or Si crystals.
2.1. THE p-n JUNCTION DIODE
In order 10 obiain a p-n junction diode with controlled and permanent proper-
tics, a Si or Ge crystal is doped with donor atoms at one end and acceptor
atoms at the other. This semiconductor crystal has both p-type and n-type
regions, which make a junction between them as shown in Fig. 2.1. The donor
ions are shown as © because the donor impurity atom becomes positive after
donating one electron, The acceptor ions are shown as © because the acceptor
atom becomes a negative ion after accepting one electron, Free electrons and
holes arc represented as ~ and + symbols. The formation of the p-n junction is
described below.
Initially, holes are present in the majority to the left of the junction, and
electrons in the majority to the right of the junction. These holes and electrons
are free to move randomly in the Initice. Since there are more electrons to the
right of the junction and more holes to the left of the junction, there is a density
gradient across the junction. Therefore, more holes diffuse to the right of the
junction and more electrons diffuse to the left of the junction. As a result of the
‘electrons leaving the n-material, donor ions are produced on the n-side of theSemiconductor Junction Diode 17
Hale majority p-n Hole min
corriers, fiction _rearriers
v e/e t
++ + -~t-
Oi
* Sate * Lolo] 7 wuse *
type
e+ a
ole
+ + al 7 4
Electron/ Accepter” space-charge OPO" 10”
Career ‘on region or depletion ery
char
genshy
(>)
Ver
Potentiot
(c)
Fig. 2.1. Formation of a p-n junction.
junction. When these electrons fill holes on the p-side of the junction, the
accepior ions are produced. These stationary positive and negative charges
along the n- and p-sides of the junction respectively are shown in Fig. 2.1(a)
and (b). The space occupied between these ions is called the space-charge
region. The movement of holes and electrons across the junetion constitutes
current known as diffusion current. Thus, the region just to the left of the junc-
tion becomes negatively charged and the region just to the right of the junction
becomes positively charged, and a potential difference is established across the
pn junction (Fig. 2.1(c).
Any charge carriers entering this space-charge region, arc rapidly swept
out of it, and hence this region is depleted of charge carriers and is known as
the depletion region. It is a region of high electrical resistance and is approxi-
mately 0.001 mm in width.
‘The region near the junction of p and n materials is thus referred to by
many names: the space-charge region, potential barrier, and depletion region;
and this device is known as the p-n junction or a semiconductor diode. The
various notations generally used for a semiconductor diode are shown in
Fig. 22. The pype and n-type portions of the diode are called anode and18 Semiconductor Electronics
cathode respectively, just following the vacuum tube terminology. The direc-
tion in which the diode resistance is small is shown by the arrowhead. Itis also
the direction of conventional current flow when the diode is forward-biased,
Another meaning of the arrowhead is that it represents the anode and points
towards the cathode,
anoce| , | ,, |catnove =D
(a) (b)
e a DB a eal
(c) @) ter
Fig.22. Semiconductor Diode Notations.
2.2. BIASING A SEMICONDUCTOR DIODE:
‘CURRENT/VOLTAGE CHARACTERISTICS.
When an extemal battery is connected across the p-n junction, itis called bias-
ing the p-n junction. There are two methods to bias a diode, viz. the forward
biasing and the reverse biasing.
2.2.1. Forward Biasing of a Diode
When the positive terminal of a battery is connected to the p-side and the neg-
ative terminal to the n-side of a p-n junction, the diode is said to be forward
biased, as shown in Fig. 2.3(a). In this condition, the holes in the p-region and
electrons in the n-region of the diode experience a repelling force from the
battery and therefore, drift towards the junction, This drift of holes and
4]
3.9}
29}
Battery ‘9
Forward current(ma)
Ji) x ~_
11] TOES OTF
Forward bios voltage (vets
(a) on
Fig. 2.3. (a) Forward Biasing of a p-n Junction Diode, (b) Current/Vol-
tage characteristic in forward biasing.Semiconductor Junction Diode 19
electrons towards the junction reduces the width of the depletion region and
also the junction potential barrier. This helps the holes of relatively lower
energy in the p-region to cross the junction and combine with the electrons in
the n-tegion. Similarly, more free electrons in the n-region cross the junetion
and combine with the holes in the p-region. The reason for the continuous
Presence of a large number of holes in the p-region and the electrons in the
n-region inspite of diffusion is that the positive and the negative terminals of
the battery are considered 10 inject holes and electrons to the p-side and the
aside of the diode, respectively. In other words, it may be regarded that the
holes and the electrons diffusing across the junction are coming from the bat-
tery. This diffusion of majority charge carriers constitute a current across the
Junction and the total current is the sum of the hole and the electron currents.
‘The resultant current enters the p-region as a hole current and leaves the
neregion as an electron current. Therefore, it is said that in the forward biasing
the current flow is by majority charge carriers,
Now, if the forward voltage applied across the p-n junction is inereased,
more majority charge carriers cross the junction and more forward current
flows across the junction. However, when the forward bias becomes more than
the junction potential, the barrier disappears and the current increases rapidly,
but it is limited by the bulk resistance of the crystal and the resistance of the
‘ohmic contacts of the p- and n-regions. Thus, in the forward biasing, initially
the current increases slowly with the biasing potential but when this becomes
slightly more than the junction potential, the current is govemed by the ohmic
contact resistance and the crystal bulk resistance. Thus, the current/voltage
characteristic becomes approximately a straight fine, as shown in Fig. 2.3 (b).
The diode offers very small resistance in the forward biasing.
2.2.2. Reverse Biasing of a Diode
‘When the positive terminal of a battery is connected to the n-side and the neg-
ative terminal to the p-side of a p-n diode, the diode is said to be reverse biased,
as shown in Fig. 2.4 (a). In this condition, the holes in the p-region and
the electrons in the n-region of the diode experience attractive forces from the
battery and therefore, drift away from the junction. This drift of holes and
electrons away from the junction increases the width of the depletion region
and also the junction potential barrier. Fewer holes in the p-region and elec
ons in the n-region now have sufficient energy to overcome the junction
potential and therefore, the majority charge carrier current decreases. Since the
minority charge carrier current is constant, the resultant current flows across
the junction from the n-region to the p-tegion, When the reverse bias is
increased, more majority charge carriers become incompetent to overcome the
junction potential and the majority charge carrier current reduces further.
Hence the net current from the n-region to the p-region increases. This increase20 Semiconductor Electronics
Reverse bias voltage (volts)
200 150 00 0 0
Breakdown / Reverse
| | voltage saturation
a
current
&
Reverse current (1A)
I
‘It
Battery
Fig. 24. (a) Reverse biasing of a p-n junction diode (b) Curreny/Voltage
characteristic in reverse biasing.
in current with increasing reverse bias voltage continues until a point is
reached when no majority charge carrier is able to cross the junction. In this
condition, the constant current flowing across the junction is equal to the
minority charge carrier current and is known as reverse saturation current,
Hence, in the reverse biasing, the diode offers a very high resistance to the flow
of current. If the reverse bias is further increased, a critical voltage known as
breakdown voltage is reached, at which a rapid increase in current occurs, as
shown in Fig. 2.4 (b). The breakdown of a diode is described in Sec. 2.3. The
‘maximum reverse biased voltage that can be maintained across a p-n junction
is known as peak inverse voltage (PIV).
2.2.3. The Cut-in Voltage
For every semiconductor diode, there exists a cut-in voltage V, , below which
20}
8
Forward current (mA)
oof a
Forward bias veltage (volts)
Fig. 2.5. Cut-in voltages in Ge and Si diodes.Semiconductor Junction Diode 24
the current is very small and beyond which the current rises very rapidly. This
voltage is also known as offset, breat-point,.ot threshold voliage. Figure 2.5
shows the current/voltage forward characteristics for Ge and Si diodes at room
temperature. The cut-in voltage for Ge and Si'are 0.2 V and 0.6 V respectively.
2.3. THE BREAKDOWN OF A p-n JUNCTION
Asexplained in See. 2.2.2, all the p-n junctions have a limit of allowable maxi-
‘mum reverse-bias voltage, beyond which a rapid increase in the current occurs.
This limiting voltage is known as breakdown voltage and two mechanisms are
responsible for this breakdown.
2.3.1. Zener Breakdown
‘When the applied reverse voltage produces a sufficient large electric field
across the junction, some of the covalent bonds are ruptured owing to this
electric field, and a large number of holes and electrons is produced in the
crystal. These holes and clecirons are responsible for the rapid increase in the
saturation current. This phenomenon is known as Zener breakdown.
2.3.2. Avalanche Breakdown
When the applied reverse voltage is large enough to accelerate the minority
charge carriers to gain sufficient energy, some of the covalent bonds are
broken owing to the collision of these accelerated charge carriers with the
atoms. The large number of holes and electrons thus produced is responsible
for the rapid increase in the saturation current. This type of breakdown is
known as avalanche breakdown,
2.4 IDEAL DIODE
As discussed in Sec. 2.
, a semiconductor diode has a very high resistance in
snort gievit
Berens bas 7] Seal rene
&
& (a) (b) (c)
Fig. 2.6. (a) Voltage/Current characteristic of an ideal diode,
(b) Forward biased diode showing short circuit,
(©) Reverse biased diode showing open circuit.22 Semiconductor Electronics
the reverse biasing and a very low resistance in the forward biasing. However,
in the case of an ideal diode, the forward resistance of the diode is zero, while
the reverse resistance is infinite. The voltage/current characteristic for an ideal
diode is shown in Fig 2.6 (a). It is clear from the figure that the forward
resistance is zero and the diode behaves as a short circuit (Fig. 2.6 (b)). In the
reverse biasing, the diode behaves as an open circuit (Fig. 2.6(c)} showing
infinite resistance.
2.5. STATIC AND DYNAMIC RESISTANCES
Figure 2.7 shows voltage/current characteristics along with the load line for a
semiconductor diode. The intersection of the load line and the diode character-
istic is known as the quiescent point or the point of operation for the diode. The
voltage across and the current through the diode can be very easily found by
drawing vertical and horizontal lines respectively.
Diode
characteristic
1K0
(b)
ores 4s 6 7
6 3 0
vivo!) (ay
Fig. 2.7. (a) Quiescent point and static resistance of a diode (b) Diode cir-
‘cuit for static resistance,
2.5.1. Static Resistance
Figure 2.7 shows that the diode has a fixed voltage and current corresponding
to the quiescent point. The static or dc resistance of the diode at the quiescent
point is defined by,
Rowe = Qn
‘The advantage of finding the dc resistance is that the diode can be
replaced by a simple resistance equal to the de resistance, while drawing an
equivalent circuit.Semiconductor Junction Diode 23
2.5.2. Dynamic Resistance
Figure 2.8 shows that wusoidal signal on a de level is applied to the diode
circuit. With this additional ac signal, two additional load lines are obtained.
2
Aas ImAG0
Ts
ot ts 0
se 7
(vain)
BVqr0O1V (
Fig.2.8, (a) Quiescent point and dynamic resistance of a diode
(©) Diode circuit for dynamic resistance,
‘The dynamic or ac resistance is obtained by drawing a tangent on the charac-
teristic at the quiescent point and using the relation.
AV,
Roma Be @2
2.6. EFFECT OF TEMPERATURE ON A DIODE
The decrease with barrier potential in a forward biased p-n junction with
increase in the temperature is approximately given by
AV=-25 mVPC (2.3)
Because of this change in the barrier potential, the cut-in voltage
decreases with increase in temperature, as shown in Fig. 2.9. In reverse biasing
the available leakage current depends upon the temperature. For a Ge diode,
the leakage current becomes double for every 10°C rise in temperature. For a
Si diode, the leakage current becomes double for every 6°C rise in temperature.
2.7. TYPES OF DIODE
‘The various types of diodes used in all the branches of modem electronic cir-
cuitry and radio enginecring are described in this section.24° Semiconductor Electronics.
Reverse bias (volt)
Ge diode 250200 160 100 s¢_0
2 wore | Jase ° z
i 100] 2% ae jo =
za ° P 5
= sol so E
ze Ge diode a
2 40} :
8 bard
2 2d so
oe 8
Forward bias (volt)
(a) (b)
Fig. 2.9. Effect of temperature ona diode in (a) Forward biasing, and
(b) Reverse biasing.
2.7.1, Zener Diode
‘The breakdown of a p-n junction is described in Sec. 2.3. A semiconductor
diode which is designed to operate in the breakdown region without damage is
known as a Zener, avalanche, or breakdown diode. The current is restricted toa
safe value by using an extemal resistance so that the diode is not damaged.
Reverse bias
eo °
L
(a) (b) (ce)
Fig. 2.10. (a) Symbol for a Zener Diode, (b) Voltage/current characteristic
of a Zener diode, (c) Zener diode circuit for voltage stabilization,
Figure 2.10 (a) shows the symbol and the circuit of a Zener diode, and its
voltage/current characteristic. ‘The location of the Zener potential V;, also
known as reference voltage can be adjusted by varying the doping levels, as
Zener potential decreases by increasing the doping.
‘The Zener diodes are used for stabilizing voltage and therefore, are also
called stabilizer diodes or stabilitrons. The voltage/current characteristic of a
Zener diode shows that in the breakdown region, an extremely minor change in
voltage causes very large variations in the current across the diode, The Zener‘Semiconductor Junction Diode 25
diode is generally connected in parallel 1o the load across which the stabilized
voltage is achieved. The resistance R of the limiting resistor connected in series
with the diode is so adjusted that the current fz flowing through the diode cor-
responds to the middle point of the breakdown region [point O in Fig. 2.10 (c)].
‘Suppose there is some change in the supply voltage (say increase). Asa result,
the current in the circuit increases, but since large changes in the diode current
are able to produce only very small changes in the Zener diode voltage (sce
breakdown region in Fig, 2.10 (b)}, the voltage across the Zener diode or the
load remains almost unchanged, In this way, the voltage stabilization is
achieved by using a Zener diode as in the circuit of Fig. 2.10(¢).
2.7.2. Tunnel Diode
‘The tunnel diode was first manufactured by Dr Leo Esaki in 1958. The symbol
of tunnel diode is shown in Fig. 2.1 (a). It was found that ifthe depletion layer
ina p-n junction was very thin, the electrons could penetrate
Negative
fecstonce
A tegen
Forward current
Ferword biot Ry
(a) (b) (c)
Fig. 2.11 Tunnel diode: (a) Symbol, (b) Voliage/current characteristic,
(©) Equivalent circuit in negative resistance region
through the junction barrier and thus could pass from one side of the depletion
layer to the other with less energy than was apparently necessary. This
quantum-mechanical phenomenon is known as tunneling and the p-n diode
based upon this tunneling effect is known as a tunnel diode,
Ina tunnel diode, the width of the depletion layer is reduced by increasing
the concentration of impurity atoms, say, | part in 10° (in ordinary diode, itis 1
part in 10°), With this impurity concentration, the width of the depletion layer
is reduced to less than 100°A which is one-fiftieth the wavelength of light. For
potential barriers of this thickness, the probability of an electron to pencirate
this barrier (as calculated quantum-mechanically using SchréSdinger equation)
becomes very large, and the voltage/current characteristic of this high impurity
density diode is completely changed, as shown in Fig. 2.11 (b). The tunnel
diode shows a negative resistance for part of its characteristic [A to B in Fig.
2.11 (b)] and therefore, is also called a negative resistance device. For currents26 Semiconductor Electronics
between fy (peak current) and Jy (valley current) the characteristic is
ued because the same current can be achieved for three different appl
ages. The multivalued feature of the tunnel diode makes it a useful device in
the high speed switching circuits. The equivalent circuit of a tunnel diode is
shown in Fig. 2.11(6).
2.7.3. Power Diode
The power diode is a p-n junction diode specially designed to be used in the
applications of high power and at high temperature. The power diode is con-
structed to have higher forward current, as well as higher peak inverse voltage.
The typical value of PIV is somewhere between 50 V and 1000 V, with a
maximum curreny of 30A. The forward resistance of a power diode is also very
low, in the order of one ohm, In many cases, the heat sinks are also used along
with a power diode to draw away the heat due to heavy current,
2.7.4, Photodiode
The photodiode is a semiconductor p-n junction operating in the reverse-bias
region and is based upon the phenomenon of the photovoltaic affect. A voltage
is generated across the p-n junction when light falls upon it. Owing to this
voltage, a current starts flowing in an extemal circuit, in a direction reverse to
that usually flowing in a general-purpose diode. This current increases linearly
with the inerease in the incident light. The symbol, biasing arrangement. and
voltage/current characteristics of a photodiode are depicted in Fig. 2.12. The
dark current corresponds to the current flowing without incident light and
obviously, itis the reverse saturation current of the diode,
Reverse current
(a)
= Light intensity
ib) Reverse bias te}
Fig. 2.12. Photodiode: (a) Symbol, (b) Voltage/Current characteristic,
(©) Biasing arrangement.
As discussed in Sec. 2.2.2, the current in a reverse-biased p-n junction is
owing to diffusing minority charge carriers, As the incident light produces
electron-hole pairs in the reverse-biased diode, the electrons in the p-region
and the holes in.the n-region become additional minority charge carriers andSemiconductor Junction Diode 27
the current increases. If the incident light falls at a distance from the p-n junc
tion, the minority carriers produced duc 10 light may recombine before diffus-
ing across the junction and a small current will flow. This current will increase
if the light falls near the junction because the probability of recombination is
less. Hence, the photocurrent is a function of the distance from the junction at
which the light falls, as shown in Fig, 2.13. As the diffusion lengths of minority
charge carriers in the p- and the n-regions are different, the curve is not sym-
metrical on both sides.
z
>
gf
ae
Dark current
o
Distance from junction (mm)
Fig. 2.13. Variation of photocurrent with distance from the junction at
which light falls,
2.7.5. Varactor Diode
The varactor diode is a semiconductor variable voltage capacitor. It is also
called varieap diode or capacitor diode. Ithas been discussed in Sec. 2.2.2 that
in the reverse-biased diode, tne depiction region is depleted of charge cartiers.
So, the junction area can be used as a capacitor because the depletion region
acis as a diclectric medium, and the ions on cach side of the depletion region
act as conductors, The capacitance of this capacitor, known as transition region
capacitance, decreases as the reverse-bias vollage is increased, as shown in
Fig. 2.14, This is because the depletion region becomes wider as the reverse
bias is increased. This process is analogous to separating the plates of parallel
plate capacitor, resulting in the fall of capacitance, The normal range of reverse
bais for VVC diodes is limited to about 20 V. The Figure 2.14 also shows the
symbols used for the varactor diode. These diodes are used in the field of
parametric amplification, in which a bias voltage and a signal are applied28 Semiconductor Electronics
Capacitance (pF)
Reverse bias (volt)
fa) (b)
Fig. 2.14, Varactor Diode: (a) Characteristic, (b) Symbol.
simultaneously to a junction. Other applications are: frequency modulators,
adjustable band-pass filters, automatic frequency control devices, etc.
2.7.6, Light Emitting Diode (LED)
When a p-n diode is forward biased, annihilation of holes and electrons takes
place close to the junction and some energy is rcleased in the junction. In Ge
and Si, this energy is in the form of heat. But it has been observed that in some
Ys)
Fig. 2.15. Symbol of light emitting diode (LED).
other semiconductors, ¢.g. gallium arsenide, the energy is released in the form
of radiation, This phenomenon is known as eleciro-luminiscence and the diode
based upon this phenomenon is called a light emitting diode. The LED's are
used in pilot lamps, display devices, etc,
2.8. SOLVED PROBLEMS
Problem 1
Calculate the voltage across the load and the power delivered to the load for the
circuit of Fig. 27.Semiconductor Junction Diode 29
Solution
From Fig. 2.7 (a),
Vo=1V and Ig=9mA
‘The voliage division in the circuit of Fig. 2.7 (b) gives the voltage across the
Toad as
V_=V-Vp=V-Vo
=10-1=9V
The power delivered to the load is
‘P= power supplied by the source ~ Power dissipated across the diode,
=VMp-Vorly
= 10x9x 10°-1x9x10"
=81mW.
Problem 2
Find the static or de resistance of the diode of the circuit of Fig. 2.7.
Solution
Using Eq, 2.1, the static resistance of the diode is given by,
Problem 3
Find the dynamic resistance for the diode of circuit given in Fig. 2.8.
Solution
Using Eq. 2.2, the dynamic resistance of the diode is given by,
Vo
Renie =
From Fig. 2.8(a), AVo = 0.01V; Alo = 2 mA
= 5-59.
‘omni 2x 107
Problem 4
Find the voltage drop and the current across the diode for the input signal
shown in Fig. 2,16, Given: the diode resistance = 4 2,30 Semiconductor Electronics
R100.
= AT
(pp)
lov |
Fig. 2.16, Circuit for Problem 4.
Solution
Inthe a.c equivalent circuit for the circuit shown in Fig. 2.16, the dc supply is
ignored and the ac voltage drop across the diode is given by,
| -4x50x107
“=F 100
and the diode current owing to the ac signal is
2mV
4a
=05mA (pp).
=2mV(p -p)
Problem &
In the circuit of Fig. 2.10, R = S00 Q, V, = 25 V, Vz = 10 V, and
Peoaa= 250 m W . Find the minimum and maximum load currents
Solution
‘When the diode is ON, R, will be minimum. Therefore, from the circuit,
Renin X25
Ven We
or, 10 Rin + 5000 = 25 Rin
or Ruan = 334.2.
The minimum R, allows maximum current through R,.
Vz __10V
fm TD
=30 mA
The maximum power capability limits the maximum current through the diode,
ie.Semiconductor Junction Diode 31
1, =20mY
zm 10V
when diode is ON, the voltage across R is 25 V - 10 V = 15 Vand the current
through R is zar;=30 m A, Hence, the current division dictates that the current
through the load is,
Juin = Current through & - maximum current through diode
=25 mA
=30mA-25 mA
=SmA
‘This current yields the maximum value of load resistance,
Vz _10V
Rem SMA
=2kQ
Questions and Problems
. Describe the characteristics of an ideal diode.
. What is the meaning of forward bias and reverse bias in the case of a
diode?
}. How does a diode work as a switch?
. Which diode works on the principle of breakdown and how?
. What are the barrier potentials for germanium and silicon diodes?
. What does the space charge at a p-n junction consist of ?
. Describe various types of diode.
. What do you understand by diffusion current in a p-n diode?
. What is a depletion region and how is it formed?
|. What is the meaning of breakdown of a p-n junction?
11, Describe static and dynamic resistances of a p-n diode.
12. On what principle does a tunnel diode work?
13. Discuss the effect of biasing on the width of the depletion region at a p-n
junetion,
14, Why cannot the p-n junction barrier potential be measured by connecting
a volumeter across the diode terminals?
15, Can a p-n diode be used as a capacitor in an ac circuit? Give examples,
16. What is the importance of defining the peak inverse voltage for a p-n
diode?
17. Calculate the voltage across the load and the power delivered to the load
for the circuit shown in Fig, 2.7, if R, is changed to 1.5 kQ.
pe
Semrsanaw32
19,
2.
2,
‘Semiconductor Electronics
Find the dynamic resistance of the diode using the circuit given in
Fig. 28 (b),if V = 15 V.
Calculate the power dissipated by a diode of intornal resistance 20 Q and
barrier potential 0.7 V, when a current of 400 m A is flowing through it.
|. Find the minimum and maximum values of the load resistance for a 10 V
Zener diode, if R = 500 Q, V;= 20 V, and Py ma, = 500 m W.
Find the voltage drop and the current across the diode for the input signal
of 100 m V in Fig, 2.16, if the battery potential is changed to 15 V.
IER = 1k Q, V,=20V, Vz= 10 V, and P, no, =250 mW, find the minimum
and maximum load currents in the circuit shown in Fig. 2.10.Diode Circuits
In this Chapter some practical examples of diode application in various elec’
tronic circuits are discussed.
3.1. CLIPPERS
‘The clipping circuits are used to clip-off a portion of the input signal. In the
output of a clipping circuit, only that part of the input waveform appears which
lies above or below some reference level. The clippers are also called vollage
or current limiters, amplitude selectors, or slicers. A clipping circuit involves a
diode. a resistor and in some circuits, a dc supply too. Some basic clipping
circuits are discussed in the following sections. The input waveform is taken 10
be sinusoidal in all these circuits.
3.1.1, Simple Series Positive Clippers
The relevant circuit diagram along with input and output waveforms is shown
in Fig. 3.1. For the positive half-cycle of the input, the diode is reverse-biased
and no current flows through R. Therefore, no output voliage appears across R.
But for the negative half-cycle of the input, the diode is forward-biased and the
%
Fig. 3.1. Simple series positive clipper.
voltage across R follows the input waveform as shown in Fig. 3.1. So, the
positive portion of the input waveform is clipped-off.34 Semiconductor Electronics
3.1.2. Simple Series Negative Clippers
The relevant circuit diagram along with input and output waveforms are shown
in Fig. 3.2, In this case, the diode is forward-biased for the positive cycle and
reverse-biased for the negative cycle of the input waveform. Therefore, the
negative portion of the input waveform is clipped-off.
%
. : vy
° uy Ym ol
Fig. 3.2. Simple series negative clipper.
3.1.3. Biased Series Positive Clippers
Figure 3.3 shows the relevant circuit along with ue input and the ouput
waveforms. When the input in the positive cycle is less than the bias voltage,
ic. v, V (region be). Again when v, < V, the diode becomes
forward-biased and remains as such for the whole of the negative half-cycle of
the input, So, in the clipped-off output, the maximum negative voltage is v,+V
as shown in Fig. 3.3.
3.1.4. Biased Series Negative Clippers
In Fig. 3.4, the diode remains reverse-biased for v, $V and there is no output
(region a b). When at b, with v, >V, the diode is forward-biased and the clipped
output is obisined with «maximum value of v,—V. Again at C, when v, ¢ V, the
diode becomes reverse-biased and remains off during the whole negative cycle
Cf the input and no output is obtained.vy
my
Diode Circuits 35
Fig. 3.4. Biased series negative clipper.
Vol
q t
vee
3.1.5. Simple Parallel Positive Clippers
In Fig. 3.5, the diode is forward-biased for the positive half-cycle of the input
and offers no resistance. Therefore, the whole of the input voltage is dropped
RoE To
Fig. 3.5, Simple parallel positive clipper.
across R and no output is generated. For the negative half-cycle of the input,
the diode is reverse-biased and offers infinite resistance. Since there is no cur-
rent through , the output voltage is equal to the input voltage. Thus, the posi-
tive half-portion of the input signal is clipped-off in the output.
3.1.6. Simple Parallel Negotive Clippers
In Fig. 3.6, for the positive half-cycle, the diode is reverse-biased and offers
* z $M
| wy a)
Fig. 3.5, Simple paralls negative clipper.36 Semiconductor Electronics
infinite resistance. Therefore, the whole of the input is oblained across the
diode terminals as output. But for the negative half-cycle, the diode is
forward-biased and offers zero resistance. Therefore, the input voltage is
dropped across & and no output is obtained across the diode. In this case, the
negative half of the input signal is clipped-off in the output.
3.1.7. Biased Parallel Positive Clippers
In Fig. 3.7, the diode is reverse-biased owing to the battery V. When the posi-
tive half-cycle of the input signal is applied, the diode remains reverse-biased
upto v, SV (region ab), and the output is obtained. When at v,>V, the diode
becomes forward-biased and no output is obtained. Again, when at C, v, Vs In the positive half-cycle, the diode D, remains
vi A Ve
+ +
0 D “
1
d vj % °
y, “
Fig. 3.9. Double ended clipper.
reverse-biased until V,s V, and D5 remains reverse-biased for the whole of the
Positive cycle of the input. The output is obtained but at v, = V,, the diode D,
becomes forward-biased and the output drops to zero and remains so until
v,SV, again. At this point, the output is obtained, since D, becomes reverse-
biased again. In the negative half-cycle, the diode D, remains reverse-biased
until v, 2 ¥; (D, remains reverse-biased in the whole of the negative cycle), At
D, becomes forward-biased and the output becomes zero. Hence, the
output is clipped at V; in the positive cycle and at V; in the negative cycle, as
shown in Fig. 3.9. In order to get symmetrical square waveform, V, must be
equal 10 V5,
3.2. CLAMPERS
The circuits which are used o convert a waveform into another whose positive
or negative or both-extremities are maintained at some constant reference
level, are known as clamping circuits, Since the output cannot rise above a
certain reference level, it is said 10 be clamped to that level. Whenever a signal
(waveform) is passed through a coupling capacitor or a transformer, its de
component is lost because neither the capacitor nor the transformer allows dc
to pass through it, The clamping circuits are used to restore the lost de or
introduce a new one to such signals. Therefore, the clampers are also called dc
restorers or dc reinseriers. A diode, a capacitor, and a resistor are the three
essential elements required for a clamping circuit. The values of the resistor
and the capacitor are selected so that the time constant RC is very large in
comparison o the time period of the input signal. Under this condition, the38 Semiconductor Electronics
voltage across the capacitor may be assumed to remain fairly constant during
the input signal, when the capacitor is not charging. The description of a simple
clamping circuit, shown along with input and output waveforms in Fig, 3.10 is
given below,
vit yu
vl - J
* Cc
Le % i Yu og
6
Fig. 3.10. Clamping Circuit slong with Input and output waveforms,
Whea the input is +V, the diode is forward-biased and the ourput taken
across the diode is zero, The capacitor charges to +V immediately as the time
constant RC = 0 (forward-biased diode has zero resistance). Now, when the
input switches to -V, the diode becomes reverse-biased, showing infinite
resistance. The voltage across the capacitor does not change appreciably dur-
ing this interval of time and the capacitor acts like a fixed voltage source. The
output is obtained as the sum of the input signal voltage (-V) and the capacitor
voltage (-V), ie. (-V)+(-V) =-2V.
Thus, the output is clamped to the negative region at 2 V and will repeat
itself xt the frequency of the input signal. An important point here is that the
swing of the input (2V) and of the output (2V/) is the same, and it is true for all
the clamping circuits.
3.3, COMPARATORS
As its name indicates, the comparator circuit is used to compare two wave-
forms. If one waveform is taken as the reference level, the comparator is used
tomark the instant when another waveform attains this reference level. Thus, a
comparator output may be a sharp pulse which appears when the increasing
signal becomes equal to the reference. A comparator circuit along with the
input and the output waveforms is shown in Fig. 3.11, The input signal is taken
as 4 ramp. The diode remains cut off until v;SV_ and the output remains
quiescent at v= V>. When v, 2 Vp, the diode is forward-biased and the output
rises with the input signal. In this way, the comparator output marks the instant
Lal which the input becomes V,, the reference voltage.Diode Circuits 39
bobs
Time T Time
Fig. 3.11, Comparator circuit along with input and output waveforms.
3.4. RECTIFIERS
Anelectronic circuit which is used to convert an alternating waveform (vokage
OF current) into a pulsating d.c or unidirectional waveform is known as a recti-
fring circuit, or simply a rectifier. The p-n junction diode is well suited for this
Purpose because it conducts heavily in the forward biasing and only stightly in
the reverse biasing. There are three most common rectifying circuits: half-
wave, full-wave, and bridge rectifiers.
3.4.1. Half-wave Rectifier
Figure 3.12 shows a circuit for 2 half-wave rectifier with its input and output
waveforms, A half-wave rectifier use only altemate half-cycles (positive or
w %
Vn}
o| vy; o|
Fig. 3.12. Half wave rectifier circuit along with input and output wave
forms.
negative) of the a c input waveform to produce a pulsating d ¢ output. For the
other half-cycles of the input, there is no output.
For the positive half-cycles of the input signal, the diode becomes
forward-biased (diode resistance becomes zero) and this input waveform
appears as the output across the resistor R. For the negative half-cycles of the
pul, the diode becomes reverse-biased (diode resistance is infinite), and no
output appears across R. Thus, the output is available only for the positive40 Semiconductor Electronics
half-cycles of the input, as shown in Fig. 3.12, Although this output is not a
steady dc (it is a pulsating dc), it has an average positive value, The output
voltage of the half-wave rectifier can be expressed as
v=V,, sind if 05050
=0 if nsos2n en
For @ from 0 to 2n radians, the average value of the pulsating dc output is
given by,
ea
V.= V,sin@ d@
2X. 0
v.(*
-=f sind do (using Eq3.1)
V
=z ul-eosn+cos0]
ov
Re
=0318 V, 2)
where V,, is the peak value of the input and V,, is the average dc output. Dur-
ing the negative half-cycles, the reverse voltage developed across the diode is
V,, which is the peak inverse voltage for the diode used in the half-wave
rectifier.
3.4.2. Full-wave Rectifier
In order to increase the average d c output and obtain output during both the
cycles of the input, a full-wave rectifier circuit is used, It requires a centre-
tapped transformer and two diodes. The peak voltage developed across each
half of the transformer during the positive cycles is V,, and during the negative
cycles is -V,,. During the alternate positive half-cycles of the input, the upper
half of the transformer makes the diode D, forward-biased and the lower half
of the transformer makes the diode D, reverse-biased. Hence, with the diode D,
conducting, a positive half-cycle of the input waveform, with peak value V,. is
developed across R. Similarly, during the alternate negative half-cycles of the
input, the diode D; is conducting and the diode D, is nonconducting, In this
condition, the output voltage with peak value V,, developed across R is of the
same polarity as for the positive half-cycles because the current through RDiode Circuits 41
Fig. 3.13. Pull wave rectifier circuit along with input and output wave-
forms.
flows in the same direction in both the cycles, as shown in Fig. 3.13. Hence,
the output of a full-wave rectifier is two positive-going half cycles. Therefore,
the average value for the de output of a full-wave rectifier is twice the average
value obtained in the case of a half-wave rectifier, ic.
Vee = 240.318 V,)
= 0.636 V,, 3)
For the positive half-cycles (or negative half-cycles), the reverse voltage
developed across D; (OF D,) is 2 V,,, ic. the sum of the voltage V,, across the
Jower half (or the upper half) of the transformer and the voltage V,, across the
load resistor R. This is the peak inverse voltage for the diodes used in the full-
‘wave rectifier, which is twice the peak value of the input signal.
3.4.3. Bridge Rectifier
The circuit for a bridge rectifier is shown in Fig. 3.14. It is another form of a
full-wave rectifier, in which a centre-tapped wansformer is not required. Also,
the diodes used have peak inverse voltage rating of V,,, rather than 2V,...
During the positive half-cycles of the input signal, the didoes D, and D,
become forward-biased (D, and D, being reverse-biased) and a current flows
along the path @ 6 dc. A voltage from the transformer V,, appears across R.42. Semiconductor Electronics
vy
Nok Vo
Vm
|
qd
Fig. 3.14. Bridge rectifier circuit alongwith input and output waveforms.
Similarly, during the negative half-cycles of the input signal, the diodes D, and
D, become forward-biased (D, and D, being reverse-biased) and a current
flows along the path ¢ b d a. Since this current direction through R is the same
‘as in the case of the positive half-cycles, the voltage from the transformer V,,
appears across R in the same polarity as in the positive half-cycles. Thus, the
output of a bridge rectifier is also positive-going half cycles.
During the negative half-cycles, the reverse-biasing across D; and D, is
the sum of the transformer voltage V,, and the voltage across the load, V,,
owing to the conduction of D, and Dy, i.e. 2V,,. Since there are two diodes in
the path, the reverse voltage across each diode is V,,. Similarly, the reverse
voltage across either of D, and D, during the positive half-cycles is also V,,.
Hence, the peak inverse voltage rating for diodes used in the bridge rectifier is
Vye Father than 2V,,.
3.5. FILTER CIRCUITS:
The output from a rectifier is obtained as pulsating d c signals, whose fre-
quency is the same as the input frequency for the half-wave rectifier, or
twice the input frequency for the full-wave rectifier. Hence, a rectifier is unable
to give a steady dc; it has ripple. The ripple is defined as the departure of the
‘output wavefon of a rectifier from pure d c, The ripple in the output of a rec-
tifier circuit is measured in the form of the ripple factor. This factor is defined.
as the ratio of the r.m.s. value of the a.c. component to the average dc value, InDiode Circuits 43
ure d c, the ripple factor becomes zero. In order to reduce the ripple factor to a
minimum value (ideally zero), oF to obtain pure d ¢, fillering or smoothing cir-
cuits are used.
3.5.1. Capacitor Filter
Ifa simple capacitor is connected across the rectifier output, the ripple factor is
considerably reduced and the d c output voltage is available across the capaci-
tor. Figure 3.15 shows a full-wave rectifier circuit with capacitor filter. Also,
the waveforms without filter and with filter are shown in Fig. 3.15.
Ac.
Mains
fa)
0
Cb) mut
Fig, 3.15. (a) Full wave rectifier with capacitor filter, (b) Unfiltered recti-
fied waveform, (c) Filtered d.¢ waveform,
When the positive-going voltage pulse of a rectifier output appears across
the capacitor, it starts charging towards the peak voltage V,, through the
secondary of the transformer and the conducting diode. After reaching the peak
value V,, the pulse starts its negative-going excursion and the capacitor starts
discharging through R,, thereby holding the voliage across R, at some higher
value than its unfiltered value, Before the capacitor can fully discharge, the
positive-going excursion of the next half-cycle of the unfiltered voltage is
nearing its peak value, recharging the capacitor again. Now the pulse, after
reaching the peak value V, again starts its negative-going excursion and the
capacitor starts discharging once again. Before a complete discharging of the
capacitor, the positive-going excursion of the next half-cycle comes in and the
capacitor recharges again. This action of charging and recharging of the
capacitor continues as long as the circuit is in operation, as shown in Fig. 3.15.
In this way, the time during which the current passes through the load R, is44° Semiconductor Electronics
prolonged and the ripple factor is reduced.
If the average value of d c output is 10 be very close 10 V.. the capacitor
must discharge only slightly. In order to fulfil this condition, the time cons-
tant of R, and C is chosen to be very large in comparison to the time period of
the unfiltered waveform. Because of the long time constant, the discharge of
the capacitor is taken to be approximately linear and the ripple, as shown in
Fig. 3.15, is similar to a sawtooth waveform. The average value of the ou\put
voltage is given by,
Vac. G4)
If, is the time during which the capacitor discharges and T/2 is the time
of the half-cycle of the unfiltered waveform, the long time constant of R, and C
dictates that 7; = 7/2. This is because the conduction time is negligible in this,
case, During 7, the capacitor loses a charge J,. . T which gives a change in
capacitor voltage or the ripple voltage as
Jag-Ta
(es T,=7R)
"0 G5)
where f= 1/T is the frequency of the a ¢ input. Hence, from Eq. 3.4,
G6)
Equation 3.5 shows that the ripple varies inversely with the capacitance and
therefore, large values of capacitance must be used to keep the ripple low.
3.6.2 RC Filter
In order to further reduce the ripple present in the d c obtained after capacitor
filter (Sec. 3.5.1), an additional RC filtering circuit is used, as shown in Fig.
3.16 (a). Though the XC filter is good to attenuate the ripple voltage, it has the
drawback of lowering the d c vollage also, owing to a voltage drop across R.
‘The final values of the dc and the ripple voltages are described below.
Figures 3.16(b) and (c) show the equivalent circuits to calculate the dc
‘and the ripple voltages after RC filtering. V,, and V, are the dc and the ripple
vollages before the RC filter circuit, i.e. across the capacitor C,. As theDiode Circuits 45
D1
2 ~T
aR c. Sf
2 (se2¥—)
fa) =
R R
|
Ve a cm W BR,
(b) {c)
Fig. 3.16. (a) Full wavercctifier with RC filter (b) Equivalent circuit for d
operation (c) Equivalent circuit for ac or ripple.
reactance of a capacitor for dc is infinite, the capacitors C, and C; in the
parallel combination are removed in the equivalent circuit of Fig. 3.16 (b).
Hence, the final dc voltage across the load R, is
v [ Re hy. 3.7)
Lae | G7
In the circuit of Fig. 3.16 (c), the resultant impedance of the parallel
combination of C, and R,, is of the order of C, alone and is much less than the
load resistance R, (if C, = 10 wF and R, = 2K ohms, typically). Therefore, the
load resistance can be ignored in comparison to C, and the ripple voltage after
the RC filter is
Vea C,
Vie? +(10c,?
using simple voltage division rule, Equation 3.7 and 3.8 show that the RC filter
is able to reduce the ripple voltage by a greater amount than it decreases the d¢
voltage, providing better filter operation.
3.8)46 Semiconductor Electronics
3.5.3. n-Filter
In Sec. 3.5.2, the role of the series resistance R in reducing the ripple voltage
was discussed. Equations 3,7 and 3.8 show that in order to reduce the ripple
voltage, the value of R should be large and in order to have little loss in dc
voltage, the value of R should be as small as possble, So, there is the problem
of selecting the optimal value of R, The replacement of this series resistance R
by an inductor fulfils the above two requirements simulianeously. This is
because an inductor has very low resistance for the dc and at the same time,
offers a very large inpedance to the ac signals. Figure 3.17 shows the filter
circuit having two capacitors C, and C, and an inductor L connected in the
shape of 7, and therefore known as n-filter, The output d c voltage is reduced
owing to a drop in voltage across the d c resistance of the inductor R,, and
therefore,
Wee= Vee—Hae-R G9)
Fig. 3.17. x-Filter circuit.
If R is replaced by ac impedance of the inductor cL, the expression for the
ripple voltage from Eq. 3.8 is
Va C;
Val =(ia Gy”? 6.10)
3.6. VOLTAGE MULTIPLYING CIRCUITS
A number of circuits of diodes and capacitors can be used to get dc output
voltage that is double, triple, or many times the peak value of the ac input
voltage. These circuits are known as voltage multiplying circuits: doublers,
triplers, quadruplers, etc. All these circuits use the charge stored in the capac-
itors to increase the output voltage. The input is a ¢ and the output is dc
multiple.
3.6.1. Half-wave Voltage Doubler
Figure 3.18 shows the circuit for a half-wave voltage doubler, which gives a
dc voltage twice that obiained from the half-wave rectifier circuit. For theDiode Circuits 47
positive half-cycles of the input, the top of the transformer secondary is posi-
live and the capacitor C,, charges through the conducting diode D, to approxi-
mately the peak value of the secondary voltage. At this time, the diode D, is
nonconducting and there is no output. During the negative cycle of the input,
the top of the transformer secondary becomes negative and the diode D,
becomes cut off, As the voliage across C; is in series with this applied ac
input, the two voltages are added to give a forward-biasing of Vy + Vq= 2V, 10
the diode D2, and the capacitor C; is charged to this voltage, i.c. 2V,. The out-
pul waveform across the capacitor Cis double that to a half-wave rectifier fil-
tered by a capacitor filter, and the peak inverse voltage across each diode is
2V,. In this way, ad ¢ output approximately double the peak value of the ac
input is obtained.
cy Dz
1
+ FE Kt 2
Yon
Ac j ~My,
Mains Yn 1V CAR 2Vq, 2Ym
+
- +
Fig. 3.18, Half-wave voltage doubler circuit.
3
Figure 3.19 shows the circuit of a full-wave voltage doubler, For the positive
half-cycle of the a ¢ input, the top of the transformer secondary is positive
=
Full-wave Voltage Doubler
Fig. 3.19. Full-wave voltage doubler circuit.48 Semiconductor Electronics
and the diode D, conducts, The capacitor C, charges through D, and the trans-
former secondary to the peak value of the secondary voltage V,. At this time,
the diode D, is nonconducting. During the negative half-cycle of the ac input,
the diode Dy conducts. The capacitor C charges tuough D, and the trans-
former secondary 10 the peak value of the secondary voliage V., At this time,
the diode D, is nonconducting. Thus, the voltage across C, and C; is 2V..
because both are in a series combination. The peak inverse voltage for each
diode is 2 V,.. In this case, the filtering action is poor as the resultant capacitor
is less than the capacitance of either C, or C3, 28 both are in series.
3.6.3. Voltage Tripler and Quodrupler
Figure 3.20 shows a voltage tripler circuit which provides a dc output that is
Fig, 3.20, Voltage vipler circuit,
three times the peak value of the secondary a c voltage. This circuit is an
extension of the voltage doubler circuit, with an additional diode and capacitor,
During the positive half-cycle of the transformer secondary voltage, the diode
D, conducts and the capacitor C, charges to the peak voltage V_. During the
negative half-cycle of the wansformer secondary voltage, the diode D; con-
ducts and the capacitor C; charges to the sum of the voltage across C, and the
transformer, ic. V.+V,=2 V,. During the next positive half-cycle, the diode
Dy conducts and the capacitor C, charges to the sum of the voltages across C3
and the transformer secondary, i.e. 2 V,, + V,,= 3 V,.In this way, the dc ouiput
voltage is three times the peak value of the ac input voltage.
Figure 3.21 shows a voltage quadrupler circuit, which gives a d c output
voltage four times the peak value of the secondary a ¢ voltage. The circuit
behaviour is on the same lines as explained for the tripler circuit above. This
circuit may be further extended to obtain very large voltages.Fig. 3.21. Voltage quadrupler circuit.
3.7. SOLVED PROBLEMS
Problem 1
Calculate the ripple voltage under no-load and full-load conditions in the case
of capacitor filter with C = 2000 jt F, 44, = 250m A, and V,.=9 V.
Solution
The ripple voltage using a simple capacitor is given by
Nae dae
‘ToC S=50 Hz
Under no-load condition,
V,=0V
Under full-load condition, /,,= 250 mA
250x107
y,=— 20x10"
100 2000 x 10°
=25V.
Problem 2
Find the d voltage obtained from a half-wave and a full-wave rectifier cir-
cuits, with peak rectified voltage of 24 V. Also, calculate the peak inverse
‘vollage developed in the two cases.50 Semiconductor Electronics
Solution
For the half-wave rectifier,
Ve = 0.318 V,, = 0.318 x24
=16V
and the peak inverse voltage
PIV=V,.=24 V
For the full-wave rectifier circuit,
Vue =0.636 V,, = 0.63624
=153V
and the peak inverse voltage
PIV=2V,,=48V
Problem 3
Find the peak inverse voltage for the diodes used in a bridge rectifier if Vie =
63.6 V.
Solution
For a bridge rectifier,
V,. = 0.636 V,,
v= = 100 V
= 0.636
and the peak inverse voltage
PIV=V,,= 100 V
Problem 4
‘What will be the output dc voltage for a x-filter if the input voltage is 30 V, the
filter inductor is 5 henry with 200 Q resistance and the output current is 50
mA?
‘Solution
Across the n-filter,
Vac =Vae~ lac Re
= 30-50% 10° 200
=20V
Problem 5
Draw the output waveforms for the input applied to the circuit of Fig. 3.22.
SolutionDiode Circuits $1
wv
oO [ +
|| * *
L 2
aH
yi 5x3 Vo
i
4
a
wv _ -
° rl.
Fig. 3.22. Clipping circuit for problem 5.
For values v,>2 V, the diode is forward-biased and V, =5-2=3 V.
For values v, <2. V, the diode is reverse-biased and v=0. The resultant
output waveforms are shown in Fig. 3.22 ().
Problem 6
Draw the output waveforms for the input applied to the circuit of Fig. 3.23.
Fig. 9.23. Claming cireuit for problem 6.52. Semiconductor Electronics
Solution
During the positive cycle of the input, v,=+5 V and the diode is forward-biased
(ic. short circuit). The capacitor will charge rapidly to + 5 V. The output will
remain zero for this period. During the negative cycle of the input V;=-5 V,
the diode is reverse-biased (i. open circuit) and the capacitor voltage remains
at +5 V as the discharge time (which is generally taken as five times the time
constant of the circuit, i.e. $ RC =5%200x 10°x0.1 x 10%= 100 msec) is much
ie. Tatache.
she robeske2 ne)
= supply voltage + capacitor voltage
=(5V)+-5¥)
=-10V
The output wavefomus are shown in Fig. 3.23 by which itis clear that the volt=
age swing is the same for the input as well as the output waveforms,
Problem 7
In the circuit of Fig. 3.11, if Ve=0, R= 1K, is a ramp rising at the rate of 15
Vin sec, and the diode used has a reverse saturation current of 2 A, find the
time 1 at which a device operative at 150 mV will respond. Ifthe resistance R is
increased to 75 K, how many times will the time ¢ increase?
Solution
When R = 1 K, the diode will remain eut off up to a voltage
greater than the duration of they, =
The output will be
V, = Crevers stration caren %R)
=2x10%x1x10°=2 mV
The device will respond when the output voltage of the circuit
vy= 1504 2.=152mV
‘Therefore, the time at which the device will respond,
3
1,5 (152x 10 yt
= 10.1 n see.
Similarly, when R = 75 kQ, the diode will be cut off up to
V,= 2 10°75 x 10°
= 150 mV