MBRM2H100T3G,

NRVBM2H100T3G

Surface Mount
Schottky Power Rectifier
POWERMITE®
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Power Surface Mount Package
The Schottky Powermite® employs the Schottky Barrier principle SCHOTTKY BARRIER
with a barrier metal and epitaxial construction that produces optimal
RECTIFIER
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature, 2.0 AMPERES, 100 VOLTS
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite® has the same thermal performance as the SMA while
being 50% smaller in footprint area. Because of its small size, it is CATHODE
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
ANODE
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “ORing” of multiple supply POWERMITE
voltages and any other application where performance and size are CASE 457
critical.

Features MARKING DIAGRAM

• Low Profile − Maximum Height of 1.1 mm
• Small Footprint − Footprint Area of 8.45 mm2 M
1 2
• Low VF Provides Higher Efficiency and Extends Battery Life B2HG

• Supplied in 12 mm Tape and Reel

• Low Thermal Resistance with Direct Thermal Path of Die on M = Date Code
Exposed Cathode Heat Sink B2H = Device Code
G = Pb−Free Package
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• This is a Pb−Free Device ORDERING INFORMATION
Device Package Shipping†
Mechanical Characteristics:
• Powermite® is JEDEC Registered as D0−216AA MBRM2H100T3G Powermite 12000/Tape &
(Pb−Free) Reel
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in NRVBM2H100T3G Powermite 12000/Tape &
(Pb−Free) Reel
• Weight: 16.3 mg (Approximately)
• Lead and Mounting Surface Temperature for Soldering Purposes: †For information on tape and reel specifications,
including part orientation and tape sizes, please
260°C Maximum for 10 Seconds refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

© Semiconductor Components Industries, LLC, 2014 1 Publication Order Number:

January, 2014 − Rev. 2 MBRM2H100/D
 MBRM2H100T3G, NRVBM2H100T3G

MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 100 V
Working Peak Reverse Voltage VRWM
VR
DC Blocking Voltage
Average Rectified Forward Current IO 2.0 A
(TL = 160°C)

Non−Repetitive Peak Surge Current IFSM 50 A

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)

Storage and Operating Junction Temperature Range (Note 1) Tstg, TJ −65 to +175 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Lead (Note 2) YJCL 12 °C/W
Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 75 °C/W
Thermal Resistance, Junction−to−Ambient (Note 3) RqJA 260 °C/W

ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 4) VF V

(IF = 1.0 A, TJ = 25°C) 0.76
(IF = 2.0 A, TJ = 25°C) 0.84
(IF = 1.0 A, TJ = 125°C) 0.61
(IF = 2.0 A, TJ = 125°C) 0.68

Maximum Instantaneous Reverse Current (Note 4) IR

(Rated dc Voltage, TJ = 25°C) 20 mA
(Rated dc Voltage, TJ = 125°C) 1.0 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Board.
3. Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Board.
4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.

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 MBRM2H100T3G, NRVBM2H100T3G

TYPICAL CHARACTERISTICS

100 100
IF, FORWARD CURRENT (A)

IF, FORWARD CURRENT (A)

150°C 125°C 25°C 150°C 125°C 25°C

10 10

1 1

0.1 0.1
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

10 10
150°C
150°C
IR, REVERSE CURRENT (mA)

IR, REVERSE CURRENT (mA)

1 1

125°C
0.1 0.1
125°C

0.01 0.01

25°C
0.001 0.001

25°C
0.0001 0.0001

0.00001 0.00001
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

4.0
IF(AV), AVERAGE FORWARD CURRENT (A)

3
PFO, AVERAGE POWER DISSIPATION (W)

RqJL = 12°C/W 2.8 TJ = 175°C

3.5 2.6
dc
2.4
3.0 2.2 Square Wave
2
2.5 Square Wave 1.8
1.6 dc
2.0
1.4
1.2
1.5
1
1.0 0.8
0.6
0.5 0.4
0.2
0 0
135 140 145 150 155 160 165 170 175 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating Figure 6. Forward Power Dissipation

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 MBRM2H100T3G, NRVBM2H100T3G

TYPICAL CHARACTERISTICS

140
TJ = 25°C
120

C, CAPACITANCE (pF)
100

80

60

40

20

0
0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (V)
Figure 7. Capacitance

1000

50% (DUTY CYCLE)

100 25%
10%
5.0%
R(t) (C/W)

10 2.0%

1.0%
1.0

0.1
SINGLE PULSE
0.01
0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
PULSE TIME (s)
Figure 8. Thermal Response, Junction−to−Ambient (20 mm2 pad)

100
50% (DUTY CYCLE)
25%
10 10%
5.0%
R(t) (C/W)

2.0%
1.0
1.0%

0.1
SINGLE PULSE

0.01
0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
PULSE TIME (s)
Figure 9. Thermal Response, Junction−to−Ambient (1 in2 pad)

POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.

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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

POWERMITE
CASE 457
ISSUE G
DATE 12 JAN 2022
SCALE 4:1

GENERIC
MARKING DIAGRAMS*

M M
1 XXXG 2 1 XXXG 2

STYLE 1: STYLE 2: STYLE 3:

PIN 1. CATHODE PIN 1. ANODE OR CATHODE PIN 1. ANODE
STYLE 1 STYLE 2 2. ANODE 2. CATHODE OR ANODE 2. CATHODE
(BI−DIRECTIONAL)

M *This information is generic. Please refer to

1 XXXG 2
device data sheet for actual part marking.
XXX = Specific Device Code Pb−Free indicator, “G” or microdot “G”, may
M = Date Code or may not be present. Some products may
STYLE 3 G = Pb−Free Package not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB14853C Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: POWERMITE PAGE 1 OF 1

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