ASSEMBLING
INTELLIGENT
MACHINE
Understanding the Future
of Intelligent Systems.
MEMBERS
EURRAY NHEIL DAVID CARL
SALAS AGAG BALURAN CURAY
MEMBERS
ERIN RAYA FRENCE ANGENIE
LIMOT SENERPIDA PEROCHO VEDRA
Soldery / de-soldery procedure &
01
techniques
02 Hot air soldiery procedures
03 Hand soldery
04 RoHs & lead free Soldery
05 Continuation testing
06 Aging test
07 Substitution test
08 Mechanical testing
SOLDERING PROCEDURES
AND TECHNIQUES
Soldering involves joining two or
more metals (usually a metal
component and a PCB) by melting a
filler material (solder) to create a
strong electrical and mechanical
bond.
TOOLS NEED FOR
SOLDERING
Soldering Iron: The primary tool used to heat the
solder to its melting point. It has a pointed tip for
precision.
Soldering Wire: The solder is typically a mixture of
tin and lead (or lead-free alloys such as tin-copper
or tin-silver).
Flux: A chemical used to clean and prepare the
surfaces to be soldered, preventing oxidation and
improving the flow of solder.
TOOLS NEED FOR
SOLDERING
Soldering Iron Stand: A safe place to hold the
hot iron.
Soldering Tip Cleaner: A sponge or brass wool
to clean the soldering iron tip.
Tweezers: To hold small components in place
while soldering.
Desoldering Pump (optional): Can be useful in
case of excess solder.
SOLDERING IRON
SOLDERING WIRE
FLUX
SOLDERING IRON
STAND
SOLDERING TIP
CLEANER
TWEEZERS
DESOLDERING
PUMP
SOLDERING
STEPS
Ensure the PCB and components are clean and free from dust or oil.
Insert the component leads into the PCB holes and bend them
slightly to hold them in place. Heating the Soldering Iron:
Turn on the soldering iron and allow it to heat to the appropriate
temperature (usually between 350°C and 400°C, depending on the
solder type). Apply Flux:
Use flux on the component leads and the PCB pads to enhance the
solder’s flow and ensure a clean connection. Soldering:
Hold the soldering iron’s tip against the joint (the lead
and the PCB pad) for 1-2 seconds to heat both parts.
Once they’re heated, feed solder onto the joint (not
directly onto the iron’s tip).
Allow the solder to flow evenly around the lead and pad.
Remove the solder, and then the iron. Let the solder joint
cool naturally, ensuring it forms a shiny, smooth
connection. Inspect:
After soldering, inspect the joint for a
"volcano" or "hourglass" shape to ensure
it is strong and electrically sound.
Ensure there are no cold joints (dull and
cracked), which indicate poor
connections.
DESOLDERING
is the process of removing
solder from a joint, typically
to replace components or fix
errors in the soldering
process.
TOOLS NEED FOR
DESOLDERING
Soldering Iron: The same iron used for soldering is used to
heat up the solder during desoldering.
Desoldering Pump: A hand-operated tool that vacuums up
the molten solder once it's heated.
Desoldering Braid/Wick: A braided copper wire used to wick
up molten solder.
Flux: Helps in removing the solder and making the
desoldering process more efficient.
Soldering Iron Tip Cleaner: To clean the soldering iron tip.
SOLDERING IRON
DESOLDERING PUMP
DESOLDERING
BRAID/WICK
FLUX
SOLDERING TIP
CLEANER
DESOLDERING
STEPS
iron to around 350°C. Apply Flux:
Apply flux to the solder joints. Flux will help the solder melt faster
and more uniformly. Desolder Using Desoldering Pump:
Heat the solder joint with the soldering iron. Once the solder has
melted, quickly place the desoldering pump near the joint and
activate it to suck up the molten solder. Be quick, as the solder will
re-solidify shortly after removal. OR:
Desolder Using Desoldering Braid:
Place the desoldering braid on top of the solder joint. Press the hot
soldering iron on top of the braid. The heat will cause the solder to
melt and be absorbed by the braid. Remove the braid and soldering
iron once the solder is gone. Clean Up:
After removing the solder, use a desoldering pump or braid a few
times if needed to ensure the joint is clean. Clean the PCB with
isopropyl alcohol to remove any remaining flux residues. Inspect:
Ensure that the pad is not damaged. If the PCB pad is lifted or
damaged, further repair work might be needed before installing a
new component.
An assembling intelligence machine might,
for instance, use sensors, machine
learning, and robotics to efficiently and
autonomously assemble products in a
factory setting. These machines could
optimize assembly workflows, detect
defects, or adjust to varying tasks.
HOT AIR SOLDERING
a technique commonly used for surface mount
technology (SMT) and rework of electronic
components. It involves using a stream of hot
air to heat and melt solder, allowing for the
placement, removal, or reflowing of
components. This technique is typically used
with a hot air rework station, which provides
both temperature control and airflow
regulation.
TOOLS NEEDED FOR
HOT AIR SOLDERING
Hot Air Rework Station: This is the main tool used,
and it includes a heated air nozzle and a blower to
direct the airflow.
Nozzles: Different sizes of nozzles are used
depending on the size and number of pins of the
component being soldered.
Tweezers: For precise handling of components
while heating.
Soldering Flux: Used to prevent oxidation and
ensure the solder melts and flows easily.
Soldering Iron (optional): Sometimes, it’s used to
fine-tune or complete connections.
Solder Paste: Used for applying solder to the pads
before placing the component.
PCB Holder or Vice: Holds the PCB steady during
the procedure.
Isopropyl Alcohol (for cleaning): Cleans up any
flux residue after the process.
HOT AIR REWORK
STATION
NOZZLES
TWEEZERS
SOLDERING FLUX
SOLDERING IRON
SOLDER PASTE
PCB HOLDER OR
VICE
ISOPROPYL ALCOHOL
HOT AIR SOLDERING
STEPS
1. Preparation: Clean the PCB using isopropyl alcohol and a lint-
free cloth or brush to remove dust and oils. Apply solder paste to
pads for SMT components to ensure a strong connection.
2. Set Up the Hot Air Rework Station: Set the temperature between
250°C to 350°C (482°F to 662°F) depending on the type of solder.
Adjust airflow to medium or low to avoid blowing components off
the PCB.
3. Position the PCB and Component: Secure the PCB on a stable
surface (using a holder or vice) and place the component onto the
solder pads, aligning it properly, usually with tweezers.
4. Apply Hot Air: Direct hot air at the component to melt the solder
paste. Keep the nozzle 2-3 cm above the component and move it in
circular motions to ensure even heating. Wait for the solder to melt
and the component to align correctly.
5. Cool Down: Allow the PCB to cool naturally before moving it. This
ensures proper solder joint solidification. Inspect the joints for a
shiny and concave appearance without any bridging.
6. Post-Soldering Clean-up: Clean the PCB again with isopropyl
alcohol to remove flux residue. Inspect the joints with a magnifying
lens to check for quality soldering (no shorts or cold joints).
HAND SOLDERING
is the most common method for soldering
electronic components to a printed circuit board
(PCB) manually, usually involving the use of a
soldering iron. It’s often employed for small
batches, repairs, or projects involving through-
hole or surface-mount components. The process
involves the careful application of solder and heat
to create strong electrical and mechanical bonds
between components and PCB pads.
TOOLS NEEDED FOR
HAND SOLDERING
Soldering Iron: A tool used to heat solder. Typically, it
has a replaceable tip that needs to be maintained for
effective use.
Soldering Tip: The tip of the soldering iron should be
clean and in good condition for precision work.
Solder: A filler metal, typically composed of tin and
lead or lead-free alloys like tin-copper or tin-silver.
Soldering Iron Stand: A holder to safely place the
soldering iron when not in use.
Soldering Iron Tip Cleaner: A wet sponge or brass
wool used to clean the tip of the iron.
Flux: A chemical that helps clean the PCB pads and
component leads, allowing for better flow of the
solder and reducing oxidation.
Tweezers: Used for handling small components.
Desoldering Tools: Like a desoldering pump or
braid for correcting mistakes.
Safety Gear: Wear safety glasses to protect your
eyes from solder splashes, and work in a well-
ventilated area to avoid inhaling solder fumes.
SOLDERING IRON
SOLDERING TIP
SOLDER
SOLDERING IRON
STAND
SOLDERING IRON TIP
CLEANER
FLUX
TWEEZERS
DESOLDERING TOOLS
SAFETY GEAR
HAND SOLDERING
STEPS
1. Preparation of the Workspace and Components
Ensure a clean, organized, and well-lit workspace.
Clean the PCB with isopropyl alcohol.
Insert components through the PCB holes or
align surface-mount components on the pads.
2. Set Up the Soldering Iron
Heat the soldering iron to 350°C (662°F) for lead-
based solder.
Clean the iron tip with a wet sponge or brass wool.
3. Soldering Process
Apply flux to the pads and component leads if not already
pre-coated.
For through-hole components, heat the joint, apply solder,
and remove the iron.
For surface-mount components, heat the pads and
component, apply solder, and remove the iron.
4. Inspect the Solder Joint
Ensure the joint is smooth, shiny, and concave in
appearance.
Check for cold joints (dull or cracked) and solder bridges
(unintended connections).
Rework as needed with a desoldering pump or braid.
5. Clean the PCB
Clean off flux residue with isopropyl alcohol and a brush.
Perform a final inspection for any issues like solder bridges
or cold joints.
RoHS (Restriction of Hazardous Substances)
and lead-free soldering are essential
concepts in modern electronics assembly.
RoHS mandates that certain hazardous
materials, including lead (Pb), be restricted in
electrical and electronic products. As a result,
the use of lead-free solder became
mandatory in many industries.
LEAD FREE PROCEDURES
AND TECHNIQUES
1. Preparation: Use a soldering iron set to 350°C
(662°F) for lead-free solder, as it requires higher
heat.
2. Soldering Process: Heat the joint for 2-3
seconds to ensure even heating, apply solder
(not directly onto the iron tip), and avoid
excessive solder to prevent bridges. Allow the
joint to cool naturally, forming a smooth, shiny,
and concave joint.
3. Inspecting the Joint: Check that the joint is
smooth, shiny, and concave. Reflow cold joints (dull
or cracked) by reheating and adding more solder.
4. Post-Soldering Clean-up: Clean flux residues
with isopropyl alcohol (IPA) and a brush, and
inspect for any remaining solder balls or flux,
cleaning them off.
RESTRICTED SUBSTANCES OF
ROHS
1. Lead (Pb)
2. Mercury (Hg)
3. Cadmium (Cd)
4. Hexavalent Chromium (Cr6+)
5. Polybrominated Biphenyls (PBB)
6. Polybrominated Diphenyl Ethers
(PBDE)
CONTINUATION TESTING
refers to the ongoing or repeated process of
testing, usually in the context of systems,
products, or services that are in a continuous
development or production cycle. It is often
associated with ensuring that the system
remains stable, performs as expected, and
adheres to specifications over time, especially
after changes, updates, or maintenance.
AGING TEST
used to assess the long-term performance,
reliability, and durability of a product, system, or
material over time. These tests simulate the effects
of prolonged use, environmental stress, or other
factors that could affect the product's lifespan.
Aging tests are crucial in various industries,
particularly in electronics, automotive, materials
science, and consumer products, to ensure that
the products can withstand real-world conditions
and maintain their functionality over time.
TYPES OF
AGING TEST
environmental (temperature, humidity, UV,
salt spray)
mechanical (vibration, flexing, impact), and
chemical (exposure, biodegradation).
Accelerated aging tests speed up the process
by intensifying conditions. The specific tests
used depend on the product and its intended
use.
SUBSTITION TEST
Substitution tests in assembling
intelligent machines can be
categorized into different types
based on how AI replaces or
assists human functions.
1. Weak Substitution Test -
Purpose: Evaluates if AI can assist humans in tasks,
improving efficiency, but not fully replacing them. -
Example: AI-powered grammar checkers (like
Grammarly) or medical imaging assistance.
2. Strong Substitution Test -
Purpose: Assesses whether AI can completely replace
humans in a task without needing human oversight.
- *Example: Self-checkout systems in supermarkets or
automated warehouses.
3. Adaptive Substitution Test -
Purpose: Tests if AI can adapt to dynamic, unpredictable
environments and handle changing situations.
Example: Autonomous vehicles or AI in real-time
cybersecurity threat detection.
4. Hybrid Substitution Test -
Purpose: Evaluates AI-human collaboration, where AI plays
a major role but human supervision is still required for
decision-making. -
Example: AI-assisted surgery or AI-powered customer
service chatbots.
3. Adaptive Substitution Test -
Purpose: Tests if AI can adapt to dynamic, unpredictable
environments and handle changing situations.
Example: Autonomous vehicles or AI in real-time
cybersecurity threat detection.
4. Hybrid Substitution Test -
Purpose: Evaluates AI-human collaboration, where AI plays
a major role but human supervision is still required for
decision-making. -
Example: AI-assisted surgery or AI-powered customer
service chatbots.
MECHANICAL TESTING
The process of evaluating the physical and
mechanical properties of materials, components,
or structures under different conditions. These
tests help determine characteristics such as
strength, durability, hardness, elasticity, and
resistance to forces like tension, compression, and
impact. Mechanical testing is crucial in industries
like manufacturing, construction, aerospace, and
automotive to ensure material reliability and safety.
TYPES OF
MECHANICAL TESTING
1. Tensile Testing (Tension Test)
Purpose: Measures how much a material can
stretch before breaking.
Method: Material is pulled apart using a testing
machine until it fractures.
2. Compression Testing
Purpose: Measures a material's ability to resist
being crushed.
Method: Material is compressed between plates
until it deforms or breaks.
3. Hardness Testing
Purpose: Assesses a material's resistance to
deformation or scratching.
Methods: Includes Brinell, Rockwell, Vickers,
and Mohs tests, each using different
techniques for various materials.
4. Impact Testing
Purpose: Tests a material’s toughness (energy
absorption before breaking).
Methods: Charpy and Izod tests, with
variations in sample position and testing
methods.
5. Fatigue Testing
Purpose: Measures a material's ability to
endure repeated loading cycles.
Method: Material is subjected to cyclic
stress until failure to measure fatigue life.
6. Creep Testing
Purpose: Assesses material deformation
under constant stress and high
temperatures. Method: Material is
subjected to a fixed load at elevated
temperature for extended periods.
7. Fracture Toughness Testing
Purpose: Tests a material's resistance to
crack propagation under stress.
Method: Pre-cracked material is stressed
until the crack grows.
8. Shear Testing
Purpose: Measures a material's resistance
to forces that cause sliding between
layers. Method: Material is subjected to
opposing forces to measure shear
strength.
THANK YOU
FOR YOUR ATTENTION
