Data sheet acquired from Harris Semiconductor
SCHS035C – Revised September 2003
The CD4030B types are supplied in 14-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages (E
suffix), 14-lead small-outline packages (M, MT,
M96, and NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 1-May-2025
PACKAGING INFORMATION
Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)
CD4030BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4030BE
CD4030BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4030BF
CD4030BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4030BF3A
CD4030BM Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4030BM
CD4030BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4030BM
CD4030BM96G4 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4030BM
CD4030BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4030B
CD4030BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM030B
CD4030BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM030B
JM38510/05353BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
05353BCA
(1)
Status: For more details on status, see our product life cycle.
(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without
limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available
for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the
finish value exceeds the maximum column width.
(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per
JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the
previous line and the two combined represent the entire part marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 1-May-2025
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4030B, CD4030B-MIL :
• Catalog : CD4030B
• Military : CD4030B-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Dec-2024
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS
K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4030BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4030BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4030BNSR SOP NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4030BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Dec-2024
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4030BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4030BM96G4 SOIC D 14 2500 356.0 356.0 35.0
CD4030BNSR SOP NS 14 2000 356.0 356.0 35.0
CD4030BPWR TSSOP PW 14 2000 356.0 356.0 35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Dec-2024
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4030BE N PDIP 14 25 506 13.97 11230 4.32
CD4030BE N PDIP 14 25 506 13.97 11230 4.32
CD4030BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4030BEE4 N PDIP 14 25 506 13.97 11230 4.32
Pack Materials-Page 3
PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
C
6.2
TYP SEATING PLANE
5.8
A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1
8.75 2X
8.55 7.62
NOTE 3
7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4
0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE
0.25
0 -8 1.27 0.10
0.40
DETAIL A
TYPICAL
4220718/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.
www.ti.com
EXAMPLE BOARD LAYOUT
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
14X (1.55) SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(R0.05)
TYP
(5.4)
LAND PATTERN EXAMPLE
SCALE:8X
SOLDER MASK METAL UNDER SOLDER MASK
METAL OPENING
OPENING SOLDER MASK
0.07 MAX 0.07 MIN
ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
SOLDER MASK DETAILS
4220718/A 09/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
14X (1.55) SYMM
1
14
14X (0.6)
12X (1.27)
SYMM
7 8
(5.4)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:8X
4220718/A 09/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID A 4X .005 MIN
(OPTIONAL) [0.13] .015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
7 8
B .245-.283 .2 MAX TYP .13 MIN TYP
[6.22-7.19] [5.08] [3.3]
C SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE
[0.38]
0 -15 14X .008-.014
TYP [0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A
1 14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
7 8
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX (.063)
[0.05] [1.6]
ALL AROUND METAL
( .063)
SOLDER MASK [1.6]
OPENING
METAL
SOLDER MASK .002 MAX
(R.002 ) TYP [0.05]
OPENING
[0.05] ALL AROUND
DETAIL A DETAIL B
SCALE: 15X 13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1
2X
5.1 3.9
4.9
NOTE 3
4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220202/B 12/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
14X (1.5) SYMM
(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK METAL UNDER SOLDER MASK
METAL SOLDER MASK OPENING
OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN
ALL AROUND ALL AROUND
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000
4220202/B 12/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
14X (1.5) SYMM
(R0.05) TYP
1
14X (0.45) 14
SYMM
12X (0.65)
7 8
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220202/B 12/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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