QPC6324 Data Sheet
QPC6324 Data Sheet
®
Absorptive, High Isolation SPDT Switch
Product Overview
The QPC6324 is a Silicon on Insulator (SOI) single-pole,
double-throw (SPDT) switch, designed for use in 4G/5G
wireless infrastructure applications and other high-
performance communications systems. It offers high
isolation with excellent linearity and power handling
capability. No blocking capacitors are necessary on the RF
ports. The design is non-reflective such that the RFX ports
QFN 20 Pin 4 mm x 4 mm leadless SMT Package
are terminated into 50 Ω in the off state. The QPC6324 is
+1.8V logic compatible.
CTRL2
GND
GND
VDD
20 19 18 17 16
GND 1 15 GND
CMOS Logic/
Control Circuitry
GND 2 14
GND
Applications
RF1 3 13
RF2
GND 4 12
• Wireless Infrastructure
GND
• Macro or picocell base stations
50Ω 50Ω
GND 5
50Ω
11
GND
• TDD-based architectures
6 7 8 9 10
GND
GND
GND
GND
RFC
Top View
Ordering Information
Part No. Description
QPC6324TR13 2500 pcs on a 13” reel
QPC6324EVB-01 Evaluation board
Datasheet, Rev. H, January 31, 2020 | Subject to change without notice 1 of 11 www.qorvo.com
QPC6324
®
High Isolation SPDT Switch
Electrical Specifications
Test conditions, unless otherwise noted: Temp = 25°C, VDD = +5V.
Parameter Conditions Min Typ Max Units
Operational Frequency Range 5 6000 MHz
100 – 2000 MHz 0.9 1.15 dB
2000 – 4000 MHz 1.0 1.25 dB
Insertion Loss (1)
4000 – 5000 MHz 1.05 1.3 dB
5000 - 6000 MHz 1.1 1.35 dB
Insertion Loss Ripple In any 400 MHz band 0.03 dB
100 - 2000 MHz 55 61.5 dB
2000 – 4000 MHz 50 57 dB
Isolation, RFC-RFX (1)
4000 – 5000 MHz 48 54 dB
5000 - 6000 MHz 44 50 dB
100 - 2000 MHz 57 63 dB
2000 – 4000 MHz 50 57 dB
Isolation, RFX-RFX (1)
4000 – 5000 MHz 48 54 dB
5000 - 6000 MHz 44 50 dB
100 - 4000 MHz 14 17 dB
Return Loss, RFC (2) 4000 – 5000 MHz 13 16 dB
5000 - 6000 MHz 14 17 dB
100 - 4000 MHz 13 16 dB
Return Loss, RFX (2) 4000 – 5000 MHz 12 15 dB
5000 - 6000 MHz 15 18 dB
RFC Terminated, 2000 MHz 22 dB
Return Loss
RFC Terminated, 6000 MHz 15 dB
RFX Terminated, 2000 MHz 20 dB
Return Loss
RFX Terminated, 6000 MHz 13 dB
Note:
1. Production screen of product is done only at 2GHz and 6GHz.
2. Guaranteed by design only. Not tested in production.
Bill of Material
Ref Des Value Description Manuf. Part Number
n/a n/a Printed Circuit Board Qorvo
U1 n/a High Isolation SPDT Switch Qorvo QPC6324
C1, C2 200 pF CAP, 0402, 50V, 5%, C0G Various
C4 0.1 μF CAP, 0402, 50V, 10%, X7R Various
R3, R4 0Ω RES, 0402 Various
R1, R2, C3 DNP
Logic Table
CTRL1 CTRL2 RFC-RF1 RFC-RF2
0 0 OFF OFF
0 1 OFF ON
1 0 ON OFF
(1)
1 1 OFF OFF (1)
Notes:
1. This is not a supported ‘switch’ mode. RFC is not terminated.
Performance Plots
Insertion Loss vs Frequency (RFC-RFX) Return Loss vs frequency (RFC) Return Loss vs Frequency (RFC, RF1 ON)
0.0 0 0
+110 °C Temp.=+25 °C VDD = 5.5V
-0.2
+25 °C
-0.4 -5 -5
−40 °C
-0.6
Insertion loss (dB)
Return Loss vs Frequency (RFC, RF2 ON) Return Loss vs Frequency (RFX) Return Loss vs Frequency (RF1)
0 0 0
VDD = 5.5V Temp.=+25 °C VDD = 5.5V
-5 -5
-5
-10
Return loss (dB)
-20
-25 -25
VDD = 2.7V, RF1 ON
-25 VDD = 5.5V, RF1 ON
-30 -30
VDD = 2.7V, RF2 ON
VDD = 5.5V, RF2 ON
-35 -30 -35
0 1000 2000 3000 4000 5000 6000 0 1000 2000 3000 4000 5000 6000 0 1000 2000 3000 4000 5000 6000
Frequency (MHz) Frequency (MHz) Frequency (MHz)
Return Loss vs Frequency (RF2) Return Loss vs Frequency (RFC, All OFF) Return Loss vs Frequency (RF1, All OFF)
0 0 0
VDD = 5.5V VDD = 5.5V VDD = 5.5V +110 °C
-5 +110 °C -5 +25 °C
-5
+25 °C −40 °C
-10
Return loss (dB)
+110 °C
+25 °C -15 -15
-15 −40 °C
-20 -20
-20
-25 -25
-25
-30 -30
Return Loss vs Frequency (RF2, All OFF) Isolation vs Frequency (RFC-RF1, RF2 ON) Isolation vs Frequency (RFC-RF2, RF1 ON)
0 -40 -40
VDD = 5.5V VDD = 5.5V
+110 °C
-5 +25 °C
-50 -50
−40 °C
-10
Return loss (dB)
-60 -60
Isolation (dB)
Isolation (dB)
-15
-70 -70
-20
-80 -80
-25
Isolation vs Frequency (RFC-RFX, Over Voltage) Isolation vs Frequency (RF1-RF2, Over Voltage) Isolation vs Frequency (RF1-RF2, RF1 ON)
-40 -40 -30
Temp.=+25 °C Temp.=+25 °C VDD = 5.5V
-40
-50 -50
-50
-60 -60
Isolation (dB)
Isolation (dB)
Isolation (dB)
-60
-70 -70
-70
-80 -80
-80
VDD = 5.5V, RF1 ON VDD = 5.5V, RF2 ON
-90 VDD = 2.7V, RF1 ON -90 VDD = 2.7V, RF2 ON -40°C
-90
VDD = 5.5V, RF2 ON VDD = 5.5V, RF1 ON +25°C
VDD = 2.7V, RF2 ON VDD = 2.7V, RF1 ON +110°C
-100 -100 -100
0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6
Frequency (GHz) Frequency (GHz) Frequency (GHz)
Isolation vs Frequency (RF1-RF2, RF2 ON) Isolation vs Frequency (RFC-RFX, All OFF) Isolation vs Frequency (RFC-RF1, All OFF)
-30 -40 -30
VDD = 5.5V Temp.=+25 °C VDD = 5.5V
+110 °C
-40 -40 +25 °C
-50
−40 °C
-50 -50
-60
Isolation (dB)
Isolation (dB)
Isolation (dB)
-60 -60
-70
-70 -70
-80
-80 -80
VDD = 5.5V, RFC-RF1
-90 VDD = 2.7V, RFC-RF1
-90 -40°C -90
+25°C VDD = 5.5V, RFC-RF2
+110°C VDD = 2.7V, RFC-RF2
-100 -100 -100
0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6
Frequency (GHz) Frequency (GHz) Frequency (GHz)
Isolation vs Frequency (RFC-RF2, All OFF) Isolation vs Frequency (RFX-RFX, All OFF) P1dB vs Frequency
-30 -50 40
VDD = 5.5V VDD = 5.5V
+110 °C +110 °C
-40 +25 °C +25 °C
−40 °C -60 −40 °C 37
-50
−40 °C
Isolation (dB)
isolation (dB)
P1dB(dBm)
-70 34 +25 °C
-60
+115 °C
-70
-80 31
-80
-90 28
-90
-100 -100 25
0 1 2 3 4 5 6 0 1 2 3 4 5 6 5 25 45 65 85 105 125
Frequency (GHz) Frequency (GHz) Freq(MHz)
CTRL1
CTRL2
GND
GND
VDD
20 19 18 17 16
GND 1 15 GND
CMOS Logic/
Control Circuitry
GND 2 14
GND
RF1 3 13
RF2
GND 4 12
GND
50Ω 50Ω
GND 5
50Ω
11
GND
6 7 8 9 10
GND
GND
GND
GND
RFC
Top View
4.00±0.10 A
0.850±0.05
B (0.203) (0.400) 2.10
PIN 1 INDICATOR (0.050) PIN # 1 I.D.
(0.35X45°)
R0.08
0.50
QPC6324 2.10
4.00±0.10
20x 0.25
Trace Code
R0.13
0.10 A B C
0.05 C
0.10 C
(2.00)
SEATING PLANE
0.10 C A B
20x 0.55
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Dimension and tolerance formats conform to ASME Y14.4M-1994.
3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
4. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical.
5. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.01”).
6. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Notes:
1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A.
2. Labels are placed on the flange opposite the sprockets in the carrier tape.
Handling Precautions
Parameter Rating Standard
ESD – Human Body Model (HBM) Class 2 ESDA / JEDEC JS-001-2012 Caution!
ESD – Charged Device Model (CDM) Class C3 JEDEC JESD22-C101F ESD-Sensitive Device
MSL – Moisture Sensitivity Level Level 1 IPC/JEDEC J-STD-020
Solderability
Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes.
Solder profiles available upon request.
Contact plating: NiPdAu (Plating thickness: Ni 0.5000~2.0066 μm; Pd 0.01999~0.15011 μm; Au 0.00254~0.01501 μm)
RoHS Compliance
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment) as amended by Directive 2015/863/EU.
Important Notice
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herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained
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