RFMD + TriQuint = Qorvo

RFPA5542 RFPA5542
WiFi Integrated PA Module
4.9GHz to 5.925GHz
Package: QFN, 20-pin,
4.0mm x 4.0mm x 0.90mm
The RFPA5542 is a three-stage power amplifier (PA) designed for
802.11a/n/ac applications. The integrated input and output 50Ω match
Features
greatly reduces the layout area, bill of materials and manufacturability
■ POUT = 23dBm, 5V, 11ac, 80MHz
cost in the customer application. The PA is optimized to minimize the MCS9 at 1.8% EVM
required external components to maintain linear performance. The
■ POUT = 25dBm, 5V, 11n, 20/40MHz
RFPA5542 is manufactured on an advanced InGaP heterojunction bipolar MCS7 at 3% EVM
transistor (HBT) process and is capable of achieving linear powers up to
■ Typical Gain = 33dB
23dBm with an EVM <1.8% while maintaining excellent power added
efficiency. The device is provided in a 4.0mm x 4.0mm x 0.90mm ■ High PAE
package that meets or exceeds the power requirements of ■ Required external components
IEEE802.11a/n/ac WiFi RF systems. minimized
■ Integrated Regulator
VCC1 VCC2 VCC3 GND GND
■ Input and Output Matched to 50Ω
20

19

18

16
17

■ Integrated Power Detector

NC 1 15 GND

GND 2 14 GND Applications

RFIN 3 13 RFOUT ■ Customer Premise Equipment
GND 4 12 GND
(CPE)

PA_EN 5 REGULATOR 11 GND

■ Wireless Access Points, Gateways
■ Routers
10
6

■ Set-Top Box Applications

NC NC NC NC PDET
■ Picocell/Femtocell
Functional Block Diagram

Ordering Information
RFPA5542SB Standard 5-piece Sample Bag
RFPA5542SQ Standard 25-piece Sample Bag
RFPA5542SR Standard 100-piece Reel
RFPA5542TR13 Standard 2500-piece Reel
RFPA5542PCK-410 Fully Assembled Evaluation Board

Data Sheet 20161027 1 of 8 Disclaimer: Subject to change without notice

www.qorvo.com
 RFPA5542
RFMD + TriQuint = Qorvo

Absolute Maximum Ratings

Parameter Rating Unit Caution! ESD sensitive device.

DC Supply Voltage -0.5 to +6 VDC

DC Supply Current 1000 mA
Operating Case Temperature -40 to +85 ºC RFMD Green: RoHS status based on EU
Directive 2011/65/EU (at time of this
Storage Temperature -40 to +150 ºC document revision), halogen free per IEC
Maximum TX Input Power into 50Ω Load for 11a/n/ac (No Damage). 61249-2-21, < 1000ppm each of
+10 dBm antimony trioxide in polymeric materials
*R1=0Ω
and red phosphorus as a flame retardant,
Maximum TX Input Power into 10:1 VSWR Load for 11a/n/ac (No and <2% antimony in solder.
+15 dBm
Damage). *R1=15Ω
Junction Temperature +160 C Exceeding any one or a combination of the Absolute
Maximum Rating conditions may cause permanent
Moisture Sensitivity Level (260°C JEDEC J-STD-020) MSL2 damage to the device. Extended application of Absolute
*Note: For R1 placement, please refer to the applications schematic. Maximum Rating conditions to the device may reduce
device reliability. Specified typical performance or
functional operation of the device under Absolute
Maximum Rating conditions is not implied. This is an
InGaP PA designed for high duty cycle applications with
Tj>30oC over ambient.
Nominal Operating Parameters
Specification
Parameter Unit Condition
Min Typ Max

Compliance 802.11a/n/ac
Operating Frequency 5.180 5.925 GHz
Extended Operating Frequency 4.900 5.180 GHz
Power Supply VCC 4.75 5.00 5.25 V
PA Enable - High 1.7 3.0 3.3 V
PA Enable - Low 0 0.5 V
T= +25ºC, VCC=5.0V, VPAEN = 3.0V, Unless otherwise
5V Transmit Performance
noted
11ac 80MHz Output Power 22 23 dBm
1.5 1.8 % MCS9 256QAM
11ac 80MHz DEVM
-36.5 -35 dB
11ac 160MHz Output Power 21 22 dBm
1.5 1.8 % MCS9 256QAM
11ac 160MHz DEVM
-36.5 -35 dB
11n 20/40MHz Output Power 23.5 25 dBm
2.5 3 % MCS7 64QAM
11n 20/40MHz DEVM
-32.0 -30.5 dB
Gain 31 33 dB
Gain Variation over Temp -2.5 +2.5 dB Over operating frequency band
3 dB POUT=23dBm; MCS0 160MHz
3 dB POUT=25dBm; MCS0 80MHz
Margin to Spectral Mask
3 dB POUT=26dBm; MCS0 40MHz
3 dB POUT=27dBm; MCS0 20MHz
285 310 mA POUT=23dBm
Operating Current
385 430 mA POUT=27dBm
Quiescent Current 150 165 mA RF=Off, T= +25ºC, VCC=5.0V, VPAEN = 3.0V,

Data Sheet 20161027 2 of 8 Disclaimer: Subject to change without notice

www.qorvo.com
RFPA5542
RFMD + TriQuint = Qorvo

Specification
Parameter Unit Condition
Min Typ Max
PA Enable Current 1 5 uA PA_EN High
Leakage Current 0.2 1 uA RF OFF; VCC=5.0V, VPAEN = 0V
T= +25ºC, VCC=5.0V, VPAEN = 3.0V, Unless otherwise
5V Transmit Performance
noted
Second Harmonic -45 -40 dBm/MHz POUT = 27dBm, measured with a standard IEEE802.11a 6 Mbps
waveform
Third Harmonic -50 -45 dBm/MHz POUT = 27dBm, measured with a standard IEEE802.11a 6 Mbps
waveform
-5 dB Gain @ 3.3-3.8GHz
OOB Gain
7 dB Gain @ 7.0GHz
Input Return Loss 12 dB
Output Return Loss 12 dB
0.25 V RF=Off
0.55 POUT = 22dBm
Power Detector Range
0.65 V POUT = 23dBm
0.85 V POUT = 27dBm
General Specifications
Stability
Output VSWR 4:1 CW signal. No spurious above -41.25dBm/MHz for non-harmonic
related signals.
Output Power Range 0 27 dBm
Output P1dB 33 dBm CW signal
Ramp ON/OFF time 200 nS 10-90% / 90-10% of gain
Thermal Resistance 25 °C/W
ESD HBM 1500 V EIA/JESD22-114A; All pins
ESD CDM 500 V JESD22-C101C; All pins

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
3 of 8
RFPA5542
RFMD + TriQuint = Qorvo

Timing Diagram

RF/DC Power On/Off Sequence

VCC

PA-EN

RF On
TX RF Signal
RF OFF

Time

Td Td Td Td

Note: Observe the timing sequence shown in the diagram above and described below.
DC and RF signal levels per data sheet specification

 Apply V CC prior to turning on or pulsing PA enable.

 Turn off PA enable prior to turning off VCC.

 Turn on PA enable prior to applying RF signal.

 Turn off RF signal prior to turning off PA enable.

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
4 of 8
RFPA5542
RFMD + TriQuint = Qorvo

RFPA5542 Applications Schematic

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
5 of 8
RFPA5542
RFMD + TriQuint = Qorvo

Pin Out

VCC1 VCC2 VCC3 GND GND

20

19

18

16
17
NC 1 15 GND

GND 2 14 GND

RFIN 3 13 RFOUT

GND 4 12 GND

PA_EN 5 11 GND

10
6

NC NC NC NC PDET

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
6 of 8
RFPA5542
RFMD + TriQuint = Qorvo

Package Drawing

PCB Patterns

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
7 of 8
RFPA5542
RFMD + TriQuint = Qorvo

Pin Names and Descriptions

Pin Name Description
1 NC Not connected internally. It may be left floating or connected to ground.

2 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

3 RFIN RF input, internally matched to 50Ω and DC shorted. External DC blocking capacitor required.

4 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

5 PA_EN PA Enable pin. Apply <0.4VDC. Apply 1.5VDC to VCC to enable PA.

6 NC Not connected internally. It may be left floating or connected to ground.

7 NC Not connected internally. It may be left floating or connected to ground.

8 NC Not connected internally. It may be left floating or connected to ground.

9 NC Not connected internally. It may be left floating or connected to ground.

10 PDET Power detector. Provides an output voltage proportional to the RF output power level.

11 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

12 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

13 RFOUT RF output, internally matched to 50Ω and DC shorted. External DC blocking capacitor required.

14 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

15 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

16 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

17 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground.

18 VCC3 Third stage supply voltage

19 VCC2 Second stage supply voltage.

20 VCC1 First stage supply voltage.

Ground connection. The back side of the package should be connected to the ground plan though as
Pkg Base GND
short of a connection as possible. PCB vias under the device are recommended.

Data Sheet 20161027 Disclaimer: Subject to change without notice

www.qorvo.com
8 of 8