Tên : Nguyễn Võ Phương Uyên
MSSV :058306001251
1. HARDWARE ARCHITECTURE
1.1. Overview
The IBM z15 Model T02, introduced in May 2020,
represents the next evolution in IBM’s enterprise-class
mainframe systems. Designed to support hybrid cloud
environments with enterprise-grade security, scalability,
and availability, the z15 T02 is housed in a standard 19-
inch industry rack frame, offering a more compact
footprint without compromising on performance. This
system is especially tailored for organizations requiring
continuous availability, massive transactional
throughput, and secure data handling.
1.2. Processing Unit (CPU) and Capacity
At the heart of the z15 T02 is its central processing
complex (CPC), which can be configured with one or
two drawers. Each drawer contains up to four processor
chips (System Control Modules – SCMs), each built on
14nm technology and offering 7 to 11 active cores
running at 4.5 GHz. The system supports a maximum of
65 processor units (PUs), depending on configuration,
and includes spare cores for failover and maintenance
without service disruption. With support for over 150
finely graduated capacity levels and Capacity-on-
Demand (CoD), the z15 T02 offers highly flexible
scaling to match both short-term and long-term workload
demands.
1.3. Memory Architecture
Memory architecture is another key strength of the z15
T02. The system supports up to 16 TB of physical
memory, with a maximum of 8 TB usable per logical
partition (LPAR). It utilizes DDR4 memory DIMMs
ranging from 32 GB to 512 GB per module and includes
redundant memory through RAIM (Redundant Array of
Independent Memory) for improved reliability. A
reserved area known as Hardware System Area (HSA),
along with memory buffers, ensures optimized
performance and support for system recovery and
virtualization tasks. Each SCM also incorporates
multiple levels of cache—L1, L2, L3, and L4—designed
to reduce latency and improve throughput for critical
workloads.
1.4. I/O Subsystem
In terms of I/O capabilities, the z15 T02 supports up to
four PCIe+ I/O drawers in a single-drawer configuration,
or three in a dual-CPC setup. Each drawer can
accommodate up to 12 fanout cards that connect to
various I/O adapters. Supported interfaces include
FICON and OSA for mainframe-specific networking,
RoCE Express for RDMA, Crypto Express adapters for
hardware-based encryption, and zHyperLink Express for
ultra-low-latency disk access. The system also supports
advanced features such as HiperSockets and IBM’s
compression accelerator, fully integrated into the
processor chip itself.
1.5. Power and Cooling System
Power and cooling are efficiently handled with air-
cooled systems using redundant blowers. The z15 T02
can be powered using single-phase or three-phase PDUs
depending on configuration, and offers redundant power
support for high availability. Its frame can accommodate
both top and bottom cabling for ease of integration in
data centers.
1.6. Security and Compression Support
Security and resilience are built into the hardware. Each
processor includes on-chip cryptographic functions
(CPACF), enabling secure execution of cryptographic
algorithms such as AES, RSA, ECC, and SHA. The Nest
compression unit on each chip supports real-time
compression (GZIP, Deflate), reducing storage and
transfer costs while improving performance.
1.7. Reliability and Availability
With built-in reliability, availability, and serviceability
(RAS) features—including hot-swappable components,
dynamic LPAR support, and failover-ready spare
processors—the z15 T02 is engineered for non-stop
enterprise computing.
1.8. Summary
In summary, the IBM z15 Model T02 offers a robust
hardware foundation for mission-critical applications. Its
combination of high core count, large memory capacity,
versatile I/O architecture, integrated security, and
scalable design makes it a powerful platform for
organizations modernizing their IT infrastructure with
confidence in performance, reliability, and security.
